International Rrectifier IR2112S User Manual

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Data Sheet No. PD60026-R
IR2112(S) & ( PbF)
HIGH AND LOW SIDE DRIVER
Features
Product Summary
Floating channel designed for bootstrap operation
Fully operational to +600V
V
OFFSET
600V max.
Tolerant to negative transient voltage
+/- 200 mA / 420 mA
dV/dt immune
I
O
Gate drive supply range from 10 to 20V
Undervoltage lockout for both channels
V
OUT
10 - 20V
3.3V logic compatible
CMOS Schmitt-triggered inputs with pull-down
t
(typ.) 125 & 105 ns
on/off
Delay Matching 30 ns
Cycle by cycle edge-triggered shutdown logic
Matched propagation delay for both channels
Outputs in phase with inputs
Packages
Also available LEAD-FREE
Description
The IR2112(S) is a high voltage, high speed power MOSFET and IGBT driver with independent high and low side referenced output channels. Proprietary HVIC and latch immune CMOS technologies enable rugge­dized monolithic construction. Logic inputs are com­patible with standard CMOS or LSTTL outputs, down to 3.3V logic. The output drivers feature a high pulse current buffer stage designed for minimum driver cross­conduction. Propagation delays are matched to simplify use in high frequency applications. The floating channel can be used to drive an N-channel power MOSFET or IGBT in the high side configuration which operates up to 600 volts.
14-Lead PDIP
16-Lead SOIC
(wide body)
Typical Connection
HO
V
DD
HIN
SD LIN
V
SS
V
CC
(Refer to Lead Assignments for correct pin configuration). This/These diagram(s) show electrical connections only. Please refer to our Application Notes and DesignTips for proper circuit board layout.
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V
DD
HIN SD LIN V
SS
V
COM
LO
V
B
V
S
CC
up to 600V
TO
LOAD
IR2112(S) & ( PbF)
Absolute Maximum Ratings
Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage param­eters are absolute voltages referenced to COM. The Thermal Resistance and Power Dissipation ratings are measured under board mounted and still air conditions. Additional information is shown in Figures 28 through 35.
Symbol Definition Min. Max. Units
V
B
V
S
V
HO
V
CC
V
LO
V
DD
V
SS
V
IN
dVs/dt Allowable Offset Supply Voltage Transient (Figure 2) 50 V/ns
P
D
R
THJA
T
J
T
S
T
L
Recommended Operating Conditions
The Input/Output logic timing diagram is shown in Figure 1. For proper operation the device should be used within the recommended conditions. The VS and VSS offset ratings are tested with all supplies biased at 15V differential. Typical ratings at other bias conditions are shown in Figures 36 and 37.
Symbol Definition Min. Max. Units
V
B
V
S
V
HO
V
CC
V
LO
V
DD
V
SS
V
IN
T
A
High Side Floating Supply Voltage -0.3 625 High Side Floating Supply Offset Voltage VB - 25 VB + 0.3 High Side Floating Output Voltage VS - 0.3 V Low Side Fixed Supply Voltage -0.3 25
B
+ 0.3
V
Low Side Output Voltage -0.3 VCC + 0.3 Logic Supply Voltage -0.3 VSS + 25 Logic Supply Offset Voltage VCC - 25 V Logic Input Voltage (HIN, LIN & SD) VSS - 0.3 V
Package Power Dissipation @ TA +25°C (14 Lead DIP) 1.6
(16 Lead SOIC) 1.25
Thermal Resistance, Junction to Ambient (14 Lead DIP) 75
(16 Lead SOIC) 100
CC DD
+ 0.3 + 0.3
W
°C/W
Junction Temperature 150 Storage T emperature -55 150
°C
Lead Temperature (Soldering, 10 seconds) 300
High Side Floating Supply Absolute Voltage VS + 10 VS + 20 High Side Floating Supply Offset Voltage Note 1 600 High Side Floating Output Voltage V
S
V
B
Low Side Fixed Supply Voltage 10 20 Low Side Output Voltage 0 VCC
V
Logic Supply Voltage VSS + 3 VSS + 20 Logic Supply Offset Voltage -5 (Note 2) 5 Logic Input Voltage (HIN, LIN & SD) V
SS
V
DD
Ambient Temperature -40 125 °C
Note 1: Logic operational for VS of -5 to +600V. Logic state held for VS of -5V to -VBS. (Please refer to the Design Tip DT97-3 for more details). Note 2: When VDD < 5V, the minimum VSS offset is limited to -VDD.
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IR2112(S) & ( PbF)
Dynamic Electrical Characteristics
V
(VCC, VBS, VDD) = 15V, CL = 1000 pF, T
BIAS
electrical characteristics are measured using the test circuit shown in Figure 3.
Symbol Definition Figure Min. T yp. Max. Units T est Conditions
t
on
t
off
t
sd
MT Delay Matching, HS & LS Turn-On/Off 30
Turn-On Propagation Delay 7 125 180 VS = 0V Turn-Off Propagation Delay 8 105 160 VS = 600V Shutdown Propagation Delay 9 105 160 VS = 600V
t
Turn-On Rise Time 10 80 130
r
t
Turn-Off Fall Time 11 40 65
f
Static Electrical Characteristics
V
(VCC, VBS, VDD) = 15V , T
BIAS
are referenced to VSS and are applicable to all three logic input leads: HIN, LIN and SD. The VO and IO parameters are referenced to COM and are applicable to the respective output leads: HO or LO.
Symbol Definition Figure Min. Typ. Max. Units Test Conditions
V V
V
OH
V
OL
I
LK
I
QBS
I
QCC
I
QDD
I
IN+
I
IN-
V
BSUV+
V
BSUV-
V
CCUV+VCC
V
CCUV-
I
O+
I
O-
Logic “1” Input Voltage 12 9.5
IH
Logic “0” Input Voltage 13 6.0
IL
High Level Output Voltage, V Low Level Output Voltage, V Offset Supply Leakage Current 16 50 VB = VS = 600V Quiescent VBS Supply Current 17 25 60 V Quiescent VCC Supply Current 18 80 180 VIN = 0V or V Quiescent VDD Supply Current 19 2.0 5.0 VIN = 0V or V Logic “1” Input Bias Current 20 20 40 VIN = V Logic “0” Input Bias Current 21 1.0 V
VBS Supply Undervoltage Positive Going 22 7.4 8.5 9.6 Threshold VBS Supply Undervoltage Negative Going 23 7.0 8.1 9.2 Threshold
Supply Undervoltage Positive Going 24 7.6 8.6 9.6 Threshold VCC Supply Undervoltage Negative Going 25 7.2 8.2 9.2 Threshold Output High Short Circuit Pulsed Current 26 200 250 VO = 0V , V
Output Low Short Circuit Pulsed Current 27 420 500 VO = 15V , V
= 25°C and VSS = COM unless otherwise specified. The VIN, VTH and IIN parameters
A
= 25°C and VSS = COM unless otherwise specified. The dynamic
A
ns
V
BIAS
O
- V
O
14 100 IO = 0A 15 100 IO = 0A
mV
µA
V
mA
= 0V or V
IN
= 0V
IN
IN
PW10 µs
PW10 µs
DD
IN
DD DD DD
= V
= 0V
DD
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IR2112(S) & ( PbF)
Functional Block Diagram
V
DD
HIN
SD
LIN
V
RSQ
RSQ
SS
VDD/V
LEVEL
SHIFT
VDD/V
LEVEL
SHIFT
CC
PULSE
GEN
CC
Lead Definitions
Symbol Description
V
DD
HIN Logic input for high side gate driver output (HO), in phase SD Logic input for shutdown LIN Logic input for low side gate driver output (LO), in phase V
SS
V
B
HO High side gate drive output V
S
V
CC
LO Low side gate drive output COM Low side return
Logic supply
Logic ground High side floating supply
High side floating supply return Low side supply
HV LEVEL SHIFT
UV
DETECT
PULSE FILTER
DETECT
UV
DELAY
RQ R S
V
B
HO
V
S
V
LO
COM
CC
Lead Assignments
14 Lead DIP 16 Lead SOIC (Wide Body)
IR2112 IR2112S
Part Number
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IR2112(S) & ( PbF)
<50 V/ns
Figure 1. Input/Output Timing Diagram Figure 2. Floating Supply Voltage Transient Test
HIN
50%
Circuit
50%
LIN
t
on
t
r
90% 90%
t
off
t
f
HO LO
Figure 3. Switching Time Test Circuit Figure 4. Switching Time Waveform Definition
HIN
LIN
50%
SD
t
sd
HO
90%
LO
10% 10%
50%
LO
MT
50%
HO
10%
90%
MT
HOLO
Figure 6. Delay Matching Waveform DefinitionsFigure 5. Shutdown Waveform Definitions
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IR2112(S) & ( PbF)
0
)
)
)
0
)
250
200
Max.
150
100
50
Turn-On Delay Time (ns
0
Figure 7A. Turn-On Time vs. Tem pe rature
400
300
Typ.
-50 -25 0 25 50 75 100 125 Temperature
Max.
200
100
Tur n-O n Del ay Time (ns)
0
0 2 4 6 8 101214161820
Typ.
VDD Supply Voltage (V)
250
Max
200
150 100
50
Turn-On Delay Time (ns
0
10 12 14 16 18 2
VCC/VBS Supply Voltage (V)
.
Typ.
Figure 7B. T urn-On Time vs. VCC/VBS Supply Voltage
250
200
150
100
50
Turn-Off Delay Time (ns
0
-50 -25 0 25 50 75 100 125
Max.
Typ.
Temperature (°C)
Figure 7C. T urn-On T ime vs. V DD Supply Voltage
250
200
150
100
Max.
Typ.
50
0
Turn-Off Delay Time (ns
10 12 14 16 18 2
VCC/VBS Supply Vol tage (V)
Figure 8B. Turn-Off T ime vs. VCC/VBS Supply Voltage
Figure 8A. Turn-Off Tim e vs. Temperature
400
300
Max.
200
100
Typ.
0
Turn-OFF D el ay Time (ns)
0 2 4 6 8 101214161820
VDD S uppl y Vol tage (V)
Figure 8C. Turn-Off Time vs. VDD Supply Voltage
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