International Rrectifier SC105-5 User Manual

查询SC105.....5. Series供应商

SCHOTTKY DIE 105 x 125 mils

Bulletin I0503J rev. C 05/01

SC105.....5. Series

a

c

b

d

D

Ø

Wafer flat a lligned with
side b of the die

C

0.35 ± 0.01

(14 ± 0.4)

A

40 (157)

NOTES:

1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS).

2. CONTROLLING DIMENSION: (MILS).

3. DIMENSIONS AND TOLERANCES:

a = 3.18 + 0, - 0.01
(125 + 0, - 0.4)
b = 2.67 + 0, - 0.01
(105 + 0, - 0.4)
c = 3.02 + 0, - 0.01
(119 + 0, - 0.4)
d = 2.51 + 0, - 0.01
(99 + 0 , - 0.4)
Ø = 1 ± 0.15
(40 ± 6)

4. LETTER DESIGNATION:
A = Anode (Top Metal)
C = Cathode (Back Metal)
D = Reject Ink Dot (only on non-conforming dies)

5. SAWING:
Recommend ed Blade
SEMITEC S1025 QS00 Blade
Sawing Street

0.05 + 0, - 0.005
(2 + 0, - 0.2)

Ø 125 (492)

NOT TO SCALE

NOTE: 10 mils die thickness is available on specific request only.

Contact factory for information.

www.irf.com 1

SC105.....5. Series

Bulletin I0503J rev. C 05/01

Electrical Characteristics

Device TJ Max. V

# (°C) (V) (µA) (mA) (V) Style

SC105R015x5x 125 15 n.a. contact factory

SC105S020x5x 150 20 700 180 0.51 @ 40A TO-220

SC105S030x5x 150 30 220 100 0.49 @ 15A TO-220

SC105S045x5x 150 45 150 75 0.54 @ 15A TO-247

SC105S060x5x 150 60 110 60 0.60 @ 15A TO-247

SC105H045x5x 175 45 35 10 0.62 @ 15A TO-220

SC105H100x5x 175 100 12 7 0.86 @ 15A TO-247

SC105H150x5x 175 150 15 10 1.0 @ 15A TO-220

Typ. IR @ 25°C Typ. IR @ 125°C Max. V

R

@ I

F

Package

F

Mechanical Data

Device Metal Thickness Metal Thickness

# Front Metal Back Metal

SC105xxxxA5x Bondable -- Al/Si 30 kÅ -- Cr 1 kÅ Ni 2 kÅ Ag 3 kÅ

SC105xxxxS5x Solderable Ti 2 kÅ Ni 1 kÅ Ag 35 kÅ Cr 1 kÅ Ni 2 kÅ Ag 3 kÅ

Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination.
Shelf life for parts stored in above condition is 2 years.
If the storage is done in normal atmosphere shelf life is reduced to six months.

Packaging

Device Description Minimum Order Quantity

# Die in Sale Package

SC105xxxxx5B Inked Probed Unsawn Wafer (Wafer in Box) 1170

SC105xxxxx5R Probed Die in Tape & Reel 8,000

SC105xxxxx5P Probed Die in Waffle Pack 1170

SC105xxxxx5F Inked Probed Sawn Wafer on Film 1170

2

www.irf.com

Ordering Information Table

Device Code

1 - Schottky Die

2 - Chip Dimension in Mils

3 - Process (see Electrical Characteristics Table)

4 - Voltage code: Code = V

5 - Chip surface metallization (see Mechanical Data Table)

6 - Wafer Diameter in inches

7 - Packaging (see Packaging Table)

SC 105 H 100 S 5 B

3

1 2

RRM

4

Bulletin I0503J rev. C 05/01

5

6

H = 830 Process
R = OR'ing Process
S = Standard Process

SC105.....5. Series

7

Wafer on Film

STEEL FRAME

www.irf.com

3

SC105.....5. Series

Bulletin I0503J rev. C 05/01

Wafer in Box

ROUND CONTAINER

Die in Waffle Pack

TYVEK DISK

FOAM DISK

CHIP TRAY POCKET

4

www.irf.com

Tape and Reel

SC105.....5. Series

Bulletin I0503J rev. C 05/01

REEL FRAME

BARE DIE CARRIER TAPE

WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 U.S.A. Tel: [phone]. Fax: [phone].

EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, U.K. Tel: ++ 44 1883 732020. Fax: ++ 44 1883 733408.

IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower,13-11, Singapore 237994. Tel: ++ 65 838 4630.

http://www.irf.com Fax-On-Demand: [phone] Data and specifications subject to change without notice.

IR CANADA: 15 Lincoln Court, Brampton, Markham, Ontario L6T3Z2. Tel: [phone]. Fax: [phone].

IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg. Tel: ++ 49 6172 96590. Fax: ++ 49 6172 965933.

IR ITALY: Via Liguria 49, 10071 Borgaro, Torino. Tel: ++ 39 11 4510111. Fax: ++ 39 11 4510220.

IR FAR EAST: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo, Japan 171. Tel: [phone].

IR TAIWAN: 16 Fl. Suite D.207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan. Tel: [phone].

www.irf.com

5