HFA3046, HFA3096,
HFA3127, HFA3128
Data Sheet October 1998 File Number 3076.10
Ultra High Frequency Transistor Arrays
The HF A3046, HFA3096, HFA3127 and the HFA3128 are
Ultra High Frequency Transistor Arrays that are fabricated
from Intersil Corporation’s complementary bipolar UHF-1
process. Each array consists of fiv e dielectrically isolated
transistors on a common monolithic substrate. The NPN
transistors exhibit a f
provide a f
of 5.5GHz. Both types exhibit low noise (3.5dB),
T
of 8GHz while the PNP transistors
T
making them ideal for high frequency amplifier and mixer
applications.
The HFA3046 and HFA3127 are all NPN arrays while the
HFA3128 has all PNP transistors. The HFA3096 is an NPNPNP combination. Access is provided to each of the
terminals for the individual transistors for maximum
application flexibility. Monolithic construction of these
transistor arrays provides close electrical and thermal
matching of the five transistors.
For PSPICE models, please request AnswerFAX document
number 663046. Intersil also provides an Application Note
illustrating the use of these devices as RF amplifiers
(request AnswerFAX document 99315).
Ordering Information
TEMP.
PART NUMBER
RANGE (oC) PACKAGE
HFA3046B -55 to 125 14 Ld SOIC M14.15
HFA3096B -55 to 125 16 Ld SOIC M16.15
HFA3127B -55 to 125 16 Ld SOIC M16.15
HFA3128B -55 to 125 16 Ld SOIC M16.15
PKG.
NO.
Features
• NPN Transistor (fT). . . . . . . . . . . . . . . . . . . . . . . . . . 8GHz
• NPN Current Gain (h
• NPN Early Voltage (V
• PNP Transistor (f
• PNP Current Gain (h
• PNP Early Voltage (V
). . . . . . . . . . . . . . . . . . . . . . . 130
FE
) . . . . . . . . . . . . . . . . . . . . . . . 50V
A
). . . . . . . . . . . . . . . . . . . . . . . . 5.5GHz
T
). . . . . . . . . . . . . . . . . . . . . . . . 60
FE
) . . . . . . . . . . . . . . . . . . . . . . . 20V
A
• Noise Figure (50Ω) at 1.0GHz . . . . . . . . . . . . . . . . . 3.5dB
• Collector-to-Collector Leakage. . . . . . . . . . . . . . . . . <1pA
• Complete Isolation Between Transistors
• Pin Compatible with Industry Standard 3XXX Series
Arrays
Applications
• VHF/UHF Amplifiers
• VHF/UHF Mixers
• IF Converters
• Synchronous Detectors
Pinouts
1
Q
2
3
Q
4
5
6
7
HFA3046
TOP VIEW
1
Q
5
2
Q
4
Q
3
HFA3096
TOP VIEW
NC
14
13
12
11
10
9
8
1
Q
1
2
3
4
Q
2
5
6
7
Q
3
8
3-447
16
15
Q
5
14
13
12
Q
4
11
10
9
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
NC
http://www.intersil.com or 407-727-9207
TOP VIEW
1
2
3
Q
4
5
6
7
Q
8
HFA3127
Q
2
3
HFA3128
TOP VIEW
16
1
15
14
Q
5
13
12
11
10
Q
4
9
NC
1
2
3
Q
2
4
5
6
7
Q
3
8
16
Q
1
15
14
Q
5
13
12
11
10
Q
4
9
| Copyright © Intersil Corporation 1999
HFA3046, HFA3096, HFA3127, HFA3128
Absolute Maximum Ratings Thermal Information
Collector to Emitter Voltage (Open Base) . . . . . . . . . . . . . . . . . . 8V
Collector to Base Voltage (Open Emitter) . . . . . . . . . . . . . . . . . 12V
Emitter to Base Voltage (Reverse Bias). . . . . . . . . . . . . . . . . . . 5.5V
Collector Current (100% Duty Cycle) . . . . . 18.5mA at TJ= 150oC
34mA at TJ= 125oC
37mA at TJ= 110oC
Peak Collector Current (Any Condition). . . . . . . . . . . . . . . . . . 65mA
Operating Information
Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operationofthe
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
Thermal Resistance (Typical, Note 1) θJA (oC/W)
14 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 120
16 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 115
Maximum Power Dissipation (Any One Transistor) . . . . . . . . 0.15W
Maximum Junction Temperature (Die). . . . . . . . . . . . . . . . . . . 175oC
Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC
Maximum Storage Temperature Range. . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Electrical Specifications T
PARAMETER TEST CONDITIONS
DC NPN CHARACTERISTICS
Collector-to-Base Breakdown
Voltage, V
Collector-to-Emitter Breakdown
Voltage, V
Collector-to-Emitter Breakdown
Voltage, V
Emitter-to-Base Breakdown
Voltage, V
Collector-Cutoff-Current, I
Collector-Cutoff-Current, I
Collector-to-Emitter Saturation
Voltage, V
Base-to-Emitter Voltage, V
DC Forward-Current Transfer
Ratio, h
Early Voltage, V
Base-to-Emitter Voltage Drift IC = 10mA - -1.5 - - -1.5 - mV/oC
Collector-to-Collector Leakage - 1 - - 1 - pA
(BR)CBO
(BR)CEO
(BR)CES
(BR)EBO
CEO
CBO
CE(SAT)
BE
FE
A
= 25oC
A
DIE SOIC
UNITSMIN TYP MAX MIN TYP MAX
IC = 100µA, IE = 0 1218-1218- V
IC = 100µA, IB = 0 8 12 - 8 12 - V
IC = 100µA, Base Shorted to Emitter 10 20 - 10 20 - V
IE = 10µA, IC = 0 5.5 6 - 5.5 6 - V
VCE = 6V, IB = 0 - 2 100 - 2 100 nA
VCB = 8V, IE = 0 - 0.1 10 - 0.1 10 nA
IC = 10mA, IB = 1mA - 0.3 0.5 - 0.3 0.5 V
IC = 10mA - 0.85 0.95 - 0.85 0.95 V
IC = 10mA
VCE = 2V
IC = 1mA, VCE = 3.5V 20 50 - 20 50 - V
40 130 - 40 130 -
Electrical Specifications T
PARAMETER TEST CONDITIONS
DYNAMIC NPN CHARACTERISTICS
Noise Figure f = 1.0GHz, VCE = 5V,
fT Current Gain-Bandwidth
Product
Power Gain-Bandwidth Product,
f
MAX
= 25oC
A
IC = 5mA, ZS = 50Ω
IC = 1mA, VCE = 5V - 5.5 - - 5.5 - GHz
IC = 10mA, VCE = 5V - 8 - - 8 - GHz
IC = 10mA, VCE = 5V - 6 - - 2.5 - GHz
3-448
DIE SOIC
UNITSMIN TYP MAX MIN TYP MAX
- 3.5 - - 3.5 - dB
HFA3046, HFA3096, HFA3127, HFA3128
Electrical Specifications T
PARAMETER TEST CONDITIONS
Base-to-Emitter Capacitance VBE = -3V - 200 - - 500 - fF
Collector-to-Base Capacitance VCB = 3V - 200 - - 500 - fF
Electrical Specifications T
PARAMETER TEST CONDITIONS
DC PNP CHARACTERISTICS
Collector-to-Base Breakdown
Voltage, V
Collector-to-Emitter Breakdown
Voltage , V
Collector-to-Emitter Breakdown
Voltage, V
Emitter-to-Base Breakdown
Voltage, V
Collector-Cutoff-Current, I
Collector-Cutoff-Current, I
Collector-to-Emitter Saturation
Voltage, V
Base-to-Emitter Voltage, V
DC Forward-Current Transfer
Ratio, h
Early Voltage, V
Base-to-Emitter Voltage Drift IC = -10mA - -1.5 - - -1.5 - mV/oC
Collector-to-Collector Leakage - 1 - - 1 - pA
(BR)CBO
(BR)CEO
(BR)CES
(BR)EBO
CEO
CBO
CE(SAT)
BE
FE
A
= 25oC (Continued)
A
DIE SOIC
UNITSMIN TYP MAX MIN TYP MAX
= 25oC
A
DIE SOIC
UNITSMIN TYP MAX MIN TYP MAX
IC = -100µA, IE = 0 1015-1015- V
IC = -100µA, IB = 0 8 15 - 8 15 - V
IC = -100µA, Base Shorted to Emitter 10 15 - 10 15 - V
IE = -10µA, IC = 0 4.5 5 - 4.5 5 - V
VCE = -6V, IB = 0 - 2 100 - 2 100 nA
VCB = -8V, IE = 0 - 0.1 10 - 0.1 10 nA
IC = -10mA, IB = -1mA - 0.3 0.5 - 0.3 0.5 V
IC = -10mA - 0.85 0.95 - 0.85 0.95 V
IC = -10mA, VCE = -2V 20 60 - 20 60 -
IC = -1mA, VCE = -3.5V 10 20 - 10 20 - V
Electrical Specifications T
PARAMETER TEST CONDITIONS
DYNAMIC PNP CHARACTERISTICS
Noise Figure f = 1.0GHz, VCE = -5V,
fT Current Gain-Bandwidth
Product
Power Gain-Bandwidth
Product
Base-to-Emitter Capacitance VBE = 3V - 200 - - 500 - fF
Collector-to-Base Capacitance VCB = -3V - 300 - - 600 - fF
= 25oC
A
DIE SOIC
UNITSMIN TYP MAX MIN TYP MAX
- 3.5 - - 3.5 - dB
IC = -5mA, ZS = 50Ω
IC = -1mA, VCE = -5V - 2 - - 2 - GHz
IC = -10mA, VCE = -5V - 5.5 - - 5.5 - GHz
IC = -10mA, VCE = -5V - 3 - - 2 - GHz
3-449