2
20ETS..S Series
V oltage Ratings
T
J
Max. Junction Temperature Range - 40 to 150 °C
T
stg
Max. Storage Temperature Range - 40 to 150 °C
Soldering Temperature 24 0 °C for 10 seconds (1.6mm from case)
R
thJC
Max. Thermal Resistance Junction 1.3 °C/W DC operation
to Case
R
thJA
Typ. Thermal Resistance Junction 40 °C/W
to Ambient (PCB Mount)**
wt Approximate Weight 2 (0.07) g (oz.)
T Case Style SMD-220
Thermal-Mechanical Specifications
Parameters 20ETS..S Units Conditions
**When mounted on 1" square (650mm2) PCB of FR-4 or G-10 material 4 oz (140µm) copper 40°C/W
For recommended footprint and soldering techniques refer to application note #AN-994
Part Number
Provide terminal coating for voltages above 1200V
V
RRM
, maximum V
RSM
, maximum non repetitive I
RRM
peak reverse voltage peak reverse voltage 150°C
VVmA
20ETS08S 800 900
20ETS12S 1200 1300 1
20ETS16S 1600 1700
I
F(AV)
Max. Average Forward Current 20 A 50% duty cycle @ TC = 105° C, sinusoidal wave form
I
FSM
Max. Peak One Cycle Non-Repetitive 250 10ms Sine pulse, rated V
RRM
applied
Surge Current 300 10ms Sine pulse, no voltage reapplied
I2t Max. I2t for fusing 316 10ms Sine pulse, rated V
RRM
applied
442 10ms Sine pulse, no voltage reapplied
I2√t Max. I2√t for fusing 3160 A2√s t = 0.1 to 10ms, no voltage reapplied
Absolute Maximum Ratings
Parameters 20ETS..S Units Conditions
A
A2s
V
FM
Max. Forward Voltage Drop 1.1 V @ 20A, TJ = 25°C
r
t
Forward slope resistance 10.4 mΩ
V
F(TO)
Threshold voltage 0.85 V
I
RM
Max. Reverse Leakage Current 0.1 TJ = 25 °C
1.0 TJ = 150 °C
Electrical Specifications
Parameters 20ETS..S Units Conditions
TJ = 150°C
VR = rated V
RRM
mA