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Preliminary Data Sheet PD60214 Rev B
IR20153S & (PbF)
HIGH SIDE DRIVER WITH RECHARGE
Features
Product Summary
• Floating channel designed for bootstrap operation
Fully operational up to 150V
Tolerant to negative transient voltage, dV/dt immune
• Gate drive supply range from 5V to 20V
• Undervoltage lockout
V
OFFSET
IO+/- 400mA @ VBS=7V,
• Internal recharge FET for bootstrap refresh
• Internal deadtime of 11µs and 0.8µs
• CMOS Schmitt-triggered input logic
• Output out of phase with input
• Reset input
• Split pull-up and pull-down gate drive pins
V
OUT
t
on/off
• Also available LEAD-FREE (PbF)
Description
The IR20153S is a high voltage, high speed power MOSFET driver . Proprietary HVIC
and latch immune CMOS technologies enable ruggedized monolithic construction. The
logic input is compatible with standard CMOS output down to 3.3V. The output driver
features a high pulse current buffer stage designed for minimum cross-conduction. The
floating channel can be used to drive an N-channel power MOSFET in the high or low
side configuration which operates up to 150 volts.
Typical Connection
150V max.
1.5A @ VBS=16V
5-20V
1.0 and 0.3 µs
Package
8-Lead SOIC
up to 150V
VCC
IN
RESET
(Refer to Lead Assignments
for correct configuration).
This/These diagram(s) show
electrical connections only.
Please refer to our Application Notes and DesignTips
for proper circuit board layout.
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VCC
IN
GND
RESET
VB
HOH
HOL
VS
Load

IR20153S & (PbF)
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to GND, all currents are defined positive into any lead. This is a stress only rating
and operation of the device at these or any conditions exceeding those indicated in the operational sections of this
specifications is not implied.
Symbol Definition Min. Max. Units
V
B
V
S
V
HO
V
CC
V
IN
dV/dt Allowable offset voltage slew rate — 50 V/nsec
T
J
T
S
T
L
High side driver output stage voltage -5.0 170
High side floating supply offset voltage - 8.0 150
Output voltage gate high connection VS - 0.3 V
Low side fixed supply voltage -0.3 25
Input voltage (IN and RESET) -0.3 V
Junction temperature -55 150
Storage temperature -55 150
Lead temperature (soldering, 10 seconds) — 300
B
+ 0.3
CC
°C
V
+0.3
Recommended Operating Conditions
The input/output logic timing diagram is shown in Fig. 2. For proper operation the device should be used within the
recommended conditions. All voltage parameters are absolute voltages referenced to GND. The VS offset rating is tested
with all suppliers biased at Vcc=5V and VBS=7V.
Symbol Definition Min. Max. Units
V
B
V
S
V
HO
V
CC
V
IN
T
A
2 www.irf.com
High side driver output stage voltage VS + 5 VS + 20
High side floating supply offset voltage -1.6 150
Output voltage gate high connection V
Supply voltage 5 20
Input voltage (IN and RESET) 0 Vcc
Ambient temperature -55 150 °C
S
V
B
V

IR20153S & (PbF)
Electrical Characteristics
Unless otherwise specified,
Unless otherwise noted, these specifications apply for an operating ambient temperature of TA =25°C.
Symbol Definition Min. Typ. Max. Units Test Conditions
VCC Supply Characteristics
V
CCUV+
V
CCUV-
V
CCUVHYSVCC
I
QCC
VBS Supply Characteristics
V
BSUV
V
BSUV
V
BSUVHYSVBS
I
QBS1
I
QBS2
VB. VS Supply Characteristics
I
LK
Gate Driver Characteristics
I
o+1
I
o+2
t
r1
t
r2
I
o-1
I
o-2
t
f1
t
f2
t
on
t
off
t
res,off
VCC supply undervoltage positive going threshold
VCC supply undervoltage negative going threshold 2.5 — — VCC dropping
VCC supply current
+VBS supply undervoltage positive going threshold
-VBS supply undervoltage negative going threshold 2.5
VBS supply current
VBS supply current
Offset supply leakage current
Peak output source current 250 400
Peak output source current 800 1500
Output rise time
Output rise time
Peak output sink current 250 400
Peak output sink current 800 1500
Output fall time
Output fall time
Input-to-Output Turn-on propogation delay
(50% input level to 10% output level)
Input-to-Output Turn-off propogation delay
(50% input level to 90% output level)
RES-to-Output Turn-off propogation delay
(50% input level to 90% [t
VCC = 5V, VBS = 7V, VS = 0V, IN = 0V, RES = 5V, load R = 50Ω, C = 6.8nF (see Figure 3).
——
supply undervoltage lockout hysteresis 0.01 0.3 0.60
——
——
supply undervoltage lockout hysteresis 0.01 0.3 0.60
——
——
——
—
—
—
—
—
—
—
] output levels)
phl
4.3
400 uA VCC = 3.6V & 6.5V
4.3 V VBS rising from 0V
——
100
200
50
—
—
0.2 0.4µsec
0.1 0.2µsec VBS = 16V
—
—
0.2 0.4µsec IN = 5V
0.1 0.2µsec VBS = 16V, IN = 5V
1.0 2.0µsec
0.3 0.9µsec
0.3 0.9µsec
V
V
µ
A static mode, VBS =
µ
A static mode, VBS =
16V, IN = 0V or 5V
µ
AVB = VS = 150V
mA
mA VBS = 16V
mA IN = 5V
mA VBS = 16V, IN = 5V
rising from 0V
CC
from 5V
VBS dropping
from 5V
7V, IN = 0V or 5V
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IR20153S & (PbF)
Electrical Characteristics
Unless otherwise specified,
Unless otherwise noted, these specifications apply for an operating ambient temperature of T
VCC = 5V, VBS = 7V, VS = 0V, IN = 0V, RES = 5V, load R = 50
Symbol Definition Min. Typ. Max. Units Test Conditions
Gate Driver Characteristics cont.
Supply Characteristics
V
CC
t
res,on
RES-to-Output Turn-On Propogation Delay - 1.0 2.0
(50% input level to 10% [t
] output levels)
plh
Input Characteristics
V
INH
V
INL
R
IN
V
H_RES
V
L_RES
R
RES
Recharge Characteristics
t
on_rech
t
off_rech
V
RECH
High Logic Level Input Threshold 3 - - V
Low Logic Level Input Threshold - - 1.4 V
High Logic Level Input Resistance 40 100 220 k
High Logic Level RES Input Threshold 3 - - V
Low Logic Level RES Input Threshold - - 1.4 V
High Logic Level RES Input Resistance 40 100 220 k
(see Figure 3a)
Recharge Transistor Turn-On Propogation Delay 7 11 15
Recharge Transistor Turn-Off Propogation Delay - 0.3 0.9
Recharge Output Transistor On-State Voltage Drop - - 1.2 V IS = 1mA, IN = 5V
Deadtime Characteristics
DT
DT
HOFF
HON
High Side Turn-Off to Recharge gate Turn-On 7 11 15
Recharge gate Turn-Off to High Side Turn-On0. 0.4 0.8 1.5
Ω
, C = 6.8nF (see Figure 3).
=25°C.
A
µ
sec
Ω
Ω
µ
sec VS = 5V
µ
sec
µ
sec
µ
sec
4 www.irf.com

IR20153S & (PbF)
A True table for
,
V
cc
, RESET, IN,
V
BS
LOW IN.
V
cc VBS
<V
ccUVLO-
<V
ccUVLO-
<V
ccUVLO-
<V
ccUVLO-
<V
ccUVLO-
<V
ccUVLO-
<V
ccUVLO-
<V
ccUVLO-
>V
ccUVLO+
>V
ccUVLO+
>V
ccUVLO+
<VBSUVLO-
<VBSUVLO-
<VBSUVLO-
<VBSUVLO-
>VBSUVLO+
>VBSUVLO+
>VBSUVLO+
>VBSUVLO+
<VBSUVLO-
<VBSUVLO-
<VBSUVLO-
and RechFET is shown as follows.
H
O
RESET- IN-
HIGH HIGH OFF ON
HIGH LOW OFF ON
LOW HIGH OFF ON
LOW LOW OFF ON
HIGH HIGH OFF ON
HIGH LOW OFF ON
LOW HIGH OFF ON
LOW LOW OFF ON
HIGH HIGH OFF ON
HIGH LOW OFF OFF
LOW HIGH OFF ON
This truth table is for ACTIVE
H
O
RechFET
>V
ccUVLO+
>V
ccUVLO+
>V
ccUVLO+
>V
ccUVLO+
>V
ccUVLO+
RESET = HIGH indicates that high side MOSFET is allowed to be turned on.
<VBSUVLO-
>VBSUVLO+
>VBSUVLO+
>VBSUVLO+ LOW HIGH OFF ON1
>VBSUVLO+
LOW LOW OFF ON
HIGH HIGH OFF ON
HIGH LOW ON OFF
LOW LOW OFF ON
1
1
1
RESET = LOW indicates that high side MOSFET is OFF.
IN = LOW indicates that high side MOSFET is on.
IN = HIGH indicates that high side MOSFET is off.
RechFET = ON indicates that the recharge MOSFET is on.
RechFET = OFF indicates that the recharge MOSFET is off.
1
Note: Refer to the RESET functionality graph of Figure 7, for VCC and VBS voltage ranges under which
the functionality is normal.
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