International Rrectifier IR2111S User Manual

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Data Sheet No. PD60028-M
IR2111(S) & (PbF
HALF-BRIDGE DRIVER
Features
Floating channel designed for bootstrap operation
Fully operational to +600V Tolerant to negative transient voltage dV/dt immune
Gate drive supply range from 10 to 20V
Undervoltage lockout for both channels
CMOS Schmitt-triggered inputs with pull-down
Internally set deadtime
High side output in phase with input
Also available LEAD-FREE
Description
The IR2111(S) is a high voltage, high speed power MOSFET and IGBT driver with dependent high and low side referenced output channels designed for half­bridge applications. Proprietary HVIC and latch immune CMOS technologies enable ruggedized monolithic construction. Logic input is compatible with standard CMOS outputs. The output drivers feature a high pulse current buffer stage designed for minimum driver cross-conduction. Internal deadtime is provided to avoid shoot-through in the output half-bridge. The floating channel can be used to drive an N-channel power MOSFET or IGBT in the high side configuration which operates up to 600 volts.
Product Summary
V
OFFSET
+/- 200 mA / 420 mA
I
O
V
OUT
t
(typ.) 750 & 150 ns
on/off
Deadtime (typ.) 650 ns
Packages
8-Lead PDIP 8-Lead SOIC
)
600V max.
10 - 20V
Typical Connection
up to 600V
V
CC
V
CC
IN
(Refer to Lead Assignments for correct pin configuration). This/These diagram(s) show electrical connections only. Please refer to our Application Notes and DesignT ips for proper circuit board layout.
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IN COM LO
V
HO
V
B
S
TO
LOAD
IR2111(S
) & ( PbF)
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param­eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Additional information is shown in figures 7 through 10.
Symbol Definition Min. Max. Units
V
B
V
S
V
HO
V
CC
V
LO
V
IN
dVs/dt Allowable offset supply voltage transient (figure 2) 50 V/ns
P
D
Rth
JA
T
J
T
S
T
L
High side floating supply voltage -0.3 625 High side floating supply offset voltage VB - 25 VB + 0.3 High side floating output voltage VS - 0.3 V Low side and logic fixed supply voltage -0.3 25 Low side output voltage -0.3 VCC + 0.3 Logic input voltage -0.3 V
Package power dissipation @ TA +25°C (8 Lead PDIP) 1.0
(8 lead SOIC) 0.625
Thermal resistance, junction to ambient (8 lead PDIP) 125
(8 lead SOIC) 200 Junction temperature 150 Storage temperature -55 150 Lead temperature (soldering, 10 seconds) 300
CC
B
+ 0.3
+ 0.3
V
W
°C/W
°C
Recommended Operating Conditions
The input/output logic timing diagram is shown in figure 1. For proper operation the device should be used within the recommended conditions. The VS offset rating is tested with all supplies biased at 15V differential.
Symbol Definition Min. Max. Units
V
B
V
S
V
HO
V
CC
V
LO
V
IN
T
A
Note 1: Logic operational for VS of -5 to +600V. Logic state held for VS of -5V to -VBS. (Please refer to the Design Tip DT97-3 for more details).
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High side floating supply absolute voltage VS + 10 VS + 20 High side floating supply offset voltage Note 1 600 High side floating output voltage V Low side and logic fixed supply voltage 10 20 Low side output voltage 0 V Logic input voltage 0 V Ambient temperature -40 125
S
V
B
CC CC
V
°C
IR2111(S
) & ( PbF)
Dynamic Electrical Characteristics
V
(VCC, VBS) = 15V, CL = 1000 pF and TA = 25°C unless otherwise specified. The dynamic electrical characteristics
BIAS
are measured using the test circuit shown in figure 3.
Symbol Definition Min. T yp. Max. Units T est Conditions
t
on
t
off t
t
DT Deadtime, LS turn-off to HS turn-on & 480 650 820
MT Delay matching, HS & LS turn-on/off 30
Turn-on propagation delay 550 750 950 VS = 0V Turn-off propagation delay 150 180 VS = 600V Turn-on rise time 80 130
r
Turn-off fall time 40 65
f
HS turn-off to LS turn-on
ns
Static Electrical Characteristics
V
(VCC, VBS) = 15V and TA = 25°C unless otherwise specified. The VIN, VTH and IIN parameters are referenced to
BIAS
COM. The VO and IO parameters are referenced to COM and are applicable to the respective output leads: HO or LO.
Symbol Definition Min. T yp. Max. Units Test Conditions
V
V
V
V
I
I
QBS
I
QCC
I
IN+
I
IN-
V
BSUV+
V
BSUV-
V
CCUV+
V
CCUV-
I
O+
I
OH
OL
LK
O-
Logic “1” input voltage for HO & logic “0” for LO 6.4 VCC = 10V
IH
9.5 VCC = 15V
12.6 VCC = 20V
Logic “0” input voltage for HO & logic “1” for LO 3.8 VCC = 10V
IL
6.0 VCC = 15V
8.3 VCC = 20V High level output voltage, V Low level output voltage, V Offset supply leakage current 50 VB = VS = 600V Quiescent VBS supply current 50 100 V Quiescent VCC supply current 70 180 VIN = 0V or V Logic “1” input bias current 30 50 VIN = V Logic “0” input bias current 1.0 VIN = 0V VBS supply undervoltage positive going threshold 7.6 8.6 9.6 VBS supply undervoltage negative going threshold 7.2 8.2 9.2 VCC supply undervoltage positive going threshold 7.6 8.6 9.6 VCC supply undervoltage negative going threshold 7.2 8.2 9.2 Output high short circuit pulsed current 200 250 VO = 0V , V
Output low short circuit pulsed current 420 500 VO = 15V, V
BIAS
O
- V
O
100 IO = 0A
100 IO = 0A
V
mV
µA
V
mA
= 0V or V
IN
IN
PW10 µs
PW10 µs
CC
IN
CC CC
= V
= 0V
CC
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IR2111(S
) & ( PbF)
Functional Block Diagram
DEAD
TIME
HV LEVEL SHIFT
UV
DETECT
PULSE FILTER
V
B
R
Q
R S
HO
PULSE
GEN
IN
DETECT
DEAD
TIME
UV
Lead Definitions
Symbol Description
IN Logic input for high side and low side gate driver outputs (HO & LO), in phase with HO V
B
HO High side gate drive output V
S
V
CC
LO Low side gate drive output COM Low side return
High side floating supply
High side floating supply return Low side and logic fixed supply
Lead Assignments
V
S
V
CC
LO
COM
8 Lead DIP 8 Lead SOIC
IR2111 IR2111S
Part Number
4 www.irf.com
IR2111(S
IN
HO
LO
Figure 1. Input/Output Timing Diagram Figure 2. Floating Supply Voltage Transient Test Circuit
IN
(LO)
50%
t
off
90% 90%
IN
(HO)
t
on
50%
t
r
) & ( PbF)
t
f
LO HO
Figure 3. Switching Time T est Circuit Figure 4. Switching Time Waveform Definition
IN
50% 50%
(LO)
IN
IN
(HO)
90%
HO
LO
Figure 5. Deadtime Waveform Definitions Figure 6. Delay Matching Waveform Definitions
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10%
DT
90%
10%
10% 10%
50%
LO
MT
50%
HO
10%
MT
90%
HOLO
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