Intersil Corporation HC-5509B Datasheet

HC-5509B
Data Sheet July 1998 File Number
ITU CO/Loop Carrier SLIC
The HC-5509B telephone Subscriber Line Interface Circuit integrates most of the BORSCHT functions on a monolithic IC. The device is manufactured in a Dielectric Isolation (DI) process and is designed for use as a high voltage interface between the traditional telephone subscriber pair (Tip and Ring) and the low voltage filtering and coding/decoding functions of the line card. Together with a secondary protection diode bridge and “feed” resistors, the device will withstand 1000V lightning induced surges, in plastic packages. The SLIC also maintains specified transmission performance in the presence of externally induced longitudinal currents. The BORSCHT functions that the SLIC provides are:
Battery Feed with Subscriber Loop Current Limiting
• Overvoltage Protection
• Ring Relay Driver
• Supervisory Signaling Functions
2799.6
Features
• DI Monolithic High Voltage Process
• Compatible with Worldwide PBX and CO Performance Requirements
• Controlled Supply of Battery Feed Current with Programmable Current Limit
• Operates with 5V Positive Supply (V
• Internal Ring Relay Driver and a Utility Relay Driver
• High Impedance Mode for Subscriber Loop
• High Temperature Alarm Output
• Low Power Consumption During Standby Functions
• Switch Hook, Ground Key, and Ring Trip Detection
• Selective Power Denial to Subscriber
• Voice Path Active During Power Denial
• On-Chip Op Amp for 2-Wire Impedance Matching
B+
)
• Hybrid Functions (with External Op Amp)
• Test (or Battery Reversal) Relay Driver In addition, the SLIC provides selective denial of power to
subscriber loops, a programmable subscriber loop current limit from 20mA to 60mA, a thermal shutdown with an alarm output and line fault protection. Switch hook detection, ring trip detection and ground key detection functions are also incorporated in the SLIC device.
The HC-5509B SLIC is ideally suited for line card designs in PBX and CO systems, replacing traditional transformer solutions.
Ordering Information
PART
NUMBER
HC3-5509B-5 0 to 75 28 Ld PDIP E28.6 HC3-5509B-9 -40 to 85 28 Ld PDIP E28.6 HC4P5509B-5 0 to 75 44 Ld PLCC N44.65 HC4P5509B-9 -40 to 85 44 Ld PLCC N44.65 HC9P5509B-5 0 to 75 28 Ld SOIC M28.3 HC9P5509B-9 -40 to 85 28 Ld SOIC M28.3
TEMP.RANGE
(oC) PACKAGE PKG. NO.
Applications
• Solid State Line Interface Circuit for PBX or Central Office Systems, Digital Loop Carrier Systems
• Hotel/Motel Switching Systems
• Direct Inward Dialing (DID) Trunks
• Voice Messaging PBXs
• High Voltage 2-Wire/4-Wire, 4-Wire/2-Wire Hybrid
• Related Literature
- AN9607, Impedance Matching Design Equations
- AN9628, AC Voltage Gain
- AN9608, Implementing Pulse Metering
- AN549, The HC-5502S/4X Telephone Subscriber Line
Interface Circuits (SLIC)
58
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999
HC-5509B
Absolute Maximum Ratings (Note 1) Thermal Information
Relay Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to 15V
Maximum Supply Voltages
(VB+) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to 7V
(VB+)-(VB-). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75V
Operating Conditions
Operating Temperature Range
HC-5509B-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0oC to 75oC
HC-5509B-9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
Relay Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5V to 12V
Positive Power Supply (VB+) . . . . . . . . . . . . . . . . . . . . . . . . 5V ±5%
Negative Power Supply (VB-). . . . . . . . . . . . . . . . . . . . .-42V to -58V
Loop Resistance (RL) . . . . . . . . . . . . . . . . 200 to 1750 (Note 2)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operationofthe device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. Absolute maximum ratings are limiting values, applied individually, beyond which the serviceability of the circuit may be impaired. Functional operability under any of these conditions is not necessarily implied.
2. May Be Extended to 1900 With Application Circuit.
3. θJA is measured with the component mounted on an evaluation PC board in free air.
Thermal Resistance (Typical, Note 3) θJA (oC/W) θJC (oC/W)
CERDIP Package. . . . . . . . . . . . . . . . . 48 12
PDIP Package . . . . . . . . . . . . . . . . . . . 51 N/A
PLCC Package. . . . . . . . . . . . . . . . . . . 47 N/A
SOIC Package . . . . . . . . . . . . . . . . . . . 72 N/A
Maximum Junction Temperature Ceramic . . . . . . . . . . . . . . . .175oC
Maximum Junction Temperature Plastic . . . . . . . . . . . . . . . . .150oC
Storage Temperature Range . . . . . . . . . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC
(For SMD; PLCC and SOIC - Lead Tips Only)
Die Characteristics
Transistor Count. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .224
Diode Count. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Die Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174 x 120
Substrate Potential. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Connected
Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Bipolar-DI
Electrical Specifications Unless Otherwise Specified, Typical Parameters are at T
Temperature Range, VB- = -48V, VB+ = 5V, AG = DG = BG = 0V. All AC Parameters are specified at 600 2­Wire Terminating Impedance
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
AC TRANSMISSION PARAMETERS
RX Input Impedance 300Hz to 3.4kHz (Note 4) - 100 - k TX Output Impedance 300Hz to 3.4kHz (Note 4) - - 20 4-Wire Input Overload Level 300Hz to 3.4kHz R
2-Wire Return Loss Matched for 600 (Note 4)
SRL LO 26 35 - dB ERL 30 40 - dB SRL HI 30 40 - dB
2-Wire Longitudinal to Metallic Balance Off Hook
4-Wire Longitudinal Balance Off Hook
Low Frequency Longitudinal Balance R.E.A. Test Circuit - - -67 dBmp
Longitudinal Current Capability I Insertion Loss 0dBm at 1kHz, Referenced 600
2-Wire/4-Wire - ±0.05 ±0.2 dB 4-Wire/2-Wire - ±0.05 ±0.2 dB 4-Wire/4-Wire --±0.2 dB
Frequency Response 300Hz to 3400Hz (Note 4) Referenced to
Level Linearity Referenced to -10dBm (Note 4)
2-Wire to 4-Wire and 4-Wire to 2-Wire +3 to -40dBm - - ±0.05 dB
600 Reference
Per ANSI/IEEESTD 455-1976 (Note4) 300Hz to 3400Hz
300Hz to 3400Hz (Note 4) 50 55 - dB
I
= 40mA, TA = 25oC (Note 4) - - 23 dBrnC
LINE
= 40mA, TA = 25oC (Note 4) - - 30 mA
LINE
Absolute Level at 1kHz, 0dBm Referenced 600
-40 to -50dBm - - ±0.1 dB
-50 to -55dBm - - ±0.3 dB
= 1200,
L
= 25oC, Min-Max Parameters are Over Operating
A
1.5 - - V
58 63 - dB
- ±0.02 ±0.05 dB
PEAK
RMS
59
HC-5509B
Electrical Specifications Unless Otherwise Specified, Typical Parameters are at T
= 25oC, Min-Max Parameters are Over Operating
A
Temperature Range, VB- = -48V, VB+ = 5V, AG = DG = BG = 0V. All AC Parameters are specified at 600 2­Wire Terminating Impedance (Continued)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Absolute Delay (Note 4)
2-Wire/4-Wire 300Hz to 3400Hz - - 1 µs 4-Wire/2-Wire 300Hz to 3400Hz - - 1 µs
4-Wire/4-Wire 300Hz to 3400Hz - - 1.5 µs Transhybrid Loss, THL (Note 4) See Figure 1 - 40 - dB Total Harmonic Distortion
2-Wire/4-Wire, 4-Wire/2-Wire, 4-Wire/4-Wire
Reference Level 0dBm at 600 300Hz to 3400Hz (Note 4)
- - -52 dB
Idle Channel Noise (Note 4)
2-Wire and 4-Wire C-Message - - 5 dBrnC
Psophometric - - -85 dBmp 3kHz Flat - - 15 dBrn
Power Supply Rejection Ratio (Note 4)
VB+ to 2-Wire 20 29 - dB
V
to 4-Wire 20 29 - dB
B+
to 2-Wire 20 29 - dB
V
B-
to 4-Wire 20 29 - dB
V
B-
V
to 4-Wire (Note 4)
B+
to 2-Wire 30 - - dB
V
B-
to 4-Wire 20 25 - dB
V
B-
V
to 4-Wire 20 25 - dB
B-
30Hz to 200Hz, R
200Hz to 16kHz, RL = 600
= 600
L
30 - - dB
Ring Sync Pulse Width 50 - 500 µs
DC PARAMETERS
Loop Current Programming
Limit Range 20 - 60 mA
Accuracy 10 - - % Loop Current During Power Denial R
= 200 - ±3 ±5mA
L
Fault Currents
TIP to Ground -30-mA
RING to Ground -60-mA
TIP and RING to Ground -90-mA Switch Hook Detection Threshold -1215mA Ground Key Detection Threshold -10-mA Thermal ALARM Output Safe Operating Die Temperature Exceeded 140 - 160 Ring Trip Detection Threshold V
RING
= 105V
RMS
, f
= 20Hz - 10 - mA
RING
o
C
Ring Trip Detection Period - 100 150 ms Dial Pulse Distortion - 0.1 0.5 ms Relay Driver Outputs
On Voltage V
OL
Off Leakage Current V
IOL (PR) = 60mA, IOL (RD) = 30mA - 0.2 0.5 V
= 13.2V - ±10 ±100 µA
OH
TTL/CMOS Logic Inputs (F0, F1, RS, TEST, PRI)
Logic ‘0’ V
Logic ‘1’ V
IL IH
Input Current (F0, F1, RS,
TEST, PRI) 0V VIN≤ 5V - - ±100 µA
- - 0.8 V
2.0 - 5.5 V
Logic Outputs
Logic ‘0’ V
Logic ‘1’ V
OL OH
I
= 800µA - 0.1 0.5 V
LOAD
I
= 40µA 2.7 - - V
LOAD
60
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