International Rectifier IRF5Y540CM Datasheet

PD - 94017B
HEXFET
®
POWER MOSFET
THRU-HOLE (TO-257AA)
Product Summary
Part Number BV
DSS
IRF5Y540CM 100V 0.058 18A*
Fifth Generation HEXFET® power MOSFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon unit area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications.
These devices are well-suited for applications such as switching power supplies, motor controls, invert­ers, choppers, audio amplifiers and high-energy pulse circuits.
RDS(on) ID
IRF5Y540CM
100V, N-CHANNEL
TO-257AA
Features:
n Low RDS(on) n Avalanche Energy Ratings n Dynamic dv/dt Rating n Simple Drive Requirements n Ease of Paralleling n Hermetically Sealed n Light Weight
Absolute Maximum Ratings
Parameter Units
ID @ VGS = 10V, TC = 25°C Continuous Drain Current 18*
ID @ VGS = 10V, TC = 100°C Continuous Drain Current 16
I
DM
PD @ TC = 25°C Max. Power Dissipation 75 W
V
GS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt 3.4
T
J
T
STG
* Current is limited by package
For footnotes refer to the last page
Pulsed Drain Current 72
Linear Derating Factor 0.6 W/°C Gate-to-Source Voltage ±20 V Single Pulse Avalanche Energy 225 mJ Avalanche Current 16 A Repetitive Avalanche Energy 7.5 mJ
Operating Junction -55 to 150 Storage Temperature Range Lead Temperature 300 (0.063in./1.6mm from case for 10sec) Weight 4.3 (Typical) g
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A
V/ns
o
C
12/04/01
IRF5Y540CM
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter Min Typ Max Units Test Conditions
BV
DSS
BV
DS(on)
V
GS(th)
g
fs
I
DSS
I
GSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
LS + L
iss
oss
rss
DSS
Drain-to-Source Breakdown Voltage 100 V VGS = 0V, ID = 250µA
/TJTemperature Coefficient of Breakdown 0.12 V/°C Reference to 25°C, ID = 1.0mA
Voltage Static Drain-to-Source On-State 0.058 VGS = 10V, ID = 16A Resistance Gate Threshold Voltage 2.0 4.0 V VDS = VGS, ID = 250µA Forward Transconductance 11 S ( )VDS = 25V, IDS = 16A Zero Gate Voltage Drain Current 25 V
250 VDS = 80V,
Gate-to-Source Leakage Forward 100 VGS = 20V Gate-to-Source Leakage Reverse -100 VGS = -20V Total Gate Charge 104 VGS =10V, ID = 16A Gate-to-Source Charge 20 nC VDS = 80V Gate-to-Drain (‘Miller’) Charge 43 Turn-On Delay Time 17 VDD = 50V, ID = 16A, Rise Time 83 VGS =10V, RG = 5.1 Turn-Off Delay Time 61 Fall Time 51 Total Inductance 6.8
Input Capacitance 1487 VGS = 0V, VDS = 25V Output Capacitance 353 p F f = 1.0MHz Reverse Transfer Capacitance 182
µA
nA
ns
nH
= 100V ,VGS=0V
DS
VGS = 0V, TJ =125°C
Measured from drain lead (6mm/
0.25in. from package) to source
lead (6mm/0.25in. from package)
Source-Drain Diode Ratings and Characteristics
Parameter Min Typ Max Units T est Conditions
I
Continuous Source Current (Body Diode) 18*
S
I
Pulse Source Current (Body Diode) —— 72
SM
V
Diode Forward Voltage 1.3 V Tj = 25°C, IS = 16A, VGS = 0V
SD
t
Reverse Recovery Time 240 n s Tj = 25°C, IF = 16A, di/dt 100A/µs
rr
Q
Reverse Recovery Charge 1.67 µCV
RR
t
Forward Turn-On Time Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by L
on
* Current is limited by package
A
25V
DD
S
Thermal Resistance
Parameter Min Typ Max Units Test Conditions
thJC
Note: Corresponding Spice and Saber models are available on the G&S Website.
For footnotes refer to the last page
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Junction-to-Case 1.67 °C/W
+ LD.
IRF5Y540CM
1000
100
10
1
D
I , Drain-to-Source Current (A)
0.1
0.1 1 10 100
VGS
TOP
15V 10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM
4.5V
4.5V
20µs PULSE WIDTH
T = 25 C
J
V , Drain-to-Source Voltage (V)
DS
°
Fig 1. Typical Output Characteristics
1000
1000
100
10
1
D
I , Drain-to-Source Current (A)
0.1
0.1 1 10 100
VGS
TOP
15V 10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM
4.5V
4.5V
20µs PULSE WIDTH
T = 150 C
J
V , Drain-to-Source Voltage (V)
DS
°
Fig 2. Typical Output Characteristics
2.5
I =
18A
D
2.0
100
10
D
I , Drain-to-Source Current (A)
1
4 5 6 7 8 9 10 11
V , Gate-to-Source Voltage (V)
GS
Fig 3. Typical Transfer Characteristics
°
T = 25 C
J
°
T = 150 C
J
15
V = 25V
DS
20µs PULSE WIDTH
1.5
1.0
(Normalized)
0.5
DS(on)
R , Drain-to-Source On Resistance
0.0
-60 -40 -20 0 20 40 60 80 100 120 140 160
T , Junction Temperature( C)
J
Fig 4. Normalized On-Resistance
V =
10V
GS
°
Vs. Temperature
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