International Rectifier IRGPH50M Datasheet

PD - 9.1030
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IRGPH50M
INSULATED GATE BIPOLAR TRANSISTOR
Short Circuit Rated
Fast IGBT
Features
• Short circuit rated - 10µs @ 125°C, VGE = 15V
• Switching-loss rating includes all "tail" losses
• Optimized for medium operating frequency (1 to 10kHz) See Fig. 1 for Current vs. Frequency
curve
G
C
V
= 1200V
CES
V
E
@VGE = 15V, IC = 23A
CE(sat)
2.9V
n-channel
Description
Insulated Gate Bipolar Transistors (IGBTs) from International Rectifier have higher usable current densities than comparable bipolar transistors, while at the same time having simpler gate-drive requirements of the familiar power MOSFET. They provide substantial benefits to a host of high-voltage, high­current applications.
These new short circuit rated devices are especially suited for motor control and other applications requiring short circuit withstand capability.
TO-247AC
Absolute Maximum Ratings
Parameter Max. Units
V
CES
IC @ TC = 25°C Continuous Collector Current 42 IC @ TC = 100°C Continuous Collector Current 23 A I
CM
I
LM
t
sc
V
GE
E
ARV
PD @ TC = 25°C Maximum Power Dissipation 200 W PD @ TC = 100°C Maximum Power Dissipation 78 T
J
T
STG
Collector-to-Emitter Voltage 1200 V
Pulsed Collector Current 84 Clamped Inductive Load Current 84 Short Circuit Withstand Time 10 µs Gate-to-Emitter Voltage ±20 V Reverse Voltage Avalanche Energy 20 mJ
Operating Junction and -55 to +150 Storage Temperature Range °C Soldering Temperature, for 10 sec. 300 (0.063 in. (1.6mm) from case) Mounting torque, 6-32 or M3 screw. 10 lbf•in (1.1N•m)
Thermal Resistance
R
θJC
R
θCS
R
θJA
Wt Weight 6 (0.21) g (oz)
Parameter Min. Typ. Max. Units Junction-to-Case 0.64 Case-to-Sink, flat, greased surface 0.24 °C/W Junction-to-Ambient, typical socket mount 40
Revision 1
C-471
IRGPH50M
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Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V
(BR)CES
V
(BR)ECS
V
(BR)CES
V
CE(on)
V
GE(th)
V
GE(th)
g
fe
I
CES
I
GES
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
Q
g
Q
ge
Q
gc
t
d(on)
t
r
t
d(off)
t
f
E
on
E
off
E
ts
t
sc
t
d(on)
t
r
t
d(off)
t
f
E
ts
L
E
C
ies
C
oes
C
res
Collector-to-Emitter Breakdown Voltage 1200 V VGE = 0V, IC = 250µA Emitter-to-Collector Breakdown Voltage 20 V VGE = 0V, IC = 1.0A
/T
Temp. Coeff. of Breakdown Voltage 1.1 V/°C VGE = 0V, IC = 1.0mA
J
Collector-to-Emitter Saturation Voltage 2.3 2.9 IC = 23A VGE = 15V
3.0 V IC = 42A See Fig. 2, 5 — 2.8 IC = 23A, TJ = 150°C
Gate Threshold Voltage 3.0 5.5 VCE = VGE, IC = 250µA
/TJTemp. Coeff. of Threshold Voltage -13 mV/°C VCE = VGE, IC = 250µA
Forward Transconductance 11 15 S VCE = 100V, IC = 23A Zero Gate Voltage Collector Current 250 µA VGE = 0V, VCE = 1200V
2000 VGE = 0V, VCE = 1200V, TJ = 150°C
Gate-to-Emitter Leakage Current ±100 nA VGE = ±20V
Total Gate Charge (turn-on) 89 130 IC = 23A Gate - Emitter Charge (turn-on) 22 33 nC VCC = 400V See Fig. 8 Gate - Collector Charge (turn-on) 26 39 VGE = 15V Turn-On Delay Time 42 TJ = 25°C Rise Time 32 ns IC = 23A, VCC = 960V Turn-Off Delay Time 280 820 VGE = 15V, RG = 5.0 Fall Time 190 410 Energy losses include "tail" Turn-On Switching Loss 1.6 — Turn-Off Switching Loss 3.3 mJ See Fig. 9, 10, 11, 14 Total Switching Loss 4.9 11 Short Circuit Withstand Time 10 µs VCC = 720V, TJ = 125°C
VGE = 15V, RG = 5.0, V Turn-On Delay Time 32 TJ = 150°C, Rise Time 21 ns IC = 23A, VCC = 960V Turn-Off Delay Time 490 VGE = 15V, RG = 5.0 Fall Time 440 Energy losses include "tail" Total Switching Loss 10 mJ See Fig. 10, 14 Internal Emitter Inductance 13 nH Measured 5mm from package Input Capacitance 1900 VGE = 0V Output Capacitance 140 pF VCC = 30V See Fig. 7 Reverse Transfer Capacitance 24 ƒ = 1.0MHz
CPK
< 1000V
Notes:
Repetitive rating; VGE=20V, pulse width
limited by max. junction temperature. ( See fig. 13b )
VCC=80%(V
RG= 5.0, ( See fig. 13a )
), VGE=20V, L=10µH,
CES
Repetitive rating; pulse width limited
by maximum junction temperature.
Pulse width 80µs; duty factor 0.1%.
C-472
Pulse width 5.0µs,
single shot.
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