• Floating channel designed for bootstrap operation
• Fully operational to +600V
• Tolerant to negative transient voltage
dV/dt immune
• Gate drive supply range from 10 to 20V
• Undervoltage lockout for both channels
• Separate logic supply range from 5 to 20V
• Logic and power ground ±5V offset
• CMOS Schmitt-triggered inputs with pull-down
• Cycle by cycle edge-triggered shutdown logic
• Matched propagation delay for both channels
• Outputs in phase with inputs
Description
The IR2112 is a high voltage, high speed power
MOSFET and IGBT driver with independent high and
low side referenced output channels. Proprietary HVIC
and latch immune CMOS technologies enable ruggedized monolithic construction. Logic inputs are compatible with standard CMOS or LSTTL outputs. The
output drivers feature a high pulse current buff er stage
designed for minimum driver cross-conduction. Propagation delays are matched to simplify use in high frequency applications. The floating channel can be used
to drive an N-channel power MOSFET or IGBT in the
high side configuration which operates up to 600 volts.
T ypical Connection
Product Summary
V
OFFSET
+/-200 mA / 420 mA
I
O
V
OUT
t
(typ.)125 & 105 ns
on/off
Delay Matching30 ns
600V max.
10 - 20V
Packages
14 lead PDIP
14 lead PDIP
w/o lead 4
w/o leads 4 & 5
16 lead SOIC
(wide body)
16 lead PDIP
up to 600V
HO
V
HIN
SD
LIN
V
V
V
HIN
SD
LIN
V
DD
SS
DD
SS
CC
V
COM
LO
V
B
V
S
CC
TO
LOAD
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IR2112
Absolute Maximum Ratings
Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM. The Thermal Resistance and Power Dissipation ratings are measured
under board mounted and still air conditions. Additional information is shown in Figures 28 through 35.
SymbolDefinitionMin.Max.Units
V
B
V
S
V
HO
V
CC
V
LO
V
DD
V
SS
V
IN
dVs/dtAllowable Offset Supply Voltage Transient (Figure 2)—50V/ns
P
D
R
THJA
T
J
T
S
T
L
High Side Floating Supply Voltage-0.3625
High Side Floating Supply Offset VoltageVB - 25VB + 0.3
High Side Floating Output VoltageVS - 0.3V
Low Side Fixed Supply Voltage-0.325
B
+ 0.3
V
Low Side Output Voltage-0.3VCC + 0.3
Logic Supply Voltage-0.3VSS + 25
Logic Supply Offset VoltageVCC - 25V
Logic Input Voltage (HIN, LIN & SD)VSS - 0.3V
CC
DD
+ 0.3
+ 0.3
Package Power Dissipation @ TA ≤ +25°C(14 Lead DIP)—1.6
(14 Lead DIP w/o Lead 4)—1.5
(16 Lead DIP w/o Leads 4 & 5)—1.6
W
(16 Lead SOIC)—1.25
Thermal Resistance, Junction to Ambient(14 Lead DIP)—75
(14 Lead DIP w/o Lead 4)—85
°C/W
(16 Lead DIP w/o Leads 4 & 5)—75
(16 Lead SOIC)—100
Junction Temperature—150
Storage Temperature-55150°C
Lead Temperature (Soldering, 10 seconds)—300
Recommended Operating Conditions
The Input/Output logic timing diagram is shown in Figure 1. For proper operation the device should be used within the
recommended conditions. The VS and VSS offset ratings are tested with all supplies biased at 15V differential. Typical
ratings at other bias conditions are shown in Figures 36 and 37.
SymbolDefinitionMin.Max.Units
V
B
V
S
V
HO
V
CC
V
LO
V
DD
V
SS
V
IN
T
A
Note 1: Logic operational for VS of -5 to +600V. Logic state held for VS of -5V to -VBS.
2
High Side Floating Supply Absolute VoltageVS + 10VS + 20
High Side Floating Supply Offset VoltageNote 1600
High Side Floating Output VoltageV
S
V
B
Low Side Fixed Supply Voltage1020
Low Side Output Voltage0VCC
Logic Supply VoltageVSS + 4.5VSS + 20
Logic Supply Offset Voltage-55
Logic Input Voltage (HIN, LIN & SD)V
SS
V
DD
Ambient Temperature-40125°C
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V
IR2112
Dynamic Electrical Characteristics
V
(VCC, VBS, VDD) = 15V, CL = 1000 pF, T
BIAS
electrical characteristics are measured using the test circuit shown in Figure 3.
SymbolDefinitionFigure Min.Typ. Max. Units Test Conditions
t
t
t
MTDelay Matching, HS & LS Turn-On/Off———30Figure 5
Turn-On Propagation Delay7—125180VS = 0V
on
Turn-Off Propagation Delay8—105160VS = 600V
off
Shutdown Propagation Delay9—105160VS = 600V
sd
t
Turn-On Rise Time10—80130
r
t
Turn-Off Fall Time11—4065
f
Static Electrical Characteristics
V
(VCC, VBS, VDD) = 15V, T
BIAS
are referenced to VSS and are applicable to all three logic input leads: HIN, LIN and SD. The VO and IO parameters are
referenced to COM and are applicable to the respective output leads: HO or LO.
SymbolDefinitionFigure Min.Typ. Max. Units Test Conditions
V
V
I
QBS
I
QCC
I
QDD
I
V
BSUV+
V
BSUV-
V
CCUV+
V
CCUV-
V
V
I
I
I
I
OH
OL
LK
IN+
IN-
O+
O-
Logic “1” Input Voltage129.5——
IH
Logic “0” Input Voltage13——6.0
IL
High Level Output Voltage, V
Low Level Output Voltage, V
Offset Supply Leakage Current16——50VB = VS = 600V
Quiescent VBS Supply Current17—2560V
Quiescent VCC Supply Current18—80180VIN = 0V or V
Quiescent VDD Supply Current19—2.05.0VIN = 0V or V
Logic “1” Input Bias Current20—2040VIN = V
Logic “0” Input Bias Current21——1.0V
Output Low Short Circuit Pulsed Current27420500—VO = 15V, V
= 25°C and VSS = COMunless otherwise specified. The VIN, VTH and IIN parameters
A
= 25°C and VSS = COM unless otherwise specified. The dynamic
A
ns
V
BIAS
O
- V
O
14——100IO = 0A
15——100IO = 0A
mV
µA
V
mA
= 0V or V
IN
= 0V
IN
IN
PW ≤ 10 µs
PW ≤ 10 µs
DD
IN
= V
= 0V
DD
DD
DD
DD
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3
IR2112
Functional Block Diagram
V
DD
HIN
SD
LIN
V
RSQ
RSQ
SS
VDD/V
LEVEL
SHIFT
VDD/V
LEVEL
SHIFT
CC
PULSE
GEN
CC
Lead Definitions
Symbol Description
V
DD
HINLogic input for high side gate driver output (HO), in phase
SDLogic input for shutdown
LINLogic input for low side gate driver output (LO), in phase
V
SS
V
B
HOHigh side gate drive output
V
S
V
CC
LOLow side gate drive output
COMLow side return
Logic supply
Logic ground
High side floating supply
High side floating supply return
Low side supply
HV
LEVEL
SHIFT
UV
DETECT
PULSE
FILTER
DETECT
UV
DELAY
RQ
R
S
V
B
HO
V
S
V
CC
LO
COM
Lead Assignments
14 Lead DIP14 Lead DIP w/o Lead 416 Lead DIP w/o Leads 4 & 516 Lead SOIC (Wide Body)
IR2112IR2112-1IR2112-2IR2112S
Part Number
4
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IR2112
Figure 1. Input/Output Timing DiagramFigure 2. Floating Supply Voltage Transient Test
HIN
50%
Circuit
50%
LIN
t
on
t
r
90%90%
t
off
t
f
HO
LO
Figure 3. Switching Time Test CircuitFigure 4. Switching Time Waveform Definition