International Rectifier IRF9Z24NS, IRF9Z24NL Datasheet
PD - 91742A
IRF9Z24NS/L
HEXFET® Power MOSFET
l Advanced Process Technology
l Surface Mount (IRF9Z24NS)
l Low-profile through-hole (IRF9Z24NL)
l 175°C Operating Temperature
l P-Channel
l Fast Switching
l Fully Avalanche Rated
G
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
2
Pak is a surface mount power package capable of
The D
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible onresistance in any existing surface mount package. The
D2Pak is suitable for high current applications because of
its low internal connection resistance and can dissipate
up to 2.0W in a typical surface mount application.
The through-hole version (IRF9Z24NL) is available for
low-profile applications.
Absolute Maximum Ratings
Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ -10V -12
ID @ TC = 100°C Continuous Drain Current, VGS @ -10V -8.5 A
I
DM
PD @TA = 25°C Power Dissipation 3.8 W
PD @TC = 25°C Power Dissipation 45 W
V
GS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt -5.0 V/ns
T
J
T
STG
Pulsed Drain Current -48
Linear Derating Factor 0.30 W/°C
Gate-to-Source Voltage ± 20 V
Single Pulse Avalanche Energy 96 mJ
Avalanche Current -7.2 A
Repetitive Avalanche Energy 4.5 mJ
Operating Junction and -55 to + 175
Storage Temperature Range °C
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
Thermal Resistance
Parameter Typ. Max. Units
R
θJC
R
θJA
Junction-to-Case ––– 3.3
Junction-to-Ambient ( PCB Mounted,steady-state)** ––– 40
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2
D Pak
D
R
DS(on)
V
DSS
= -55V
= 0.175Ω
ID = -12A
S
TO-262
°C/W
7/16/99
IRF9Z24NS/L
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
∆V
(BR)DSS
R
DS(on)
V
GS(th)
g
fs
I
DSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
L
S
C
iss
C
oss
C
rss
Drain-to-Source Breakdown Voltage -55 ––– – –– V VGS = 0V, ID = -250µA
/∆T
Breakdown Voltage Temp. Coefficient ––– -0.05 ––– V/°C Reference to 25°C, ID = -1mA
J
Static Drain-to-Source On-Resistance ––– ––– 0.175 Ω VGS = -10V, ID = -7.2A
Gate Threshold Voltage -2.0 ––– -4.0 V VDS = VGS, ID = -250µA
Forward Transconductance 2.5 – –– ––– S VDS = -25V, ID = -7.2A
Drain-to-Source Leakage Current
––– ––– -25
––– ––– -250 VDS = -44V, VGS = 0V, TJ = 150°C
Gate-to-Source Forward Leakage ––– ––– 100 VGS = 20V
Gate-to-Source Reverse Leakage ––– ––– -100
VDS = -55V, VGS = 0V
µA
nA
VGS = -20V
Total Gate Charge ––– ––– 19 ID = -7.2A
Gate-to-Source Charge ––– ––– 5.1 nC VDS = -44V
Gate-to-Drain ("Miller") Charge ––– ––– 10 VGS = -10V, See Fig. 6 and 13
Turn-On Delay Time ––– 13 ––– VDD = -28V
Rise Time ––– 55 ––– ID = -7.2A
Turn-Off Delay Time ––– 23 – –– RG = 24Ω
ns
Fall Time ––– 37 ––– RD = 3.7Ω, See Fig. 10
Internal Source Inductance
7.5
Between lead,
nH
and center of die contact
Input Capacitance ––– 350 ––– VGS = 0V
Output Capacitance ––– 170 ––– pF VDS = -25V
Reverse Transfer Capacitance ––– 92 ––– ƒ = 1.0MHz, See Fig. 5
Source-Drain Ratings and Characteristics
Parameter Min. Typ. Max. Units Conditions
I
S
I
SM
V
SD
t
rr
Q
rr
t
on
Continuous Source Current MOSFET symbol
(Body Diode)
Pulsed Source Current integral reverse
(Body Diode) •
––– –––
––– –––
-12
-48
showing the
A
p-n junction diode.
G
Diode Forward Voltage ––– ––– -1.6 V TJ = 25°C, IS = -7.2A, VGS = 0V
Reverse Recovery Time ––– 47 71 ns TJ = 25°C, IF = -7.2A
Reverse RecoveryCharge ––– 84 130 nC di/dt = -100A/µs
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
Repetitive rating; pulse width limited by
Pulse width ≤ 300µs; duty cycle ≤ 2%.
max. junction temperature. ( See fig. 11 )
Starting T
RG = 25Ω, I
I
SD
= 25°C, L = 3.7mH
J
= -7.2A. (See Figure 12)
AS
≤ -7.2A, di/dt ≤ -280A/µs, V
DD
≤ V
(BR)DSS
Uses IRF9Z24N data and test conditions
,
TJ ≤ 175°C
** When mounted on 1" square PCB (FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
2 www.irf.com
D
S
IRF9Z24NS/L
A
A
)
A
A
100
VGS
TO P - 15 V
- 10V
- 8.0 V
- 7.0 V
- 6.0 V
- 5.5 V
- 5.0 V
BOT TO M - 4.5V
10
D
-I , Dra in-to-Sou rc e C u rre nt (A )
1
0.1 1 10 100
-V , Drain-to-Source Voltage (V)
DS
20µs PULSE WIDTH
T
= 25°C
T = 2 5°C
c
J
-4.5 V
Fig 1. Typical Output Characteristics
100
100
VGS
TOP - 15V
- 10V
- 8.0V
- 7.0V
- 6.0V
- 5.5V
- 5.0V
BOTTOM - 4.5V
10
D
-I , Drain-to-Source Current (A)
20µs PULSE WIDTH
-4.5 V
T
= 175°C
T = 175°C
J
1
0.1 1 10 100
-V , Dra in-t o- S o u rc e Voltage (V
DS
C
Fig 2. Typical Output Characteristics
2.0
I = -12 A
D
1.5
T = 25°C
J
10
T = 175°C
J
1.0
(N orma li z ed)
0.5
D
-I , Drain-to-Source C urrent (A)
1
45678910
-V , Ga te-to- So urc e V o ltage (V)
GS
V = -25 V
DS
20µs PULSE W IDTH
Fig 3. Typical Transfer Characteristics
DS (on)
R , D ra in-to -S o u rc e O n R e s is ta nc e
0.0
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
T , Junction Temperature (°C)
J
Fig 4. Normalized On-Resistance
V = -1 0V
GS
Vs. Temperature
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