Intersil Corporation HC55171B Datasheet

HC55171B

Data Sheet July 1998 File Number

Low Cost 5 REN Ringing SLIC for ISDN Modem/TA and WL

The HC55171Blow cost, 5 REN ringing SLIC is designed to accommodate a wide variety of short loop applications and provides the same degree of ﬂexibility as the high performance HC55171. The ﬂexible features include open circuit tip to ring DC voltages, user deﬁned ringing waveforms, ring trip detection thresholds, and loop current limits that can be tailored for many applications. Additional features of the HC55171B are complex impedance matching, pulse metering, and transhybrid balance. The HC55171B is designed for use in short loop, low cost systems where traditional ring generation is not economically feasible.

The device is manufactured in a high voltage Dielectric Isolation (DI) process. The DI process provides substrate latch up immunity, resulting in a robust system design. A thermal shutdown with an alarm output and line fault protection are also included for operation in harsh environments.

Ordering Information

PART

NUMBER

HC55171BIM -40 to 85 28 Ld PLCC N28.45 HC55171BIB -40 to 85 28 Ld SOIC M28.3

TEMP.RANGE

(oC) PACKAGE PKG. NO.

4422.1

Features

• Load Drive Capability. . . . . . . . . . . . . . . . . . . . . . . 5REN

• Trapezoidal, Square or Sine Wave Capability

• Ringing from -80V Battery . . . . . . . . . . . . . . . . . . .75V

• Ringing from -75V Battery . . . . . . . . . . . . . . . . . . .70V

P-P P-P

• Ringing Current Independent of Loop Current Setting

• Ringing Crest Factor Independent of REN Loading

• Latchup Immune to Inductive Kick Back and Hot Plug

• Fax, Answering Machine and MTU Compatible

• Resistive and Complex Impedance Matching

• Programmable Loop Current Limit

• Switch Hook, Ring Trip and Ground Key Detection

• Single Low Voltage +5V Supply

Applications

• Solid State Line Interface Circuit for Hybrid Fiber Coax, Set Top Box, Voice/Data Modems

• Related Literature

- AN9607, Impedance Matching Design Equations

- AN9628, AC Voltage Gain

- AN9636, Implementing an Analog Port for ISDN

- AN549, The HC-5502/4X Telephone SLIC

Block Diagram

RING SENSE 1 RING SENSE 2

TIP FEED

TIP SENSE

RING FEED

REF

RTI

BAT

AGND BGND

2-WIRE

INTERFACE

BIAS

4-WIRE

INTERFACE

LOOP CURRENT

DETECTOR

FAULT

DETECTOR

CURRENT

LIMIT

RING TRIP

DETECTOR

IIL LOGIC INTERFACE

F1 F0 RS

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

TST RDI

RELAY

DRIVER

RING

- IN 1

OUT 1

SHD ALM

LIMIT

RTD RDO

HC55171B

Absolute Maximum Ratings T

Maximum Supply Voltages

(VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7V

(VCC)-(V

Relay Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +15V

). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90V

BAT

Operating Conditions

Temperature Range

HC55171BIM, HC55171BIB . . . . . . . . . . . . . . . . . . -40oC to 85oC

Relay Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5V to +12V

Positive Power Supply (VCC) . . . . . . . . . . . . . . . . . . . . . . . +5V ±5%

Negative Power Supply (V

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied

NOTES:

1. θJAis measured with the component mounted on an evaluation board PC board in free air.

2. All grounds (AGND, BGND) must be applied before VCCor V wishes to run separate grounds off a line card, the AGND must be applied first.

). . . . . . . . . . . . . . . . . . . -16V to -80V

BAT

Electrical Speciﬁcations Unless Otherwise Speciﬁed, Typical Parameters are at T

Operating TemperatureRange, V at 600Ω 2-Wire terminating impedance.

=25oC Thermal Information

Thermal Resistance (Typical, Note 1) θJA(oC/W)

PLCC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

Maximum Junction Temperature, Plastic Packages . . . . . . . . 150oC

Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC

Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300oC

(SOIC, PLCC - Lead Tips Only)

Die Characteristics

Transistor Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224

Diode Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Die Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 x 144

Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V

Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bipolar-DI

ESD (Human Body Model) . . . . . . . . . . . . . . . . . . . . . . . . . . . .500V

. Failure to do so may result in premature failure of the part. If a user

BAT

= 25oC, Min-Max Parameters are over

= -24V, VCC= +5V, AGND= BGND = 0V.All AC Parameters are speciﬁed

BAT

PARAMETER TEST CONDITIONS MIN TYP MAX UNITS

RINGING TRANSMISSION PARAMETERS

Input Impedance (Note 3) - 5.4 - kΩ

RING

4-Wire to 2-Wire Gain V

AC TRANSMISSION PARAMETERS

RX Input Impedance 300Hz to 3.4kHz (Note 3) - 108 - kΩ OUT1 Positive Output Voltage Swing RL = 10kΩ (Note 3) +2.5 - - V OUT1 Negative Output Voltage Swing RL = 10kΩ (Note 3) -4.5 - - V 4-Wire Input Overload Level 300Hz to 3.4kHz RL = 1200Ω, 600Ω Reference

2-Wire Return Loss Matched for 600Ω, f = 300Hz (Note 3) 37 - - dB

2-Wire Longitudinal to Metallic Balance Off Hook

4-Wire Longitudinal Balance Off Hook 300Hz to 3400Hz (Note 3) 40 - - dB Longitudinal Current Capability I Insertion Loss, 2-Wire to 4-Wire 0dBmO, 1kHz, Includes Tr ansh ybrid Amp Gain = 3 - ±0.05 ±0.2 dB

to V

RING

(Note 3)

Matched for 600Ω, f = 1000Hz (Note 3) 40 - - dB Matched for 600Ω, f = 3400Hz (Note 3) 30 - - dB Per ANSI/IEEE STD 455-1976 300Hz to 3400Hz

(Note 3)

= 40mA, TA = 25oC (Note 3) - 40 - mA

LINE

(Note 3) - 40 - V/V

T-R

- +3.1 - V

40 - - dB

PEAK

RMS

Insertion Loss, 4-Wire to 2-Wire 0dBmO,1kHz - ±0.05 ±0.2 dB Insertion Loss, 4-Wire to 4-Wire 0dBmO, 1kHz, Includes Tr ansh ybrid Amp Gain = 3 - - ±0.35 dB Frequency Response 300Hz to 3400Hz Referenced to Absolute Level

at 1kHz, 0dBm Referenced 600Ω

- ±0.02 ±0.06 dB

HC55171B

Electrical Speciﬁcations Unless Otherwise Speciﬁed, Typical Parameters are at T

Operating Temperature Range, V at 600Ω 2-Wire terminating impedance. (Continued)

PARAMETER TEST CONDITIONS MIN TYP MAX UNITS

Level Linearity +3 to 0dBm, Referenced to -10dBm (Note 3) - - ±0.10 dB

0 to -40dBm, Referenced to -10dBm (Note 3) - - ±0.12 dB

-40 to -55dBm, Referenced to -10dBm (Note 3) - - ±0.30 dB Absolute Delay, 2-Wire to 4-Wire 300Hz to 3400Hz (Note 3) - - 1.0 µs Absolute Delay, 4-Wire to 2-Wire 300Hz to 3400Hz (Note 3) - - 1.0 µs Absolute Delay, 4-Wire to 4-Wire 300Hz to 3400Hz (Note 3) - 0.95 - µs Transhybrid Loss VIN = 1V Total Harmonic Distortion

2-Wire/4-Wire, 4-Wire/2-Wire, 4-Wire/4-Wire Idle Channel Noise

2-Wire and 4-Wire

PSRR, VCC to 2-Wire 30Hz to 200Hz, RL = 600Ω (Note 3) 30 35 - dB PSRR, VCC to 4-Wire 45 47 - dB PSRR, VBAT to 2-Wire 23 28 - dB

Reference Level 0dBm at 600Ω 300Hz to 3400Hz (Note 3)

C-Message (Note 3) - 3 - dBrnC Psophometric (Note 3) - -87 - dBmp

at 1kH (Note 3) 36 40 - dB

P-P

= -24V, VCC= +5V, AGND = BGND = 0V.All AC Parameters are speciﬁed

BAT

= 25oC, Min-Max Parameters are over

- - -50 dB

PSRR, VBAT to 4-Wire 33 38 - dB PSRR, VCC to 2-Wire 200Hz to 3.4kHz, RL = 600Ω (Note 3) 33 35 - dB PSRR, VCC to 4-Wire 44 46 - dB PSRR, VBAT to 2-Wire 40 50 - dB PSRR, VBAT to 4-Wire 50 60 - dB PSRR, VCC to 2-Wire 3.4kHz to 16kHz, RL = 600Ω (Note 3) 30 34 - dB PSRR, VCC to 4-Wire 35 40 - dB PSRR, VBAT to 2-Wire 30 40 - dB PSRR, VBAT to 4-Wire 40 50 - dB

DC PARAMETERS

Loop Current Programming Range (Note 4) 20 - 60 mA Loop Current Programming Accuracy -15 - +15 % Loop Current During Power Denial RL = 200Ω, V Fault Current, Tip to Ground (Note 3) - 90 - mA Fault Current, Ring to Ground - 100 - mA Fault Current, Tip and Ring to Ground (Note 3) - 130 - mA Switch Hook Detection Threshold 9 12 15 mA

= -48V - ±4-mA

BAT

Ring Trip Comparator Voltage Threshold -0.28 -0.24 -0.22 V Thermal ALARM Output Safe Operating Die Temperature Exceeded

(Note 3)

Dial Pulse Distortion (Note 3) - 0.1 0.5 ms

140 - 160

HC55171B

Electrical Speciﬁcations Unless Otherwise Speciﬁed, Typical Parameters are at T

Operating Temperature Range, V

= -24V, VCC= +5V, AGND = BGND = 0V.All AC Parameters are speciﬁed

BAT

= 25oC, Min-Max Parameters are over

at 600Ω 2-Wire terminating impedance. (Continued)

PARAMETER TEST CONDITIONS MIN TYP MAX UNITS

UNCOMMITTED RELAY DRIVER

On Voltage, V

IOL (RDO) = 30mA - 0.2 0.5 V

Off Leakage Current - ±10 ±100 µA

TTL/CMOS LOGIC INPUTS (F0, F1, RS, TST, RDI)

Logic Low Input Voltage 0 - 0.8 V Logic High Input Voltage 2.0 - 5.5 V Input Current IIH, 0V ≤ VIN≤ 5V - - -1 µA Input Current IIL, 0V ≤ VIN≤ 5V - - -100 µA

LOGIC OUTPUTS (SHD, RTD, ALM)

Logic Low Output Voltage I Logic High Output Voltage I

= 800µA - 0.3 0.6 V

LOAD

= 40µA 2.7 - 5.5 V

LOAD

POWER DISSIPATION --Power Dissipation On Hook VCC = +5V, V

VCC = +5V, V

Power Dissipation Off Hook VCC = +5V, V

= -80V, R

BAT

= -48V, R

BAT

= -24V, R

BAT

= ∞ - 300 - mW

LOOP

= ∞ - 150 - mW

LOOP

= 600Ω,

- 280 - mW

IL = 25mA

BAT

VCC = +5V, V VCC = +5V, V VCC = +5V, V

= -80V, R

BAT

= -48V, R

BAT

= -24V, R

BAT

VCC = +5V, VB- = -80V, R VCC = +5V, VB- = -48V, R VCC = +5V, VB- = -24V, R

= ∞ -36mA

LOOP

= ∞ -25mA

LOOP

= ∞ - 1.9 5 mA

LOOP

= ∞ - 3.6 7 mA

LOOP

= ∞ - 2.6 6 mA

LOOP

= ∞ - 2.3 4.5 mA

LOOP

NOTES:

3. These parameters are controlled by design or process parametersandare not directly tested. These parameters are characterized upon

initial design release, upon design changes which would affect these characteristics, and at intervals to assure product quality and specification compliance.

4. This parameter directly affects device junction temperature. Refer to Power Dissipation discussion of data sheet for design information.

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