International Rrectifier IR2136, IR21362, IR21363 User Manual

查询IR21363 (J&S)供应商
Preliminary Data Sheet No. PD60166-I
IR2136/IR21362/IR21363
Features
Floating channel designed for bootstrap operation
Fully operational to +600V Tolerant to negative transient voltage dV/dt immune Gate drive supply range from 10 to 20V (IR2136),
11.5 to 20V (IR21362) or 12 to 20V (IR21363) Undervoltage lockout for all channels
Over-current shutdown turns off all six drivers
Independent 3 half-bridge drivers
Matched propagation delay for all channels
Lowside outputs out of phase with inputs. High
side outputs out of phase (IR2136/IR21363) or in phase (IR21362) with inputs. Cross-conduction prevention logic
3.3V logic compatible
Lower di/dt gate driver for better noise immunity
Externally programmable delay for automatic fault
clear
Description
The IR2136/IR21362/IR21363(J&S) are high votage, high speed power MOSFET and IGBT drivers with three in­dependent high and low side referenced output channels for 3-phase applications. Proprietary HVIC technology enables ruggedized monolithic construc­tion. Logic inputs are compatible with CMOS or LSTTL outputs, down to 3.3V logic. A current trip function which terminates all six outputs can be de­rived from an external current sense resistor. An enable function is available to terminate all six outputs simul­taneously. An open-drain FAULT signal is provided to indicate that an overcurrent or undervoltage shutdown has occurred. Overcurrent fault conditions are cleared
(
&
S
J
3-PHASE BRIDGE DRIVER
Product Summary
V
OFFSET
I
+/- 120 mA / 250 mA
O
V
10 - 20V or 12V - 20V
Deadtime (typ.) 200 nsec
t
(typ.) 400 nsec
on/off
Packages
28-Lead SOIC
44-Lead PLCC w/o 12 leads
automatically after a delay programmed externally via an RC network connected to the RCIN input. The out­put drivers feature a high pulse current buffer stage designed for minimum driver cross-conduction. Propa­gation delays are matched to simplify use in high frequency applications. The floating channel can be used to drive N-channel power MOSFETs or IGBTs in the high side configuration which operates up to 600 volts.
600V max.
28-Lead PDIP
)
Typical Connection
HIN1,2,3 / HIN1,2,3
(Refer to Lead Assignments for correct pin configuration). This/ These diagram(s) show electrical connections only. Please refer to our Application Notes and DesignTips for proper circuit board layout.
www.irf.com 1
VCC
LIN1,2,3
FAULT
EN
GND
VCC HIN1,2,3 / HIN1,2,3 LIN1,2,3 FAULT EN
RCIN ITRIP VSS COM
VB1,2,3
HO1,2,3
VS1,2,3
LO1,2,3
IR2136(2)(3)
up to 600V
TO
LOAD
IR2136/IR21362/IR21363
LIN
(J&S)
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Symbol Definition Min. Max. Units
V
S
V
BS
V
HO
V
CC
V
SS
V
LO1,2,3
V
IN
V
FLT
dV/dt Allowable offset voltage slew rate 50 V/ns
P
D
Rth
JA
T
J
T
S
T
L
High side offset voltage -0.3 600 High side floating supply voltage -0.3 25 High side floating output voltage V Low side and logic fixed supply voltage -0.3 25 Logic ground V Low side output voltage -0.3 VCC + 0.3 Input voltage
FAULT output voltage VSS - 0.3 V
Package power dissipation @ TA +25°C (28 lead PDIP) 1.5
Thermal resistance, junction to ambient (28 lead PDIP) 83
Junction temperature 125 Storage temperature -55 150 Lead temperature (soldering, 10 seconds) 300
,HIN(IR2136/IR21363),HIN (IR21362) ITRIP,, VSS - 0.3 (V
EN, RCIN V
(28 lead SOIC) 1.6
(44leadPLCC) 2.0
(28 lead SOIC) 78
(44 lead PLCC) 63
S1,2,3
CC
- 0.3 V
- 25 V
+ 0.3
B1,2,3
+ 0.3
CC
+ 15) or
SS
+ 0.3)
CC
which ever
is lower
+ 0.3
CC
V
W
°C/W
°C
Recommended Operating Conditions
The Input/Output logic timing diagram is shown in figure 1. For proper operation the device should be used within the recom­mended conditions. All voltage parameters are absolute referenced to COM. The VS offset rating is tested with all supplies biased at 15V differential.
Symbol Definition Min. Max. Units
V
B1,2,3
V
S1,2,3
V
HO1,2,3
V
LO1,2,3
V
CC
V
SS
V
FLT
V
RCIN
2 www.irf.com
High side floating supply voltage IR2136 10 20
IR21362 11.5 20
IR21363 12 20 High side floating supply offset voltage Note 1 600 High side output voltage V Low side output voltage 0 V Low side and logic fixed supply voltage IR2136 10 20
IR21362 11.5 20
IR21363 12 20 Logic ground -5 5 FAULT output voltage V RCIN input voltage V
S1,2,3
SS SS
V
B1,2,3
V V
CC
CC CC
V
IR2136/IR21362/IR21363
LIN
(J&S)
Recommended Operating Conditions
The Input/Output logic timing diagram is shown in figure 1. For proper operation the device should be used within the recom­mended conditions. All voltage parameters are absolute referenced to COM. The VS offset rating is tested with all supplies biased at 15V differential.
Symbol Definition Min. Max. Units
V
ITRIP
V
IN
T
A
Note 1: Logic operational for VS of COM -5 to COM +600V. Logic state held for VS of COM -5V to -COM -VBS. (Please refer to the Design Tip DT97-3 for more details). Note 2: All input pins and the ITRIP pin are internally clamped with a 5.2V zener diode.
ITRIP input voltage V Logic input voltage Ambient temperature -40 125
, HIN (IR2136), HIN(IR21362), EN V
SS SS
+5
V
SS
+5
V
SS
V
o
C
Static Electrical Characteristics
V
BIAS (VCC
are applicable to all six channels (H and are applicable to the respective output leads: H
Symbol Definition Min. Typ. Max. Units Test Conditions
V
EN,TH+
V
V V
V
RCIN,TH+
V
RCIN,HYS
V V
V V
V
CCUVHVCC
V
V
IN, CLAMP Input clamp voltage (HIN, LIN, ITRIP and EN)
, VBS1,2,3) = 15V unless otherwise specified. The VIN, VTH and IIN parameters are referenced to VSS and
V
V
EN,TH-
IT,TH+
IT,HYS
V
OH
V
OL CCUV+VCC BSUV+
CCUV­BSUV-
BSUVH
I
LK
I
QBS
I
QCC
I
LIN+
Logic “0” input voltage LIN1,2,3, HIN1,2,3 3
IH
Logic “1” input voltage HIN1,2,3 Logic “1” input voltage LIN1,2,3, HIN1,2,3 0.8
IL
Logic “0” input voltage HIN1,2,3 EN positive going threshold 3 EN negative going threshold 0.8 — ITRIP positive going threshold 370 460 550 ITRIPinput hysteresis 70 — RCIN positive going threshold 8 — RCIN input hysteresis 3 — High level output voltage, V Low level output voltage, V
and VBS supply undervoltage IR2136 8.0 8.9 9.8
positive going threshold IR21362 9.6 10.4 11.2
V
and V
CC
negative going threshold IR21362 8.6 9.4 10.2
lockout hysteresis IR21362 0.5 1.0
Offset supply leakage current 50 V
Quiescent VBS supply current 20 60 150 Quiescent VCC supply current 1 2 mA
Input bias current (LOUT = HI) 150 400 µA V
BS
and VBS supply undervoltage IR2136 0.3 0.7
1,2,3 and LS1,2,3). The VO and IO parameters are referenced to COM and VS1,2,3
S
- V
BIAS
O
supply undervoltage IR2136 7.4 8.2 9.0
and L
O1,2,3
O
O1,2,3.
0.8 1.4 IO = 20 mA — 0.3 0.6 IO = 20 mA
IR21363 10.7 11.2 11.7
IR21363 10.5 11.0 11.5
IR21363 0.2
4.9 5.2 5.5 V I
V
mV
V
µA
B1,2,3=VS1,2,3
= 600V
V
= 0V or 5V
IN =100µA
IN
LIN = 0V
www.irf.com 3
IR2136/IR21362/IR21363
(J&S)
Static Electrical Characteristics cont.
V
BIAS (VCC
are applicable to all six channels (H and are applicable to the respective output leads: H
Symbol Definition Min. Typ. Max. Units Test Conditions
I
I
ITRIP+
I
ITRIP-
I
R
ON,RCIN
R
ON,FLT
, VBS1,2,3) = 15V unless otherwise specified. The VIN, VTH and IIN parameters are referenced to VSS and
I
LIN-
HIN+
I
HIN-
I
EN+
I
EN-
RCIN
I
O+
I
O-
Input bias current (LOUT = LO) 100 250 V Input bias current (HOUT = HI) IR2136(3) 150 300 V
Input bias current (HOUT = LO) IR2136(3) 100 250 V
“high” ITRIP input bias current 100 V “low” ITRIP input bias current 0 1 V “high” ENABLE input bias current 100 V “low” ENABLE input bias current 0 1 V RCIN input bias current 0 1 V Output high short circuit pulsed current 120 200 VO=0V, PW10 µs Output low short circuit pulsed current 250 350 VO=15V, PW10 µs RCIN low on resistance 60 — FAULT low on resistance 60
1,2,3 and LS1,2,3). The VO and IO parameters are referenced to COM and VS1,2,3
S
O1,2,3
and L
IR21362
IR21362
O1,2,3.
100 V
0 1 V
µA
mA
LIN = 5V HIN = 0V HIN = 5V HIN = 5V HIN = 0V
ITRIP
ITRIP ENABLE ENABLE
RCIN
= 5V = 0V
= 5V
= 0V
= 0V or 15V
Dynamic Electrical Characteristics
VCC = VBS = V
Symbol Definition Min. Typ. Max. Units Test Conditions
t
on
t
off
t
r
t
f
t
EN
= 15V, V
BIAS
Turn-on propagation delay 400 — Turn-off propagation delay 380 — Turn-on rise time 110 — Turn-off fall time 50 — ENABLE low to output shutdown propagation delay 400 V
= VSS = COM, TA = 25oC and CL = 1000 pF unless otherwise specified.
S1,2,3
VIN = 0 & 5V
V
S1,2,3
IN, VEN
= 0 to 600V
= 0V or 5V
t
ITRIP
t
t
FLT
t
FILIN
t
FLTCLR
DT Deadtime 250 VIN = 0 & 5V MT Matching delay ON and OFF 0 80
MDT Matching delay, max (ton,t
PM Output pulse width matching, PWin - PWout (fig.2) 0 75
NOTE: For high side PWM, HIN pulse width must be ≥ 1µsec
ITRIP to output shutdown propagation delay 700 V ITRIP blanking time 100 150 V
bl
ITRIP to FAULT propagation delay 500 V
Input filter time (HIN, LIN, EN) 100 200 VIN = 0 & 5V FAULT clear time RCIN: R=2meg, C=1nF 1.8 mS V
) - min (ton,t
(ton,toff are applicable to all 3 channels)
off
), 0 75
off
nS
nS
= 5V
ITRIP
= 0V or 5V
IN
V
= 5V
ITRIP
= 0V or 5V
IN
V
= 5V
ITRIP
= 0V or 5V
IN
V
= 0V
ITRIP
External dead
time
>400nsec
4 www.irf.com
Loading...
+ 7 hidden pages