Datasheet HC5509A1R3060 Datasheet (Intersil Corporation)

June 1997

HC5509A1R3060

SLIC

Subscriber Line Interface Circuit

Features

• DI Monolithic High Voltage Process

• Compatible with Worldwide PBX and CO Performance
Requirements

• Controlled Supply of Battery Feed Current with
Programmable Current Limit

• Operates with 5V Positive Supply (V

• Internal Ring Relay Driver and a Utility Relay Driver

• High Impedance Mode for Subscriber Loop

• High Temperature Alarm Output

• Low Power Consumption During Standby Functions

• Switch Hook, Ground Key, and Ring Trip Detection

• Selective Power Denial to Subscriber

• Voice Path Active During Power Denial

• On Chip Op Amp for 2-Wire Impedance Matching

B+

)

Applications

• Solid State Line Interface Circuit for PBX or Central
Office Systems, Digital Loop Carrier Systems

• Hotel/Motel Switching Systems

• Direct Inward Dialing (DID) Trunks

• Voice Messaging PBXs

• High Voltage 2-Wire/4-Wire, 4-Wire/2-Wire Hybrid

• Related Literature

- AN9607, Impedance Matching Design Equations

- AN9628, AC Voltage Gain

- AN9608, Implementing Pulse Metering

- AN549, The HC-5502S/4X Telephone Subscriber

Line Interface Circuits (SLIC)

Description

The HC4P5509A1R3060 telephone Subscriber Line
Interface Circuit integrates most of the BORSCHT functions
on a monolithic IC. The device is manufactured in a
Dielectric Isolation (DI) process and is designed for use as a
high voltage interface between the traditional telephone
subscriber pair (Tip and Ring) and the low voltage filtering
and coding/decoding functions of the line card. Together with
a secondary protection diode bridge and “feed” resistors, the
device will withstand 1000V lightning induced surges, in
plastic packages. The SLIC also maintains specified
transmission performance in the presence of externally
induced longitudinal currents. The BORSCHT functions that
the SLIC provides are:

• Battery Feed with Subscriber Loop Current Limiting

• Overvoltage Protection

• Ring Relay Driver

• Supervisory Signaling Functions

• Hybrid Functions (with External Op Amp)

• Test (or Battery Reversal) Relay Driver

In addition, the SLIC provides selective denial of power to
subscriber loops, a programmable subscriber loop current
limit from 20mA to 60mA, a thermal shutdown with an alarm
output and line fault protection. Switch hook detection, ring
trip detection and ground key detection functions are also
incorporated in the SLIC device.

The HC4P5509A1R3060 SLIC is ideally suited for line card
designs in PBX and CO systems, replacing traditional
transformer solutions.

Ordering Information

TEMP.

PART NUMBER

HC4P5509A1R3060 0 to 75 28 Ld PLCC N28.45

RANGE (oC) PACKAGE

PKG.

NO.

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207

| Copyright © Intersil Corporation 1999

1

File Number

3675.3

HC5509A1R3060

Absolute Maximum Ratings T

Relay Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +15V

Maximum Supply Voltages

(VB+). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7V

(VB+)-(VB-) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +75V

Junction Temperature Plastic . . . . . . . . . . . . . . . . . . . . . . . . . 150oC

Lead Temperature (Soldering 10s). . . . . . . . . . . . . . . . . . . . . 300oC

Operating Conditions

Operating Temperature Range

HC4P5509A1R3060 . . . . . . . . . . . . . . . . . . . . . . . . . .0oC to 75oC

Storage Temperature Range . . . . . . . . . . . . . . . . . . -65oC to 150oC

Relay Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5V to +12V

Positive Power Supply (VB+) . . . . . . . . . . . . . . . . . . . . . . . +5V ±5%

Negative Power Supply (VB-) . . . . . . . . . . . . . . . . . . . . -42V to -58V

Loop Resistance (RL). . . . . . . . . . . . . . . . . 200Ω to 1750Ω (Note 2)

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTES:

1. θJA is measured with the component mounted on an evaluation PC board in free air.

2. May be extended to 1900Ω with application circuit.

Electrical Specifications Unless Otherwise Specified, Typical Parameters are at T

PARAMETER TEST CONDITIONS MIN TYP MAX UNITS

=25oC Thermal Information

A

Thermal Resistance (Typical, Note 1) θJA (oC/W)

PLCC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

Die Characteristics

Transistor Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224

Diode Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Die Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174 x 120

Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Connected

Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bipolar-DI

= 25oC, Min-Max Parameters are over Oper­ating Temperature Range, VB- = -48V, VB+ = +5V, AG = BG = 0V. All AC Parameters are specified at
600Ω 2-Wire terminating impedance.

A

AC TRANSMISSION PARAMETERS

RX Input Impedance 300Hz to 3.4kHz (Note 3) - 100 - kΩ
TX Output Impedance 300Hz to 3.4kHz (Note 3) - - 20 Ω
4-Wire Input Overload Level 300Hz to 3.4kHz RL = 1200Ω,

600Ω Reference

2-Wire Return Loss Matched for 600Ω (Note 3)

SRL LO 26 35 - dB
ERL 30 40 - dB
SRL HI 30 40 - dB

2-Wire Longitudinal to Metallic Balance
Off Hook

4-Wire Longitudinal Balance
Off Hook

Low Frequency Longitudinal Balance R.E.A. Test Circuit - - -67 dBmp

Longitudinal Current Capability I
Insertion Loss 0dBm at 1kHz, Referenced 600Ω

2-Wire/4-Wire -6.22 -6.02 -5.82 dB

Per ANSI/IEEE STD 455-1976 (Note 3) 300Hz
to 3400Hz

300Hz to 3400Hz (Note 3) 50 55 - dB

I

= 40mA TA = 25oC (Note 3) - - 23 dBrnC

LINE

= 40mA TA = 25oC (Note 3) - - 30 mA

LINE

+1.5 - - V

58 63 - dB

PEAK

RMS

4-Wire/2-Wire - ±0.05 ±0.2 dB
4-Wire/4-Wire -6.22 -6.02 -5.82 dB

2

HC5509A1R3060

Electrical Specifications Unless Otherwise Specified, Typical Parameters are at T

ating Temperature Range, VB- = -48V, VB+ = +5V, AG = BG = 0V. All AC Parameters are specified at
600Ω 2-Wire terminating impedance. (Continued)

PARAMETER TEST CONDITIONS MIN TYP MAX UNITS

Frequency Response 300Hz to 3400Hz (Note 3)

Referenced to Absolute Level at 1kHz,
0dBm Referenced 600Ω

Level Linearity Referenced to -10dBm (Note 3)

2-Wire to 4-Wire and 4-Wire to 2-Wire +3 to -40dBm - - ±0.05 dB

-40 to -50dBm - - ±0.1 dB

-50 to -55dBm - - ±0.3 dB

Absolute Delay (Note 3)

2-Wire/4-Wire fIN - 1kHz - 0.7 1.2 µs
4-Wire/2-Wire fIN - 1kHz - 0.3 1.0 µs

4-Wire/4-Wire fIN - 1kHz - 1.5 2.0 µs
Transhybrid Loss VIN = 1V
Total Harmonic Distortion

2-Wire/4-Wire, 4-Wire/2-Wire, 4-Wire/4-Wire

Reference Level 0dBm at 600Ω
300Hz to 3400Hz (Note 3)

at 1kHz (Note 3) 32 40 - dB

P-P

= 25oC, Min-Max Parameters are over Oper-

A

- ±0.02 ±0.05 dB

- - -52 dB

Idle Channel Noise

2-Wire and 4-Wire C-Message (Note 3) - - 5 dBrnC

Psophometric - - -85 dBmp
3kHz Flat - - 15 dBrn

Power Supply Rejection Ratio (Note 3)

VB+ to 2-Wire 25 29 - dB

VB+ to 4-Wire 25 29 - dB

VB- to 2-Wire 25 29 - dB

VB- to 4-Wire 25 29 - dB

VB+ to 4-Wire (Note 3)

VB+ to 2-Wire 25 - - dB

VB- to 4-Wire 25 25 - dB

VB- to 2-Wire 25 25 - dB
Ring Sync Pulse Width 50 - 500 µs

DC PARAMETERS

Loop Current Programming

Limit Range (Note 4) 20

30Hz to 200Hz, RL = 600Ω

25 - - dB

200Hz to 16kHz, RL = 600Ω

-60mA

(Note 4)

Accuracy 10 - - %
Loop Current During Power Denial RL = 200Ω - ±3 ±5mA

3

HC5509A1R3060

Electrical Specifications Unless Otherwise Specified, Typical Parameters are at T

= 25oC, Min-Max Parameters are over Oper-

A

ating Temperature Range, VB- = -48V, VB+ = +5V, AG = BG = 0V. All AC Parameters are specified at
600Ω 2-Wire terminating impedance. (Continued)

PARAMETER TEST CONDITIONS MIN TYP MAX UNITS

Fault Currents

TIP to Ground -3845mA

RING to Ground -5460mA

TIP and RING to Ground - 85 95 mA
Switch Hook Detection Threshold - 12 15 mA
Ground Key Detection Threshold 9.5 13.5 17.5 mA
Thermal ALARM Output Safe Operating Die Temperature Exceeded 140 - 160

o

Ring Trip Comparator Threshold See Typical Applications for more inf ormation 9.5 13.5 17.5 mA
Dial Pulse Distortion - 0.1 0.5 ms
Relay Driver Outputs

On Voltage V

OL

IOL (PR) = 60mA, IOL (RD) = 60mA - 0.2 0.5 V

Off Leakage Current VOH = 13.2V - ±10 ±100 µA
TTL/CMOS Logic Inputs (RC, PD, RS, TST,

PRI)

Logic ‘0’ V

IL

- - 0.8 V

C

Logic ‘1’ V

IH

2.0 - 5.5 V
Input Current (RC, PD, RS, TST, PRI) 0V ≤ VIN≤ 5V - - ±100 µA
Logic Outputs

Logic ‘0’ V
Logic ‘1’ V

OL

OH

I

= 800µA - 0.1 0.5 V

LOAD

I

= 40µA 2.7 - - V

LOAD

Power Dissipation On Hook Relay Drivers Off - 200 - mW
I

B+

I

B-

VB+ = +5.25V, VB- = -58V, R
VB+ = +5.25V, VB- = -58V, R

= ∞ --6mA

LOOP

= ∞ -6 - - mA

LOOP

UNCOMMITTED OP AMP PARAMETERS

Input Offset Voltage - ±5-mV
Input Offset Current - ±10 - nA
Differential Input Resistance (Note 2) - 1 - MΩ
Output Voltage Swing RL = 10kΩ - ±3-V

P-P

Small Signal GBW - 1 - MHz

NOTES:

3. Absolute maximum ratings are limiting values, applied individually, beyond which the serviceability of the circuit may be impaired. Func­tional operability under any of these conditions is not necessarily implied.

4. These parameters are controlled by design or process parameters and are not directly tested. These parameters are characterized upon
initial design release, upon design changes which would affect these characteristics, and at intervals to assure product quality and spec­ification compliance.

5. Application limitation based on maximum switch hook detect limit and metallic currents. Not a part limitation.

4

HC5509A1R3060

Pin Descriptions

SOIC SYMBOL DESCRIPTION

1 AG Analog Ground - To be connected to zero potential. Serves as a reference for the transmit output and re-

ceive input terminals.

2 VB+ Positive Voltage Source - Most Positive Supply.

3 C1 Capacitor #C1 - An e xternal capacitor to be connected between this terminal and analog ground. Required

for proper operation of the loop current limiting function.

4 PD Power Denial - A low active TTL-compatible logic input. When enabled, the output of the ring amplifier will

ramp to close to the output voltage of the tip amplifier.

5 RC Ring Command - A low active TTL-compatible logic input. When enabled, the rela y driver (RD) output goes

low on the next high level of the ring sync (RS) input, as long as the SLIC is not in the power down mode
(TST = 0) or the subscriber is not already off-hook (SHD = 0).

6 RS Ring Synchronization Input - A TTL - compatible clock input. The clock is arranged such that a positive

pulse (50 - 500µs) occurs on the zero crossing of the ring voltage source, as it appears at the RFS terminal.
For Tip side injected systems, the RS pulse should occur on the negative going zero crossing and for Ring
injected systems, on the positive going zero crossing. This ensures that the ring relay activates and deac­tivates when the instantaneous ring voltage is near zero. If synchronization is not required, the pin should
be tied to +5.

7 SHD Switch Hook Detection - An active low LS TTL compatible logic output. A line supervisory output.

8 GKD Ground Key Detection - An active low LS TTL compatible logic output. A line supervisory output.

9 TST A TTL logic input. A low on this pin will keep the SLIC in a power down mode. The TST pin in conjunction

with the ALM pin can provide thermal shutdown protection for the SLIC. Thermal shutdown is implemented
by a system controller that monitors the ALM pin. When the ALM pin is active (low) the system controller
issues a command to the Test pin (low) to power down the SLIC . The timing of the thermal recov ery is con­trolled by the system controller.

10 ALM A TTL compatible active low output which responds to the thermal detector circuit when a safe operating

die temperature has been exceeded. Reference the TST pin description for a method to reduce prolonged
thermal overstress that may reduce component life.

11 ILMT Loop Current Limit - Voltage on this pin sets the short loop current limiting conditions using a resistive volt-

age divider.

12 OUT1 The analog output of the spare operational amplifier.

13 -IN1 The inverting analog input of the spare operational amplifier.

14 TIP An analog input connected to the TIP (more positive) side of the subscriber loop through a feed resistor

and ring relay contact. Functions with the RING terminal to receive voice signals from the telephone and
for loop monitoring purpose.

15 RING An analog input connected to the RING (more negative) side of the subscriber loop through a f eed resistor.

Functions with the TIP terminal to receive voice signals from the telephone and for loop monitoring purposes.

16 RFS Ring Feed Sense - Senses RING side of the loop for Ground Key Detection. During Ring injected ringing

the ring signal at this node is isolated from RF via the ring relay. For Tip injected ringing, the RF and RFS
pins must be shorted.

17 VRX Receive Input, 4-Wire Side - A high impedance analog input. AC signals appearing at this input drive the

Tip Feed and Ring Feed amplifiers differentially.

18 LAO Longitudinal Amplifier Output - A low impedance output to be connected to C2 through a low pass filter.

Output is proportional to the difference in I

TIP

and I

RING

.

5

HC5509A1R3060

Pin Descriptions

(Continued)

SOIC SYMBOL DESCRIPTION

19 VTX Transmit Output, 4-Wire Side - A low impedance analog output which represents the differential voltage

across TIP and RING. Transhybrid balancing must be performed beyond this output to completely imple­ment two to four wire conversion. This output is referenced to analog ground. Since the DC level of this
output varies with loop current, capacitive coupling to the next stage is necessary.

20 PRI A TTL compatible input used to control PR. PRI active High = PR active low.

21 PR An active low open collector output. Can be used to drive a Polarity Reversal Relay.

22 BG Battery Ground - Tube connected to zero potential. All loop current and some quiescent current flows into

this terminal.

23 RD Ring Relay Driver - An active low open collector output. Used to drive a relay that switches ringing signals

onto the 2-Wire line.

24 VFB Feedback input to the tip feed amplifier; may be used in conjunction with transmit output signal and the

spare op amp to accommodate 2-Wire line impedance matching.

25 TF Tip Feed - A low impedance analog output connected to the TIP terminal through a feed resistor. Functions

with the RF terminal to provide loop current, and to feed voice signals to the telephone set and to sink lon­gitudinal currents.

26 RF Ring Feed - A low impedance analog output connected to the RING terminal through a feed resistor. Func-

tions with the TF terminal to provide loop current, feed voice signals to the telephone set, and to sink lon­gitudinal currents.

27 VB- The battery voltage source. The most negative supply.

28 C2 Capacitor #2 - An external capacitor to be connected between this terminal and ground. It prevents false

ring trip detection from occurring when longitudinal currents are induced onto the subscriber loop from pow­er lines and other noise sources. This capacitor should be nonpolarized.

Pinout

HC4P5509A1R3060 (PLCC)

TOP VIEW

RC
RS

SHD

GKD

TST

ALM

ILMT

PD

C1

5
6
7
8

9
10
11

12 13 14 15 16 17 18

VB+AGC2

1234

VB-

RF

262728

TF

25

VFB

24

RD

23

BG

22

PR

21

PRI

20

VTX

19

OUT1

-IN1

TIP

6

RING

RFS

VRX

LAO

Functional Diagram

HC5509A1R3060

PLCC

TF

TIP

RING

RFS

RF

25

14

15

16

26

R = 108kΩ

TF

R

+

R
R
R

R

4.5K

100K
100K
100K
100K

4.5K

RF

90K
90K

+

+

LA

+

C1

TA

25K

25K

R

R

R/2

2R

2R

2R

90K

3

VRX OUT 1

17 12

RF1

VB/2

REF

18

SHD

RTD
GKD

-IN 1

OP AMP

+

28

C2LAO ILMT

VFB

13 24 19 2

FAULT

DET

GM

VTX

+

THERM

LTD

RF2

11

VB+

BIAS

NETWORK

SW

TSD

GK

RFC

AG

1

22

BG

27

VB-

4

PD

5

RC

6

RS

9

TST

20

PRI

21

PR

23

IIL LOGIC INTERFACE

RD

7

SHD

8

GKD

10

ALM

Overvoltage Protection and Longitudinal
Current Protection

The SLIC device, in conjunction with an external protection
bridge, will withstand high voltage lightning surges and
power line crosses.

High voltage surge conditions are as specified in Table 1.
The SLIC will withstand longitudinal currents up to a

maximum or 30mA
performance degradation.

.

RMS

, 15mA

per leg, without any

RMS

TABLE 1.

PARAMETER

Longitudinal
Surge

TEST

CONDITION

10µs Rise/ ±1000 (Plastic) V
1000µs Fall

PERFORMANCE

(MAX) UNITS

Metallic Surge 10µs Rise/ ±1000 (Plastic) V

1000µs Fall
T/GND 10µs Rise/ ±1000 (Plastic) V
R/GND 1000µs Fall
50/60Hz Current

T/GND 11 Cycles 700 (Plastic) V
R/GND Limited to

10A

RMS

PEAK

PEAK

PEAK

RMS

7

Logic Diagram

RS

TTL TO I

HC5509A1R3060

2

L

RC

GK

SH

TST

PD

I

PD

PD = 0, IPD = ACTIVE

KEY

RELAY

DRIVER

2

I

TSD

BN

INJ

A
B

C

A
B
C

RD

L TO TTL

GKD

SHD

ALM

NOTE: PRI and PD are independent switch driven by TTL input levels.

8

Applications Diagram

C

S1

R

S1

TIP

PRIMARY

PROTECTION

RING

K

1A

SECONDARY
PROTECTION

(NOTE)

R

B3

PTC

Z

1

C

5

HC5509A1R3060

SYSTEM CONTROLLER

K

SHD GKD PRI RS TST PD ALM RC

1

K

2

R

V

RING

PEAK

B2

R

S2

C

S2

(MAX)

R

R

B1

K

1B

150V

B4

RD
PR
TIP

TF

VB-

RF

RFS

RING

VB- BG C2 AG VB+ C1

C

C

3

SLIC

HC4P5509A1R3060

F2

R

I

LIMIT

VRX+

R

VFB

VTX

-IN1

OUT1

LAO

C

4

L1

C

AC

KR

F

KZ

0

L2

FROM PCM
FILTER/CODER

TO HYBRID
BALANCE
NETWORK

R

F1

C

F1

NOTE: Secondary protection diode

bridge recommended is 3A,

+5V

R

F2

200V type.

FIGURE 1. TYPICAL LINE CIRCUIT APPLICATION WITH THE MONOLITHIC SLIC

TYPICAL COMPONENT VALUES

= 0.5µF, 30V

C

1

= RF2 = 210kΩ, 1%

R

F1

= CF2 = 0.22µF, 10%, 20V Nonpolarized

C

F1

= 0.01µF, 100V, ±20%

C

3

= 0.01µF, 100V, ±20%

C

4

= 0.01µF, 100V, ±20%

C

5

= 0.5µF, 20V

C

AC

= 30kΩ, (Z0 = 600Ω)

KZ

0

, RL2; Current Limit Setting Resistors:

R

L1

NOTES:

1. All grounds (AG, BG) must be applied before VB+ or VB-. Failure to do so may result in premature failure of the part. If a user wishes to
run separate grounds off a line card, the AG must be applied first.

2. Application shows Ring Injected Ringing, a Balanced or Tip injected configuration may be used.

I

= (0.6) (RL1 + RL2)/(200 x RL2), RL1 typically 100kΩ

LIMIT

= 20kΩ

KR

F

= RB2 = RB3 = RB4 = 50Ω 0.1% absolute matching

R

B1

= RS2 = 1kΩ typically

R

S1

= CS2 = 0.1µF, 200V typically, depending on V

C

S1

Ring

line length.

= 150V to 200V transient protector. PTC used as ring

Z

1

generator ballast.

and

9

HC5509A1R3060

Plastic Leaded Chip Carrier Packages (PLCC)

0.042 (1.07)

0.048 (1.22)
PIN (1) IDENTIFIER

0.020 (0.51) MAX
3 PLCS

C

L

D1

D

0.026 (0.66)

0.032 (0.81)

0.050 (1.27) TP

0.042 (1.07)

0.056 (1.42)

C

L

E1

E

0.013 (0.33)

0.021 (0.53)

0.004 (0.10) C

0.025 (0.64)

0.045 (1.14)

D2/E2

D2/E2

A1

A

-C-

VIEW “A”

0.020 (0.51)
MIN

SEATING
PLANE

R

N28.45 (JEDEC MS-018AB ISSUE A)

28 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE

INCHES MILLIMETERS

SYMBOL

A 0.165 0.180 4.20 4.57 -

A1 0.090 0.120 2.29 3.04 -

D 0.485 0.495 12.32 12.57 ­D1 0.450 0.456 11.43 11.58 3
D2 0.191 0.219 4.86 5.56 4, 5

E 0.485 0.495 12.32 12.57 ­E1 0.450 0.456 11.43 11.58 3
E2 0.191 0.219 4.86 5.56 4, 5

N28 286

NOTESMIN MAX MIN MAX

Rev. 1 3/95

0.045 (1.14)
MIN

VIEW “A” TYP.

0.025 (0.64)
MIN

NOTES:

1. Controlling dimension: INCH. Con verted millimeter dimensions
are not necessarily exact.

2. Dimensions and tolerancing per ANSI Y14.5M-1982.

3. Dimensions D1 and E1 do not include mold protrusions. Allow­able mold protrusion is 0.010 inch (0.25mm) per side.

4. To be measured at seating plane contact point.

-C-

5. Centerline to be determined where center leads exit plastic body.

6. “N” is the number of terminal positions.

10