The High-Precision MicroJoystick is an innovative, intuitive, OEM pointing system that delivers
simultaneous 360 degree control of direction and speed at the touch of a fingertip – ideal for
integration into notebook computers, remote controls, games, ruggedized products, and other
portable products where space is limited. The MicroJoystick is based on Interlink Electronics’
patented pressure-sensitive Force Sensing Resistor® (FSR®) technology. The dy namic response
of FSR technology enables the lightest of touches to be translated into smooth, intuitive cursor
control, while simultaneously enabling dynamic speed control by altering the amount of applied
pressure.
2.0Scope
This Design Guide is intended to provide OEMs with a comprehensive overview of evaluating and
integrating Interlink Electronics’ MicroJoystick. If questions arise beyond the scope of this design
guide, please contact Interlink Electronics. Before using or installing the MicroJoystick, please
take a few minutes to carefully review this Integration Guide.
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3.0Theory of Operation
When you place your finger on the top of the MicroJoystick, the pressure exerted by your finger is
transmitted to the 4-zone VersaPoint® FSR sensor located in the joystick’s base. The 4-zone
sensor consists of four overlapping zones designed to produce smooth, light cursor resp onse.
The force distribution over the four zones is immediately converted by the microcontroller into
cursor movement in the direction of applied force. The micro-controller’s dedicated firmware
optimizes the cursor’s speed response and accuracy; the result is smooth cursor movement in
any direction, from a precise crawl to a screen-crossing zip.
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4.0 Features and Operation
4.1 Component Description
The standard MicroJoystick system is a component-level solution consisting of a joystick, a
microcontroller, and a rubber cap. The integrator provides the interconnect cable and a few
simple electronic components (to support the microcontroller). Customized turn key modules
can be designed that simplify integration and improve time-to-production. Custom interconnect
cables, designed to connect the joystick or module to system boards, can also be supplied by
Interlink Electronics.
MicroJoystick Caps
The typical cap which Interlink Electronics supplies is made of rubber and is designed to slip over
the top of the MicroJoystick’s actuating stick. Custom, molded hard-plastic caps can be design ed
to produce a “control-disk” or “control-sphere” interface. Since the design of the cap can influence
the cursor response, fine tuning of the mouse speed may be required. This is accomplished by
changing R1 in the recommended schematic.
Standard Cap Control Disk Cap Control Sphere Cap
(Custom Example) (Custom Example)
4.2 Features
The MicroJoystick has many features and benefits that make it a versatile pointing solution for
a variety of applications.
Unparalleled Noise and ESD Properties
The MicroJoystick’s low-gain electrical circuitry is inherently resistant to electrica l noise and
electro static discharge (ESD). In addition, the MicroJoystick’s simple, no-moving-parts desi gn
makes it highly resistant to vibration and mechanical noise.
Unsurpassed Quality and Reliability
The MicroJoystick reliability is a benefit of its no-moving parts design – making it virtually
maintenance free and highly resistant to contamination. MicroJoystick pointing so lutions are rated
to lifetimes in excess of five million cycles.
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Compact Design Facilities Integration Flexibility
The compact size of the MicroJoystick allows it to be mounted in-between keys on keyboards –
close to the user’s hands – below the space bar, into front panels, or virtually anywhere! The
compact size – much smaller than trackballs or touchpads – allows it to be easily integrated into
tight, cramped spaces and frees up space for other system components. The MicroJoy stick is
unaffected by mounting orientation, whether horizontal, vertical, or any angle in-between,
providing integrators maximum flexibility with product design.
Robust Environmental Properties
The MicroJoystick’s robust environmental properties make it the ideal pointing device for use in
almost any environment – from climate controlled clean rooms to hot and humid tropical climates.
Hardware Interface Support
Standard MicroJoystick ICs are available with PS/2 and USB hardware interface.
Driver Software
The standard Microsoft windows mouse driver will operate the MicroJoystick.
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5.0 Mechanical Integration
Mounting the MicroJoystick
There are a variety of mounting methods available to the integrator. The MicroJoystick may be
mounted on the frame of a keyboard, either by mounting it directly on top of the frame or by
mounting it from underneath the frame with the stick protruding through the frame. Its compact
size easily fits within the constraints of most notebook keyboards. In addition, the MicroJoystick
can be mounted on a case or bezel, or directly to a printed-circuit board. Figure 1 on the next
page shows the dimensions of the MicroJoystick assembly.
How to Adhere to Printed Circuit Board
Never solder directly to the connecting traces on the printed circuit board of the MicroJoystick; the
material used for the conductive pattern is not solderable. Instead use standard or custom flex
circuit attached using heat-bonded anisotropic conductive adhesives or p ressure-sensitive
anisotropic adhesives. However, in order to ensure that the pressure-sensitive adhesive joint is
robust and reliable, a compressive force must be applied to the adhesive joint. A molded-in ri b or
mechanical clamp can be used to supply the compressive force.
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Figure 1: MicroJoystick, 7.4 mm Assembly
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5.1 Mounting Methods
Several different mounting methods are detailed in the following section. Before designing a
mounting method for the MicroJoystick, please carefully review all of the suggested mounting
methods and design parameters. This will enable you to design the best mou nting method
for your system, reduce time to production, and help optimize your installation procedure.
5.1.1 Method 1: A molded-in detail
A simple molded-in detail can be used to mount the MicroJoystick. This method is ideal for
integration of the MicroJoystick in-between keyboard key caps (i.e., the detail can be molded
directly into the keyboard’s base, eliminating or reducing incremental system costs). Either
pins or a close-tolerance fit around the MicroJoystick’s captuator can be used to register the
MicroJoystick in the detail as shown in the illustrations below.
Registering with Pin Registering by the Captuator
The portion of the molded-in detail that holds the MicroJoystick’s base is designed to be
slightly thicker than the thickness of the MicroJoystick’s base. This helps prevent
unwanted forces from being applied to the MicroJoystick. Since the MicroJoystick is
designed for maximum sensitivity, forces as small as 20 grams can cause cursor movement or cursor “drift.” The term “drift” is used to describe cursor movement caused by
unwanted force permanently applied to the FSR in the mounting process.
A support plate is used to keep the MicroJoystick in place. The support plate should be
flat and free from surface defects (e.g., bumps). The support plate can be the backplate
of a keyboard or can be constructed as a separate metal or plastic unit.
To install the MicroJoystick, simply…
Drop the MicroJoystick into the detail
Register the MicroJoystick around the captuator or on the pins
Check to make sure the MicroJoystick is positioned correctly
Install the support plate.
Please see Figure 2, “Using Pin in Top Plate for Registration with Support Bosses at
Bottom.”
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Figure 2: Using Pin in Top Plate for Registration with Support Bosses at Bottom
MicroJoystick
Integration Guide
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5.1.2 Method 2: A low profile molded-in detail
If the depth of the detail in section 5.1.1 is too great, a low-profile detail can be used in
conjunction with a special support plate to mount the MicroJoystick as shown in the illustration
below. As in section 5.1.1, either a close-tolerance fit around the MicroJoysticks captuator or pins
can be used to register the MicroJoystick in the detail. The sketch below illustrates pins being
used to register the MicroJoystick in the low-profile detail.
SUPPORT PLATE
The support plate has an indentation in it to capture the MicroJoystick’s base. The thicknes s of
the indentation is slightly thicker than the thickness of the MicroJoystick’s base. This prevents
unwanted forces from being applied to the MicroJoystick that could cause unwanted cursor drift.
The support plate should be flat and free from surface defects (e.g., bumps), and can be
integrated into the backplate of a keyboard or can be constructed as a separate metal or plastic
unit.
To install the MicroJoystick, simply…
Drop the MicroJoystick into the detail
Register the MicroJoystick around the captuator or on the pins
Check to make sure the MicroJoystick is positioned correctly
Install the support plate.
Please see Figure 3, “Using Self Tapping Screw with Indented Support Metal Plate.”
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Figure 3: Using Self Tapping Screw with Indented Support Metal Plate
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5.1.3 Method 3: Mounting the MicroJoystick to a flat surface
The illustration below shows how the MicroJoystick can be mounted to a flat surface such as a
PCB or molded keyboard housing.
LARGER OPENING IN MOUNTING
SURFACE THAN IN BASE
The holes in the mounting surface should be designed as clearance holes (e.g., larger than the
thread diameter of the screws). This helps to ensure that the screws only thread into one surface
-- the MicroJoystick’s base. If the screws thread into both the MicroJoystick’s ba se and the
mounting surface, the resultant stress could cause cursor drift. Alternatively, the screws can be
installed from the top of the MicroJoystick as shown in the illustration below.
INSTALLING SCREWS
FROM TOP
LARGER OPENING IN BASE
THAN IN MOUNTING SURFACE
MOUNTING SURFACE
When installing screws from the top of the MicroJoystick, the holes in the MicroJoysticks base are
clearance holes. The screws should only thread into the mounting surface. If the holes in the
MicroJoystick are too small, they may be drilled out and enlarged.
The mounting surface must be flat to within 0.013mm. Bowing of the mounting surface or surface
bumps can cause preloads on the MicroJoystick resulting in unwanted cursor movement. To help
reduce the effects that any existent bumps or bowing may have a hole or indentation 12.7mm to
15.2mm in diameter can be machined or molded into the mounting surface as shown below.
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The hole/indentation should be centered on the MicroJoystick’s stick. Alternatively, a spacer can
be designed with a hole/indentation and mounted in-between the MicroJoystick and the mounti ng
surface. For more information on this mounting method, please refer to the Figure 4, “Using
Captuator for Registration with Opened Support Plate.”
To install the MicroJoystick, inspect the mounting surface, MicroJoystick and optional spacer to
ensure that they are clean and free of contaminants (e.g., dirt, dust, hair, etc.). Then place the
optional spacer on the mounting surface, and place the MicroJoystick on the mounting
surface/spacer and install the screws. Use care to torque the screws evenly and ensure that they
only thread into one surface (i.e., either the MicroJoystick’s base or the mounting surface,
depending on whether installing the screws from the bottom or top).
Note: When mounting the MicroJoystick to a flat surface, please carefully review the ESD
concerns described in section 5.2.
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Figure 4: Using Captuator for Registration with Opened Support Plate
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5.1.4 Method 4: Adhesive
One of the simplest ways of mounting a MicroJoystick to a flat surface is to use a pressure
sensitive adhesive. Companies such as 3M Corporation make such adhesives, and can
recommend a specific product. Generally, the adhesive bond becomes stronger over time,
reaching its maximum in about two days. If you will need to use the holes for screws to register
the MicroJoystick (in addition to the adhesive), then you may need to cut out the adhesive strip
where it overlays the holes.
5.1.5 Method 5: Heat-stake pins
Heat-stake pins may also be used to mount the MicroJoystick to a flat surface. A horn can be
designed to melt plastic into the three holes to secure the base into place.
5.2 Custom Design Parameters
Interlink Electronics strongly recommends using one of the mounting methods described in
section 5.1. However, these methods may not be appropriate for all systems. If you do need to
design an alternative mounting method, please review the design parameters given below.
Note: These design parameters should be used when designing any mounting method. Before
proceeding to production, any mounting method should be carefully reviewed and tested to
ensure that it does not impair the performance of the MicroJoystick (e.g., introduce bias, cause
preloads on the MicroJoystick, etc.) or introduce other unwanted effects.
Flatness of Mounting Surface
If the MicroJoystick is mounted to a flat surface, the surface should be flat within 0.013mm As
detailed in section 5.1.3, a hole or indentation in the mounting surface can help reduce the
unwanted effects of the mounting surface on the MicroJoystick.
Screwing into Two Surface
Do NOT screw into two surfaces. If screws are used to mount the MicroJoystick, the screws
should only thread into one surface. For example, if the MicroJoystick is mounted to a mounting
surface, the mounting screws should only thread into the mounting surface and not the
MicroJoystick’s base. Threading into two surfaces (i.e., the MicroJoystick’s base and the
mounting surface) can cause unwanted forces to be applied to the MicroJoystick. These forces
could cause cursor movement or cursor drift. Please refer to section 5.1.3.
ESD
When designing a mounting system, care should be taken to consider your electro static
discharge (ESD) requirements. The exposed connecting traces should be properly insulated
against any direct source of static electricity. Your mounting system should be designed with a
large enough dielectric strength (i.e., length of air path from the ESD probe to the conductive
traces on the MicroJoystick’s base plus any additional dielectric insulation) to prevent unwanted
ESD effects. Generally, the further you can bury the MicroJoystick into the mounting surface, the
better your protection against ESD.
Whenever possible, the mounting methods in Section 5.1 have been designed with long or
lengthened air paths from the ESD probe to the MicroJoystick’s conductive traces. Testing is
based on IEC 61000-4-2 requirements using only the air discharge method. The MicroJoystick
with “captuator hidden” mounting method was subjected to 5, 10 and 15 KV electrostatic
discharges. ESD testing should be repeated after the actual integration. Actual ESD tolerance or
resistance is subject to the integration design. Please see Figure 5, “MicroJoystick ESD Test
Information.”
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Figure 5: MicroJoystick ESD Test Information
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5.3 Tail Attachment
The MicroJoystick is designed for easy attachment of flexible-circuit tails. Interlink Electronics
can supply flexible-circuit tails designed for use with the MicroJoysticks or can supply
MicroJoysticks with tails attached. Electrical connections between the MicroJoystick and a
flexible-circuit tail are typically made using conductive adhesives. Before designing an attachment
method for the MicroJoystick’s tail, please carefully review this section.
Flexible-Circuit Tail
Interlink Electronics can supply custom-designed flexible-circuit tails in a variety of materials
(e.g., polyester, polyimide, etc.). If you wish to fabricate your own tail, Figure 6 below illustrates
a standard flexible-circuit tail used by Interlink Electronics.
Figure 6: Flex Tail
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MicroJoystick
Integration Guide
Anisotropic (Z-axis) Conductive Adhesives
Electrical connections between the MicroJoystick and a flexible tail are typically made with a Zaxis conductive adhesive. These adhesives offer excellent Z-axis conductivity, with little leakage
in the X and Y axis. Two common types of Z-axis adhesives are heat-bond adhesives and
pressure-sensitive tape adhesives. Please review the following sections that detail design
parameters for both styles of Z-axis adhesives, so you can select the best adhesive for your
application.
Heat-Bond Z-axis Adhesives
Flexible-circuit tails can be attached to the MicroJoystick with heat-bond Z-axis adhesives.
Heat-bond adhesives are activated by heat and pressure. A heated ram applies the heat and
pressure to the bond joint allowing the adhesive to attach to the polyester tail and the
MicroJoystick. Special care should be taken to ensure that the ram head is parallel to the bond
joint. If the ram is not parallel, open circuits or biases (caused by high-resistance connections)
could result. For more details on applying heat-bond adhesives, please contact your adhesive or
heat-bonding machine vendor.
PROPERLY ALIGNED RAM
MIS-ALIGNED RAM
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Pressure-Sensitive Z-axis Adhesives
Z-axis conductive adhesive offers an inexpensive and, if used correctly, a reliable means of
connecting FSRs to flexible circuit tails. The Z-axis adhesive used by Interlink Electronics
is .05mm thick and is manufactured by 3M Corporation (Scotch™ brand number 9703). When
handling the sensor, care should be taken to prevent touching and to prevent wrinkling of the
adhesive. This can lead to a short, leakage in the X and Y directions, or an open circuit. Since
the Z-axis adhesive does not provide a strong mechanical bond, a compressive force to the
connection joint should be devised. Applying pressure to the connection joint will prevent
delamination of the adhesive which can lead to an open circuit. For example, a rib could be
designed into the assembly to apply pressure to the joint. Rubber could be used on the end of the
rib to take up tolerances in the design.
Using a Rib to Compress the Adhesive Joint
The compressive force on the joint should be applied within a few minutes of assembling the FSR
to the flexible tail. This will help prevent the Z-axis adhesive from delaminating and being
exposed to contaminants. If the Z-axis tape is exposed to contaminants, the electrical conductivity
of the tape can be permanently impaired even with the application of pressure to the bond joint.
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MicroJoystick
Integration Guide
Attaching a Flexible-Circuit Tail to the MicroJoystick
When attaching the flexible-circuit tail to the MicroJoystick’s conductive traces, care should be
taken to ensure that the tail is properly aligned to the conductive traces on the MicroJoystick’s
base. The sketch below illustrates a properly aligned tail and an improperly aligned tail.
PROPERLY ALIGNED TAIL
MIS-ALIGNED TAIL
When handling conductive adhesives, use care to avoid wrinkling the tape which could cause
leakage in the X or Y directions or open circuits. The adhesives should not be touched with bare
fingers, and the conductive traces of the MicroJoystick should be clean (i.e., free from dirt, dust,
oil or other contaminates). Contaminants on the adhesive or MicroJoystick can impair electrical
conductivity between the MicroJoystick and the flexible circuit. If the conductive traces of the
MicroJoystick need to be cleaned, use a soft material (e.g., a cotton swab) moistened with
isopropyl alcohol. The cotton swab should only be moistened with alcohol, not dripping. This will
help prevent the alcohol from wicking into the captuator base. Use care not to scratch the
conductive traces when cleaning the MicroJoystick.
Peel forces applied to the bond joint can cause the adhesive to delaminate. If peel forces are
likely to be applied to the joint, a method of mechanically reinforcing the joint should be devised
(as recommended in the section above, a mechanical reinforceme nt should always be used with
pressure-sensitive Z-axis adhesives). For example, if a long tail is attached to the MicroJoystick,
the alignment of the tail may not be perfect. If a mis-aligned tail is bent when placed into a
connector, peel forces could be transferred to the bond joint. To prevent delamination of the
adhesive, a mechanical compressive force should be applied to the bond joint. The sketch on the
next page details this situation.
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PROPERLY ALIGNED TAIL
MIS-ALIGNED TAIL
(REQUIRES TAIL TO BENT
SLIGHTLY TO FIT INTO
CONNECTION HEADER)
5.4 Handling of MicroJoyStick
MicroJoysticks are typically shipped in plastic trays that are designed with individualized
compartments for each MicroJoystick. Since the trays are designed to protect each MicroJoystick
from damage (the base of the MicroJoystick is hard enough to scratch the conductive traces),
please try to incorporate these trays into your inventory and manufacturing process. When
installing tails or handling the MicroJoysticks, keep units separate from each other to help prevent
damage to the conductive traces.
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MicroJoystick
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6.0 Electronic Integration
Circuit for the MicroJoystick
The interface circuit for the MicroJoystick uses a minimum of commonly available components,
and offers a more cost-effective and simpler interface than other types of joysticks (e.g., stra ingauge based joysticks). With its small number of components, the interface circuit for the
MicroJoystick can easily be integrated onto a system board, or Interlink Electronics can supply an
add-on interface board with the MicroJoystick. Figure 7, “Schematic - MicroJoystick, Application
Note” details the board layout for the circuit. See Section 9 for details of the interface circuit
components list.
Note: The schematic referenced is not a universal interface solution. Additional circuitry may
need to be added or component values may need to be changed to eliminate noise or counteract
other electronic issues that could have a detrimental affect on the performance of the
MicroJoystick. Use sound engineering practices when laying out and specifying your
MicroJoystick interface circuit.
Do prototype the VersaPoint system before proceeding into Production.
In the prototyping phase, the lifetime, durability, manufacturability, ergonomics and
performance of the MicroJoystick should all be thoroughly investigated to ensure they meet
your requirements.
Do mechanically reinforce the Z-axis pressure-sensitive adhesive joint.
If Z-axis pressure sensitive adhesive is used as the connection method, a compressive force
should be applied to the joint to prevent adhesive delamination.
Do mechanically reinforce the Z-axis pressure-sensitiv e adhesive joint immediately
after assembly.
This will prevent the adhesive from delaminating and being exposed to contaminants.
Do use an adhesive primer with Z-axis pressure-sensitive adhesive.
This will help increase the mechanical strength of the joint.
DON’Ts
Do not solder directly to the exposed conductive traces.
With flexible substrates, the solder joint will not hold and the substrate can easily melt and
distort during soldering.
Do not expose the MicroJoystick to Liquids
Do not screw into two surfaces when mounting.
The self-contained design of the MicroJoystick makes it highly resistant to contamination an d
failure caused by dust or liquids. In general, the MicroJoystick is better protected than the
keyboard or system into which it is integrated. However, the MicroJoystick is NOT sealed against
liquids. Exposure to moisture could affect the flex-circuit connection juncture. There is a small
vent at the base of the stick, opposite the connection juncture; the joystick’s operation may be
impaired if moisture enters this vent.
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8.0 MicroJoystick Specifications
MicroJoystick
Integration Guide
Physical Size:
Cursor Directional Control:
Cursor Speed Control:
Hardware Interface:
Data Format:
Use Force Range:
Stick Deflection at Full Force:
Stick Strength Capacity:
Lifetime (Stick):
Temperature:
Humidity:
Continuous, 360°Control
Smooth,continuous,and dynamic(a function of applied force)
PS/2 and USB Controllers Available
Emulates Microsoft mouse
40±20g min,150±20g max. Applied at extremity of 10mm
stick
3.7°(0.65mm) approximately for 10mm stick
Typical maximum side load: 20kg (42 lbs.)
Typical maximum compression load: 100kg (220 lbs.)
Typical maximum tension load: 13 kg (29 lbs.)
Greater than 5 million cycles
Operating: 0º to 60º (32°F to +140°F) Test duration: 96 hrs.
Storage: -40º to +70º (-40°F to +158°F) Test duration:96hrs
5-95% RH, non condensing. Test duration: 96hrs.
ESD Susceptibility
EMI:
Shock:
Vibration:
Connection Method:
Mounting Flatness:
UL:
CE:
*When properly integrated.
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IEC 61000-4-2 Air discharge method Level 4 (No errors at
15KV)*
Passes FCC Rule Part 15, Class B Computing Device
Peripheral*
80g acceleration in 11ms*
MIL Std.202, Method 204 condition A*
Standard or custom flex circuits can be attached with
anisotropic (Z-axis) adhesive.
Must be 0.013mm or flatter
All materials UL grade 94 V-1 or better
Conforms to 89/336/EEC
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Microcontroller Specifications
MicroJoystick
Integration Guide
Chip Family:
Configuration:
Clock Speed:
Microchip P1C18F14K50
18-pin SSOP
6MHz
Specifications are subject to change without notice
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9.0 PC-Interface Circuit Components List
Used Part Type Designator Description
1 0.22uF C1 CAP,CER,0.22UF,10%,10V,0603
1 0.1uF C2 CAP,CER,0.1UF,10%,25V,0603
1 0.01uF C3 CAP,CER,0.01UF,10%,50V,0603
1 4.7uF C4 CAP,CER,4.7UF,10%,6.3V,0603
1 3.3K R1
3 47K R2,R3,R4 RES,47K,5%,1/10W,0603
2 1.5k R5,R6 RES,1.5K,5%,1/10W,0603
1 6MHz X1
1 8Pin J2
2 600 L1,L2
1 PIC18F14K50* U1
*USE IE P/N 24-00030 4 Zone Controller IC
RES,3.3K OHM, Metal
Film,0402,1%,100ppm
Resonator, 6.00MHz, 0.5%, SMT, 2 x
4.5mm
Header, 8 Pin, 1.25mm L/S
Rt. Angle
Ferrite Chip,600
Ohm,500mA,0805,SMD
uProc,PIC18F14K50T-I/SS,16K
Flash,USB,SSOP20
MicroJoystick
Integration Guide
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10.0 Contact Interlink Electronics
United States
Corporate Office
Interlink Electronics, Inc.
546 Flynn Road
Camarillo, CA 93012, USA
Phone: +1-805-484-8855
Fax: +1-805-484-9457
Web: www.interlinkelectronics.com
Sales and support: sales@interlinkelectronics.com