Intel Corporation NG80960JA-25, NG80960JA-33, NG80960JF-25, NG80960JF-16, NG80960JF-33 Datasheet

A PRELIMINARY
80960JA/JF
EMBEDDED 32-BIT MICROPROCESSOR
Pin/Code Compatible with all 80960Jx Processors
High-Performance Embedded Architecture
— One Instruction/Clock Execution — Load/Store Programming Model — Sixteen 32-Bit Global Registers — Sixteen 32-Bit Local Registers (8 sets) — Nine Addressing Modes — User/Supervisor Protection Model
Two-Way Set Associative Instruction Cache
— 80960JA - 2 Kbyte — 80960JF - 4 Kbyte — Programmable Cache Locking
Mechanism
Direct Mapped Data Cache
— 80960JA - 1 Kbyte — 80960JF - 2 Kbyte — Write Through Operation
On-Chip Stack Frame Cache
— Seven Register Sets Can Be Saved — Automatic Allocation on Call/Return — 0-7 Frames Reserved for High-Priority
Interrupts
On-Chip Data RAM
— 1 Kbyte Critical Variable Storage — Single-Cycle Access
High Bandwidth Burst Bus
— 32-Bit Multiplexed Address/Data — Programmable Memory Configuration — Selectable 8-, 16-, 32-Bit Bus Widths — Supports Unaligned Accesses — Big or Little Endian Byte Ordering
New Instructions
— Conditional Add, Subtract and Select — Processor Management
High-Speed Interrupt Controller
— 31 Programmable Priorities — Eight Maskable Pins plus NMI — Up to 240 Vectors in Expanded Mode
Two On-Chip Timers
— Independent 32-Bit Counting — Clock Prescaling by 1, 2, 4 or 8 — lnternal Interrupt Sources
Halt Mode for Low Power
IEEE 1149.1 (JTAG) Boundary Scan
Compatibility
Packages
— 132-Lead Pin Grid Array (PGA) — 132-Lead Plastic Quad Flat Pack (PQFP)
132
PIN 1
99
A
A80960Jx
XXXXXXXXA2
M
© 19xx
i
33

Figure 1. 80960JA/JF Microprocessors

Information in this document is provided solely to enable use of Intel products. Intel assumes no liability whatsoever, including infringement of any patent or copyright, for sale and use of Intel products except as provided in Intel’s Terms and Conditions of Sale for such products. Information contained herein supersedes previously published specifications on these devices from Intel. © INTEL CORPORATION, 1995 September 1995 Order Number: 272504-004
i960
NG80960Jx
XXXXXXXXA2
M
i
© 19xx
66
A 80960JA/JF
80960JA/JF
EMBEDDED 32-BIT MICROPROCESSOR
1.0 PURPOSE ..................................................................................................................................................1
2.0 80960JA/JF OVERVIEW ............................................................................................................................1
2.1 80960 Processor Core ........................................................................................................................2
2.2 Burst Bus ............................................................................................................................................2
2.3 Timer Unit ...........................................................................................................................................3
2.4 Priority Interrupt Controller .................................................................................................................3
2.5 Instruction Set Summary ....................................................................................................................3
2.6 Faults and Debugging .........................................................................................................................3
2.7 Low Power Operation .........................................................................................................................4
2.8 Test Features ......................................................................................................................................4
2.9 Memory-Mapped Control Registers ....................................................................................................4
2.10 Data Types and Memory Addressing Modes ....................................................................................4
3.0 PACKAGE INFORMATION ........................................................................................................................6
3.1 Pin Descriptions ..................................................................................................................................6
3.1.1 Functional Pin Definitions ........................................................................................................6
3.1.2 80960Jx 132-Lead PGA Pinout .............................................................................................13
3.1.3 80960Jx PQFP Pinout ...........................................................................................................17
3.2 Package Thermal Specifications ......................................................................................................20
4.0 ELECTRICAL SPECIFICATIONS ............................................................................................................22
4.1 Absolute Maximum Ratings ..............................................................................................................22
4.2 Operating Conditions ........................................................................................................................22
4.3 Connection Recommendations .........................................................................................................22
4.4 DC Specifications .............................................................................................................................23
4.5 AC Specifications ..............................................................................................................................25
4.5.1 AC Test Conditions and Derating Curves ...............................................................................32
4.5.2 AC Timing Waveforms ............................................................................................................33
5.0 BUS FUNCTIONAL WAVEFORMS .........................................................................................................41
6.0 DEVICE IDENTIFICATION .......................................................................................................................55
7.0 REVISION HISTORY ...............................................................................................................................55
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ii
80960JA/JF A

FIGURES

Figure 1. 80960JA/JF Microprocessors ....................................................................................................0
Figure 2. 80960JA/JF Block Diagram ........................................................................................................2
Figure 3. 132-Lead Pin Grid Array Bottom View - Pins Facing Up ..........................................................13
Figure 4. 132-Lead Pin Grid Array Top View - Pins Facing Down ........................................................... 14
Figure 5. 132-Lead PQFP - Top View ..................................................................................................... 17
Figure 6. AC Test Load ............................................................................................................................32
Figure 7. Output Delay or Hold vs. Load Capacitance ............................................................................32
Figure 8. Rise and Fall Time Derating .....................................................................................................33
Figure 9. CLKIN Waveform ..................................................................................................................... 33
Figure 10. Output Delay Waveform for T Figure 11. Output Float Waveform for T Figure 12. Input Setup and Hold Waveform for T Figure 13. Input Setup and Hold Waveform for T Figure 14. Input Setup and Hold Waveform for T Figure 15. Input Setup and Hold Waveform for T Figure 16. Relative Timings Waveform for T Figure 17. DT/R
and DEN Timings Waveform .......................................................................................... 37
Figure 18. TCK Waveform ......................................................................................................................... 38
Figure 19. Input Setup and Hold Waveforms for T Figure 20. Output Delay and Output Float Waveform for T Figure 21. Output Delay and Output Float Waveform for T Figure 22. Input Setup and Hold Waveform for T
Figure 23. Non-Burst Read and Write Transactions Without Wait States, 32-Bit Bus ...............................41
Figure 24. Burst Read and Write Transactions Without Wait States, 32-Bit Bus ......................................42
Figure 25. Burst Write Transactions With 2,1,1,1 Wait States, 32-Bit Bus ................................................43
Figure 26. Burst Read and Write Transactions Without Wait States, 8-Bit Bus ........................................ 44
Figure 27. Burst Read and Write Transactions With 1, 0 Wait States
and Extra Tr State on Read, 16-Bit Bus ...................................................................................45
Figure 28. Bus Transactions Generated by Double Word Read Bus Request,
Misaligned One Byte From Quad Word Boundary, 32-Bit Bus, Little Endian 46
Figure 29. HOLD/HOLDA Waveform For Bus Arbitration .......................................................................... 47
Figure 30. Cold Reset Waveform ..............................................................................................................48
Figure 31. Warm Reset Waveform ............................................................................................................ 49
Figure 32. Entering the ONCE State .........................................................................................................50
Figure 33. Summary of Aligned and Unaligned Accesses (32-Bit Bus) ....................................................53
Figure 34. Summary of Aligned and Unaligned Accesses (32-Bit Bus) (Continued) ................................ 54
.............................................................................................34
OV1
................................................................................................34
OF
LXL
IS1 IS2 IS3 IS4
and T
BSIS1
BSIS2
and T and T and T and T
................................................................... 35
IH1
................................................................... 35
IH2
................................................................... 36
IH3
................................................................... 36
IH4
........................................................................ 37
LXA
and T
BSOV1 BSOV2
and T
..........................................................38
BSIH1
and T and T
...........................................................40
BSIH2
.......................................... 39
BSOF1
..........................................39
BSOF2
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PRELIMINARY
A 80960JA/JF

TABLES

Table 1. 80960Jx Instruction Set .............................................................................................................5
Table 2. Pin Description Nomenclature ...................................................................................................6
Table 3. Pin Description — External Bus Signals ...................................................................................7
Table 4. Pin Description — Processor Control Signals, Test Signals and Power .................................. 10
Table 5. Pin Description — Interrupt Unit Signals .................................................................................12
Table 6. 132-Lead PGA Pinout — In Signal Order ................................................................................ 15
Table 7. 132-Lead PGA Pinout — In Pin Order ....................................................................................16
Table 8. 132-Lead PQFP Pinout — In Signal Order .............................................................................18
Table 9. 132-Lead PQFP Pinout — In Pin Order .................................................................................. 19
Table 10. 132-Lead PGA Package Thermal Characteristics ................................................................... 20
Table 11. 132-Lead PQFP Package Thermal Characteristics ................................................................ 21
Table 12. 80960JA/JF Operating Conditions ..........................................................................................22
Table 13. 80960JA/JF DC Characteristics .............................................................................................. 23
Table 14. 80960JA/JF I
Table 15. 80960JA/JF AC Characteristics (33 MHz) ............................................................................... 25
Table 16. Note Definitions for Table 15, 80960JA/JF AC Characteristics (33 MHz) ...............................27
Table 17. 80960JA/JF AC Characteristics (25 MHz) ............................................................................... 27
Table 18. 80960JA/JF AC Characteristics (16 MHz) ............................................................................... 29
Table 19. Natural Boundaries for Load and Store Accesses ..................................................................51
Table 20. Summary of Byte Load and Store Accesses ...........................................................................51
Table 21. Summary of Short Word Load and Store Accesses ................................................................51
Table 22. Summary of n-Word Load and Store Accesses (n = 1, 2, 3, 4) ...............................................52
Table 23. 80960JA/JF Die and Stepping Reference ............................................................................... 55
Table 24. Data Sheet Version -003 to -004 Revision History ..................................................................55
Table 25. Data Sheet Version -002 to -003 Revision History ..................................................................56
Table 26. Data Sheet Version -001 to -002 Revision History ..................................................................57
Table 27. Data Sheet Version -002 to -003 Revision History ..................................................................58
Characteristics .............................................................................................. 23
CC
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A 80960JA/JF

1.0 PURPOSE

This document contains preliminary information for the 80960JA/JF microprocessor, including electrical characteristics and package pinout information. Detailed functional descriptions — other than parametric performance — are published in the
®
Jx Microprocessor User’s Guide (272483).
i960
Throughout this data sheet, references to “80960Jx” indicate features which apply to all of the following:
• 80960JA — 5V, 2 Kbyte instruction cache, 1 Kbyte data cache
• 80960JF — 5V, 4 Kbyte instruction cache, 2 Kbyte data cache
• 80960JD — 5V, 4 Kbyte instruction cache, 2 Kbyte data cache and clock doubling
• 80L960JA — 3.3 V version of the 80960JA
• 80L960JF — 3.3 V version of the 80960JF

2.0 80960JA/JF OVERVIEW

The 80960JA/JF offers high performance to cost­sensitive 32-bit embedded applications. The 80960JA/JF is object code compatible with the 80960 Core Architecture and is capable of sustained execution at the rate of one instruction per clock. This processor’s features include generous instruction cache, data cache and data RAM. It also boasts a fast interrupt mechanism, dual program­mable timer units and new instructions.
Memory subsystems for cost-sensitive embedded applications often impose substantial wait state penalties. The 80960JA/JF integrates considerable storage resources on-chip to decouple CPU execution from the external bus.
The 80960JA/JF rapidly allocates and deallocates local register sets during context switches. The processor needs to flush a register set to the stack only when it saves more than seven sets to its local register cache.
A 32-bit multiplexed burst bus provides a high-speed interface to system memory and I/O. A full complement of control signals simplifies the connection of the 80960JA/JF to external compo­nents. The user programs physical and logical memory attributes through memory-mapped control registers (MMRs) — an extension not found on the i960 Kx, Sx or Cx processors. Physical and logical
configuration registers enable the processor to operate with all combinations of bus width and data object alignment. The processor supports a homoge­neous byte ordering model.
This processor integrates two important peripherals: a timer unit and an interrupt controller. These and other hardware resources are programmed through memory-mapped control registers, an extension to the familiar 80960 architecture.
The timer unit (TU) offers two independent 32-bit timers for use as real-time system clocks and general-purpose system timing. These operate in either single-shot or auto-reload mode and can generate interrupts.
The interrupt controller unit (ICU) provides a flexible, low-latency means for requesting interrupts.The ICU provides full programmability of up to 240 interrupt sources into 31 priority levels. The ICU takes advantage of a cached priority table and optional routine caching to minimize interrupt latency. Local registers may be dedicated to high-priority interrupts to further reduce latency. Acting independently from the core, the ICU compares the priorities of posted interrupts with the current process priority, off­loading this task from the core. The ICU also supports the integrated timer interrupts.
The 80960JA/JF features a Halt mode designed to support applications where low power consumption is critical. The halt instruction shuts down instruction execution, resulting in a power savings of up to 90 percent.
The 80960JA/JF’s testability features, including ONCE (On-Circuit Emulation) mode and Boundary Scan (JTAG), provide a powerful environment for design debug and fault diagnosis.
The Solutions960® program features a wide variety of development tools which support the i960 processor family. Many of these tools are developed by partner companies; some are developed by Intel, such as profile-driven optimizing compilers. For more information on these products, contact your local Intel representative.
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1
80960JA/JF A
SRC1
SRC2
DEST
SRC1
SRC2
DEST
SRC1
DEST
CLKIN
TAP
Local Register Cache
PLL, Clocks, Power Mgmt
Boundary Scan
5
8-Set
128
Global / Local
Register File
SRC2 DESTSRC1
Controller
3 Independent 32-Bit SRC1, SRC2, and DEST Buses
Instruction Cache
4Kbyte (80960JF) or 2 Kbyte (80960JA)
Two-Way Set Associative
Constants
and
Address
Unit
effective
address
Control
Memory Interface
32-bit Address
32-bit Data
Multiply
Divide
Unit
Instruction Sequencer
Execution
Generation

Figure 2. 80960JA/JF Block Diagram

Unit
32-bit buses
address / data
Physical Region
Configuration
Bus
Control Unit
Bus Request
Queues
Two 32-Bit
Timers
Programmable
Interrupt Controller
Memory-Mapped Register Interface
1 K byte
Data RAM
2 Kbyte (80960JF)
or
1 Kbyte (80960JA)
Direct Mapped
Data Cache
Control
21
Address/ Data Bus
32
Interrupt Port
9

2.1 80960 Processor Core

The 80960Jx family is a scalar implementation of the 80960 Core Architecture. Intel designed this processor core as a very high performance device that is also cost-effective. Factors that contribute to the core’s performance include:
• Single-clock execution of most instructions
• Independent Multiply/Divide Unit
• Efficient instruction pipeline minimizes pipeline break latency
• Register and resource scoreboarding allow overlapped instruction execution
• 128-bit register bus speeds local register caching
2
• Two-way set associative, integrated instruction cache
• Direct-mapped, integrated data cache
• 1 Kbyte integrated data RAM delivers zero wait state program data

2.2 Burst Bus

A 32-bit high-performance bus controller interfaces the 80960JA/JF to external memory and peripherals. The BCU fetches instructions and transfers data at the rate of up to four 32-bit words per six clock cycles. The external address/data bus is multi­plexed.
PRELIMINARY
A 80960JA/JF
Users may configure the 80960JA/JF’s bus controller to match an application’s fundamental memory organization. Physical bus width is register­programmed for up to eight regions. Byte ordering and data caching are programmed through a group of logical memory templates and a defaults register.
The BCU’s features include:
• Multiplexed external bus to minimize pin count
• 32-, 16- and 8-bit bus widths to simplify I/O interfaces
• External ready control for address-to-data, data-to­data and data-to-next-address wait state types
• Support for big or little endian byte ordering to facilitate the porting of existing program code
• Unaligned bus accesses performed transparently
• Three-deep load/store queue to decouple the bus from the core
Upon reset, the 80960JA/JF conducts an internal self test. Then, before executing its first instruction, it performs an external bus confidence test by performing a checksum on the first words of the initialization boot record (IBR).
The user may examine the contents of the caches at any time by executing special cache control instruc­tions.

2.3 Timer Unit

The timer unit (TU) contains two independent 32-bit timers which are capable of counting at several clock rates and generating interrupts. Each is programmed by use of the TU registers. These memory-mapped registers are addressable on 32-bit boundaries. The timers have a single-shot mode and auto-reload capabilities for continuous operation. Each timer has an independent interrupt request to the interrupt controller. The TU can generate a fault when unauthorized writes from user mode are detected. Clock prescaling is supported.

2.4 Priority Interrupt Controller

A programmable interrupt controller manages up to 240 external sources through an 8-bit external interrupt port. Alternatively, the interrupt inputs may be configured for individual edge- or level-triggered
inputs. The interrupt unit (IU) also accepts interrupts from the two on-chip timer channels and a single Non-Maskable Interrupt (NMI serviced according to their priority levels relative to the current process priority.
Low interrupt latency is critical to many embedded applications. As part of its highly flexible interrupt mechanism, the 80960JA/JF exploits several techniques to minimize latency:
• Interrupt vectors and interrupt handler routines can be reserved on-chip
• Register frames for high-priority interrupt handlers can be cached on-chip
• The interrupt stack can be placed in cacheable memory space
) pin. Interrupts are

2.5 Instruction Set Summary

The 80960JA/JF adds several new instructions to the i960 core architecture. The new instructions are:
• Conditional Move
• Conditional Add
• Conditional Subtract
• Byte Swap
• Halt
• Cache Control
• Interrupt Control
Table 1 identifies the instructions that the 80960Jx supports. Refer to i960 Guide (272483) for a detailed description of each instruction.
®
Jx Microprocessor User’s

2.6 Faults and Debugging

The 80960Jx employs a comprehensive fault model. The processor responds to faults by making implicit calls to a fault handling routine. Specific information collected for each fault allows the fault handler to diagnose exceptions and recover appropriately.
The processor also has built-in debug capabilities. In software, the 80960Jx may be configured to detect as many as seven different trace event types. Alter­natively, mark and fmark instructions can generate
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80960JA/JF A
trace events explicitly in the instruction stream. Hardware breakpoint registers are also available to trap on execution and data addresses.

2.7 Low Power Operation

Intel fabricates the 80960Jx using an advanced sub­micron manufacturing process. The processor’s sub­micron topology provides the circuit density for optimal cache size and high operating speeds while dissipating modest power. The processor also uses dynamic power management to turn off clocks to unused circuits.
Users may program the 80960Jx to enter Halt mode for maximum power savings. In Halt mode, the processor core stops completely while the integrated peripherals continue to function, reducing overall power requirements up to 90 percent. Processor execution resumes from internally or externally generated interrupts.

2.8 Test Features

The 80960Jx incorporates numerous features which enhance the user’s ability to test both the processor and the system to which it is attached. These features include ONCE (On-Circuit Emulation) mode and Boundary Scan (JTAG).
The 80960Jx provides testability features compatible with IEEE Standard Test Access Port and Boundary Scan Architecture (IEEE Std. 1149.1).
One of the boundary scan instructions, HIGHZ, forces the processor to float all its output pins (ONCE mode). ONCE mode can also be initiated at reset without using the boundary scan mechanism.
ONCE mode is useful for board-level testing. This feature allows a mounted 80960JA/JF to electrically “remove” itself from a circuit board. This allows for system-level testing where a remote tester — such as an in-circuit emulator — can exercise the processor system.
The provided test logic does not interfere with component or circuit board behavior and ensures that components function correctly, connections
between various components are correct, and various components interact correctly on the printed circuit board.
The JTAG Boundary Scan feature is an attractive alternative to conventional “bed-of-nails” testing. It can examine connections which might otherwise be inaccessible to a test system.
2.9 Memory-Mapped Control
Registers
The 80960JA/JF, though compliant with i960 series processor core, has the added advantage of memory-mapped, internal control registers not found on the i960 Kx, Sx or Cx processors. These give software the interface to easily read and modify internal control registers.
Each of these registers is accessed as a memory­mapped, 32-bit register. Access is accomplished through regular memory-format instructions. The processor ensures that these accesses do not generate external bus cycles.
2.10 Data Types and Memory
Addressing Modes
As with all i960 family processors, the 80960JA/JF instruction set supports several data types and formats:
• Bit
• Bit fields
• Integer (8-, 16-, 32-, 64-bit)
• Ordinal (8-, 16-, 32-, 64-bit unsigned integers)
• Triple word (96 bits)
• Quad word (128 bits)
The 80960JA/JF provides a full set of addressing modes for C and assembly programming:
• Two Absolute modes
• Five Register Indirect modes
• Index with displacement
• IP with displacement
4
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A 80960JA/JF

Table 1. 80960Jx Instruction Set

Data Movement Arithmetic Logical Bit, Bit Field and Byte
Load Store Move *Conditional Select Load Address
Comparison Branch Call/Return Fault
Compare Conditional Compare Compare and
Increment Compare and
Decrement Test Condition Code Check Bit
Debug
Modify Trace Controls Mark Force Mark
NOTE: Asterisk (*) denotes new 80960Jx instructions unavailable on 80960CA/CF, 80960KA/KB and 80960SA/SB implementations.
Add Subtract Multiply Divide Remainder Modulo Shift Extended Shift Extended Multiply Extended Divide Add with Carry Subtract with Carry *Conditional Add *Conditional Subtract Rotate
Unconditional Branch Conditional Branch Compare and Branch
Processor
Management
Flush Local Registers Modify Arithmetic
Controls Modify Process
Controls *Halt System Control *Cache Control *Interrupt Control
And Not And And Not Or Exclusive Or Not Or Or Not Nor Exclusive Nor Not Nand
Call Call Extended Call System Return Branch and Link
Atomic
Atomic Add Atomic Modify
Set Bit Clear Bit Not Bit Alter Bit Scan For Bit Span Over Bit Extract Modify Scan Byte for Equal *Byte Swap
Conditional Fault Synchronize Faults
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80960JA/JF A

3.0 PACKAGE INFORMATION

The 80960JA/JF will be offered in several speed and package types. The 132-pin Pin Grid Array (PGA) device will be specified for operation at
= 5.0 V ± 5% over a case temperature range of
V
cc
0° to 100°C:
• A80960JA/JF-33 (33 MHz)
• A80960JA/JF-25 (25 MHz)
• A80960JA/JF-16 (16 MHz) The 132-pin Plastic Quad Flatpack (PQFP) devices
will be specified for operation at V over a case temperature range of 0° to 100°C:
= 5.0 V ± 5%
cc
• NG80960JA/JF-33 (33 MHz)
• NG80960JA/JF-25 (25 MHz)
• NG80960JA/JF-16 (16 MHz) For complete package specifications and infor-
mation, refer to Intel’s Packaging Handbook (240800).

3.1 Pin Descriptions

This section describes the pins for the 80960JA/JF in the 132-pin ceramic Pin Grid Array (PGA) package and 132-lead Plastic Quad Flatpack Package (PQFP).
Section 3.1.1, Functional Pin Definitions describes pin function; Section 3.1.2, 80960Jx 132­Lead PGA Pinout and Section 3.1.3, 80960Jx PQFP Pinout define the signal and pin locations for
the supported package types.

3.1.1 Functional Pin Definitions

Table 2 presents the legend for interpreting the pin descriptions which follow. Pins associated with the bus interface are described in Table 3. Pins associated with basic control and test functions are described in Table 4. Pins associated with the Interrupt Unit are described in Table 5.

Table 2. Pin Description Nomenclature

Symbol Description
I Input pin only.
O Output pin only.
I/O Pin can be either an input or output.
Pin must be connected as described.
S Synchronous. Inputs must meet setup
and hold times relative to CLKIN for proper operation.
S(E) Edge sensitive input S(L) Level sensitive input
A (...) Asynchronous. Inputs may be
asynchronous relative to CLKIN.
A(E) Edge sensitive input A(L) Level sensitive input
R (...) While the processor’s RESET
pin is
asserted, the pin:
R(1) is driven to V R(0) is driven to V R(Q) is a valid output
CC SS
R(X) is driven to unknown state R(H) is pulled up to V
CC
H (...) While the processor is in the hold state,
the pin:
H(1) is driven to V H(0) is driven to V H(Q) Maintains previous state or
CC SS
continues to be a valid output H(Z) Floats
P (...) While the processor is halted, the pin:
P(1) is driven to V P(0) is driven to V P(Q) Maintains previous state or
CC SS
continues to be a valid output
6
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Table 3. Pin Description — External Bus Signals (Sheet 1 of 4)

NAME TYPE DESCRIPTION
AD31:0 I/O
S(L) R(X) H(Z)
P(Q)
ADDRESS / DATA BUS carries 32-bit physical addresses and 8-, 16- or 32-bit data to and from memory. During an address ( address (bits 0-1 indicate SIZE; see below). During a data (T
T
a
data is present on one or more contiguous bytes, comprising AD31:24, AD23:16, AD15:8 and AD7:0. During write operations, unused pins are driven to determinate values.
SIZE, which comprises bits 0-1 of the AD lines during a number of data transfers during the bus transaction.
AD1 AD0 Bus Transfers
0 0 1 Transfer 0 1 2 Transfers 1 0 3 Transfers 1 1 4 Transfers
When the processor enters Halt mode, if the previous bus operation was a:
• write — AD31:2 are driven with the last data value on the AD bus.
• read — AD31:4 are driven with the last address value on the AD bus; AD3:2 are driven with the value of A3:2 from the last data cycle.
Typically, AD1:0 reflect the SIZE information of the last bus transaction (either instruction fetch or load/store) that was executed before entering Halt mode.
ALE O
R(0) H(Z)
ADDRESS LATCH ENABLE indicates the transfer of a physical address. ALE is
T
asserted during a active HIGH and floats to a high impedance state during a hold cycle (T
cycle and deasserted before the beginning of the Td state. It is
a
P(0)
ADDRESS LATCH ENABLE indicates the transfer of a physical address. ALE
ALE
R(1) H(Z)
inverted version of ALE. This signal gives the 80960JA/JF a high degree of compat­ibility with existing 80960Kx systems.
P(1)
ADDRESS STROBE indicates a valid address and the start of a new bus access.
ADS
R(1) H(Z)
The processor asserts ADS samples ADS
at the end of the cycle.
for the entire Ta cycle. External bus control logic typically
P(1)
A3:2 O
R(X) H(Z) P(Q)
ADDRESS3:2 comprise a partial demultiplexed address bus. 32-bit memory accesses: the processor asserts address bits A3:2 during
partial word address increments with each assertion of RDYRCV 16-bit memory accesses: the processor asserts address bits A3:1 during
driven on the assertion of RDYRCV
BE1 pin. The partial short word address increments with each
during a burst.
8-bit memory accesses: the processor asserts address bits A3:0 during driven on BE1:0 RDYRCV
. The partial byte address increments with each assertion of
during a burst.
) cycle, bits 31:2 contain a physical word
) cycle, read or write
d
T
cycle, specifies the
a
).
h
is the
T
. The
during a burst.
a
T
with A1
a
T
, with A1:0
a
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80960JA/JF A
Table 3. Pin Description — External Bus Signals (Sheet 2 of 4)
NAME TYPE DESCRIPTION
BE3:0 O
R(1) H(Z) P(1)
WIDTH/ HLTD1:0
R(0) H(Z) P(1)
D/C
R(X) H(Z) P(Q)
W/R
R(0) H(Z) P(Q)
BYTE ENABLES select which of up to four data bytes on the bus participate in the current bus access. Byte enable encoding is dependent on the bus width of the memory region accessed:
32-bit bus:
enables data on AD31:24
BE3
enables data on AD23:16
BE2
enables data on AD15:8
BE1
enables data on AD7:0
BE0
16-bit bus:
becomes Byte High Enable (enables data on AD15:8)
BE3
is not used (state is high)
BE2
becomes Address Bit 1 (A1)
BE1
becomes Byte Low Enable (enables data on AD7:0)
BE0
8-bit bus:
is not used (state is high)
BE3
is not used (state is high)
BE2
becomes Address Bit 1 (A1)
BE1
becomes Address Bit 0 (A0)
BE0
The processor asserts byte enables, byte high enable and byte low enable during Since unaligned bus requests are split into separate bus transactions, these signals do not toggle during a burst. They remain active through the last T
d
For accesses to 8- and 16-bit memory, the processor asserts the address bits in conjunction with A3:2 described above.
WIDTH/HALTED signals denote the physical memory attributes for a bus trans-
action:
WIDTH/HLTD1 WIDTH/HLTD0
0 0 8 Bits Wide 0 1 16 Bits Wide 1 0 32 Bits Wide 1 1 Processor Halted
The processor floats the WIDTH/HLTD pins whenever it relinquishes the bus in response to a HOLD request, regardless of prior operating state.
DATA/CODE indicates that a bus access is a data access (1) or an instruction
access (0). D/C
has the same timing as W/R.
0 = instruction access 1 = data access
WRITE/READ specifies, during a
read (0). It is latched on-chip and remains valid during T
T
cycle, whether the operation is a write (1) or
a
cycles.
d
0 = read 1 = write
T
cycle.
.
a
8
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A 80960JA/JF
Table 3. Pin Description — External Bus Signals (Sheet 3 of 4)
NAME TYPE DESCRIPTION
DT/R O
DEN
BLAST
RDYRCV
/
LOCK ONCE
R(0) H(Z) P(Q)
R(1) H(Z)
P(1)
R(1) H(Z)
P(1)
S(L)
S(L) R(H) H(Z)
P(1)
DATA TRANSMIT / RECEIVE indicates the direction of data transfer to and from the address/data bus. It is low during T
/Td cycles for a write. DT/R never changes state when DEN is asserted.
and T
w
0 = receive 1 = transmit
DATA ENABLE indicates data transfer cycles during a bus access. DEN
at the start of the first data cycle in a bus access and deasserted at the end of the last data cycle. DEN connected to the data bus.
0 = data cycle 1 = not data cycle
BURST LAST indicates the last transfer in a bus access. BLAST
last data transfer of burst and non-burst accesses. BLAST wait states are inserted via the RDYRCV data transfer in a bus cycle.
0 = last data transfer 1 = not last data transfer
I
READY/RECOVER indicates that data on AD lines can be sampled or removed.
When RDYRCV next cycle by inserting a wait state (T
0 = sample data 1 = don’t sample data
The RDYRCV continues to insert additional recovery states until it samples the pin HIGH. This function gives slow external devices sufficient time to float their buffers before the processor begins to drive address again.
0 = insert wait states 1 = recovery complete
BUS LOCK indicates that an atomic read-modify-write operation is in progress. The
I/O
output is asserted in the first clock of an atomic operation and deasserted in
LOCK the last data transfer of the sequence. The processor does not grant HOLDA while it is asserting LOCK in semaphore operations.
0 = Atomic read-modify-write in progress 1 = Atomic read-modify-write not in progress
ONCE MODE: The processor samples the ONCE asserted LOW at the end of reset, the processor enters ONCE mode. In ONCE mode, the processor stops all clocks and floats all output pins. The pin has a weak internal pullup which is active during reset to ensure normal operation when the pin is left unconnected.
0 = ONCE mode enabled 1 = ONCE mode not enabled
is used with DT/R to provide control for data transceivers
is not asserted during a Td cycle, the Td cycle is extended to the
pin has another function during the recovery (Tr) state. The processor
. This prevents external agents from accessing memory involved
and Tw/Td cycles for a read; it is high during Ta
a
is asserted in the
pin. BLAST becomes inactive after the final
).
w
remains active as long as
input during reset. When it is
is asserted
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80960JA/JF A
Table 3. Pin Description — External Bus Signals (Sheet 4 of 4)
NAME TYPE DESCRIPTION
HOLD I
S(L)
HOLDA O
R(Q)
H(1) P(Q)
BSTAT O
R(0)
H(Q)
P(0)

Table 4. Pin Description — Processor Control Signals, Test Signals and Power (Sheet 1 of 2)

NAME TYPE DESCRIPTION
CLKIN I CLOCK INPUT provides the processor’s fundamental time base; both the processor
RESET
A(L)
STEST I
S(L)
HOLD: A request from an external bus master to acquire the bus. When the processor receives HOLD and grants bus control to another master, it asserts HOLDA, floats the address/data and control lines and enters the T HOLD is deasserted, the processor deasserts HOLDA and enters either the T
state. When
h
state, resuming control of the address/data and control lines. 0 = no hold request
1 = hold request HOLD ACKNOWLEDGE indicates to an external bus master that the processor has
relinquished control of the bus. The processor can grant HOLD requests and enter
state during reset and while halted as well as during regular operation.
the T
h
0 = hold not acknowledged 1 = hold acknowledged
BUS STATUS indicates that the processor may soon stall unless it has sufficient access to the bus; see i960
®
Jx Microprocessor User’s Guide (272483). Arbitration
logic can examine this signal to determine when an external bus master should acquire/relinquish the bus.
0 = no potential stall 1 = potential stall
core and the external bus run at the CLKIN rate. All input and output timings are specified relative to a rising CLKIN edge.
I
RESET initializes the processor and clears its internal logic. During reset, the
processor places the address/data bus and control output pins in their idle (inactive) states.
During reset, the input pins are ignored with the exception of LOCK
/ONCE, STEST
and HOLD. The RESET
ization during power up, RESET cycles with V a minimum of 15 cycles.
pin has an internal synchronizer. To ensure predictable processor initial-
must be asserted a minimum of 10,000 CLKIN
and CLKIN stable. On a warm reset, RESET should be asserted for
CC
SELF TEST enables or disables the processor’s internal self-test feature at initial­ization. STEST is examined at the end of reset. When STEST is asserted, the processor performs its internal self-test and the external bus confidence test. When STEST is deasserted, the processor performs only the external bus confidence test.
0 = self test disabled 1 = self test enabled
or Ta
i
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Table 4. Pin Description — Processor Control Signals, Test Signals and Power (Sheet 2 of 2)
NAME TYPE DESCRIPTION
FAIL O
TCK I TEST CLOCK is a CPU input which provides the clocking function for IEEE 1149.1
TDI I
TDO O
TRST
TMS I
V
CC
V
CCPLL
V
SS
NC NO CONNECT pins. Do not make any system connections to these pins.
R(0) H(Q)
P(1)
S(L)
R(Q)
HQ) P(Q)
A(L)
S(L)
FAIL indicates a failure of the processor’s built-in self-test performed during initial­ization. FAIL indicate the status of individual tests:
• When self-test passes, the processor deasserts FAIL user code.
• When self-test fails, the processor asserts FAIL
0 = self test failed 1 = self test passed
Boundary Scan Testing (JTAG). State information and data are clocked into the processor on the rising edge; data is clocked out of the processor on the falling edge.
TEST DATA INPUT is the serial input pin for JTAG. TDI is sampled on the rising edge of TCK, during the SHIFT-IR and SHIFT-DR states of the Test Access Port.
TEST DATA OUTPUT is the serial output pin for JTAG. TDO is driven on the falling edge of TCK during the SHIFT-IR and SHIFT-DR states of the Test Access Port. At other times, TDO floats. TDO does not float during ONCE mode.
I
TEST RESET asynchronously resets the Test Access Port (TAP) controller function
of IEEE 1149.1 Boundary Scan testing (JTAG). When using the Boundary Scan feature, connect a pulldown resistor between this pin and V used, this pin must be connected to V Section 4.3, Connection Recommendations (pg. 22).
TEST MODE SELECT is sampled at the rising edge of TCK to select the operation
of the test logic for IEEE 1149.1 Boundary Scan testing. – POWER pins intended for external connection to a VCC board plane. – PLL POWER is a separate VCC supply pin for the phase lock loop clock generator. It
is intended for external connection to the V
add a simple bypass filter circuit to reduce noise-induced clock jitter and its effects
on timing relationships. – GROUND pins intended for external connection to a VSS board plane.
is asserted immediately upon reset and toggles during self-test to
and begins operation from
and then stops executing.
. When TAP is not
; however, no resistor is required. See
SS
board plane. In noisy environments,
CC
SS
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80960JA/JF A

Table 5. Pin Description — Interrupt Unit Signals

NAME TYPE DESCRIPTION
I
XINT7:0
A(E/L)
NMI
A(E)
EXTERNAL INTERRUPT pins are used to request interrupt service. The XINT7:0 pins can be configured in three modes:
Dedicated Mode: Each pin is assigned a dedicated interrupt level. Dedicated inputs
can be programmed to be level (low) or edge (falling) sensitive.
Expanded Mode: All eight pins act as a vectored interrupt source. The interrupt pins
are level sensitive in this mode.
Mixed Mode: The XINT7:5
pins act as dedicated sources and the XINT4:0 pins act as the five most significant bits of a vectored source. The least significant bits of the vectored source are set to 010
Unused external interrupt pins should be connected to V
I
NON-MASKABLE INTERRUPT causes a non-maskable interrupt event to occur.
is the highest priority interrupt source and is falling edge-triggered. If NMI is
NMI unused, it should be connected to V
CC
.
CC
.
internally.
2
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3.1.2 80960Jx 132-Lead PGA Pinout

1413121110987654321
P
AD18AD19AD22AD25
CC
CC
CC
CC
CC
CC
CC
V
V
V
V
V
V
AD6AD11AD13V
N
AD20AD24AD26AD27
SS
SS
SS
SS
SS
SS
SS
V
V
V
V
V
V
AD3AD7AD10V
M
AD1
V
V
V
V
V
V
TCKXINT3
AD0AD4AD8AD9AD12AD14AD15AD16AD17AD21AD23
V
CC
V
CC
SS
V
CC
SS
CLKINV
SS
V
CC
SS
V
CC
SS
V
CC
SS
V
CC
SS
NCSTESTTRSTHOLDNCFAIL NCBLAST
NC
TMSXINT2
AD29AD30 NC
L
K
BE2
V
BE3
AD28
AD31V
SS
CC
J
V
V
V
HOLDA
WIDTH/ADS
HLTD1
BE1V
SS
BE0V
SS
ALEV
SS
BSTAT
SS
DEN
SS
DT/RV
SS
A3 XINT1
A2
HLTD0
NCTDOWIDTH/D/CW/R XINT4
SS
NCNCALE
V
CC
SS
SS
V
V
CC
CC
V
V
V
XINT6V
SS
CC
V
CC
H
G
F
E
D
C
B
V
CC
CC
V
CC
V
CC
V
CC
LOCK/ ONCE
A
XINT0
AD5
AD2
NC
V
CCPLL
NC
RDYRCV
RESET
TDI
XINT5XINT7NMIV
P
N
M
L
K
J
H
G
F
E
D
C
B
A

Figure 3. 132-Lead Pin Grid Array Bottom View - Pins Facing Up

PRELIMINARY
1413121110987654321
13
80960JA/JF A
PNMLKJHGFEDCBA
14
TMS NC NC VCCVCCVCCVCCCLKIN VCCVCCVCCAD0 AD3 AD6
13
12
11
10
9
8
7
6
5
4
3
2
1
XINT2
TCK STEST VSSVSSVSSVSSVSSVSSVSSAD1 AD4 AD7 AD11
XINT5
XINT3 TRST
XINT4
NC
WIDTH/
HLTD0
D/C
W/R
XINT0
XINT1
BLAST
HOLDA
LOCK/ ONCE
XINT7
NMI XINT6
VCCVSSHOLD
V
CCVSS
V
CCVSS
V
CCVSS
NC A2
NC TDO
ALE
WIDTH/ HLTD1
ADS
TDI
RESET
RDYRCV NC V
CCPLL
A80960Jx
NC
M
NC
FAIL
A3
DT/R
VCCVCCVCCVCCVCCVCCVCCBE2 AD30
i
XXXXXXXX A2
DEN
V
V
SS
SSVSSVSSVSSVSSVSS
© 19xx
BSTAT ALE BE1BE0
NC
AD2 AD5
AD31
AD28
BE3 AD29
AD10 AD13AD8
AD9 V
SSVCC
AD12 VSSV
AD14 VSSV
AD15 VSSV
AD16
AD17 V
AD21 VSSV
AD23 AD20 AD18
NC
AD24
AD27 AD25
V
SS
V
SS
AD26
V
AD19
AD22
CC
CC
CC
CC
CC
CC
14
13
12
11
10
9
8
7
6
5
4
3
2
1
14
PNMLKJHGFEDCBA

Figure 4. 132-Lead Pin Grid Array Top View - Pins Facing Down

PRELIMINARY
A 80960JA/JF

Table 6. 132-Lead PGA Pinout — In Signal Order

Signal Pin Signal Pin Signal Pin Signal Pin
A2 C5 AD31 K3 TDI D12 V A3 C4 ADS
A1 TDO B4 V AD0 M14 ALE G3 TMS A14 V AD1 L13 ALE AD2 K12 BE0 AD3 N14 BE1 AD4 M13 BE2 AD5 L12 BE3 AD6 P14 BLAST AD7 N13 BSTAT F3 V AD8 M12 CLKIN H14 V AD9 M11 D/C
AD10 N12 DEN AD11 P13 DT/R AD12 M10 FAIL AD13 P12 HOLD C9 V AD14 M9 HOLDA C2 V AD15 M8 LOCK
/ONCE C1 V AD16 M7 NC A4 V AD17 M6 NC A5 V AD18 P4 NC B5 V AD19 P3 NC B14 V AD20 N4 NC C7 V AD21 M5 NC C8 V AD22 P2 NC C14 V AD23 M4 NC G12 V AD24 N3 NC J12 V AD25 P1 NC M3 V AD26 N2 NMI AD27 N1 RDYRCV AD28 L3 RESET AD29 M2 STEST C13 V AD30 M1 TCK B13 V
A3 TRST C12 V H3 V
J3 V L1 V L2 V
C3 V
B2 V E3 V D3 V C6 V
A10 V F12 V E12 V
CC CC CC CC CC CC CC CC CC CC CC CC CC CC CC CC CC CC CC CC CC CC CC CC CC
CCPLL
SS SS SS
A6 V A7 V A8 V A9 V D1 V
D14 V
E1 V
E14 V
F1 V
F14 V
G1 V
G14 V
H1 V J1 V
J14 V
K1 V K14 V L14 V
P5 W/R B1
P6 WIDTH/HLTD0 B3
P7 WIDTH/HLTD1 A2
P8 XINT0 C11
P9 XINT1 C10 P10 XINT2 A13 P11 XINT3 B12 H12 XINT4 B11
B6 XINT5 A12
B7 XINT6 B10
B8 XINT7 A11
NOTE: Do not connect any external logic to pins marked NC (no connect pins).
SS SS SS SS SS SS SS SS SS SS SS SS SS SS SS SS SS SS SS SS SS SS
B9 D2
D13
E2
E13
F2
F13
G2
G13
H2
H13
J2
J13
K2
K13
N5 N6 N7 N8
N9 N10 N11
PRELIMINARY
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