International Rectifier IRF5NJ540 Datasheet

PD - 94020A
HEXFET
®
POWER MOSFET
SURFACE MOUNT (SMD-0.5)
Product Summary
Part Number BV
IRF5NJ540 100V 0.052 22A*
Fifth Generation HEXFET® power MOSFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon unit area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications.
These devices are well-suited for applications such as switching power supplies, motor controls, invert­ers, choppers, audio amplifiers and high-energy pulse circuits.
RDS(on) ID
DSS
IRF5NJ540
100V, N-CHANNEL
SMD-0.5
Features:
n Low RDS(on) n Avalanche Energy Ratings n Dynamic dv/dt Rating n Simple Drive Requirements n Ease of Paralleling n Hermetically Sealed n Surface Mount n Light Weight
Absolute Maximum Ratings
Parameter Units
ID @ VGS = 10V, TC = 25°C Continuous Drain Current 22*
ID @ VGS = 10V, TC = 100°C Continuous Drain Current 16
I
DM
PD @ TC = 25°C Max. Power Dissipation 75 W
V
GS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt 4.1
T
J
T
STG
* Current is limited by package For footnotes refer to the last page
Pulsed Drain Current 88
Linear Derating Factor 0.60 W/°C Gate-to-Source Voltage ±20 V Single Pulse Avalanche Energy 200 mJ Avalanche Current 16 A Repetitive Avalanche Energy 7.5 mJ
Operating Junction -55 to 150 Storage Temperature Range Package Mounting Surface Temperature 300 (for 5 s) Weight 1.0 g
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A
V/ns
o
C
7/13/01
IRF5NJ540
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter Min Typ Max Units Test Conditions
BV
DSS
BV
DS(on)
V
GS(th)
g
fs
I
DSS
I
GSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
LS + L
DSS
Drain-to-Source Breakdown Voltage 100 V VGS = 0V, ID = 250µA
/TJTemperature Coefficient of Breakdown 0.11 V/°C Reference to 25°C, ID = 1.0mA
Voltage Static Drain-to-Source On-State 0.052 VGS = 10V, ID = 16A Resistance Gate Threshold Voltage 2.0 4.0 V VDS = VGS, ID = 250µA Forward Transconductance 11 S ( )VDS = 50V, IDS = 16A Zero Gate Voltage Drain Current 25 V
250 VDS = 80V,
Gate-to-Source Leakage Forward 100 VGS = 20V Gate-to-Source Leakage Reverse -100 VGS = -20V Total Gate Charge 104 VGS =10V, ID = 16A Gate-to-Source Charge 20 nC VDS = 80V Gate-to-Drain (‘Miller’) Charge 43 Turn-On Delay Time 24 VDD = 50V, ID = 16A, Rise Time 125 VGS =10V, RG = 7.5 Turn-Off Delay Time 86 Fall Time 82 Total Inductance 4.0
µA
nA
ns
nH
drain pad to center of source pad
= 100V ,VGS=0V
DS
VGS = 0V, TJ =125°C
Measured from the center of
C
iss
oss
rss
Input Capacitance 1487 VGS = 0V, VDS = 25V Output Capacitance 353 p F f = 1.0MHz Reverse Transfer Capacitance 182
Source-Drain Diode Ratings and Characteristics
Parameter Min Typ Max Units Test Conditions
I
Continuous Source Current (Body Diode) 22*
S
I
Pulse Source Current (Body Diode) —— 88
SM
V
Diode Forward Voltage 1.3 V Tj = 25°C, IS = 16A, VGS = 0V
SD
t
Reverse Recovery Time 240 nS Tj = 25°C, IF = 16A, di/dt 100A/µs
rr
Q
Reverse Recovery Charge 1.67 µCV
RR
t
Forward Turn-On Time Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by L
on
* Current is limited by package
A
50V
DD
Thermal Resistance
Parameter Min Typ Max Units Test Conditions
thJC
Note: Corresponding Spice and Saber models are available on the G&S Website.
For footnotes refer to the last page
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Junction-to-Case 1.67
°C/W
+ LD.
S
IRF5NJ540
100
10
1
D
I , Drain-to-Source Current (A)
0.1
0.1 1 10 100
VGS
TOP
15V 10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM
4.5V
4.5V
20µs PULSE WIDTH
T = 25 C
J
V , Drain-to-Source Voltage (V)
DS
°
Fig 1. Typical Output Characteristics
100
°
T = 25 C
J
°
T = 150 C
J
100
10
1
D
I , Drain-to-Source Current (A)
0.1
0.1 1 10 100
VGS
TOP
15V 10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM
4.5V
4.5V
20µs PULSE WIDTH
T = 150 C
J
V , Drain-to-Source Voltage (V)
DS
°
Fig 2. Typical Output Characteristics
2.5
2.0
1.5
22A
I =
D
10
1.0
(Normalized)
D
I , Drain-to-Source Current (A)
V = 25V
15
DS
1
4.0 5.0 6.0 7.0 8.0 9.0 10.0
V , Gate-to-Source Voltage (V)
GS
20µs PULSE WIDTH
Fig 3. Typical Transfer Characteristics
0.5
DS(on)
R , Drain-to-Source On Resistance
0.0
-60 -40 -20 0 20 40 60 80 100 120 140 160
T , Junction Temperature ( C)
J
Fig 4. Normalized On-Resistance
V =
10V
GS
°
Vs. Temperature
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