• Maximum Input Current of 1µA at 18V Over Full Pack-
age Temperature Range; 100nA at 18V and +25
• Noise Margin (Over Full Package/Temperature Range)
- 1V at VDD = 5V
- 2V at VDD = 10V
- 2.5V at VDD = 15V
• Standardized Symmetrical Output Characteristics
• Meets All Requirements of JEDEC Tentative Standard
No. 13B, “Standard Specifications for Description of
‘B’ Series CMOS Devices”
Applications
• Numerical Control
• Instrumentation
• Digital Filtering
• Frequency Synthesis
CMOS BCD Rate Multiplier
Description
CD4527BMS is a low power 4-bit digital rate multiplier that
provides an output pulse rate which is the clock input pulse
rate multiplied by 1/10 times the BCD input. For example,
when the BCD input is 8, there will be 8 output pulses for
every 10 input pulses. This device may be used to perform
arithmetic operations (add, subtract, divide, raise to a
power), solve algebraic and differential equations, generate
natural logarithms and trigonometric functions, A/D and D/A
o
C
conversion, and frequency division.
For fractional multipliers with more than one digit,
CD4527BMS devices may be cascaded in two different
modes: the Add mode and the Multiply mode (see Figures 9
and 11). In the Add mode,
2. The parameters listed on Table 3 are controlled via design or process and are not directly tested. These parameters are characterized
on initial design release and upon design changes which would affect these characteristics.
3. CL = 50pF, RL = 200K, Input TR, TF < 20ns.
4. If more than one unit is cascaded, TRCL should be made less than or equal to the sumof the transition time and the fixed propagation
delay of the output of the driving stage for the estimated capacitive load.
NOTE: 1. 5% Parameteric, 3% Functional; Cumulative for Static 1 and 2.
CONFORMANCE GROUPS
Group E Subgroup 250051, 7, 9Table 41, 9Table 4
FUNCTIONOPENGROUNDVDD9V ± -0.5V
Static Burn-In 1
Note 1
Static Burn-In 2
Note 1
Dynamic BurnIn Note 1
Irradiation
Note 2
NOTES:
1. Each pin except VDD and GND will have a series resistor of 10K ± 5%, VDD = 18V ± 0.5V
2. Each pin except VDD and GND will have a series resistor of 47K ± 5%; Group E, Subgroup 2, sample size is 4 dice/wafer, 0 failures,
VDD = 10V ± 0.5V
1, 5-72-4, 8-1516
1, 5-782-4, 9-16
-2, 4, 8, 10, 12-153, 161, 5-7911
1, 5-782-4, 9-16
METHODGROUP A SUBGROUPSREAD AND RECORD
TABLE 7. TOTAL DOSE IRRADIATION
MIL-STD-883
METHOD
TABLE 8. BURN-IN AND IRRADIATION TEST CONNECTIONS
PRE-IRRADPOST-IRRADPRE-IRRADPOST-IRRAD
(Continued)
TESTREAD AND RECORD
OSCILLATOR
50kHz25kHz
7-1221
Logic Diagram
CD4527BMS
14*
15
11*
INHIBIT IN
9*
CLOCK
VDD
A
*
B
2
*
C
*
3
D
TQ
A
C
Q
R
TQ
B
C
Q
R
S
TQ
C
C
Q
R
ALL INPUTS ARE PROTECTED
*
BY CMOS PROTECTION
NETWORK
*
STROBE*CASCADE
1012
R1
R2
R3
R4
VSS
VSS = 8
VDD = 16
OUT
OUT
6
5
4*
SET TO
“9”
13*
CLEAR
S
TQ
D
Q
C
R
FIGURE 1.
“9”
INHIBIT
OUT
1
7
7-1222
CD4527BMS
TRUTH TABLE
INPUTSOUTPUTS
NUMBER OF PULSES OR INPUT LOGIC LEVEL
(0 = Low; 1 = High; X = Don’t Care)
NUMBER OF PULSES OR OUTPUT LOGIC LEVEL
(L = Low; H = High)
DCBA CLKINH INSTRCASCLR *SET *OUTOUTINH OUT“9” OUT
0
0
0
0
10
0
0
0
1
10
0
0
1
0
10
0
0
1
1
10
0
1
0
0
10
0
1
0
1
10
0
1
1
0
10
0
1
1
1
10
1
0
0
0
10
1
0
0
1
10
1
0
1
0
10
1
0
1
1
10
1
1
0
0
10
1
1
0
1
10
1
1
1
0
10
1
1
1
1
10
X
X
X
X
10
X
X
X
X
10
X
X
X
X
10
1
X
X
X
10
0
X
X
X
10
X
X
X
X
10
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
**
10
L
1
2
3
4
5
6
7
8
9
8
9
8
9
8
9
L
H
L
L
***
10
H
1
2
3
4
5
6
7
8
9
8
9
8
9
8
9
**
H
H
H
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
H
1
1
H
H
L
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
**
1
1
L
L
H
* Clear and Set Inputs should not be high at the same time; device draws increased quiescent current when in this non-valid state.
** Depends on internal state of counter.
*** Output same as the first 16 lines of this truth table (depending on values of A, B, C, D).
Typical Performance Characteristics
AMBIENT TEMPERATURE (TA) = +25oC
30
25
20
15
10
5
OUTPUT LOW (SINK) CURRENT (IOL) (mA)
051015
GATE-TO-SOURCE VOLTAGE (VGS) = 15V
10V
5V
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
FIGURE 2. TYPICAL OUTPUT LOW (SINK) CURRENT
CHARACTERISTICS
FIGURE 3. MINIMUM OUTPUT LOW (SINK) CURRENT
AMBIENT TEMPERATURE (TA) = +25oC
15.0
12.5
10.0
7.5
5.0
2.5
OUTPUT LOW (SINK) CURRENT (IOL) (mA)
051015
GATE-TO-SOURCE VOLTAGE (VGS) = 15V
10V
5V
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
CHARACTERISTICS
7-1223
CD4527BMS
Typical Performance Characteristics (Continued)
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
0-5-10-15
AMBIENT TEMPERATURE (TA) = +25oC
GATE-TO-SOURCE VOLTAGE (VGS) = -5V
0
-5
-10
-15
-10V
-20
-25
-15V
-30
FIGURE 4. TYPICAL OUTPUT HIGH (SOURCE) CURRENT
CHARACTERISTICS
5
10
8
AMBIENT TEMPERATURE (TA) = +25oC
6
4
SUPPLY VOLTAGE (VDD) = 15V
2
4
10
POWER DISSIPATION PER (PD) (µW)
8
6
4
2
5V
3
10
8
6
4
2
2
10
8
6
4
2
10
1
10V
8642
10V
CL = 50pF
CL = 15pF
8642
2
10
10
3
10
4
10
INPUT FREQUENCY (fIN) (kHz)
FIGURE 6. TYPICAL DYNAMIC POWER DISSIPATION AS A
FUNCTION OF INPUT FREQUENCY
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
AMBIENT TEMPERATURE (TA) = +25oC
GATE-TO-SOURCE VOLTAGE (VGS) = -5V
-15V
OUTPUT HIGH (SOURCE) CURRENT (IOH) (mA)
FIGURE 5. MINIMUM OUTPUT HIGH (SOURCE) CURRENT
CHARACTERISTICS
200
AMBIENT TEMPERATURE (TA) = +25oC
150
100
50
864286428642
PROPAGATION DELAY TIME (tPHL, tPLH) (ns)
0
20406080100
LOAD CAPACITANCE (CL) (pF)
FIGURE 7. TYPICAL PROPAGATION DELAY TIME AS A FUNC-
TION OF LOAD CAPACITANCE (CLOCK OR
STROBE TO OUT)
-10V
SUPPLY VOLTAGE (VDD) = 15V
0-5-10-15
0
-5
-10
-15
OUTPUT HIGH (SOURCE) CURRENT (IOH) (mA)
10V
5V
AMBIENT TEMPERATURE (TA) = +25oC
200
150
SUPPLY VOLTAGE (VDD) = 5V
100
10V
50
TRANSITION TIME (tTHL, tTLH) (ns)
0
040608010020
15V
LOAD CAPACITANCE (CL) (pF)
FIGURE 8. TYPICAL TRANSITION TIME AS A FUNCTION OF LOAD CAPACITANCE
7-1224
Applications
CD4527BMS
CLOCK
MOST SIGNIFICANT
DIGIT
DRM 1
A
1
B
0
C
0
D
1
CLOCK
CASC.
INH. IN
ST
CLEARS
FIGURE 9. TWO CD4527BMS’s CASCADED IN THE “ADD” MODE WITH A PRESET NUMBER
OUT
OUT
INH.
OUT
“9”
LEAST SIGNIFICANT
DIGIT
DRM 2
A
0
B
0
C
1
D
0
CLOCK
CASC.
INH. IN
ST
CLEARS
OF 94
OUT
OUT
INH.
OUT
“9”
9
(
+
10100100
012345678901234567890
CLOCK
OUT
DRM 2
TIMING DIAGRAM SHOWING ONE OF FOUR OUTPUT PULSES
CONTRIBUTED BY DRM 2 TO OUTPUT FOR EVERY 100 CLOCK
PULSES IN FOR PRESET NO. 94
4
94
=
)
CLOCK
1
0
0
1
DRM 1
A
B
C
D
CLOCK
CASC.
INH. IN
ST
CLEARS
OUT
OUT
INH.
OUT
“9”
0
0
1
0
DRM 2
A
B
C
D
CLOCK
CASC.
INH. IN
ST
CLEARS
OUT
OUT
INH.
OUT
“9”
FIGURE 10. TWO CD4527BMS’s CASCADED IN THE “MULTIPLY” MODE WITH A PRESET NUMBER
OF 36
9
(
10100100
4
x
36
=
)
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
1225
Timing Diagram
CD4527BMS
012345678901234
CLOCK
Qa
Qb
Qc
Qd
R1
R2
R3
R4
OUTPUT (PIN 6)
A ENABLED
B ENABLED
C ENABLED
D ENABLED
INH. OUT
OUTPUT (PIN 6)
PRESET NO. OF 1
PRESET NO. OF 2
PRESET NO. OF 3
PRESET NO. OF 4
PRESET NO. OF 5
PRESET NO. OF 6
PRESET NO. OF 7
PRESET NO. OF 8
PRESET NO. OF 9
FIGURE 11. (SEE LOGIC DIAGRAM)
Chip Dimensions and Pad Layout
Dimensions in parenthesis are in millimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10
-3
inch).
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
7-1226
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