PD - 9.1108
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IRGBC30MD2
INSULATED GATE BIPOLAR TRANSISTOR
WITH ULTRAFAST SOFT RECOVERY
Short Circuit Rated
Fast Copack IGBT
DIODE
Features
• Short circuit rated -10µs @125°C, V
• Switching-loss rating includes all "tail" losses
• HEXFREDTM soft ultrafast diodes
• Optimized for medium operating frequency (1 to
10kHz) See Fig. 1 for Current vs. Frequency curve
GE
= 15V
G
C
V
= 600V
CES
V
CE(sat)
≤ 2.9V
@VGE = 15V, IC = 16A
E
n-channel
Description
Co-packaged IGBTs are a natural extension of International Rectifier's well
known IGBT line. They provide the convenience of an IGBT and an ultrafast
recovery diode in one package, resulting in substantial benefits to a host of
high-voltage, high-current, applications.
These new short circuit rated devices are especially suited for motor control
and other applications requiring short circuit withstand capability.
Absolute Maximum Ratings
Parameter Max. Units
V
CES
IC @ TC = 25°C Continuous Collector Current 26
IC @ TC = 100°C Continuous Collector Current 16
I
CM
I
LM
IF @ TC = 100°C Diode Continuous Forward Current 12
I
FM
t
sc
V
GE
PD @ TC = 25°C Maximum Power Dissipation 100 W
PD @ TC = 100°C Maximum Power Dissipation 42
T
J
T
STG
Collector-to-Emitter Voltage 600 V
Pulsed Collector Current 52 A
Clamped Inductive Load Current 52
Diode Maximum Forward Current 52
Short Circuit Withstand Time 10 µs
Gate-to-Emitter Voltage ± 20 V
Operating Junction and -55 to +150
Storage Temperature Range °C
Soldering Temperature, for 10 sec. 300 (0.063 in. (1.6mm) from case)
Mounting Torque, 6-32 or M3 Screw. 10 lbf•in (1.1 N•m)
Thermal Resistance
R
θJC
R
θJC
R
θCS
R
θJA
Wt Weight — 2 (0.07) — g (oz)
Parameter Min. Typ. Max. Units
Junction-to-Case - IGBT — — 1.2
Junction-to-Case - Diode — — 2.5 °C/W
Case-to-Sink, flat, greased surface — 0.50 —
Junction-to-Ambient, typical socket mount — — 80
Revision 2
C-357
IRGBC30MD2
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Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V
(BR)CES
∆V
(BR)CES
V
CE(on)
V
GE(th)
∆V
GE(th)
g
fe
I
CES
V
FM
I
GES
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
Q
g
Q
ge
Q
gc
t
d(on)
t
r
t
d(off)
t
f
E
on
E
off
E
ts
t
sc
t
d(on)
t
r
t
d(off)
t
f
E
ts
L
E
C
ies
C
oes
C
res
t
rr
I
rr
Q
rr
di
(rec)M
Notes:
Repetitive rating; VGE=20V, pulse width limited
by max. junction temperature. ( See fig. 20 )
Collector-to-Emitter Breakdown Voltage 600 —- —- V VGE = 0V, IC = 250µA
/∆T
Temp. Coeff. of Breakdown Voltage —- 0.65 —- V/°C VGE = 0V, IC = 1.0mA
J
Collector-to-Emitter Saturation Voltage —- 1.9 2.9 IC = 16A VGE = 15V
—- 2.7 —- V IC = 26A See Fig. 2, 5
—- 2.2 —- IC = 16A, TJ = 150°C
Gate Threshold Voltage 3.0 —- 5.5 VCE = VGE, IC = 250µA
/∆TJTemperature Coeff. of Threshold Voltage —- -12 —- mV/°C VCE = VGE, IC = 250µA
Forward Transconductance 3.3 6.5 —- S VCE = 100V, IC = 16A
Zero Gate Voltage Collector Current —- —- 250 µA VGE = 0V, VCE = 600V
—- —- 2500 VGE = 0V, VCE = 600V, TJ = 150°C
Diode Forward Voltage Drop —- 1.4 1.7 V IC = 12A See Fig. 13
—- 1.3 1.6 IC = 12A, TJ = 150°C
Gate-to-Emitter Leakage Current —- —- ±100 nA VGE = ±20V
Total Gate Charge (turn-on) —- 35 53 IC = 16A
Gate - Emitter Charge (turn-on) —- 7.4 11 nC VCC = 400V
Gate - Collector Charge (turn-on) —- 14 21 See Fig. 8
Turn-On Delay Time —- 68 —- TJ = 25°C
Rise Time —- 130 —- ns IC = 16A, VCC = 480V
Turn-Off Delay Time —- 330 500 VGE = 15V, RG = 23Ω
Fall Time —- 310 470 Energy losses include "tail" and
Turn-On Switching Loss —- 1.5 —- diode reverse recovery.
Turn-Off Switching Loss —- 2.1 —- mJ See Fig. 9, 10, 11, 18
Total Switching Loss —- 3.6 5.4
Short Circuit Withstand Time 10 —- —- µs VCC = 360V, TJ = 125°C
VGE = 15V, RG = 23Ω, V
Turn-On Delay Time —- 66 —- TJ = 150°C, See Fig. 9, 10, 11, 18
Rise Time —- 120 —- ns IC = 16A, VCC = 480V
Turn-Off Delay Time —- 580 —- VGE = 15V, RG = 23Ω
Fall Time —- 630 —- Energy losses include "tail" and
Total Switching Loss —- 5.7 —- mJ diode reverse recovery.
Internal Emitter Inductance —- 7.5 —- nH Measured 5mm from package
Input Capacitance —- 750 —- VGE = 0V
Output Capacitance —- 110 —- pF VCC = 30V See Fig. 7
Reverse Transfer Capacitance —- 9.3 —- ƒ = 1.0MHz
Diode Reverse Recovery Time —- 42 60 ns TJ = 25°C See Fig.
—- 80 120 TJ = 125°C 14 IF = 12A
Diode Peak Reverse Recovery Current —- 3.5 6.0 A TJ = 25°C See Fig.
—- 5.6 10 TJ = 125°C 15 VR = 200V
Diode Reverse Recovery Charge —- 80 180 nC TJ = 25°C See Fig.
—- 220 600 TJ = 125°C 16 di/dt = 200A/µs
/dt Diode Peak Rate of Fall of Recovery —- 180 —- A/µs TJ = 25°C See Fig.
During t
b
—- 120 —- TJ = 125°C 17
VCC=80%(V
), VGE=20V, L=10µH,
CES
RG= 23Ω, ( See fig. 19 )
Pulse width 5.0µs,
single shot.
Pulse width ≤ 80µs; duty factor ≤ 0.1%.
CPK
< 500V
C-358
IRGBC30MD2
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16
D u ty c y cle: 5 0 %
T = 1 25 °C
J
T = 90 °C
sink
G a te d ri ve a s sp ecifie d
12
Tu rn -o n lo s s es in clu d e
effe cts o f reve rse rec o ve ry
P o we r D iss ip a tion = 21 W
8
60% of rat e d
vo ltage
Load Current (A)
4
0
0.1 1 10 100
f, Frequency (kHz)
Fig. 1 - Typical Load Current vs. Frequency
100
(Load Current = I
T = 25°C
J
T = 150°C
10
J
of fundamental)
RMS
100
10
T = 150°C
J
T = 25°C
J
1
C
I , Collector-to-Emitter Current (A)
0.1
0.1 1 10
V , Collector-to-Emitter Voltage (V)
Fig. 2 - Typical Output Characteristics
CE
V = 15V
GE
20µs PULSE WIDTH
C-359
C
I , Collector-to-Emitter Current (A)
1
5 10 15 20
V , Gate-to-Emitter Voltage (V)
GE
V = 100V
CC
5µs PULSE WIDTH
Fig. 3 - Typical Transfer Characteristics