International Rectifier IRFZ24NS, IRFZ24NL Datasheet
PD - 9.1355B
IRFZ24NS/L
HEXFET® Power MOSFET
l Advanced Process Technology
l Surface Mount (IRFZ24NS)
l Low-profile through-hole (IRFZ24NL)
l 175°C Operating Temperature
l Fast Switching
l Fully Avalanche Rated
Description
G
D
S
V
R
DS(on)
= 55V
DSS
= 0.07Ω
= 17A
I
D
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
2
The D
Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible onresistance in any existing surface mount package. The
2
D
Pak is suitable for high current applications because of
2
D Pa k
TO-262
its low internal connection resistance and can dissipate
up to 2.0W in a typical surface mount application.
The through-hole version (IRFZ24NL) is available for lowprofile applications.
Absolute Maximum Ratings
Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 17
@ TC = 100°C Continuous Drain Current, VGS @ 10V 12 A
I
D
I
DM
PD @TA = 25°C Power Dissipation 3.8 W
PD @TC = 25°C Power Dissipation 45 W
V
GS
E
AS
I
AR
E
AR
dv/d t Peak Diode Recovery dv/dt 6.8 V/ns
T
J
T
STG
Pulsed Drain Current 68
Linear Derating Factor 0.30 W/°C
Gate-to-Source Voltage ± 20 V
Single Pulse Avalanche Energy 71 mJ
Avalanche Current 10 A
Repetitive Avalanche Energy 4.5 mJ
Operating Junction and -55 to + 175
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
Thermal Resistance
Parameter Typ. Max. Units
R
θJC
R
θJA
Junction-to-Case ––– 3.3
Junction-to-Ambient ( PCB Mounted,steady-state)** –– – 40
°C/W
°C
9/22/97
IRFZ24NS/L
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
∆V
(BR)DSS
R
DS(on)
V
GS(th)
g
fs
I
DSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
L
S
C
iss
C
oss
C
rss
Drain-to-Source Breakdown Voltage 55 ––– ––– V VGS = 0V, ID = 250µA
/∆T
Breakdown Voltage Temp. Coefficient –– – 0.052 ––– V/°C Reference to 25°C, ID =1mA
J
Static Drain-to-Source On-Resistance –– – ––– 0.07 Ω VGS =10V, ID = 10A
Gate Threshold Voltage 2.0 ––– 4.0 V VDS = VGS, ID = 250µA
Forward Transconductance 4.5 ––– ––– S VDS = 25V, ID = 10A
Drain-to-Source Leakage Current
––– ––– 25
––– ––– 250 VDS = 44V, VGS = 0V, TJ = 150°C
Gate-to-Source Forward Leakage ––– –– – 100 V
Gate-to-Source Reverse Leakage ––– ––– -100
VDS = 55V, VGS = 0V
µA
= 20V
GS
nA
VGS = -20V
Total Gate Charge ––– ––– 20 ID = 10A
Gate-to-Source Charge ––– ––– 5.3 nC VDS = 44V
Gate-to-Drain ("Miller") Charge ––– ––– 7. 6 VGS = 10V, See Fig. 6 and 13
Turn-On Delay Time ––– 4.9 ––– VDD = 28V
Rise Time ––– 34 ––– ID = 10A
Turn-Off Delay Time ––– 19 ––– RG = 24Ω
ns
Fall Time ––– 27 ––– RD = 2.6Ω, See Fig. 10
Internal Source Inductance
––– –––
7.5
Between lead,
nH
and center of die contact
Input Capacitance ––– 370 – –– VGS = 0V
Output Capacitance ––– 14 0 – –– pF VDS = 25V
Reverse Transfer Capacitance ––– 65 ––– ƒ = 1.0MHz, See Fig. 5
Source-Drain Ratings and Characteristics
Parameter Min. Typ. Max. Units Conditions
I
S
I
SM
V
SD
t
rr
Q
rr
t
on
Notes:
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
Starting T
RG = 25Ω, I
I
SD
TJ ≤ 175°C
** When mounted on 1" square PCB (FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
Continuous Source Current MOSFET symbol
(Body Diode)
Pulsed Source Current integral reverse
(Body Diode)
––– –––
––– –––
17
68
showing the
A
p-n junction diode.
Diode Forward Voltage ––– ––– 1.3 V TJ = 25°C, IS = 10A, VGS = 0V
Reverse Recovery Time ––– 56 83 ns TJ = 25°C, IF = 10A
Reverse Recovery Charge ––– 120 180 nC di/dt = 100A/µs
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Pulse width ≤ 280µs; duty cycle ≤ 2%.
= 25°C, L =1.0mH
J
= 10A. (See Figure 12)
AS
≤ 10A, di/dt ≤ 280A/µs, V
DD
≤ V
(BR)DSS
Uses IRFZ24N data and test conditions
,
D
G
S
IRFZ24NS/L
100
VGS
TOP 15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTT OM 4.5V
10
D
I , D ra in-to-S ou rce C urrent (A )
4.5V
20µs PULSE WIDTH
TJ = 25°C
T = 25 ° C
1
0.1 1 10 100
V , D rain-to-Source Voltage (V )
DS
100
C
100
VGS
TOP 15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTT OM 4.5V
10
4.5V
D
I , D ra in-to-S ou rce C urrent (A )
20µs PUL SE W IDTH
TJ = 175°C
T = 175°C
A
1
0.1 1 1 0 100
V , Drain-to-So urc e V oltag e (V)
DS
C
A
Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics
3.0
I = 17A
D
T = 25°C
J
T = 175°C
J
10
D
I , D rain-to- S o urce Cu r r e nt ( A )
1
45678910
V , Ga te-to-Source Voltage (V)
GS
V = 25V
DS
20µs PULSE WIDTH
Fig 3. Typical Transfer Characteristics
2.5
2.0
1.5
(No rm a lized)
1.0
0.5
DS(on)
R , D rain -to-S ou rc e O n R e si stan ce
A
0.0
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
T , Ju nc tio n T em perat u re ( °C )
J
V = 1 0V
GS
A
Fig 4. Normalized On-Resistance
Vs. Temperature
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