International Rectifier IRF5Y9540CM Datasheet

PD - 94027A
HEXFET
®
POWER MOSFET
THRU-HOLE (TO-257AA)
Product Summary
Part Number BV
DSS
IRF5Y9540CM -100V 0.117 -18A
Fifth Generation HEXFET® power MOSFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon unit area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications.
These devices are well-suited for applications such as switching power supplies, motor controls, invert­ers, choppers, audio amplifiers and high-energy pulse circuits.
RDS(on) ID
IRF5Y9540CM
100V, P-CHANNEL
TO-257AA
Features:
n Low RDS(on) n Avalanche Energy Ratings n Dynamic dv/dt Rating n Simple Drive Requirements n Ease of Paralleling n Hermetically Sealed n Light Weight
Absolute Maximum Ratings
Parameter Units
ID @ VGS = -10V, TC = 25°C Continuous Drain Current -18
ID @ VGS = -10V, TC = 100°C Continuous Drain Current -11
I
DM
PD @ TC = 25°C Max. Power Dissipation 75 W
V
GS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt 4.4
T
J
T
STG
For footnotes refer to the last page
Pulsed Drain Current -72
Linear Derating Factor 0.6 W/°C Gate-to-Source Voltage ±20 V Single Pulse Avalanche Energy 256 mJ Avalanche Current -11 A Repetitive Avalanche Energy 7.5 mJ
Operating Junction -55 to 150 Storage Temperature Range Lead Temperature 300 (0.063in./1.6mm from case for 10sec) Weight 4.3 (Typical) g
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A
V/ns
o
C
11/17/00
IRF5Y9540CM
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter Min Typ Max Units Test Conditions
BV
DSS
BV
DS(on)
V
GS(th)
g
fs
I
DSS
I
GSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
LS + L
iss
oss
rss
DSS
Drain-to-Source Breakdown Voltage -100 V VGS = 0V, ID = -250µA
/TJTemperature Coefficient of Breakdown -0.11 V/°C Reference to 25°C, ID = -1.0mA
Voltage Static Drain-to-Source On-State 0.117 VGS = 10V, ID = -11A Resistance Gate Threshold Voltage -2.0 -4.0 V VDS = VGS, ID = -250µA Forward Transconductance 5.3 S ( )VDS = -50V, IDS = -11A Zero Gate Voltage Drain Current -25 V
-250 VDS = -80V,
Gate-to-Source Leakage Forward -100 VGS = -20V Gate-to-Source Leakage Reverse 100 VGS = 20V Total Gate Charge 109 VGS =-10V, ID = -11A Gate-to-Source Charge 19 nC VDS = -80V Gate-to-Drain (‘Miller’) Charge 5 3 Turn-On Delay Time 29 VDD = -50V, ID = -11A, Rise Time 135 RG = 7.5 Turn-Off Delay Time 87 Fall Time 84 Total Inductance 6.8
Input Capacitance 1390 VGS = 0V, VDS = -25V Output Capacitance 428 pF f = 1.0MHz Reverse Transfer Capacitance 246
µA
nA
ns
nH
lead (6mm/0.25in. from package)
= -100V ,VGS=0V
DS
VGS = 0V, TJ =125°C
Measured from drain lead (6mm/
0.25in. from package) to source
Source-Drain Diode Ratings and Characteristics
Parameter Min Typ Max Units T est Conditions
I
Continuous Source Current (Body Diode) - 18
S
I
Pulse Source Current (Body Diode) -72
SM
V
Diode Forward Voltage -1.6 V Tj = 25°C, IS = -11A, VGS = 0V
SD
t
Reverse Recovery Time 220 n s Tj = 25°C, IF = -11A, di/dt 100A/µs
rr
Q
Reverse Recovery Charge 1200 nC VDD -50V
RR
t
Forward Turn-On Time Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by L
on
A
Thermal Resistance
Parameter Min Typ Max Units Test Conditions
thJC
Note: Corresponding Spice and Saber models are available on the G&S Website.
For footnotes refer to the last page
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Junction-to-Case 1.67 °C/W
+ LD.
S
IRF5Y9540CM
100
10
1
D
-I , Drain-to-Source Current (A)
0.1
0.1 1 10 100
VGS
TOP
-15V
-10V
-8.0V
-7.0V
-6.0V
-5.5V
-5.0V
BOTTOM
-4.5V
-4.5V
20µs PULSE WIDTH
T = 25 C
J
-V , Drain-to-Source Voltage (V)
DS
°
Fig 1. Typical Output Characteristics
100
°
T = 25 C
J
100
10
1
D
-I , Drain-to-Source Current (A)
0.1
0.1 1 10 100
VGS
TOP
-15V
-10V
-8.0V
-7.0V
-6.0V
-5.5V
-5.0V
BOTTOM
-4.5V
-4.5V
20µs PULSE WIDTH
T = 150 C
J
-V , Drain-to-Source Voltage (V)
DS
°
Fig 2. Typical Output Characteristics
2.5
-18A
I =
D
°
T = 150 C
J
10
1
D
-I , Drain-to-Source Current (A)
V = -25V
15
DS
0.1 4 6 8 10 12 14
-V , Gate-to-Source Voltage (V)
GS
20µs PULSE WIDTH
Fig 3. Typical Transfer Characteristics
2.0
1.5
1.0
(Normalized)
0.5
DS(on)
R , Drain-to-Source On Resistance
0.0
-60 -40 -20 0 20 40 60 80 100 120 140 160
T , Junction Temperature( C)
J
Fig 4. Normalized On-Resistance
V =
GS
°
-10V
Vs. Temperature
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