Intersil Corporation FSJ055R Datasheet

FSJ055D, FSJ055R
Data Sheet October 1999 File Number 4250.5
70A, 60V, 0.012 Ohm, Radiation Hardened, SEGR Resistant, N-Channel Power MOSFETs
The Discrete Products Operation of Intersil has developed a series of Radiation Hardened MOSFETs specifically designed for commercial and military space applications. Enhanced Power MOSFET immunity to Single Event Effects (SEE), Single Event Gate Rupture (SEGR) in particular, is combined with 100K RADS of totaldose hardness to provide devices which are ideally suited to harsh space environments. The dose rate and neutron tolerance necessary for military applications have not been sacrificed.
The Intersil portfolio of SEGR resistant radiation hardened MOSFETs includes N-Channel and P-Channel devices in a variety of voltage, current and on-resistance ratings. Numerous packaging options are also available.
This MOSFET is an enhancement-mode silicon-gate power field-effect transistor of the vertical DMOS (VDMOS) structure. It is specially designed and processed to be radiation tolerant. The MOSFET is well suited for applications exposed to radiation environments such as switching regulation, switching converters, motor drives, relay drivers and drivers for high-power bipolar switching transistors requiring high speed and low gate drive power. This type can be operated directly from integrated circuits.
Features
• 70A, 60V, r
• Total Dose
- Meets Pre-RAD Specifications to 100K RAD (Si)
• Single Event
- Safe Operating Area Curve for Single Event Effects
- SEE Immunity for LET of 36MeV/mg/cm V
up to 80% of Rated Breakdown and
DS
V
of 10V Off-Bias
GS
• Dose Rate
- Typically Survives 3E9 RAD (Si)/s at 80% BV
- Typically Survives 2E12 if Current Limited to I
• Photo Current
- 6.0nA Per-RAD(Si)/s Typically
• Neutron
- Maintain Pre-RAD Specifications for 3E13 Neutrons/cm
- Usable to 3E14 Neutrons/cm
DS(ON)
= 0.012
2
2
with
2
Symbol
D
G
DSS
DM
Reliability screening is available as either commercial, TXV equivalent of MIL-S-19500, or Space equivalent of MIL-S-19500. Contact Intersil for any desired deviations from the data sheet.
Ordering Information
RAD LEVEL SCREENING LEVEL PART NUMBER/BRAND
10K Commercial FSJ055D1 10K TXV FSJ055D3 100K Commercial FSJ055R1 100K TXV FSJ055R3 100K Space FSJ055R4
Packaging
CAUTION: Beryllia Warning per MIL-S-19500
S
TO-254AA
G
S
D
refer to package specifications.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 407-727-9207
| Copyright © Intersil Corporation 1999
FSJ055D, FSJ055R
Absolute Maximum Ratings T
= 25oC, Unless Otherwise Specified
C
FSJ055D, FSJ055R UNITS
Drain to Source Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Drain to Gate Voltage (RGS = 20k) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DS
DGR
60 V 60 V
Continuous Drain Current
TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
TC = 100oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
D D
DM
GS
70 A
54 A 200 A ±20 V
Maximum Power Dissipation
TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .P
TC = 100oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .P
T T
125 W
50 W
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.20 W/oC
Single Pulsed Avalanche Current, L = 100µH, (See Test Figure) . . . . . . . . . . . . . . . . . . . . . . . . I
Continuous Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Source Current (Body Diode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TJ,T
STG
Lead Temperature (During Soldering) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
AS
S
SM
L
200 A
70 A
200 A
-55 to 150 300
o
C
o
C
(Distance >0.063 in. (1.6mm) from Case, 10s Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Specifications T
= 25oC, Unless Otherwise Specified
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage BV Gate Threshold Voltage V
DSSID
GS(TH)VGS
= 1mA, VGS = 0V 60 - - V
= VDS,
ID = 1mA
TC = -55oC - - 5.0 V TC = 25oC 1.5 - 4.0 V TC = 125oC 0.5 - - V
Zero Gate Voltage Drain Current I
Gate to Source Leakage Current I
DSS
GSS
VDS = 48V, VGS = 0V
TC = 25oC--25µA TC = 125oC - - 250 µA
VGS = ±20V TC = 25oC - - 100 nA
TC = 125oC - - 200 nA Drain to Source On-State Voltage V Drain to Source On Resistance r
Turn-On Delay Time t
DS(ON)VGS
DS(ON)12ID
D(ON)
Rise Time t Turn-Off Delay Time t
d(OFF)
Fall Time t Total Gate Charge Q
g(TOT)VGS
Gate Charge at 12V Q Threshold Gate Charge Q Gate Charge Source Q Gate Charge Drain Q Plateau Voltage V
(PLATEAU)ID
Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Thermal Resistance Junction to Case R Thermal Resistance Junction to Ambient R
r
f
g(12)
g(TH)
gs
gd
ISS OSS RSS
JC
θ
JA
θ
= 12V, ID = 70A - - 0.88 V
= 54A,
VGS = 12V VDD = 30V, ID = 70A,
RL = 0.43, VGS 12V, RGS = 2.35
TC = 25oC - 0.008 0.012 TC = 125oC - - 0.022
- - 40 ns
- - 200 ns
- - 70 ns
- - 40 ns
= 0V to 20V VDD = 30V,
VGS = 0V to 12V - 150 170 nC
ID = 70A
- - 280 nC
VGS = 0V to 2V - - 12 nC
-3543nC
-5981nC
= 70A, VDS = 15V - 7 - V
VDS = 25V, VGS = 0V, f = 1MHz
- 4850 - pF
- 2200 - pF
- 425 - pF
- - 0.83
o
C/W
--40oC/W
2
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Forward Voltage V Reverse Recovery Time t
SD
rr
FSJ055D, FSJ055R
ISD = 70A 0.6 - 1.8 V ISD = 70A, dISD/dt = 100A/µs - - 250 ns
Electrical Specifications up to 100K RAD T
PARAMETER SYMBOL TEST CONDITIONS MIN MAX UNITS
Drain to Source Breakdown Volts (Note 3) BV Gate to Source Threshold Volts (Note 3) V Gate to Body Leakage (Notes 2, 3) I Zero Gate Leakage (Note 3) I Drain to Source On-State Volts (Notes 1, 3) V Drain to Source On Resistance (Notes 1, 3) r
NOTES:
1. Pulse test, 300µs Max.
2. Absolute value.
3. Insitu Gamma bias must be sampled for both VGS = 12V, VDS = 0V and VGS = 0V, VDS = 80% BV
= 25oC, Unless Otherwise Specified
C
DSS
GS(TH)
GSS DSS
DS(ON)
DS(ON)12VGS
VGS = 0, ID = 1mA 60 - V VGS = VDS, ID = 1mA 1.5 4.0 V VGS = ±20V, VDS = 0V - 100 nA VGS = 0, VDS = 48V - 25 µA VGS = 12V, ID = 70A - 0.88 V
= 12V, ID = 54A - 0.012
DSS
.
Single Event Effects (SEB, SEGR) (Note 4)
ENVIRONMENT (NOTE 5)
ION
TEST SYMBOL
Single Event Effects Safe Operating Area
NOTES:
4. Testing conducted at Brookhaven National Labs; sponsored by Naval Surface Warfare Center (NSWC), Crane, IN.
5. Fluence = 1E5 ions/cm2 (typical), T = 25oC.
6. Does not exhibit Single Event Burnout (SEB) or Single Event Gate Rupture (SEGR).
SEESOA Ni 26 43 -20 60
SPECIES
Br 37 36 -10 60 Br 37 36 -15 48 Br 37 36 -20 36
I6031060 I6031-548 I 60 31 -10 36 I 60 31 -15 24 I 60 31 -20 12
TYPICAL LET
(MeV/mg/cm)
TYPICAL
RANGE (µ)
APPLIED V
BIAS (V)
GS
(NOTE 6)
MAXIMUM
VDS BIAS (V)
3
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