Intersil Corporation FRF9250R, FRF9250H, FRF9250D Datasheet

June 1998

FRF9250D, FRF9250R,

FRF9250H

14A, -200V, 0.315 Ohm, Rad Hard,

P-Channel Power MOSFETs

Features

• 14A, -200V, RDS(on) = 0.315Ω

• Second Generation Rad Hard MOSFET Results From New Design Concepts

• Gamma - Meets Pre-Rad Specifications to 100KRAD(Si)

- Defined End Point Specs at 300KRAD(Si) and 1000KRAD(Si)

- Performance Permits Limited Use to 3000KRAD(Si)

• Gamma Dot - Survives 3E9RAD(Si)/sec at 80% BVDSS Typically

- Survives 2E12 Typically If Current Limited to IDM

• Photo Current - 12.0nA Per-RAD(Si)/sec Typically

• Neutron - Pre-RAD Specifications for 1E13 Neutrons/cm

- Usable to 1E14 Neutrons/cm

2

2

Description

The Intersil Corporation has designed a series of SECOND GENERATION hard­ened power MOSFETs of both N and P channel enhancement types with ratings
from 100V to 500V, 1A to 60A, and on resistance as low as 25mΩ. Total dose
hardness is offered at 100K RAD(Si) and 1000KRAD(Si) with neutron hardness
ranging from 1E13n/cm
rate hardness (GAMMA DOT) exists for rates to 1E9 without current limiting and
2E12 with current limiting.

This MOSFET is an enhancement-mode silicon-gate power field effect transistor of
the vertical DMOS (VDMOS) structure. It is specially designed and processed to
exhibit minimal characteristic changes to total dose (GAMMA) and neutron (n
exposures. Design and processing efforts are also directed to enhance survival to
heavy ion (SEE) and/or dose rate (GAMMA DOT) exposure.

2

for 500V product to 1E14n/cm2 for 100V product. Dose

Package

TO-254AA

CAUTION: Beryllia Warning per MIL-S-19500

refer to package specifications.

Symbol

o

)

This part may be supplied as a die or in various packages other than shown above .
Reliability screening is available as either non TX (commercial), TX equivalent of
MIL-S-19500, TXV equivalent of MIL-S-19500, or space equivalent of
MIL-S-19500. Contact the Intersil Corporation High-Reliability Marketing group for
any desired deviations from the data sheet.

Absolute Maximum Ratings (TC = +25

Drain-Source Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VDS -200 V

Drain-Gate Voltage (RGS = 20kΩ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR -200 V

Continuous Drain Current

TC = +25

TC = +100oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID

Pulsed Drain Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM 42 A

Gate-Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VGS ±20 V

Maximum Power Dissipation

TC = +25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PT

TC = +100oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PT

Derated Above +25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Inductive Current, Clamped, L = 100µH, (See Test Figure). . . . . . . . . . . . . . . . . . . . . . . . . . ILM 42 A

Continuous Source Current (Body Diode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .IS 14 A

Pulsed Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ISM 42 A

Operating And Storage Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJC, TSTG -55 to +150

Lead Temperature (During Soldering)

Distance > 0.063 in. (1.6mm) From Case, 10s Max. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL 300

o

C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID

o

C) Unless Otherwise Specified

FRF9250D, R, H UNITS

14

9

125

50

1.00

A
A

W
W

W/oC

o

C

o

C

File Number 3247.1

1

FRF9250D, FRF9250R, FRF9250H

Pre-Radiation Electrical Specifications TC = +25

o

C, Unless Otherwise Specified

LIMITS

PARAMETER SYMBOL TEST CONDITIONS

Drain-Source Breakdown Volts BVDSS VGS = 0, ID = 1mA -200 - V
Gate-Threshold Volts VGS(th) VDS = VGS, ID = 1mA -2.0 -4.0 V
Gate-Body Leakage Forward IGSSF VGS = -20V - 100 nA
Gate-Body Leakage Reverse IGSSR VGS = +20V - 100 nA
Zero-Gate Voltage

Drain Current

IDSS1
IDSS2
IDSS3

VDS = -200V, VGS = 0
VDS = -160V, VGS = 0
VDS = -160V, VGS = 0, TC = +125oC

-

-

-

1

0.025

0.25
Rated Avalanche Current IAR Time = 20µs - 42 A
Drain-Source On-State Volts VDS(on) VGS = -10V, ID = 14A - -4.63 V
Drain-Source On Resistance RDS(on) VGS = -10V, ID = 9A - 0.315 Ω
Turn-On Delay Time td(on) VDD = -100V, ID = 14A - 102
Rise Time tr Pulse Width = 3µs - 242
Turn-Off Delay Time td(off) Period = 300µs, Rg = 25Ω - 658
Fall Time tf 0 ≤ VGS ≤ 10 (See Test Circuit) - 278
Gate-Charge Threshold QG(th)

Gate-Charge Total QGM 125 502

VDD = -100V, ID = 14A

312

IGS1 = IGS2

Plateau Voltage VGP 2 10 V

0 ≤ VGS ≤ 20

Gate-Charge Source QGS 10 42
Gate-Charge Drain QGD 21 86
Diode Forward Voltage VSD ID = 14A, VGD = 0 -0.6 -1.8 V
Reverse Recovery Time TT I = 14A; di/dt = 100A/µs - 600 ns
Junction-To-Case Rθjc - 1.0
Junction-To-Ambient Rθja Free Air Operation - 48

UNITSMIN MAX

o

mA

ns

ncGate-Charge On State QG(on) 62 248

nc

C/W

0V

V

GS

= -12V

ELECTRONIC SWITCH OPENS

WHEN I

V

DD

R

L

V

DS

VARY t

TO OBTAIN

DUT

0V

R

GS

P

REQUIRED PEAK I

t

P

VGS≤ 20V

CURRENT

TRANSFORMER

50Ω

AS

V

DS

L

+

I

AS

-

50Ω

DUT

IS REACHED

AS

FIGURE 1. RESISTIVE SWITCHING TEST CIRCUIT FIGURE 2. UNCLAMPED ENERGY TEST CIRCUIT

2

+

V

DD

-

50V-150V