International Rectifier IRF7901D1 Datasheet

PD- 93844B
IRF7901D1
• Co-Pack Dual N-channel HEXFET Power MOSFET and Schottky Diode
• Ideal for Synchronous Buck DC-DC Converters Up to 5A Peak Output
• Low Conduction Losses
• Low Switching Losses
Q1
18
Source
Q1
27
Gate
PGND
3
Q2
4
SO-8
Gate
Co-Packaged Dual MOSFET Plus Schottky Diode
Device Ratings (Max.V alues)
Q1 Q2
Pwr
Top View
Vin Pwr
Vin Pwr
6
Vout Pwr
5
Vout
V
DS
R
(on)
DS
Q
G
Q
sw
V
SD
Dual FETKY
and Schottky
30V 30V
38 m 32 m
10.5 nC 18.3 nC
3.8 nC 9.0 nC
1.0V 0.52V
Description
The FETKY
family of Co-Pack HEXFETMOSFETs and Schottky diodes offers the designer an innovative,
board space saving solution for switching regulator and power management applications. Advanced HEXFETMOSFETs combined with low forward drop Schottky results in an e xtremely efficient de vice suitable
for a wide variety of portable electronics applications. The SO-8 has been modified through a customized leadframe for enhanced thermal characteristics and multiple
die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. Internal connections enable easier board layout design with reduced stray inductance.
Absolute Maximum Ratings
Parameter Symbol IRF7901D1 Units
Drain-Source Voltage V Gate-Source Voltage V Continuous Output TL = 100°C I
DS
GS
6.2 A
D
30 V
±20
Current (VGS ≥ 4.5V) Pulsed Drain Current I Power Dissipation TL = 100°C P Junction & Storage Temperature Range TJ, T Pulsed Source Current I
24
DM
D
STG
12 A
SM
2.0 W
–55 to 150 °C
Thermal Resistance
Parameter Max. Units
Maximum Junction-to-Ambient R Maximum Junction-to-Lead R
θJA
θJL
62.5 °C/W 25 °C/W
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IRF7901D1
Electrical Characteristics
Q1 - Control FET Q2 - Synch FET
& Schottky
Parameter Min Typ Ma x Min Typ M ax Units Conditions
Drain-to-Source BV Breakdown V oltage*
Static Drain-Source R on Resistance*
Gate Threshold V oltage* V Drain-Source Leakage I
Gate-Source Leakage I Current*
DSS
GSS
T otal Gate Charge* Q
Q
Pre-Vth Q Gate-Source Charge
Post-Vth Q Gate-Source Charge
Gate to Drain Charge Q Switch Charge* Q
(Q
+ Qgd)
gs2
Output Charge* Q Gate Resistance R Input Capacitance C Output Capacitance C T ransf er Capacitance C T urn-On Delay Time t Rise Time t T urn-Off Delay Time t Fall Time t
d
r
d
f
DS
GS
G cont
G synch
GS1
GS2
GD
sw
oss
G
iss
oss
rss
(on) 7.2 10.4 VDD = 16V , ID = 5A, VGS = 5V
(off) 14.7 14.6 See test diagram Fig 17.
30 30 V VGS = 0V , ID = 250µA
DSS
(on) 28 38 23 3 2 m VGS = 4.5V , ID = 5A
(th) 1.0 1.0 V VDS = VGS, ID = 250µA
30 30 µA VDS = 24V , VGS = 0 – 0.15 4.3 m A V
= 24V , V
DS
= 0, TJ = 125°C
GS
±100 ±100 nA VGS = ±20V
7.6 10.5 15.5 21.0 VGS = 5V , VDS = 16V , ID = 5A –6.79.0–13.518.3V
= 5V , VDS= 100mV , ID = 5A
GS
2.0 5.5 VDS = 16V , ID = 5A
0.5 0.9 nC
1.9 4.7 – –2.43.8–5.69.0
13.5 18.0 9.0 12.3 VDS = 16V , VGS = 0 – 3.4 4.3 780 1810 – – 430 310 pF VDS = 16V , VGS = 0, f = 1MHz – 30 110
13.8 16.4 ns Clamped inductive load
–8––5.2–
Source-Drain Ratings and Characteristics
Q1 Q2 &
parallel Schottky
Parameter Min Typ Max Min Typ Max Units Conditions
Diode Forward V
k
V oltage*
SD
Reverse Recovery Q Charge V
Repetitive rating; pulse width limited by max. junction temperature.Pulse width 300 µs; duty cycle 2%.When mounted on 1 inch square copper board, t < 10 sec.
0.7 1.0 0.48 0.52 V IS = 1A, VGS = 0V
62.3 8.9 nC dl/dt = 700A/us
rr
m Combined Q1, Q2 I
current based on maximum allowable junction temperature; switching or other losses will decrease RMS current capability
When mounted on IRNBPS2 design kit. Measured as device T
to Pwr leads (Vin & V
* Devices are 100% tested to these parameters.
@ Pwr V
RMS
)
out
= 16V , VGS = 0V , IS = 5A
DS
pins. Calculated continuous
out
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IRF7901D1
Power MOSFET Optimization f or DC-DC Converters
Table 1 and Table 2 describes the event during the various charge segments and shows an approximation of losses during that period.
Conduction
Loss
Gate Drive
Loss
Switching
Loss
Losses associated with MOSFET on time. I current and duty cycle.
Losses associated with charging and discharging the gate of the MOSFET every cycle. Use the control FET QG.
Losses during the drain voltage and drain current transitions for every full cycle. Losses occur during the Q
Output
Loss
using Q
Losses associated with the Q FET turns on. Losses are caused by both FETs, but are dissipated by the
switch
.
control FET .
Conduction
Loss
Gate Drive
Loss
Switching
Loss
Losses associated with MOSFET on time. I duty cycle.
Losses associated with charging and discharging the gate of the MOSFET every cycle. Use the Sync FET QG.
Generally small enough to ignore except at light loads when the current reverses in the output inductor. Under these conditions various light load power saving techniques are employed by the control IC to maintain switching losses to a negligible level.
Output
Loss
Losses associated with the Q turns on. They are caused by the synchronous FET, but are dissipated in the control FET .
Typical Application
The performance of the new Dual FETKY Synchronous Buck Design Kit”, operating up to 21V 1V
out
to 5V
out
.
Table 1 – Control FET Losses
Segment LossesDescription
is a function of load
RMS
2
and QGD time period and can be simplified by
GS2
of the device every cycle when the control
OSS
P
OUTPUT
Table 2 – Synchronous FET Losses
Segment LossesDescription
is a function of load current and
RMS
SWITCH
P
OUTPUT
of the device every cycle when the control FET
OSS
TM
has been tested in-circuit using IR’s new IRNBPS2 “Dual Output
and 5A peak output current, with operating voltages from
in
2
×=
RIP
ƒ××=
QVP
GGIN
Q
GS
IVP
LINQGS
I
G
Q
GD
IVP
LINQGD
I
G
Q
SW
IVP
LINSWITCH
I
OSS
2
2
GGIN
G
V
IN
×=
RIP
DSonRMSCOND
ƒ××=
Q
QVP
0P
Q
OSS
V
IN
2
)on(DSRMSCOND
2
ƒ×××
ƒ×××
ƒ××
ƒ××=
ƒ××=
Q2
Pin 5&6
Pwr Vout
Sha ded area = Du al FETKY
Schottky
Vout
Pin 7&8 Pwr Vin
Vin
Pin 3
PGND
Q1
Pin 2
Q1 Gate
Pin 1
Q1 Sourc e
Pin 4
Q2 Gate
Figure 1: Synchronous Buck dc-dc
T opology
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