International Rrectifier JANTX2N6806 User Manual

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HEXFET
®
POWER MOSFET
Provisional Data Sheet No. PD-9.548B
JANTX2N6806
JANTXV2N6806
[REF:MIL-PRF-19500/562]
[GENERIC:IRF9230]
P-CHANNEL
-200 V olt, 0.80
HEXFET technology is the key to International Rectifier’s advanced line of power MOSFET transis­tors. The efficient geometry achieves very low on­state resistance combined with high transconductance.
HEXFET transistors also feature all of the well-es­tablish advantages of MOSFETs, such as voltage control, very fast switching, ease of paralleling and electrical parameter temperature stability. They are well-suited for applications such as switching power supplies, motor controls, inverters, choppers, audio amplifiers, and high energy pulse circuits, and virtu­ally any application where high reliability is required.
ΩΩ
HEXFET
ΩΩ
Product Summary
Part Number BVDSS RDS(on) ID
JANTX2N6806
JANTXV2N6806
Features:
Avalanche Energy Rating
Dynamic dv/dt Rating
Simple Drive Requirements
Hermetically Sealed
Absolute Maximum Ratings
Parameter JANTX2N6806, JANTXV2N6806 Units
ID @ VGS = -10V , TC = 25°C Continuous Drain Current -6.5
ID @ VGS = -10V , TC = 100°C Continuous Drain Current -4.0
I
DM
PD @ TC = 25°C Max. Power Dissipation 75 W
V
GS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt -5.0
T
J
T
STG
Pulsed Drain Current -28
Linear Derating Factor 0.60 W/K Gate-to-Source Voltage ±20 V Single Pulse Avalanche Energy 66 mJ Avalanche Current -6.5 A Repetitive Avalanche Energy 7.5 mJ
Operating Junction -55 to 150 Storage Temperature Range
Lead Temperature 300
Weight 11.5 (typical) g
(0.063 in. (1.6mm) from
case for 10.5 seconds)
-6.5A0.80-200V
A
V/ns
o
C
JANTX2N6806, JANTXV2N6806 Device
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter Min. Typ. Max. Units Test Conditions
BV
DSS
BV R
DS(on)
V
GS(th)
g
fs
I
DSS
I
GSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
L
D
L
S
C
iss
C
oss
C
rss
DSS
Drain-to-Source Breakdown Voltage -200 V VGS = 0V, ID = -1.0 mA
/TJTemperature Coefficient of Breakdown -0.20 V/°C Reference to 25°C, ID = -1.0 mA
Voltage Static Drain-to-Source 0.80 VGS = -10V, ID = -4.0A On-State Resistance 0.92 VGS = -10V, ID = -6.5A Gate Threshold Voltage -2.0 -4.0 V VDS = VGS, ID = -250µA Forward Transconductance 2.0 S ( )VDS > -15V, IDS = -4.0A Zero Gate Voltage Drain Current -25 VDS = 0.8 x Max Rating,VGS = 0V
-250 VDS = 0.8 x Max Rating
Gate-to-Source Leakage Forward -100 VGS = -20V Gate-to-Source Leakage Reverse 100 VGS = 20V
µA
nA
Total Gate Charge 8 31 VGS = -10V, ID = -6.5A Gate-to-Source Charge 0.8 7.0 VDS = Max. Rating x 0.5
nC Gate-to-Drain (“Miller”) Charge 5.0 17 see figures 6 and 13 Turn-On Delay T ime 50 VDD = -100V, ID = -6.5A, Rise Time 10 0 RG = 7.5, VGS = -10V Turn-Off Delay Time 100
ns Fall Time 80 see figure 10
Internal Drain Inductance 5.0
Internal Source Inductance 13.0
Measured from the drain lead, 6mm (0.25 in.) from package to center of die.
nH
Measured from the source lead, 6mm (0.25 in.) from package to source bonding pad.
Input Capacitance 700 VGS = 0V, VDS = -25V Output Capacitance 200 f = 1.0 MHz
pF Reverse Transfer Capacitance 40 see figure 5
VGS = 0V, TJ = 125°C
Modified MOSFET symbol showing the internal inductances.
Source-Drain Diode Ratings and Characteristics
Parameter Min. Typ. Max. Units Test Conditions
I
Continuous Source Current (Body Diode) -6.5 Modified MOSFET symbol showing the
S
I
Pulse Source Current (Body Diode) -28 integral reverse p-n junction rectifier.
SM
V
Diode Forward Voltage -6.0 V Tj = 25°C, IS = -6.5A, VGS = 0V
SD
t
Reverse Recovery Time 40 0 ns Tj = 25°C, IF = -6.5A, di/dt -100A/µs
rr
Q
Reverse Recovery Charge 4.0 µCV
RR
t
Forward Turn-On Time
on
Intrinsic turn-on time is negligible. T urn-on speed is substantially controlled by LS + LD.
Thermal Resistance
Parameter Min. Typ. Max. Units Test Conditions
R R
thJC thJA
Junction-to-Case 1.67 Junction-to-Ambient 30 K/W Typical socket mount
A
-50V
DD
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