Intersil Corporation ACS14MS Datasheet
ACS14MS
Data Sheet November 1998 File Number 4544
Radiation Hardened Hex Inverting Schmitt
Trigger
The Radiation Hardened ACS14MS is a Hex Inverting
Schmitt Trigger. This device simply inverts the level present
on each input. The Schmitt Trigger input stage provides
400mV (Min) of hysteresis and permits input signals with
longer rise times. All inputsare buffered and the outputs are
designed for balanced propagation delay and transition
times.
The ACS14MS is fabricated on a CMOS Silicon on Sapphire
(SOS) process, which provides an immunity to Single Event
Latch-up and the capability of highly reliable performance in
any radiation environment. These devices offer significant
power reduction and faster performance when compared to
ALSTTL types.
Specifications for Rad Hard QML devices are controlled
by the Defense Supply Center in Columbus (DSCC). The
SMD numbers listed below must be used when ordering.
Detailed Electrical Specifications for the ACS14MS are
contained in SMD 5962-98623. A “hot-link” is provided
on our homepage with instructions for downloading.
www.intersil.com/data/sm/index.asp
Features
• QML Qualified Per MIL-PRF-38535 Requirements
• 1.25 Micron Radiation Hardened SOS CMOS
• Radiation Environment
- Latch-Up Free Under any Conditions
- Total Dose. . . . . . . . . . . . . . . . . . . . . . 3 x 10
- SEU Immunity. . . . . . . . . . . . <1 x 10
5
-10
RAD (Si)
Errors/Bit/Day
- SEU LET Threshold . . . . . . . . . . . >100MeV/(mg/cm
• Input Logic Levels . . . . V
= (0.3)(VCC), VIH = (0.7)(VCC)
IL
• Hysteresis Voltage . . . . . . . . . . . . . . . . . . . . 400mV (Min)
• Output Current . . . . . . . . . . . . . . . . . . . . . . . . ±8mA (Min)
• Quiescent Supply Current . . . . . . . . . . . . . . 100µA (Max)
• Propagation Delay . . . . . . . . . . . . . . . . . . . . . 14ns (Max)
Applications
• High Speed Control Circuits
• Sensor Monitoring
• Low Power Designs
2
)
Ordering Information
ORDERING NUMBER INTERNAL MKT. NUMBER TEMP. RANGE (oC) PACKAGE DESIGNATOR
5962F9862301VCC ACS14DMSR-03 -55 to 125 14 Ld SBDIP CDIP2-T14
ACS14D/SAMPLE-03 ACS14D/SAMPLE-03 25 14 Ld SBDIP CDIP2-T14
5962F9862301VXC ACS14KMSR-03 -55 to 125 14 Ld Flatpack CDFP4-F14
ACS14K/SAMPLE-03 ACS14K/SAMPLE-03 25 14 Ld Flatpack CDFP4-F14
5962F9862301V9A ACS14HMSR-03 25 Die N/A
Pinouts
A1
Y1
A2
Y2
A3
Y3
GND
ACS14MS
(SBDIP)
TOP VIEW
1
2
3
4
5
6
7
14
V
CC
A6
13
Y6
12
A5
11
Y5
10
A4
9
Y4
8
Y1
A2
Y2
A3
Y3
GND
ACS14MS
(FLATPACK)
TOP VIEW
1A1
2
3
4
5
6
7
14
13
12
11
10
9
8
V
A6
Y6
A5
Y5
A4
Y4
CC
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
Die Characteristics
ACS14MS
DIE DIMENSIONS:
Size: 2390µm x 2390µm (94 mils x 94 mils)
Thickness: 525µm ± 25µm (20.6 mils ± 1 mil)
Bond Pad: 110µm x 110µm (4.3 x 4.3 mils)
METALLIZATION: AL
Metal 1 Thickness: 0.7µm ± 0.1µm
Metal 2 Thickness: 1.0µm ± 0.1µm
SUBSTRATE POTENTIAL:
Unbiased Insulator
Metallization Mask Layout
A2 (3)
Y1 A1
(2) (1)
ACS14MS
V
CC
(14)
PASSIVATION
Type: Phosphorous Silicon Glass (PSG)
Thickness: 1.30µm ± 0.15µm
SPECIAL INSTRUCTIONS:
CC
First
Bond V
ADDITIONAL INFORMATION:
Worst Case Current Density: <2.0 x 10
Transistor Count: 130
A6
(13)
Y6
(12)
5
A/cm
2
Y2 (4)
NC
A3 (5)
(6) (7) (8) (9)
A4Y4GNDY3
(11) A5
NC
(10) Y5
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only .Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
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