• Floating channel designed for bootstrap operation
• Fully operational to +600V
V
OFFSET
600V max.
• Tolerant to negative transient voltage
+/-200 mA / 420 mA
dV/dt immune
I
O
• Gate drive supply range from 10 to 20V
• Undervoltage lockout for both channels
V
OUT
10 - 20V
• 3.3V logic compatible
Separate logic supply range from 3.3V to 20V
Logic and power ground ±5V offset
• CMOS Schmitt-triggered inputs with pull-down
t
(typ.)125 & 105 ns
on/off
Delay Matching30 ns
• Cycle by cycle edge-triggered shutdown logic
• Matched propagation delay for both channels
• Outputs in phase with inputs
Packages
• Also available LEAD-FREE
Description
The IR2112(S) is a high voltage, high speed power
MOSFET and IGBT driver with independent high and
low side referenced output channels. Proprietary HVIC
and latch immune CMOS technologies enable ruggedized monolithic construction. Logic inputs are compatible with standard CMOS or LSTTL outputs, down
to 3.3V logic. The output drivers feature a high pulse current buffer stage designed for minimum driver crossconduction. Propagation delays are matched to simplify use in high frequency applications. The floating
channel can be used to drive an N-channel power MOSFET or IGBT in the high side configuration which
operates up to 600 volts.
14-Lead PDIP
16-Lead SOIC
(wide body)
Typical Connection
HO
V
DD
HIN
SD
LIN
V
SS
V
CC
(Refer to Lead Assignments for correct pin configuration). This/These diagram(s) show electrical connections only.
Please refer to our Application Notes and DesignTips for proper circuit board layout.
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V
DD
HIN
SD
LIN
V
SS
V
COM
LO
V
B
V
S
CC
up to 600V
TO
LOAD
IR2112(S) & ( PbF)
Absolute Maximum Ratings
Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM. The Thermal Resistance and Power Dissipation ratings are measured
under board mounted and still air conditions. Additional information is shown in Figures 28 through 35.
SymbolDefinitionMin.Max.Units
V
B
V
S
V
HO
V
CC
V
LO
V
DD
V
SS
V
IN
dVs/dtAllowable Offset Supply Voltage Transient (Figure 2)—50V/ns
P
D
R
THJA
T
J
T
S
T
L
Recommended Operating Conditions
The Input/Output logic timing diagram is shown in Figure 1. For proper operation the device should be used within the
recommended conditions. The VS and VSS offset ratings are tested with all supplies biased at 15V differential. Typical
ratings at other bias conditions are shown in Figures 36 and 37.
SymbolDefinitionMin.Max.Units
V
B
V
S
V
HO
V
CC
V
LO
V
DD
V
SS
V
IN
T
A
High Side Floating Supply Voltage-0.3625
High Side Floating Supply Offset VoltageVB - 25VB + 0.3
High Side Floating Output VoltageVS - 0.3V
Low Side Fixed Supply Voltage-0.325
B
+ 0.3
V
Low Side Output Voltage-0.3VCC + 0.3
Logic Supply Voltage-0.3VSS + 25
Logic Supply Offset VoltageVCC - 25V
Logic Input Voltage (HIN, LIN & SD)VSS - 0.3V
Package Power Dissipation @ TA ≤ +25°C(14 Lead DIP)—1.6
(16 Lead SOIC)—1.25
Thermal Resistance, Junction to Ambient(14 Lead DIP)—75
(16 Lead SOIC)—100
CC
DD
+ 0.3
+ 0.3
W
°C/W
Junction Temperature—150
Storage T emperature-55150
°C
Lead Temperature (Soldering, 10 seconds)—300
High Side Floating Supply Absolute VoltageVS + 10VS + 20
High Side Floating Supply Offset VoltageNote 1600
High Side Floating Output VoltageV
S
V
B
Low Side Fixed Supply Voltage1020
Low Side Output Voltage0VCC
V
Logic Supply VoltageVSS + 3VSS + 20
Logic Supply Offset Voltage-5 (Note 2)5
Logic Input Voltage (HIN, LIN & SD)V
SS
V
DD
Ambient Temperature-40125°C
Note 1: Logic operational for VS of -5 to +600V. Logic state held for VS of -5V to -VBS. (Please refer to the Design Tip
DT97-3 for more details).
Note 2: When VDD < 5V, the minimum VSS offset is limited to -VDD.
2www.irf.com
IR2112(S) & ( PbF)
Dynamic Electrical Characteristics
V
(VCC, VBS, VDD) = 15V, CL = 1000 pF, T
BIAS
electrical characteristics are measured using the test circuit shown in Figure 3.
SymbolDefinitionFigure Min. T yp. Max. Units T est Conditions
are referenced to VSS and are applicable to all three logic input leads: HIN, LIN and SD. The VO and IO parameters are
referenced to COM and are applicable to the respective output leads: HO or LO.
SymbolDefinitionFigure Min. Typ. Max. Units Test Conditions
V
V
V
OH
V
OL
I
LK
I
QBS
I
QCC
I
QDD
I
IN+
I
IN-
V
BSUV+
V
BSUV-
V
CCUV+VCC
V
CCUV-
I
O+
I
O-
Logic “1” Input Voltage129.5——
IH
Logic “0” Input Voltage13——6.0
IL
High Level Output Voltage, V
Low Level Output Voltage, V
Offset Supply Leakage Current16——50VB = VS = 600V
Quiescent VBS Supply Current17—2560V
Quiescent VCC Supply Current18—80180VIN = 0V or V
Quiescent VDD Supply Current19—2.05.0VIN = 0V or V
Logic “1” Input Bias Current20—2040VIN = V
Logic “0” Input Bias Current21——1.0V
Supply Undervoltage Positive Going247.68.69.6
Threshold
VCC Supply Undervoltage Negative Going257.28.29.2
Threshold
Output High Short Circuit Pulsed Current26200250—VO = 0V , V
Output Low Short Circuit Pulsed Current27420500—VO = 15V , V
= 25°C and VSS = COMunless otherwise specified. The VIN, VTH and IIN parameters
A
= 25°C and VSS = COM unless otherwise specified. The dynamic
A
ns
V
BIAS
O
- V
O
14——100IO = 0A
15——100IO = 0A
mV
µA
V
mA
= 0V or V
IN
= 0V
IN
IN
PW ≤ 10 µs
PW ≤ 10 µs
DD
IN
DD
DD
DD
= V
= 0V
DD
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IR2112(S) & ( PbF)
Functional Block Diagram
V
DD
HIN
SD
LIN
V
RSQ
RSQ
SS
VDD/V
LEVEL
SHIFT
VDD/V
LEVEL
SHIFT
CC
PULSE
GEN
CC
Lead Definitions
Symbol Description
V
DD
HINLogic input for high side gate driver output (HO), in phase
SDLogic input for shutdown
LINLogic input for low side gate driver output (LO), in phase
V
SS
V
B
HOHigh side gate drive output
V
S
V
CC
LOLow side gate drive output
COMLow side return
Logic supply
Logic ground
High side floating supply
High side floating supply return
Low side supply
HV
LEVEL
SHIFT
UV
DETECT
PULSE
FILTER
DETECT
UV
DELAY
RQ
R
S
V
B
HO
V
S
V
LO
COM
CC
Lead Assignments
14 Lead DIP 16 Lead SOIC (Wide Body)
IR2112 IR2112S
Part Number
4www.irf.com
IR2112(S) & ( PbF)
<50 V/ns
Figure 1. Input/Output Timing DiagramFigure 2. Floating Supply Voltage Transient Test
HIN
50%
Circuit
50%
LIN
t
on
t
r
90%90%
t
off
t
f
HO
LO
Figure 3. Switching Time Test CircuitFigure 4. Switching Time Waveform Definition