Intersil Corporation FSS230R, FSS230D Datasheet

June 1998
FSS230D , FSS230R
8A, 200V, 0.440 Ohm, Rad Hard,
SEGR Resistant, N-Channel Power MOSFETs
Features
• 8A, 200V, r
- Meets Pre-RAD Specifications to 100K RAD (Si)
• Single Event
- Safe Operating Area Curve for Single Event Effects
- SEE Immunity for LET of 36MeV/mg/cm V
up to 80% of Rated Breakdown and
DS
V
of 10V Off-Bias
GS
• Dose Rate
- Typically Survives 3E9 RAD (Si)/s at 80% BV
- Typically Survives 2E12 if Current Limited to I
• Photo Current
- 3.0nA Per-RAD(Si)/s Typically
• Neutron
- Maintain Pre-RAD Specifications for 1E13 Neutrons/cm
- Usable to 1E14 Neutrons/cm
DS(ON)
= 0.440
2
2
with
DSS
DM
2
Ordering Information
RAD LEVEL SCREENING LEVEL PART NUMBER/BRAND
10K Commercial FSS230D1 10K TXV FSS230D3 100K Commercial FSS230R1 100K TXV FSS230R3 100K Space FSS230R4
Description
The Discrete Products Operation of Intersil Corporation has developed a series of Radiation Hardened MOSFETs specif­ically designed for commercial and military space applica­tions. Enhanced Power MOSFET immunity to Single Event Effects (SEE), Single Event Gate Rupture (SEGR) in particu­lar, is combined with 100K RADS of total dose hardness to provide devices which are ideally suited to harsh space envi­ronments. The dose rate and neutron tolerance necessary for military applications have not been sacrificed.
The Intersil portfolio of SEGR resistant radiation hardened MOSFETs includes N-Channel and P-Channel devices in a variety of voltage, current and on-resistance ratings. Numerous packaging options are also available.
This MOSFET is an enhancement-mode silicon-gate power field-effect transistor of the vertical DMOS (VDMOS) struc­ture. It is specially designed and processed to be radiation tolerant. The MOSFET is well suited for applications exposed to radiation environments such as switching regula­tion, switching converters, motor drives, relay drivers and drivers for high-power bipolar switching transistors requiring high speed and low gate drive power. This type can be operated directly from integrated circuits.
Reliability screening is available as either commercial, TXV equivalent of MIL-S-19500, or Space equivalent of MIL-S-19500. Contact Intersil for any desired deviations from the data sheet.
Symbol
D
G
Formerly available as type TA17637.
Package
TO-257AA
S
D
G
CAUTION: Beryllia Warning per MIL-S-19500
refer to package specifications.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207
| Copyright © Intersil Corporation 1999
3-77
S
File Number 4054.2
FSS230D, FSS230R
Absolute Maximum Ratings T
= 25oC, Unless Otherwise Specified
C
FSS230D, FSS230R UNITS
Drain to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Drain to Gate Voltage (RGS = 20k) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DS
DGR
200 V 200 V
Continuous Drain Current
TC = 25oC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
TC = 100oC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
D D
DM
GS
8A 5A
24 A
±20 V
Maximum Power Dissipation
TC = 25oC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .P
TC = 100oC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .P
T T
50 W 20 W
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.40 W/oC
Single Pulsed Avalanche Current, L = 100µH, (See Test Figure). . . . . . . . . . . . . . . . . . . . . . I
Continuous Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Source Current (Body Diode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TJ, T
STG
Lead Temperature (During Soldering) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
AS
S
SM
L
24 A
8A
24 A
-55 to 150 300
o
C
o
C
(Distance >0.063in (1.6mm) from Case, 10s Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Specifications T
= 25oC, Unless Otherwise Specified
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage BV Gate Threshold Voltage V
DSSID
GS(TH)VGS
= 1mA, VGS = 0V 200 - - V
= VDS,
ID = 1mA
TC = -55oC - - 5.0 V TC = 25oC 1.5 - 4.0 V TC = 125oC 0.5 - - V
Zero Gate Voltage Drain Current I
Gate to Source Leakage Current I
DSS
GSS
VDS = 160V, VGS = 0V
TC = 25oC--25µA TC = 125oC - - 250 µA
VGS = ±20V TC = 25oC - - 100 nA
TC = 125oC - - 200 nA Drain to Source On-State Voltage V Drain to Source On Resistance r
Turn-On Delay Time t
DS(ON)VGS
DS(ON)12ID
d(ON)
Rise Time t Turn-Off Delay Time t
d(OFF)
Fall Time t Total Gate Charge Q
g(TOT)VGS
Gate Charge at 12V Q Threshold Gate Charge Q Gate Charge Source Q Gate Charge Drain Q Plateau Voltage V
(PLATEAU)ID
Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Thermal Resistance Junction to Case R Thermal Resistance Junction to Ambient R
r
f
g(12)
g(TH)
gs
gd
ISS OSS RSS
JC
θ
JA
θ
= 12V, ID = 8A - - 3.70 V
= 5A,
VGS = 12V
VDD = 100V, ID = 8A, RL = 12.5, VGS 12V, RGS = 7.5
TC = 25oC - 0.320 0.440 TC = 125oC - - 0.744
- - 65 ns
- - 160 ns
- - 120 ns
- - 90 ns
= 0V to 20V VDD = 100V,
VGS = 0V to 12V - 33 42 nC
ID = 8A
- - 64 nC
VGS = 0V to 2V - - 3.1 nC
- 7.8 12 nC
-1722nC
= 8A, VDS = 15V - 8 - V
VDS = 25V, VGS = 0V, f = 1MHz
- 765 - pF
- 185 - pF
-45-pF
- - 2.5
o
C/W
--60oC/W
3-78
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
FSS230D, FSS230R
Forward Voltage V Reverse Recovery Time t
SD
rr
Electrical Specifications up to 100K RAD T
ISD = 8A 0.6 - 1.8 V ISD = 8A, dISD/dt = 100A/µs - - 340 ns
= 25oC, Unless Otherwise Specified
C
PARAMETER SYMBOL TEST CONDITIONS MIN MAX UNITS
Drain to Source Breakdown Volts (Note 3) BV Gate to Source Threshold Volts (Note 3) V Gate to Body Leakage (Notes 2, 3) I Zero Gate Leakage (Note 3) I Drain to Source On-State Volts (Notes 1, 3) V Drain to Source On Resistance (Notes 1, 3) r
DS(ON)12VGS
DSSVGS
GS(TH)VGS
GSS DSS
DS(ON)VGS
= 0, ID = 1mA 200 - V
= VDS, ID = 1mA 1.5 4.0 V VGS = ±20V, VDS = 0V - 100 nA VGS = 0, VDS = 160V - 25 µA
= 12V, ID = 8A - 3.70 V
= 12V, ID = 5A - 0.440
NOTES:
1. Pulse test, 300µs Max.
2. Absolute value.
3. Insitu Gamma bias must be sampled for both VGS = 12V, VDS = 0V and VGS = 0V, VDS = 80% BV
DSS
.
Single Event Effects (SEB, SEGR) (Note 4)
ENVIRONMENT (NOTE 5)
APPLIED
VGS BIAS
TEST SYMBOL
Single Event Effects Safe Operating Area
ION
SPECIES
SEESOA Ni 26 43 -20 200
Br 37 36 -5 200
TYPICAL LET (MeV/mg/cm)
TYPICAL
RANGE (µ)
Br 37 36 -10 160 Br 37 36 -15 100 Br 37 36 -20 40
NOTES:
4. Testing conducted at Brookhaven National Labs; sponsored by Naval Surface Warfare Center (NSWC), Crane, IN.
5. Fluence = 1E5 ions/cm2 (typical), T = 25oC.
6. Does not exhibit Single Event Burnout (SEB) or Single Event Gate Rupture (SEGR).
(V)
(NOTE 6)
MAXIMUM
VDS BIAS
(V)
Typical Performance Curves
LET = 26MeV/mg/cm2, RANGE = 43µ
240
200
160
(V)
120
DS
V
80
40
TEMP = 25oC
0
0 -10
LET = 37MeV/mg/cm2, RANGE = 36µ
FLUENCE = 1E5 IONS/cm2 (TYPICAL)
-5 VGS (V)
Unless Otherwise Specified
-15
-20 -25
LIMITING INDUCTANCE (HENRY)
1E-3
1E-4
1E-5
1E-6
1E-7
30
DRAIN SUPPLY (V)
ILM = 10A
30A
100A
300A
30010010
FIGURE 1. SINGLE EVENT EFFECTS SAFE OPERATING AREA FIGURE 2. DRAIN INDUCTANCE REQUIRED TO LIMIT
GAMMA DOT CURRENT TO I
AS
3-79
1000
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