• Maximum Input Current of 1µA at 18V Over Full Pack-
age Temperature Range; 100nA at 18V and +25
• Noise Margin (Over Full Package/Temperature Range)
- 1V at VDD = 5V
- 2V at VDD = 10V
- 2.5V at VDD = 15V
• Standardized Symmetrical Output Characteristics
• Meets All Requirements of JEDEC Tentative Standard
No. 13B, “Standard Specifications for Description of
‘B’ Series CMOS Devices”
Description
The CD40101BMS is a 9-bit (8 data bits plus 1 parity bit)
parity generator/checker. It may be used to detect errors in
data transmission or data retrieval. Odd and even outputs
facilitate odd or even parity generation and checking.
When used as a parity generator, a parity bit is supplied
along with the data to generate an even or odd parity output.
CMOS 9-Bit Parity Generator/Checker
Pinout
CD40101BMS
TOP VIEW
D1
1
D2
D3
D4
D9
VSS
2
3
4
5
6
7
o
C
ODD OUT
Functional Diagram
INHIBIT
8
D1 1
VDD
14
D8
13
D7
12
D6
11
D5
10
EVEN OUT
9
INHIBIT
8
VDD = 14
VSS = 7
When used as a parity checker, the received data bits and
parity bits are compared for correct parity. The even or odd
outputs are used to indicate an error in the received data.
Word length capability is expandable by cascading. The
CD40101BMS is also provided with an inhibit control. If the
inhibit control is set at logical “1”, the even and odd outputs
go to a logical “0”.
The CD40101BMS is supplied in these 14 lead outline
packages:
Braze Seal DIPH4H
Frit Seal DIPH1B
Ceramic FlatpackH3W
2. The parameters listed on Table 3 are controlled via design or process and are not directly tested. These parameters are characterized on
initial design release and upon design changes which would affect these characteristics.
3. CL = 50pF, RL = 200K, Input TR, TF < 20ns.
PARAMETERSYMBOLCONDITIONSNOTESTEMPERATURE
Supply CurrentIDDVDD = 20V, VIN = VDD or GND1, 4+25oC-25µA
N Threshold VoltageVNTHVDD = 10V, ISS = -10µA1, 4+25oC-2.8-0.2V
N Threshold Voltage
Delta
P Threshold VoltageVTPVSS = 0V, IDD = 10µA1, 4+25oC0.22.8V
P Threshold Voltage
Delta
FunctionalFVDD = 18V, VIN = VDD or GND1+25oCVOH >
Propagation Delay TimeTPHL
NOTES: 1. All voltages referenced to device GND.
2. CL = 50pF, RL = 200K, Input TR, TF < 20ns.
TPHL1
TPLH1
TPHL2
TPLH2
TTHL
TABLE 4. POST IRRADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS
NOTE: 1. 5% Parameteric, 3% Functional; Cumulative for Static 1 and 2.
CONFORMANCE GROUPS
Group E Subgroup 250051, 7, 9Table 41, 9Table 4
METHODGROUP A SUBGROUPSREAD AND RECORD
TABLE 7. TOTAL DOSE IRRADIATION
MIL-STD-883
METHOD
PRE-IRRADPOST-IRRADPRE-IRRADPOST-IRRAD
TESTREAD AND RECORD
TABLE 8. BURN-IN AND IRRADIATION TEST CONNECTIONS
OSCILLATOR
FUNCTIONOPENGROUNDVDD9V ± -0.5V
Static Burn-In 1
Note 1
Static Burn-In 2
Note 1
Dynamic BurnIn Note 1
Irradiation
Note 2
NOTES:
1. Each pin except VDD and GND will have a series resistor of 10K ± 5%, VDD = 18V ± 0.5V
2. Each pin except VDD and GND will have a series resistor of 47K ± 5%; Group E, Subgroup 2, sample size is 4 dice/wafer, 0 failures,
VDD = 10V ± 0.5V
6, 91-5, 7, 8, 10-1314
6, 971-5, 8, 10-14
-4, 712, 146, 92, 3, 5, 8, 101, 11, 13
6, 971-5, 8, 10-14
50kHz25kHz
7-1290
Logic Diagram
1
D1
2
D2
3
D3
4
D4
10
D5
11
D6
12
D7
13
D8
5
D9
CD40101BMS
INHIBIT
8
VDD
EVEN
OUT
9
ODD
OUT
6
ALL INPUTS ARE PROTECTED
*
BY CMOS PROTECTION
NETWORK
VSS
TRUTH TABLE
INPUTSOUTPUTS
D1-D9INHIBITEVENODD
Σ1’s = Even010
Σ1’s = Odd001
X100
X = Don’t Care Logic 1 = High Logic 0 = Low
Typical Performance Characteristics
AMBIENT TEMPERATURE (TA) = +25oC
30
25
20
15
10
5
OUTPUT LOW (SINK) CURRENT (IOL) (mA)
051015
FIGURE 2. TYPICAL OUTPUT LOW (SINK) CURRENT CHAR-
GATE-TO-SOURCE VOLTAGE (VGS) = 15V
10V
5V
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
ACTERISTICS
FIGURE 1.
AMBIENT TEMPERATURE (TA) = +25oC
15.0
12.5
10.0
7.5
5.0
2.5
OUTPUT LOW (SINK) CURRENT (IOL) (mA)
051015
GATE-TO-SOURCE VOLTAGE (VGS) = 15V
10V
5V
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
FIGURE 3. MINIMUM OUTPUT LOW (SINK) CURRENT CHAR-
ACTERISTICS
7-1291
CD40101BMS
Typical Performance Characteristics (Continued)
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
0-5-10-15
AMBIENT TEMPERATURE (TA) = +25oC
GATE-TO-SOURCE VOLTAGE (VGS) = -5V
0
-5
-10
-15
-10V
-20
-25
-15V
-30
FIGURE 4. TYPICAL OUTPUT HIGH (SOURCE) CURRENT
CHARACTERISTICS
AMBIENT TEMPERATURE (TA) = +25oC
400
300
SUPPLY VOLTAGE (VDD) = 5V
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
AMBIENT TEMPERATURE (TA) = +25oC
GATE-TO-SOURCE VOLTAGE (VGS) = -5V
-10V
-15V
OUTPUT HIGH (SOURCE) CURRENT (IOH) (mA)
FIGURE 5. MINIMUM OUTPUT HIGH (SOURCE) CURRENT
CHARACTERISTICS
AMBIENT TEMPERATURE (TA) = +25oC
200
0-5-10-15
0
-5
-10
-15
OUTPUT HIGH (SOURCE) CURRENT (IOH) (mA)
200
10V
15V
100
PROPAGATION DELAY TIME (tPHL, tPLH) (ns)
50
020406080100
1030507090
LOAD CAPACITANCE (CL) (pF)
FIGURE 6. TYPICAL PROPAGATION DELAY TIME AS A
FUNCTION OF LOAD CAPACITANCE
AMBIENT TEMPERATURE (TA) = +25oC
4
10
8
SUPPLY VOLTAGE (VDD) = 15V
6
4
2
3
10
8
6
4
2
2
10
8
6
4
2
2
10
8
6
4
2
DYNAMIC POWER DISSIPATION (PD) (µW)
10
1
8642
10
INPUT FREQUENCY (fIN) (kHz)
150
SUPPLY VOLTAGE (VDD) = 5V
100
10V
50
TRANSITION TIME (tTHL, tTLH) (ns)
0
040608010020
15V
LOAD CAPACITANCE (CL) (pF)
FIGURE 7. TYPICAL TRANSITION TIME AS A FUNCTION OF
LOAD CAPACITANCE
10V
10V
5V
CL = 50pF
CL = 15pF
8642
10
8642
2
10
8642
3
10
8642
4
FIGURE 8. TYPICAL DYNAMIC POWER DISSIPATION AS A FUNCTION OF INPUT FREQUENCY
7-1292
Chip Dimensions and Pad Layout
CD40101BMS
Dimensions in parenthesis are in millimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10
-3
inch).
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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1293
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