International Rrectifier SC095-5 User Manual

查询SC095.....5. Series供应商

SCHOTTKY DIE 95 x 95 mils

Bulletin I0500J rev.A 05/01

SC095.....5. Series

a

c

b

d

D

Ø

Wafer flat alligned with
side b of the die

0.35 ± 0.01

(14 ± 0.4)

C

A

40 (157)

Ø 125 (492)

NOTES:

1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS).

2. CONTROLLING DIMENSION: (MILS).

3. DIMENSIONS AND TOLERANCES:

a = 2.41 + 0, - 0.01
(95 + 0, - 0.4)
b = 2.41 + 0, - 0.01
(95 + 0, - 0.4)
c = 2.26 + 0, - 0.01
(89 + 0, - 0.4)
d = 2.26 + 0, - 0.01
(89 + 0, - 0.4)
Ø = 1 ± 0.15
(40 ± 6)

4. LETTER DESIGNATION:
A = Anode (Top Metal)
C = Cathode (Back Meta l)
D = Reject Ink Dot (only on non-conforming dies)

5. SAWING:
Recommended Blade
SEMITEC S1025 QS00 Blade
Sawing Street

0.05 + 0, - 0.005
(2 + 0, - 0.2)

NOT TO SCALE

NOTE: 10 mils die thickness is available on specific request only.

Contact factory for information.

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SC095.....5.

Bulletin I0500J rev.A 05/01

Electrical Characteristics

Device TJ Max. V

# (°C) (V) (µA) (mA) (V) Style

SC095R015x5x 125 15 n.a. contact factory

SC095S020x5x 150 20 n.a. contact factory

SC095S030x5x 150 30 n.a. contact factory

SC095S045x5x 150 45 n.a. contact factory

SC095S060x5x 150 60 n.a. contact factory

SC095H045x5x 175 45 15 5 0.84 @ 20A TO-220

SC095H100x5x 175 100 n.a. contact factory

SC095H150x5x 175 150 n.a. contact factory

Typ. IR @ 25°C Typ. IR @ 125°C Max. V

R

@ I

F

F

Mechanical Data

Device Metal Thickness Metal Thickness

# Front Metal Back Metal

Package

SC095xxxxA5x Wire Bondable -- Al 30 kÅ -- Cr 1 kÅ Ni 2 kÅ Ag 3 kÅ

SC095xxxxS5x Solderable Ti 2 kÅ Ni 1 kÅ Ag 35 kÅ Cr 1 kÅ Ni 2 kÅ Ag 3 kÅ

Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination.
Shelf life for parts stored in above condition is 2 years.
If the storage is done in normal atmosphere shelf life is reduced to six months.

Packaging

Device Description Minimum Order Quantity

# Die in Sale Package

SC095xxxxx5B Inked Probed Unsawn Wafer (Wafer in Box) 1545

SC095xxxxx5R Probed Die in Tape & Reel n. a.

SC095xxxxx5P Probed Die in Waffle Pack 1545

SC095xxxxx5F Inked Probed Sawn Wafer on Film 1545

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Ordering Information Table

Device Code

1 - Schottky Die

2 - Chip Dimension in Mils

3 - Process (see Electrical Characteristics Table)

4 - Voltage code: Code = V

5 - Chip surface metallization (see Mechanical Data Table)

6 - Wafer Diameter in inches

7 - Packaging (see Packaging Table)

Wafer on Film

SC 095 H 150 A 5 B

3

1 2

RRM

4

SC095.....5.

Bulletin I0500J rev.A 05/01

56 7

H = 830 Process
R = OR'ing Process
S = Standard Process

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SC095.....5.

Bulletin I0500J rev.A 05/01

Wafer in Box

ROUND CONTAINER

Die in Waffle Pack

TYVEK DISK

FOAM DISK

CHIP TRAY POCKET

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SC095.....5.

Bulletin I0500J rev.A 05/01

WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 U.S.A. Tel: [phone]. Fax: [phone].

EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, U.K. Tel: ++ 44 1883 732020. Fax: ++ 44 1883 733408.

IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower,13-11, Singapore 237994. Tel: ++ 65 838 4630.

http://www.irf.com Fax-On-Demand: [phone] Data and specifications subject to change without notice.

IR CANADA: 15 Lincoln Court, Brampton, Markham, Ontario L6T3Z2. Tel: [phone]. Fax: [phone].

IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg. Tel: ++ 49 6172 96590. Fax: ++ 49 6172 965933.

IR ITALY: Via Liguria 49, 10071 Borgaro, Torino. Tel: ++ 39 11 4510111. Fax: ++ 39 11 4510220.

IR FAR EAST: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo, Japan 171. Tel: [phone].

IR TAIWAN: 16 Fl. Suite D.207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan. Tel: [phone].

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