International Rectifier IRG4PH50K Datasheet

PD - 9.1576
IRG4PH50K
INSULATED GATE BIPOLAR TRANSISTOR
Features
High short circuit rating optimized for motor control,
tsc =10µs, V
Combines low conduction losses with high
switching speed
Latest generation design provides tighter
parameter distribution and higher efficiency than previous generations
= 720V, TJ = 125°C, VGE = 15V
CC
C
G
E
n-channel
Short Circuit Rated
UltraFast IGBT
V
CES
V
CE(on) typ.
@VGE = 15V, IC = 24A
= 2.77V
Benefits
As a Freewheeling Diode we recommend our HEXFRED
ultrafast, ultrasoft recovery diodes for minimum EMI/Noise and switching losses in the Diode and IGBT
Latest generation 4 IGBTs offer highest power density
motor controls possible
This part replaces the IRGPH50K and IRGPH50M devices
TM
TO-247 AB
Absolute Maximum Ratings
Parameter Max. Units
V
CES
IC @ TC = 25°C Continuous Collector Current 45 IC @ TC = 100°C Continuous Collector Current 24 A I
CM
I
LM
t
sc
V
GE
E
ARV
PD @ TC = 25°C Maximum Power Dissipation 200 W PD @ TC = 100°C Maximum Power Dissipation 78 T
J
T
STG
Collector-to-Emitter Voltage 1200 V
Pulsed Collector Current 90 Clamped Inductive Load Current 90 Short Circuit Withstand Time 10 µs Gate-to-Emitter Voltage ±20 V Reverse Voltage Avalanche Energy 190 mJ
Operating Junction and -55 to +150 Storage Temperature Range °C Soldering Temperature, for 10 sec. 300 (0.063 in. (1.6mm) from case) Mounting torque, 6-32 or M3 screw. 10 lbf•in (1.1N•m)
Thermal Resistance
Parameter Typ. Max. Units
R
θJC
R
θCS
R
θJA
Wt Weight 6 (0.21) g (oz)
Junction-to-Case 0.64 Case-to-Sink, Flat, Greased Surface 0.24 °C/W Junction-to-Ambient, typical socket mount 40
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IRG4PH50K
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V
(BR)CES
V
(BR)ECS
V
(BR)CES
V
CE(ON)
V
GE(th)
V
GE(th)
g
fe
I
CES
I
GES
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Q
g
Q
ge
Q
gc
t
d(on)
t
r
t
d(off)
t
f
E
on
E
off
E
ts
t
sc
t
d(on)
t
r
t
d(off)
t
f
E
ts
L
E
C
ies
C
oes
C
res
Notes:
Repetitive rating; V
junction temperature. (see figure 13b)
V
CC
(see figure 13a)
Collector-to-Emitter Breakdown Voltage 1200 V VGE = 0V, IC = 250µA Emitter-to-Collector Breakdown Voltage 18 V VGE = 0V, IC = 1.0A
/T
Temperature Coeff. of Breakdown Voltage 0.91 V/°C VGE = 0V, IC = 2.0mA
J
2.77 3.5 IC = 24A VGE = 15V
Collector-to-Emitter Saturation Voltage 3.28 IC = 45A see figures 2, 5
2.54 IC = 24A , TJ = 150°C
V
Gate Threshold Voltage 3.0 6.0 VCE = VGE, IC = 250µA
/TJTemperature Coeff. of Threshold Voltage -10 mV/°C VCE = VGE, IC = 2.0mA
Forward Transconductance 13 19 S VCE = 100 V, IC = 24A Zero Gate Voltage Collector Current
250 VGE = 0V, VCE = 1200V — 2.0 VGE = 0V, VCE = 10V, TJ = 25°C
µA
5000 VGE = 0V, VCE = 1200V, TJ = 150°C
Gate-to-Emitter Leakage Current ±100 nA VGE = ±20V
Parameter Min. Typ. Max. Units Conditions
Total Gate Charge (turn-on) 180 270 IC = 24A Gate - Emitter Charge (turn-on) 25 38 nC VCC = 400V see figure 8 Gate - Collector Charge (turn-on) 70 110 VGE = 15V Turn-On Delay Time 36 — Rise Time 27 TJ = 25°C Turn-Off Delay Time 200 300 IC = 24A, VCC = 960V
ns
Fall Time 130 190 VGE = 15V, RG = 5.0 Turn-On Switching Loss 1.21 Energy losses include "tail" Turn-Off Switching Loss 2.25 m J see figures 9,10,14 Total Switching Loss 3.46 4.1 Short Circuit Withstand Time 10 µs VCC = 720V, TJ = 125°C
VGE = 15V, RG = 5.0 Turn-On Delay Time 35 TJ = 150°C, Rise Time 29 IC = 24A, VCC = 960V Turn-Off Delay Time 380 VGE = 15V, RG = 5.0
ns
Fall Time 280 Energy losses include "tail" Total Switching Loss 7.80 mJ see figures 10,11,14 Internal Emitter Inductance 13 nH Measured 5mm from package Input Capacitance 2800 — VGE = 0V Output Capacitance 140 pF VCC = 30V see figure 7 Reverse Transfer Capacitance 53 ƒ = 1.0MHz
= 80% (V
= 20V, pulse width limited bymax.
GE
), V
CES
= 20V, L = 10µH, RG = 5.0,
GE
Repetitive rating; pulse width limited by maximum
junction temperature.
Pulse width 80µs; duty factor 0.1%.Pulse width 5.0µs, single shot.
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