Intersil Corporation HCTS191MS Datasheet

September 1995
HCTS191MS
Radiation Hardened
Synchronous 4-Bit Up/Down Counter
Features
• 3 Micron Radiation Hardened CMOS SOS
• Total Dose 200K RAD (Si)
• SEP Effective LET No Upsets: >100 MEV-cm
• Single Event Upset (SEU) Immunity < 2 x 10
2
/mg
-9
Errors/Bit-
Day (Typ)
• Dose Rate Survivability: >1 x 10
• Dose Rate Upset: >10
10
RAD (Si)/s 20ns Pulse
• Cosmic Ray Upset Immunity 2 x 10
12
RAD (Si)/s
-9
Errors/Bit Day
• Latch-Up Free Under Any Conditions
• Fanout (Over Temperature Range)
- Standard Outputs - 10 LSTTL Loads
• Military Temperature Range: -55
o
C to +125oC
• Significant Power Reduction Compared to LSTTL ICs
• DC Operating Voltage Range: 4.5V to 5.5V
• LSTTL Input Compatibility
- VIL = 0.8V Max
- VIH = VCC/2 Min
• Input Current Levels Ii 5µA @ VOL, VOH
Description
The Intersil HCTS191MS is a Radiation Hardened asynchro­nously presettable 4 bit binary up/down synchronous counter. Presetting the counter to the number on the preset data inputs (P0 - P3) is accomplished by a low asynchronous parallel load input (
PL). Counting occurs when PL is high, Count Enable (CE) is low, and the or high for down-counting. The counter is incremented or decre­mented synchronously with the low-to-high transition of the clock.
When an overflow or underflow of the counter occurs, the Terminal Count output (TC), which is low during counting, goes high and remains high for one clock cycle. This output can be used for look-ahead carry in high speed cascading. The TC output also initiates the Ripple Clock output ( high, goes low and remains low for the low-level portion of the clock pulse. These counter can be cascaded using the Ripple Carry output.
The HCTS191MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of radiation hardened, high-speed, CMOS/SOS Logic Family.
The HCTS191MS is supplied in a 16 lead Ceramic flatpack (K suffix) or a SBDIP Package (D suffix).
Up/Down (U/D) input is either low for up-counting
RC) which, normally
Pinouts
16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE
(SBDIP) MIL-STD-1835 CDIP2-T16
TOP VIEW
P1
1
Q1
2
Q0
3
CE
4
U/D
5
Q2
6
Q3
7
GND
8
16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE
(FLATPACK) MIL-STD-1835 CDFP4-F16
TOP VIEW
P1 Q1 Q0 CE
U/D
Q2 Q3
GND
FUNCTION
Count Up H L L Count Down H L H Asynchronous Preset L X X X No Change H H X X
H = High Level, L = Low Level, X = Immaterial
= Transition from low to high
NOTE: U/D orCE should be changed only when CLOCK (CP)
is high.
116 2 3 4 5 6 7 8
TRUTH TABLE
PL CE U/D CP
VCC
16
P0
15 14
CP
13
RC
12
TC
11
PL P2
10
9
P3
VCC 15 14 13 12 11 10
9
P0 CP RC TC PL P2 P3
Ordering Information
PART NUMBER TEMPERATURE RANGE SCREENING LEVEL PACKAGE
HCTS191DMSR -55oC to +125oC Intersil Class S Equivalent 16 Lead SBDIP HCTS191KMSR -55oC to +125oC Intersil Class S Equivalent 16 Lead Ceramic Flatpack HCTS191D/Sample +25oC Sample 16 Lead SBDIP HCTS191K/Sample +25oC Sample 16 Lead Ceramic Flatpack HCTS191HMSR +25oC Die Die
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
580
Spec Number
File Number 2250.2
DB NA
518621
Functional Diagram
581
CP
U/D
PD
14
5
11
13
RC
12
TC
HCTS191MS
PL
P
TCPQ
Q
FF0
PL
P
TCPQ
FF1
PL
P
TCPQ
Q
Q
FF2
PL
P
TCPQ
Q
FF3
Spec Number 518621
CE
4
Q0
3
Q1
2
Q2
6
Q3
7
Specifications HCTS191MS
Absolute Maximum Ratings Reliability Information
Supply Voltage (VCC). . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to +7.0V
Input Voltage Range, All Inputs . . . . . . . . . . . . .-0.5V to VCC +0.5V
DC Input Current, Any One Input . . . . . . . . . . . . . . . . . . . . . . . .±10mA
DC Drain Current, Any One Output. . . . . . . . . . . . . . . . . . . . . . .±25mA
(All Voltage Reference to the VSS Terminal)
Storage Temperature Range (TSTG) . . . . . . . . . . . -65oC to +150oC
Lead Temperature (Soldering 10sec) . . . . . . . . . . . . . . . . . . +265oC
Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . +175oC
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
CAUTION: As with all semiconductors, stress listed under “Absolute Maximum Ratings” may be applied to devices (one at a time) without resulting in permanent damage. This is a stress rating only. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. The conditions listed under “Electrical Performance Characteristics” are the only conditions recommended for satisfactory device operation..
Operating Conditions
Supply Voltage (VCC). . . . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Input Rise and Fall Times at VCC = 4.5V (TR, TF) . . . . .500ns Max
Operating Temperature Range (TA) . . . . . . . . . . . . -55oC to +125oC
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
Thermal Resistance θ
SBDIP Package. . . . . . . . . . . . . . . . . . . . 73oC/W 24oC/W
Ceramic Flatpack Package . . . . . . . . . . . 114oC/W 29oC/W
Maximum Package Power Dissipation at +125oC Ambient
SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.68W
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . . . . 0.44W
If device power exceeds package dissipation capability, provide heat sinking or derate linearly at the following rate:
SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13.7mW/oC
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . .8.8mW/oC
Input Low Voltage (VIL). . . . . . . . . . . . . . . . . . . . . . . . . 0.0V to 0.8V
Input High Voltage (VIH). . . . . . . . . . . . . . . . . . . . . . .VCC/2 to VCC
JA
θ
JC
(NOTE 1)
PARAMETER SYMBOL
Quiescent Current ICC VCC = 5.5V,
Output Current (Sink)
Output Current (Source)
Output Voltage Low VOL VCC = 4.5V, VIH = 2.25V,
Output Voltage High VOH VCC = 4.5V, VIH = 2.25V,
Input Leakage Current
IOL VCC = 4.5V, VIH = 4.5V,
IOH VCC = 4.5V, VIH = 4.5V,
IIN VCC = 5.5V, VIN = VCC or
CONDITIONS
VIN = VCC or GND
VOUT = 0.4V, VIL = 0V
VOUT = VCC -0.4V, VIL = 0V
IOL = 50µA, VIL = 0.8V
VCC = 5.5V, VIH = 2.75V, IOL = 50µA, VIL = 0.8V
IOH = -50µA, VIL = 0.8V
VCC = 5.5V, VIH = 2.75V, IOH = -50µA, VIL = 0.8V
GND
GROUP
A SUB-
GROUPS TEMPERATURE
1 +25oC-40µA
2, 3 +125oC, -55oC - 750 µA
1 +25oC 4.8 - mA
2, 3 +125oC, -55oC 4.0 - mA
1 +25oC -4.8 - mA
2, 3 +125oC, -55oC -4.0 - mA
1, 2, 3 +25oC, +125oC, -55oC - 0.1 V
1, 2, 3 +25oC, +125oC, -55oC - 0.1 V
1, 2, 3 +25oC, +125oC, -55oC VCC
1, 2, 3 +25oC, +125oC, -55oC VCC
1 +25oC-±0.5 µA
2, 3 +125oC, -55oC - 5.0 µA
LIMITS
-V
-0.1
-V
-0.1
UNITSMIN MAX
Noise Immunity Functional Test
NOTES:
1. All voltages reference to device GND.
2. For functional tests VO 4.0V is recognized as a logic “1”, and VO 0.5V is recognized as a logic “0”.
FN VCC = 4.5V, VIH = 2.25V,
VIL = 0.8V (Note 2)
7, 8A, 8B +25oC, +125oC, -55oC---
582
Spec Number 518621
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