International Rectifier IRGBC20MD2 Datasheet

PD - 9.1106
TO-220AB
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IRGBC20MD2
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY
Short Circuit Rated
Fast Copack IGBT
DIODE
Features
• Short circuit rated -10µs @125°C, V
• Switching-loss rating includes all "tail" losses
• HEXFREDTM soft ultrafast diodes
• Optimized for medium operating frequency (1 to 10kHz) See Fig. 1 for Current vs. Frequency curve
GE
G
C
V
= 600V
CES
V
CE(sat)
2.5V
@VGE = 15V, IC = 8.0A
E
n-channel
Description
Co-packaged IGBTs are a natural extension of International Rectifier's well known IGBT line. They provide the convenience of an IGBT and an ultrafast recovery diode in one package, resulting in substantial benefits to a host of high-voltage, high-current, applications.
These new short circuit rated devices are especially suited for motor control and other applications requiring short circuit withstand capability.
Absolute Maximum Ratings
Parameter Max. Units
V
CES
IC @ TC = 25°C Continuous Collector Current 13 IC @ TC = 100°C Continuous Collector Current 8.0 I
CM
I
LM
IF @ TC = 100°C Diode Continuous Forward Current 7.0 I
FM
t
sc
V
GE
PD @ TC = 25°C Maximum Power Dissipation 60 W PD @ TC = 100°C Maximum Power Dissipation 24 T
J
T
STG
Collector-to-Emitter Voltage 600 V
Pulsed Collector Current 26 A Clamped Inductive Load Current 26
Diode Maximum Forward Current 60 Short Circuit Withstand Time 10 µs Gate-to-Emitter Voltage ± 20 V
Operating Junction and -55 to +150 Storage Temperature Range °C Soldering Temperature, for 10 sec. 300 (0.063 in. (1.6mm) from case) Mounting Torque, 6-32 or M3 Screw. 10 lbf•in (1.1 N•m)
Thermal Resistance
R
θJC
R
θJC
R
θCS
R
θJA
Wt Weight 2 (0.07) g (oz)
Parameter Min. Typ. Max. Units Junction-to-Case - IGBT 2.1 Junction-to-Case - Diode 3.5 °C/W Case-to-Sink, flat, greased surface 0.50 — Junction-to-Ambient, typical socket mount 80
Revision 2
C-349
IRGBC20MD2
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Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V
(BR)CES
V
(BR)CES
V
CE(on)
V
GE(th)
V
GE(th)
g
fe
I
CES
V
FM
I
GES
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
Q
g
Qge Gate - Emitter Charge (turn-on) 3.6 5.2 nC VCC = 400V Q
gc
t
d(on)
t
r
t
d(off)
t
f
E
on
E
off
E
ts
t
sc
t
d(on)
t
r
t
d(off)
t
f
E
ts
L
E
C
ies
C
oes
C
res
t
rr
I
rr
Q
rr
di
(rec)M
Notes:
Repetitive rating; VGE=20V, pulse width limited
by max. junction temperature. ( See fig. 20 )
Collector-to-Emitter Breakdown Voltage 600 V VGE = 0V, IC = 250µA
/T
Temperature Coeff. of Breakdown Voltage 0.42 V/°C VGE = 0V, IC = 1.0mA
J
Collector-to-Emitter Saturation Voltage 2.0 2.5 IC = 8.0A VGE = 15V
2.7 V IC = 13A See Fig. 2, 5 — 2.5 IC = 8.0A, TJ = 150°C
Gate Threshold Voltage 3.0 5.5 VCE = VGE, IC = 250µA
/TJTemperature Coeff. of Threshold Voltage -11 — mV/°C VCE = VGE, IC = 250µA
Forward Transconductance 2.7 3.8 S VCE = 100V, IC = 8.0A Zero Gate Voltage Collector Current 250 µA VGE = 0V, VCE = 600V
1700 VGE = 0V, VCE = 600V, TJ = 150°C
Diode Forward Voltage Drop 1.4 1.7 V IC = 8.0A See Fig. 13
1.4 1.7 IC = 8.0A, TJ = 150°C
Gate-to-Emitter Leakage Current ±100 nA VGE = ±20V
Total Gate Charge (turn-on) 16 24 IC = 8.0A
Gate - Collector Charge (turn-on) 6.0 9.0 See Fig. 8 Turn-On Delay Time 66 TJ = 25°C Rise Time 40 ns IC = 8.0A, VCC = 480V Turn-Off Delay Time 330 540 VGE = 15V, RG = 50 Fall Time 260 480 Energy losses include "tail" and Turn-On Switching Loss 0.5 diode reverse recovery. Turn-Off Switching Loss 1.0 mJ See Fig. 9, 10, 11, 18 Total Switching Loss 1.5 2.5 Short Circuit Withstand Time 10 µs VCC = 360V, TJ = 125°C
VGE = 15V, RG = 50, V Turn-On Delay Time 65 TJ = 150°C, See Fig. 9, 10, 11, 18 Rise Time 46 ns IC = 8.0A, VCC = 480V Turn-Off Delay Time 520 VGE = 15V, RG = 50 Fall Time 560 Energy losses include "tail" and Total Switching Loss 2.3 mJ diode reverse recovery. Internal Emitter Inductance 7.5 nH Measured 5mm from package Input Capacitance 365 VGE = 0V Output Capacitance 47 pF VCC = 30V See Fig. 7 Reverse Transfer Capacitance 4.8 ƒ = 1.0MHz Diode Reverse Recovery Time 37 55 ns TJ = 25°C See Fig.
55 90 TJ = 125°C 14 IF = 8.0A
Diode Peak Reverse Recovery Current 3.5 5.0 A TJ = 25°C See Fig.
4.5 8.0 TJ = 125°C 15 VR = 200V
Diode Reverse Recovery Charge 65 138 nC TJ = 25°C See Fig.
124 360 TJ = 125°C 16 di/dt = 200A/µs
/dt Diode Peak Rate of Fall of Recovery 240 A/µs TJ = 25°C See Fig.
During t
b
210 TJ = 125°C 17 VCC=80%(V
), VGE=20V, L=10µH,
CES
RG= 50, ( See fig. 19 )
Pulse width 5.0µs,
single shot.
Pulse width 80µs; duty factor 0.1%.
CPK
< 500V
C-350
IRGBC20MD2
A
A
A
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10
D u ty c y cle : 5 0% T = 1 2 5 °C
J
T = 90 ° C
8
6
60% o f rat e d voltage
4
Load Current (A)
2
0
0.1 1 10 100
f, Fr equency (kHz)
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = I
of fundamental)
RMS
sink
G a te d rive as spe cifie d Tu rn -o n loss e s includ e effe cts o f re v erse re c o ve ry P o we r D issip atio n = 13 W
100
T = 25°C
J
T = 150°C
J
10
C
I , Collector-to-Emitter Current (A)
1
1 10
V , Collector-to-Emitter Voltage (V)
CE
V = 15V
GE
20µs PULSE WIDTH
Fig. 2 - Typical Output Characteristics
C-351
100
T = 150°C
J
10
T = 25°C
J
C
I , Collector-to-Emitter Current (A)
1
5 10 15 20
V , Gate-to-Emitter Voltage (V)
GE
V = 100V
CC
5µs PULSE WIDTH
Fig. 3 - Typical Transfer Characteristics
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