80960MC
iv
FIGURES
Figure 1. 80960MC Programming Environment ........................................................................................1
Figure 2. Instruction Formats ....................................................................................................................4
Figure 3. Multiple Register Sets Are Stored On-Chip ...............................................................................6
Figure 4. Connection Recommendations for Low Current Drive Network ..............................................13
Figure 5. Connection Recommendations for High Current Drive Network ..............................................13
Figure 6. Typical Supply Current vs. Case Temperature ........................................................................14
Figure 7. Typical Current vs. Frequency (Room Temp) ..........................................................................14
Figure 8. Typical Current vs. Frequency (Hot Temp) ..............................................................................15
Figure 9. Worst-Case Voltage vs. Output Current on Open-Drain Pins ..................................................15
Figure 10. Capacit iv e Dera tin g Curv e .. .................................. .... .... .... ... ....................... .... .... .... .... .............15
Figure 11. Test Load Circuit for Three-State Output Pins .........................................................................16
Figure 12. Test Load Circuit for Open-Drain Output Pins .........................................................................16
Figure 13. Drive Levels and Timing Relationships for 80960MC Signals .................................................18
Figure 14. Timing Relationship of L-Bus Signals ......................................................................................19
Figure 15. System and Processor Clock Relationship ..............................................................................19
Figure 16. Processor Clock Pulse (CLK2) ................................................................................................21
Figure 17. RESET Signal Timing ..............................................................................................................21
Figure 18. HOLD Timing ...........................................................................................................................22
Figure 19. 132-Lead Pin-Grid Array (PGA) Package ................................................................................23
Figure 20. 80960MC PGA Pinout—View from Bottom (Pins Facing Up) ..................................................24
Figure 21. 80960MC PGA Pinout—View from Top (Pins Facing Down) ..................................................25
Figure 22. 25 MHz Maximum Allowable Ambient Temperature ................................................................29
Figure 23. Non-Burst Read and Write Transactions Without Wait States .................................................30
Figure 24. Burst Read and Write Transaction Without Wait States ..........................................................31
Figure 25. Burst Write Transaction with 2, 1, 1, 1 Wait States ..................................................................32
Figure 26. Accesses Gene rated by Quad Word Rea d Bus Request, Misaligned Two Bytes from
Quad Word Boundary (1, 0, 0, 0 Wait States) .........................................................................33
Figure 27. Interrupt Acknowledge Transaction .........................................................................................34
Figure 28. Bus Ex change Transaction (PBM = Primary Bus Master, SBM = Secondary Bus Master) .....35
TABLES
Table 1. 80960MC Instruction Set ...........................................................................................................3
Table 2. Memory Addressing Modes .......................................................................................................4
Table 3. Sample Floating-Point Execution Times (µs) at 25 MHz ...........................................................7
Table 4. 80960MC Pin Description: L-Bus Signals ..................................................................................9
Table 5. 80960MC Pin Description: Support Signals .............................................................................11
Table 6. DC Characteristics ...................................................................................................................17
Table 7. 80960MC AC Characteristics (25 MHz) ...................................................................................20
Table 8. 80960MC PGA Pinout — In Pin Order .....................................................................................26
Table 9. 80960MC PGA Pinout — In Signal Order ................................................................................27
Table 10. 80960MC PGA Package Thermal Characteristics ...................................................................28