Preliminary Data Sheet PD - 9.1135
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IRGBC40M-S
INSULATED GATE BIPOLAR TRANSISTOR
Short Circuit Rated
Fast IGBT
Features
• Short circuit rated - 10µs @ 125°C, VGE = 15V
• Switching-loss rating includes all "tail" losses
• Optimized for medium operating frequency (1 to
10kHz)
G
C
V
= 600V
CES
V
E
@VGE = 15V, IC = 24A
CE(sat)
≤ 3.0V
n-channel
Description
Insulated Gate Bipolar Transistors (IGBTs) from International Rectifier have
higher usable current densities than comparable bipolar transistors, while at
the same time having simpler gate-drive requirements of the familiar power
MOSFET. They provide substantial benefits to a host of high-voltage, highcurrent applications.
These new short circuit rated devices are especially suited for motor control
and other applications requiring short circuit withstand capability.
Absolute Maximum Ratings
Parameter Max. Units
V
CES
IC @ TC = 25°C Continuous Collector Current 40
IC @ TC = 100°C Continuous Collector Current 24 A
I
CM
I
LM
t
sc
V
GE
E
ARV
PD @ TC = 25°C Maximum Power Dissipation 160 W
PD @ TC = 100°C Maximum Power Dissipation 65
T
J
T
STG
Collector-to-Emitter Voltage 600 V
Pulsed Collector Current 80
Clamped Inductive Load Current 80
Short Circuit Withstand Time 10 µs
Gate-to-Emitter Voltage ±20 V
Reverse Voltage Avalanche Energy 15 mJ
Operating Junction and -55 to +150
Storage Temperature Range °C
Soldering Temperature, for 10 sec. 300 (0.063 in. (1.6mm) from case)
Mounting torque, 6-32 or M3 screw. 10 lbf•in (1.1N•m)
SMD-220
Thermal Resistance
R
θJC
R
θJA
R
θJA
Wt Weight — 2 (0.07) — g (oz)
** When mounted on 1" square PCB (FR-4 or G-10 Material)
For recommended footprint and soldering techniques refer to application note #AN-994.
Parameter Min. Typ. Max. Units
Junction-to-Case — — 0.77
Junction-to-Ambient, (PCB mount)** — — 40 °C/W
Junction-to-Ambient, typical socket mount — — 80
Revision 1
C-347
IRGBC40M-S
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Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V
(BR)CES
V
(BR)ECS
∆V
(BR)CES
V
CE(on)
V
GE(th)
∆V
GE(th)
g
fe
I
CES
I
GES
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
Q
g
Q
ge
Q
gc
t
d(on)
t
r
t
d(off)
t
f
E
on
E
off
E
ts
t
sc
t
d(on)
t
r
t
d(off)
t
f
E
ts
L
E
C
ies
C
oes
C
res
Notes:
Repetitive rating; VGE=20V, pulse width
limited by max. junction temperature.
VCC=80%(V
RG= 10Ω
Collector-to-Emitter Breakdown Voltage 600 — — V VGE = 0V, IC = 250µA
Emitter-to-Collector Breakdown Voltage 20 — — V VGE = 0V, IC = 1.0A
/∆T
Temp. Coeff. of Breakdown Voltage — 0.70 — V/°C VGE = 0V, IC = 1.0mA
J
Collector-to-Emitter Saturation Voltage — 2.0 3.0 IC = 24A VGE = 15V
— 2.6 — V IC = 40A
— 2.4 — IC = 24A, TJ = 150°C
Gate Threshold Voltage 3.0 — 5.5 VCE = VGE, IC = 250µA
/∆TJTemperature Coeff. of Threshold Voltage — -12 — mV/°C VCE = VGE, IC = 250µA
Forward Transconductance 9.2 12 — S VCE = 100V, IC = 24A
Zero Gate Voltage Collector Current — — 250 µA VGE = 0V, VCE = 600V
— — 1000 VGE = 0V, VCE = 600V, TJ = 150°C
Gate-to-Emitter Leakage Current — — ±100 nA VGE = ±20V
Total Gate Charge (turn-on) — 59 80 IC = 24A
Gate - Emitter Charge (turn-on) — 8.6 10 nC VCC = 400V
Gate - Collector Charge (turn-on) — 25 42 VGE = 15V
Turn-On Delay Time — 26 — TJ = 25°C
Rise Time — 37 — ns IC = 24A, VCC = 480V
Turn-Off Delay Time — 240 410 VGE = 15V, RG = 10Ω
Fall Time — 230 420 Energy losses include "tail"
Turn-On Switching Loss — 0.75 —
Turn-Off Switching Loss — 1.65 — mJ
Total Switching Loss — 2.4 3.6
Short Circuit Withstand Time 10 — — µs VCC = 360V, TJ = 125°C
VGE = 15V, RG = 10Ω, V
Turn-On Delay Time — 28 — TJ = 150°C,
Rise Time — 37 — ns IC = 24A, VCC = 480V
Turn-Off Delay Time — 380 — VGE = 15V, RG = 10Ω
Fall Time — 460 — Energy losses include "tail"
Total Switching Loss — 4.5 — mJ
Internal Emitter Inductance — 7.5 — nH Measured 5mm from package
Input Capacitance — 1500 — VGE = 0V
Output Capacitance — 190 — pF VCC = 30V
Reverse Transfer Capacitance — 20 — ƒ = 1.0MHz
Pulse width 5.0µs,
single shot.
), VGE=20V, L=10µH,
CES
Repetitive rating; pulse width limited
by maximum junction temperature.
Pulse width ≤ 80µs; duty factor ≤ 0.1%.
CPK
< 500V
Refer to Section D for the following:
Package Outline 2 - SMD-220 Section D - page D-12
C-348