International Rectifier IRFBA22N50A Datasheet

SMPS MOSFET
PD-91866B
IRFBA22N50A
HEXFET® Power MOSFET
Applications
l Switch Mode Power Supply ( SMPS ) l Uninterruptible Power Supply l High Speed Power Switching
V
DSS
R
DS(on)
max I
500V 0.23 24A
Benefits
l Low Gate Charge Qg results in Simple
Drive Requirement
l Improved Gate, Avalanche and Dynamic
dv/dt Ruggedness
l Fully Characterized Capacitance and
Avalanche Voltage and Current
l Effective Coss Specified (See AN1001)
Super-220™
(TO-273AA)
Absolute Maximum Ratings
Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 24 ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 15 A I
DM
PD @TC = 25°C Power Dissipation 340 W
V
GS
dv/dt Peak Diode Recovery dv/dt 3.4 V/ns
T
J
T
STG
Pulsed Drain Current 96
Linear Derating Factor 2.7 W/°C Gate-to-Source Voltage ± 30 V
Operating Junction and -55 to + 150 Storage Temperature Range Soldering Temperature, for 10 seconds 300 (1.6mm from case ) Recommended clip force 20 N
°C
D
Applicable Off Line SMPS Topologies:
l Full Bridge Converters l Power Factor Correction Boost
Notes through are on page 8
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12/12/00
IRFBA22N50A
Static @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
R
DS(on)
V
GS(th)
I
DSS
I
GSS
Dynamic @ TJ = 25°C (unless otherwise specified)
g
fs
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
C
iss
C
oss
C
rss
C
oss
C
oss
C
eff. Effective Output Capacitance ––– 154 ––– VGS = 0V, VDS = 0V to 400V
oss
Avalanche Characteristics
E
AS
I
AR
E
AR
Thermal Resistance
R
θJC
R
θCS
R
θJA
Diode Characteristics
I
S
I
SM
V
SD
t
rr
Q
rr
t
on
2 www.irf.com
Drain-to-Source Breakdown Voltage 500 ––– ––– VVGS = 0V, ID = 250µA Static Drain-to-Source On-Resistance ––– ––– 0.23 VGS = 10V, ID = 13.8A Gate Threshold Voltage 2.0 ––– 4.0 V VDS = VGS, ID = 250µA
Drain-to-Source Leakage Current Gate-to-Source Forward Leakage ––– ––– 100 VGS = 30V
Gate-to-Source Reverse Leakage ––– ––– -100
––– ––– 25 ––– ––– 250 VDS = 400V, VGS = 0V, TJ = 125°C
µA
nA
= 500V, VGS = 0V
V
DS
VGS = -30V
Parameter Min. Typ. Max. Units Conditions Forward Transconductance 12 ––– ––– SVDS = 50V, ID = 13.8A Total Gate Charge ––– ––– 114 ID = 23A Gate-to-Source Charge ––– ––– 28 nC VDS = 400V Gate-to-Drain ("Miller") Charge ––– ––– 47 VGS = 10V, See Fig. 6 and 13 Turn-On Delay Time ––– 20 ––– VDD = 250V Rise Time ––– 66 ––– ID = 23A Turn-Off Delay Time ––– 46 ––– RG = 4.3
ns
Fall Time ––– 44 ––– RD = 10.6,See Fig. 10 Input Capacitance ––– 3397 ––– VGS = 0V Output Capacitance ––– 505 ––– VDS = 25V Reverse Transfer Capacitance ––– 17 ––– pF ƒ = 1.0MHz, See Fig. 5 Output Capacitance ––– 4884 ––– VGS = 0V, VDS = 1.0V, ƒ = 1.0MHz Output Capacitance ––– 134 ––– VGS = 0V, VDS = 400V, ƒ = 1.0MHz
Parameter Typ. Max. Units
Single Pulse Avalanche Energy ––– 1180 mJ Avalanche Current ––– 24 A Repetitive Avalanche Energy ––– 34 mJ
Parameter Typ. Max. Units
Junction-to-Case ––– 0.37 Case-to-Sink, Flat, Greased Surface 0.50 ––– °C/W Junction-to-Ambient ––– 58
Parameter Min. Typ. Max. Units Conditions Continuous Source Current MOSFET symbol (Body Diode) Pulsed Source Current integral reverse (Body Diode)
––– –––
––– –––
Diode Forward Voltage ––– ––– 1.5 V TJ = 25°C, IS = 23A, VGS = 0V Reverse Recovery Time ––– 490 735 ns TJ = 25°C, IF = 23A Reverse RecoveryCharge ––– 6.4 9.6 µC di/dt = 100A/µs Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
23
92
showing the
A
p-n junction diode.
G
D
S
IRFBA22N50A
100
10
1
D
I , Drain-to-Source Current (A)
0.1
0.1 1 10 100
100
VGS
TOP
15V 10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM
4.5V
4.5V
20µs PULSE WIDTH
T = 25 C
J
V , Drain-to-Source Voltage (V)
DS
°
100
10
D
I , Drain-to-Source Current (A)
1
0.1 1 10 100
VGS
TOP
15V 10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM
4.5V
20µs PULSE WIDTH
T = 150 C
V , Drain-to-Source Voltage (V)
DS
4.5V
°
J
Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics
3.0
23A
I =
D
2.5
°
T = 150 C
J
2.0
10
°
T = 25 C
J
D
I , Drain-to-Source Current (A)
V = 50V
DS
1
4.0 5.0 6.0 7.0 8.0 9.0 10.0
V , Gate-to-Source Voltage (V)
GS
20µs PULSE WIDTH
Fig 3. Typical Transfer Characteristics
1.5
(Normalized)
1.0
0.5
DS(on)
R , Drain-to-Source On Resistance
0.0
-60 -40 -20 0 20 40 60 80 100 120 140 160
T , Junction Temperature ( C)
J
Fig 4. Normalized On-Resistance
V =
10V
GS
°
Vs. Temperature
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