PD - 91688A
PRELIMINARY
INSULATED GATE BIPOLAR TRANSISTOR WITH
ULTRAFAST SOFT RECOVERY DIODE
Features
• Hole-less clip/pressure mount package compatible
IRG4PSH71KD
Short Circuit Rated
UltraFast IGBT
C
V
= 1200V
CES
with TO-247 and TO-264, with reinforced pins
• High short circuit rating IGBTs, optimized for
motorcontrol
G
V
CE(on) typ.
= 2.97V
• Minimum switching losses combined with low
conduction losses
• Tightest parameter distribution
• IGBT co-packaged with ultrafast soft recovery
E
n-channel
@VGE = 15V, IC = 42A
antiparallel diode
• Creepage distance increased to 5.35mm
Benefits
• Highest current rating copack IGBT
• Maximum power density, twice the power
handling of the TO-247, less space than TO-264
• HEXFREDTM diode optimized for operation with
IGBT, to minimize EMI, noise and switching losses
SUPER - 247
Absolute Maximum Ratings
Parameter Max. Units
V
CES
IC @ TC = 25°C Continuous Collector Current 78
IC @ TC = 100°C Continuous Collector Current 42
I
CM
I
LM
IF @ TC = 100°C Diode Continuous Forward Current 42
I
FM
t
sc
V
GE
PD @ TC = 25°C Maximum Power Dissipation 350
PD @ TC = 100°C Maximum Power Dissipation 140
T
J
T
STG
Collector-to-Emitter Voltage 1200 V
Pulsed Collector Current 156 A
Clamped Inductive Load Current 156
Diode Maximum Forward Current 156
Short Circuit Withstand Time 10 µs
Gate-to-Emitter Voltage ± 20 V
W
Operating Junction and -55 to +150
Storage Temperature Range °C
Soldering Temperature, for 10 sec. 300 (0.063 in. (1.6mm) from case)
Thermal Resistance\ Mechanical
Parameter Min. Typ. Max. Units
R
θJC
R
θJC
R
θCS
R
θJA
Junction-to-Case - IGBT ––– ––– 0.36
Junction-to-Case - Diode ––– ––– 0.69 °C/W
Case-to-Sink, flat, greased surface ––– 0.24 –––
Junction-to-Ambient, typical socket mount ––– ––– 38
Recommended Clip Force 20.0(2.0) ––– ––– N (kgf)
Weight ––– 6 (0.21) ––– g (oz)
www.irf.com 1
5/11/99
IRG4PSH71KD
Electrical Characteristics @ T
= 25°C (unless otherwise specified)
J
Parameter Min. Typ. Max. Units Conditions
V
(BR)CES
∆V
(BR)CES
V
CE(on)
Collector-to-Emitter Breakdown Voltage 1200 — — V VGE = 0V, IC = 250µA
/∆T
Temperature Coeff. of Breakdown Voltage — 1.1 — V/°C VGE = 0V, IC = 10mA
J
Collector-to-Emitter Saturation Voltage — 2.97 3.9 IC = 42A VGE = 15V
— 3.44 — V IC = 78A See Fig. 2, 5
— 2.60 — IC = 42A, TJ = 150°C
V
∆V
g
I
CES
GE(th)
GE(th)
fe
Gate Threshold Voltage 3.0 — 6.0 VCE = VGE, IC = 250µA
/∆TJTemperature Coeff. of Threshold Voltage — -12 — mV/°C VCE = VGE, IC = 1.5mA
Forward Transconductance 25 38 — S VCE = 50V, IC = 42A
Zero Gate Voltage Collector Current — — 500 µA VGE = 0V, VCE = 1200V
— — 10 mA VGE = 0V, VCE = 1200V, TJ = 150°C
V
I
FM
GES
Diode Forward Voltage Drop — 2.5 3 . 7 IC = 42A See Fig. 13
— 2.4 — IC = 42A, TJ = 150°C
V
Gate-to-Emitter Leakage Current — — ±100 nA VGE = ±20V
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
Q
Q
Q
t
d(on)
t
r
t
d(off)
t
f
E
E
E
t
sc
g
ge
gc
on
off
ts
Total Gate Charge (turn-on) — 410 610 IC = 42A
Gate - Emitter Charge (turn-on) — 47 70 nC VCC = 400V See Fig.8
Gate - Collector Charge (turn-on) — 145 220 VGE = 15V
Turn-On Delay Time — 67 —
Rise Time — 84 — TJ = 25°C
Turn-Off Delay Time — 230 350 IC = 42A, VCC = 800V
ns
Fall Time — 130 190 VGE = 15V, RG = 5.0Ω
Turn-On Switching Loss — 5.68 — Energy losses include "tail"
Turn-Off Switching Loss — 3.23 — m J and diode reverse recovery
Total Switching Loss — 8.90 11.6 See Fig. 9,10,18
Short Circuit Withstand Time 10 — — µs VCC = 720V, TJ = 125°C
VGE = 15V, RG = 5.0Ω
t
d(on)
t
r
t
d(off)
t
f
E
L
C
C
C
t
rr
ts
E
ies
oes
res
Turn-On Delay Time — 65 — TJ = 150°C, See Fig. 11,18
Rise Time — 87 — IC = 42A, VCC = 800V
Turn-Off Delay Time — 370 — VGE = 15V, RG = 5.0Ω
ns
Fall Time — 290 — Energy losses include "tail"
Total Switching Loss — 13.7 — mJ and diode reverse recovery
Internal Emitter Inductance — 13 — nH Measured 5mm from package
Input Capacitance — 5770 — VGE = 0V
Output Capacitance — 400 — pF VCC = 30V See Fig. 7
Reverse Transfer Capacitance — 100 — ƒ = 1.0MHz
Diode Reverse Recovery Time — 107 160 n s TJ = 25°C See Fig.
— 160 240 TJ = 125°C 14 IF = 42A
I
rr
Diode Peak Reverse Recovery Current — 10 15 A TJ = 25°C See Fig.
—1624 TJ = 125°C 15 VR = 200V
Q
rr
Diode Reverse Recovery Charge — 680 1020 nC TJ = 25°C See Fig.
— 1400 2100 TJ = 125°C 16 di/dt = 200A/µs
di
/dt Diode Peak Rate of Fall of Recovery — 250 — A/µs TJ = 25°C See Fig.
(rec)M
During t
b
— 320 — TJ = 125°C 17
2 www.irf.com
IRG4PSH71KD
40
For both:
Duty cycle: 50%
T = 125°C
J
T = 90° C
30
Square wave:
20
LOAD CURRENT (A)
10
0
0.1 1 10 100
60 % o f r a ted
v o l tage
I
Ideal diodes
f, Frequency (KHz)
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = I
of fundamental)
RMS
sink
Gate drive as specified
Power Dissipation = W
58
1000
100
10
C
I , Collector Current (A)
Ic , Collector-to-Emitter Current (A)
1
1.0 2.0 3.0 4.0 5.0
T = 150 C
V , Collector-to-Emitter Voltage (V)
J
CE
°
°
T = 25 C
J
V = 15V
GE
80µs PULSE WIDTH
1000
100
°
T = 150 C
J
10
°
T = 25 C
J
C
I , Collector-to-Emitter Current (A)
1
5 6 7 8 9 10 11
V , Gate-to-Emitter Voltage (V)
GE
V = 50V
CC
5µs PULSE WIDTH
Fig. 2 - Typical Output Characteristics Fig. 3 - Typical Transfer Characteristics
www.irf.com 3