Intersil Corporation FSL23A0D, FSL23A0R Datasheet

FSL23A0D, FSL23A0R

Data Sheet June 1999

6A, 200V, 0.350 Ohm, Radiation Hardened,
SEGR Resistant, N-Channel Power
MOSFETs

The Discrete Products Operation of Intersil Corporation has
developed a series of Radiation Hardened MOSFETs
specifically designed for commercial and military space
applications. Enhanced Power MOSFET immunity to Single
Event Effects (SEE), Single Event Gate Rupture (SEGR) in
particular, is combined with 100K RADS of total dose
hardness to providedeviceswhichareideallysuitedtoharsh
space environments. The dose rate and neutron tolerance
necessary for military applications have not been sacrificed.

The Intersil portfolio of SEGR resistant radiation hardened
MOSFETs includes N-Channel and P-Channel devices in a
variety of voltage, current and on-resistance ratings.
Numerous packaging options are also available.

This MOSFET is an enhancement-mode silicon-gate power
field-effect transistor of the vertical DMOS (VDMOS)
structure. It is specially designed and processed to be
radiation tolerant. The MOSFET is well suited for
applications exposed to radiation environments such as
switching regulation, switching converters, motor drives,
relay drivers and drivers for high-power bipolar switching
transistors requiring high speed and low gate drive power.
This type can be operated directly from integrated circuits.

Reliability screening is available as either commercial, TXV
equivalent of MIL-S-19500, or Space equivalent of
MIL-S-19500. Contact Intersil for any desired deviations
from the data sheet.

File Number 4476.2

Features

• 6A, 200V, r

• Total Dose

- Meets Pre-RAD Specifications to 100K RAD (Si)

• Single Event

- Safe Operating Area Curve for Single Event Effects

- SEE Immunity for LET of 36MeV/mg/cm
V

up to 80% of Rated Breakdown and

DS

V

of 10V Off-Bias

GS

• Dose Rate

- Typically Survives 3E9 RAD (Si)/s at 80% BV

- Typically Survives 2E12 if Current Limited to I

• Photo Current

- 3.0nA Per-RAD(Si)/s Typically

• Neutron

- Maintain Pre-RAD Specifications
for 1E13 Neutrons/cm

- Usable to 1E14 Neutrons/cm

DS(ON)

= 0.350Ω

2

2

with

2

Symbol

D

G

S

DSS

DM

Ordering Information

RAD LEVEL SCREENING LEVEL PART NUMBER/BRAND

10K Commercial FSL23A0D1
10K TXV FSL23A0D3
100K Commercial FSL23A0R1
100K TXV FSL23A0R3
100K Space FSL23A0R4

Formerly available as type TA17697.

4-1

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

Package

TO-205AF

G

S

D

1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 2000

FSL23A0D, FSL23A0R

Absolute Maximum Ratings T

= 25oC, Unless Otherwise Specified

C

FSL23A0D, FSL23A0R UNITS

Drain to Source Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V

Drain to Gate Voltage (RGS = 20kΩ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V

DS

DGR

200 V
200 V

Continuous Drain Current

TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I

TC = 100oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I

Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I

Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V

D
D

DM

GS

6A
4A

18 A

±20 V

Maximum Power Dissipation

TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P

TC = 100oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P

T
T

25 W
10 W

Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.20 W/oC

Single Pulsed Avalanche Current, L = 100µH, (See Test Figure) . . . . . . . . . . . . . . . . . . . . . . . . . .I

AS

Continuous Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I

Pulsed Source Current (Body Diode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I

Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, T

SM

STG

Lead Temperature (During Soldering) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T

S

L

18 A

6A

18 A

-55 to 150
300

o

C

o

C

(Distance >0.063in (1.6mm) from Case, 10s Max)

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

Electrical Specifications T

= 25oC, Unless Otherwise Specified

C

PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS

Drain to Source Breakdown Voltage BV
Gate Threshold Voltage V

GS(TH)VGS

Zero Gate Voltage Drain Current I

Gate to Source Leakage Current I

Drain to Source On-State Voltage V
Drain to Source On Resistance r

Turn-On Delay Time t

DS(ON)VGS

DS(ON)12ID

d(ON)

Rise Time t
Turn-Off Delay Time t

d(OFF)

Fall Time t
Total Gate Charge Q

g(TOT)VGS

Gate Charge at 12V Q
Threshold Gate Charge Q
Gate Charge Source Q
Gate Charge Drain Q
Plateau Voltage V

(PLATEAU)ID

Input Capacitance C
Output Capacitance C
Reverse Transfer Capacitance C
Thermal Resistance Junction to Case R
Thermal Resistance Junction to Ambient R

DSSID

DSS

GSS

r

f

g(12)

g(TH)

gs

gd

ISS
OSS
RSS

JC

θ

JA

θ

= 1mA, VGS = 0V 200 - - V

= VDS,

ID = 1mA

VDS = 160V,
VGS = 0V

TC = -55oC - - 5.0 V

= 25oC 1.5 - 4.0 V

T

C

= 125oC 0.5 - - V

T

C

TC = 25oC--25µA

= 125oC - - 250 µA

T

C

VGS = ±20V TC = 25oC - - 100 nA

= 125oC - - 200 nA

T

C

= 12V, ID = 6A - - 2.21 V

= 4A,

VGS = 12V
VDD = 100V, ID = 6A,

RL = 16.7Ω, VGS = 12V,
RGS = 7.5Ω

TC = 25oC - 0.280 0.350 Ω

= 125oC - - 0.637 Ω

T

C

- - 20 ns

- - 30 ns

- - 55 ns

- - 15 ns

= 0V to 20V VDD = 100V,

VGS = 0V to 12V - 34 38 nC

ID = 6A

- - 57 nC

VGS = 0V to 2V - - 1.9 nC

- 6.0 6.8 nC

-1820nC

= 6A, VDS = 15V - 7 - V

VDS = 25V, VGS = 0V,
f = 1MHz

- 750 - pF

- 180 - pF

-50-pF

- - 5.0

- - 175

o
o

C/W
C/W

4-2

Source to Drain Diode Specifications

PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS

Forward Voltage V
Reverse Recovery Time t

SD

rr

FSL23A0D, FSL23A0R

ISD = 6A 0.6 - 1.8 V
ISD = 6A, dISD/dt = 100A/µs - - 290 ns

Electrical Specifications up to 100K RAD T

= 25oC, Unless Otherwise Specified

C

PARAMETER SYMBOL TEST CONDITIONS MIN MAX UNITS

Drain to Source Breakdown Volts (Note 3) BV
Gate to Source Threshold Volts (Note 3) V
Gate to Body Leakage (Notes 2, 3) I
Zero Gate Leakage (Note 3) I
Drain to Source On-State Volts (Notes 1, 3) V
Drain to Source On Resistance (Notes 1, 3) r

DS(ON)VGS

DS(ON)12VGS

DSS

GS(TH)VGS

GSS
DSS

VGS = 0, ID = 1mA 200 - V

= VDS, ID = 1mA 1.5 4.0 V
VGS = ±20V, VDS = 0V - 100 nA
VGS = 0, VDS = 160V - 25 µA

= 12V, ID = 6A - 2.21 V

= 12V, ID = 4A - 0.350 Ω

NOTES:

1. Pulse test, 300µs Max.

2. Absolute value.

3. Insitu Gamma bias must be sampled for both VGS = 12V, VDS = 0V and VGS = 0V, VDS = 80% BV

DSS

.

Single Event Effects (SEB, SEGR) (Note 4)

ENVIRONMENT (NOTE 5)

TEST SYMBOL

ION

SPECIES

TYPICAL LET

(MeV/mg/cm)

TYPICAL

RANGE (µ)

Single Event Effects Safe Operating Area SEESOA Ni 26 43 -20 200

Br 37 36 -5 200
Br 37 36 -10 160
Br 37 36 -15 100
Br 37 36 -20 40

NOTES:

4. Testing conducted at Brookhaven National Labs; sponsored by Naval Surface Warfare Center (NSWC), Crane, IN.

5. Fluence = 1E5 ions/cm2 (typical), T = 25oC.

6. Does not exhibit Single Event Burnout (SEB) or Single Event Gate Rupture (SEGR).

APPLIED

V

BIAS

GS

(V)

(NOTE 6)

MAXIMUM

VDSBIAS (V)

Typical Performance Curves Unless Otherwise Specified

VGS (V)

2

, RANGE = 43µ

-15

-20 -25

LIMITING INDUCTANCE (HENRY)

1E-3

1E-4

1E-5

1E-6

1E-7

30

DRAIN SUPPLY (V)

GAMMA DOT CURRENT TO I

ILM = 10A

30A

100A

300A

30010010

AS

LET = 26MeV/mg/cm
LET = 37MeV/mg/cm2, RANGE = 36µ

FLUENCE = 1E5 IONS/cm2 (TYPICAL)

200

160

(V)

120

DS

V

80

40

TEMP = 25oC

0

0 -10

-5

FIGURE 1. SINGLE EVENT EFFECTS SAFE OPERATING AREA FIGURE2. DRAIN INDUCTANCEREQUIREDTO LIMIT

4-3

1000