CA3083
Data Sheet September 1998 File Number 481.4
General Purpose High Current NPN
Transistor Array
The CA3083 is a versatile array of five high current (to
100mA) NPN transistors on a common monolithic substrate.
In addition, two of these transistors (Q
and Q2) are
1
matched at low current (i.e., 1mA) for applications in which
offset parameters are of special importance.
Independent connections for each transistor plus a separate
terminal for thesubstratepermit maximum flexibility in circuit
design
.
Ordering Information
PART NUMBER
(BRAND)
CA3083 -55 to 125 16 Ld PDIP E16.3
CA3083M
(3083)
CA3083M96
(3083)
TEMP.
RANGE (oC) PACKAGE
-55 to 125 16 Ld SOIC M16.15
-55 to 125 16 Ld SOIC Tape
and Reel
PKG.
M16.15
NO.
Pinout
CA3083
(PDIP, SOIC)
TOP VIEW
Features
• High IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100mA (Max)
•Low V
• Matched Pair (Q
-V
IO
-I
IO
(at 50mA). . . . . . . . . . . . . . . . . . 0.7V (Max)
CE sat
and Q2)
1
(VBE Match). . . . . . . . . . . . . . . . . . . . ±5mV (Max)
(at 1mA). . . . . . . . . . . . . . . . . . . . . . . . 2.5µA (Max)
• 5 Independent Transistors Plus Separate Substrate
Connection
Applications
• Signal Processing and Switching Systems Operating from
DC to VHF
• Lamp and Relay Driver
• Differential Amplifier
• Temperature Compensated Amplifier
• Thyristor Firing
• See Application Note AN5296 “Applications of the
CA3018 Circuit Transistor Array” for Suggested
Applications
SUBSTRATE
1
2
3
4
5
6
7
8
Q
1
Q
2
Q
3
Q
4
16
15
14
13
Q
5
12
11
10
9
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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| Copyright © Intersil Corporation 1999
CA3083
Absolute Maximum Ratings Thermal Information
The following ratings apply for each transistor in the device:
Collector-to-Emitter Voltage, V
Collector-to-Base Voltage, V
Collector-to-Substrate Voltage, V
Emitter-to-Base Voltage, V
Collector Current (I
Base Current (I
). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100mA
C
). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA
B
. . . . . . . . . . . . . . . . . . . . . . 15V
CEO
. . . . . . . . . . . . . . . . . . . . . . . . 20V
CBO
(Note 1). . . . . . . . . . . . . . 20V
CIO
. . . . . . . . . . . . . . . . . . . . . . . . . . 5V
EBO
Operating Conditions
Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. The collector of each transistor of the CA3083 is isolated from the substrate by an integral diode. The substrate must be connected to a voltage
which is more negative than any collector voltage in order to maintain isolation between transistors and provide normal transistor action. Toavoid
undesired coupling between transistors, the substrate Terminal (5) should be maintained at either DC or signal (AC) ground. A suitable bypass
capacitor can be used to establish a signal ground.
2. θJA is measured with the component mounted on an evaluation PC board in free air.
Thermal Resistance (Typical, Note 2) θJA (oC/W) θJC (oC/W)
PDIP Package . . . . . . . . . . . . . . . . . . . 135 N/A
SOIC Package . . . . . . . . . . . . . . . . . . . 200 N/A
Maximum Power Dissipation (Any One Transistor) . . . . . . . 500mW
Maximum Junction Temperature (Plastic Package) . . . . . . . 150
o
Maximum Storage Temperature Range. . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
C
Electrical Specifications For Equipment Design, T
= 25oC
A
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
FOR EACH TRANSISTOR
Collector-to-Base Breakdown Voltage V
Collector-to-Emitter Breakdown Voltage V
Collector-to-Substrate Breakdown Voltage V
Emitter-to-Base Breakdown Voltage V
(BR)CBOIC
(BR)CEOIC
(BR)CIOICI
(BR)EBOIE
Collector-Cutoff-Current I
Collector-Cutoff-Current I
DC Forward-Current Tr ansf er Ratio (Note 3) (Figure 1) h
CEO
CBO
FE
= 100µA, IE = 0 20 60 - V
= 1mA, IB = 0 15 24 - V
= 100µA, IB = 0, IE = 0 20 60 - V
= 500µA, IC = 0 5 6.9 - V
VCE = 10V, IB = 0 - - 10 µA
VCB = 10V, IE = 0 - - 1 µA
VCE = 3V IC = 10mA 40 76 -
IC = 50mA 40 75 Base-to-Emitter Voltage (Figure 2) V
Collector-to-Emitter Saturation V oltage (Figures 3, 4) V
CE SATIC
Gain Bandwidth Product f
BE
VCE = 3V, IC = 10mA 0.65 0.74 0.85 V
= 50mA, IB = 5mA - 0.40 0.70 V
VCE = 3V, IC = 10mA - 450 - MHz
T
FOR TRANSISTORS Q1 AND Q2(As a Differential Amplifier)
Absolute Input Offset Voltage (Figure 6) |VIO|VCE = 3V, IC = 1mA - 1.2 5 mV
Absolute Input Offset Current (Figure 7) |IIO|VCE = 3V, IC = 1mA - 0.7 2.5 µA
NOTE:
3. Actual forcing current is via the emitter for this test.
2