Intel Xeon 5500 Series Design Manual

Intel® Xeon® Processor 5500 Series

Thermal/Mechanical Design Guide

March 2009

Document Number:321323-001

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING T O SALE AND/OR USE OF INTEL PRODUCT S INCLUDING LIABILITY OR WARRANTIES RELA TING T O FITNES S FOR A PARTICULAR PURPOSE, MERCHANT ABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life savin g, or life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel

reserves these for future definition and shall have no responsibility whatsoev er for conflicts or incompatibilities arising from future changes to them.

The Intel® Xeon® processor 5500 series and LGA1366 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel processor numbers are not a measure of performance. Processor numb ers differentia te features withi n each processo r family,

not across different processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details.

Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see www.intel.com.

2 Thermal/Mechanical Design Guide

Contents

1Introduction..............................................................................................................9

1.1 References.......................................................................................................10

1.2 Definition of Terms............................................................................................10

2 LGA1366 Socket ......................................................................................................13

2.1 Board Layout....................................................................................................15

2.2 Attachment to Motherboard................................................................................16

2.3 Socket Components...........................................................................................16

2.3.1 Socket Body Housing..............................................................................16

2.3.2 Solder Balls...........................................................................................16

2.3.3 Contacts ...............................................................................................17

2.3.4 Pick and Place Cover...............................................................................17

2.4 Package Installation / Removal ......... ..................................................................18

2.4.1 Socket Standoffs and Package Seating Plane..............................................18

2.5 Durability.........................................................................................................19

2.6 Markings..........................................................................................................19

2.7 Component Insertion Forces ...............................................................................19

2.8 Socket Size ......................................................................................................19

2.9 LGA1366 Socket NCTF Solder Joints.....................................................................20

3 Independent Loading Mechanism (ILM)...................................................................21

3.1 Design Concept.................................................................................................21

3.1.1 ILM Cover Assembly Design Overview.......................................................21

3.1.2 ILM Back Plate Design Overview...............................................................22

3.2 Assembly of ILM to a Motherboard.......................................................................23

4 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications .27

4.1 Component Mass...............................................................................................27

4.2 Package/Socket Stackup Height ..........................................................................27

4.3 Socket Maximum Temperature............................................................................27

4.4 Loading Specifications.................................... .. .. .. ......................... .. .. .................28

4.5 Electrical Requirements......................................................................................28

4.6 Environmental Requirements .................................................................. ............29

5Thermal Solutions...................................................................................................31

5.1 Performance Targets..........................................................................................31

5.1.1 25.5 mm Tall Heatsink............................................................................33

5.2 Heat Pipe Considerations....................................................................................34

5.3 Assembly .........................................................................................................35

5.3.1 Thermal Interface Material (TIM)..............................................................36

5.4 Structural Considerations ...................................................................................36

5.5 Thermal Design.................................................................................................36

5.5.1 Thermal Characterization Parameter.........................................................36

5.5.2 Dual Thermal Profile ...............................................................................37

5.6 Thermal Features..............................................................................................38

5.6.1 Fan Speed Control..................................................................................39

5.6.2 PECI Averaging and Catastrophic Thermal Management...............................40

5.6.3 Intel® Turbo Boost Technology................................................................40

5.7 Thermal Guidance .............................................................................................40

5.7.1 Thermal Excursion Power for 95 W Processor .............................................40

5.7.2 Thermal Excursion Power for 80 W Processor .............................................41

5.7.3 Absolute Processor Temperature ..............................................................41

Thermal/Mechanical Design Guide 3

6 Quality and Reliability Requirements .......................................................................43

6.1 Test Conditions .................................................................................................43

6.2 Intel Reference Component Validation ..................................................................45

6.2.1 Board Functional Test Sequence ...............................................................45

6.2.2 Post-Test Pass Criteria.............................................................................45

6.2.3 Recommended BIOS/Processor/Memory Test Procedures .............................46

6.3 Material and Recycling Requirements....................................................................46

A Component Su ppliers...............................................................................................47

A.1 Intel Enabled Supplier Information.......................................................................47

A.1.1 Intel Reference Thermal Solution..............................................................47

A.1.2 Intel Collaboration Thermal Solution..........................................................47

A.1.3 Alternative Thermal Solution ....................................................................48

A.1.4 Socket and ILM Components....................................................................49

B Mechanical Drawings ...............................................................................................51

C Socket Mechanical Drawings....................................................................................79

D Heatsink Load Metrology..........................................................................................85

E Embedded Thermal Solutions...................................................................................87

E.1 Performance Targets.................................................. ........................................87

E.2 Thermal Design Guidelines................................ .. ........................... .. ...................88

E.2.1 NEBS Thermal Profile ..............................................................................88

E.2.2 Custom Heat Sinks For UP ATCA...............................................................89

E.3 Mechanical Drawings and Supplier Information......................................................92

F Processor Installation Tool ......................................................................................97

Figures

1-1 Intel® Xeon® 5500 Platform Socket Stack................................................................... 9

2-1 LGA1366 Socket with Pick and Place Cover Removed ....................................................13

2-2 LGA1366 Socket Contact Numbering (Top View of Socket).............................................14

2-3 LGA1366 Socket Land Pattern (Top View of Board) .......................................................15

2-4 Attachment to Motherboard .......................................................................................16

2-5 Pick and Place Cover.................................................................................................17

2-6 Package Installation / Removal Features......................................................................18

2-7 LGA1366 NCTF Solder Joints......................................................................................20

3-1 ILM Cover Assembly ................... .. ................................................... .. .. .. ...................22

3-2 Back Plate ...............................................................................................................23

3-3 ILM Assembly .................... ......................... .. .. .......................... .. .. ......................... ..24

3-4 Pin1 and ILM Lever...................................................................................................25

4-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology .................................30

5-1 1U Heatsink Performance Curves.................................... .. ..........................................32

5-2 TTV Die Size and Orientation......................................................................................34

5-3 1U Reference Heatsink Assembly................................................................................35

5-4 Processor Thermal Characterization Parameter Relationships..........................................37

5-5 Dual Thermal Profile .................................................................................................38

6-1 Example Thermal Cycle - Actual profile will vary ...........................................................45

B-1 Board Keepin / Keepout Zones (Sheet 1 of 4)...............................................................52

B-2 Board Keepin / Keepout Zones (Sheet 2 of 4)...............................................................53

B-3 Board Keepin / Keepout Zones (Sheet 3 of 4)...............................................................54

B-4 Board Keepin / Keepout Zones (Sheet 4 of 4)...............................................................55

B-5 1U Reference Heatsink Assembly (Sheet 1 of 2) ...........................................................56

B-6 1U Reference Heatsink Assembly (Sheet 2 of 2) ...........................................................57

4 Thermal/Mechanical Design Guide

B-7 1U Reference Heatsink Fin and Base (Sheet 1 of 2) ......................................................58

B-8 1U Reference Heatsink Fin and Base (Sheet 2 of 2) ......................................................59

B-9 Heatsink Shoulder Screw (1U, 2U and Tower)..............................................................60

B-10Heatsink Compression Spring (1U, 2U and Tower)........................................................61

B-11Heatsink Retaining Ring (1U, 2U and Tower) ...............................................................62

B-12Heatsink Load Cup (1U, 2U and Tower).......................................................................63

B-132U Collaborative Heatsink Assembly (Sheet 1 of 2).......................................................64

B-142U Collaborative Heatsink Assembly (Sheet 2 of 2).......................................................65

B-152U Collaborative Heatsink Volumetric (Sheet 1 of 2).....................................................66

B-162U Collaborative Heatsink Volumetric (Sheet 2 of 2).....................................................67

B-17Tower Collaborative Heatsink Assembly (Sheet 1 of 2)..................................................68

B-18Tower Collaborative Heatsink Assembly (Sheet 2 of 2)..................................................69

B-19Tower Collaborative Heatsink Volumetric (Sheet 1 of 2) ................................................70

B-20Tower Collaborative Heatsink Volumetric (Sheet 2 of 2) ................................................71

B-211U Reference Heatsink Assembly with TIM (Sheet 1 of 2)..............................................72

B-221U Reference Heatsink Assembly with TIM (Sheet 2 of 2)..............................................73

B-232U Reference Heatsink Assembly with TIM (Sheet 1 of 2)..............................................74

B-242U Reference Heatsink Assembly with TIM (Sheet 2 of 2)..............................................75

B-25Tower Reference Heatsink Assembly with TIM (Sheet 1 of 2) .................. .. .. ...................76

B-26Tower Reference Heatsink Assembly with TIM (Sheet 2 of 2) .................. .. .. ...................77

C-1 Socket Mechanical Drawing (Sheet 1 of 4)...................................................................80

C-2 Socket Mechanical Drawing (Sheet 2 of 4)...................................................................81

C-3 Socket Mechanical Drawing (Sheet 3 of 4)...................................................................82

C-4 Socket Mechanical Drawing (Sheet 4 of 4)...................................................................83

D-1 Intel® Xeon® Processor 5500 Series Load Cell Fixture.................................................. 86

E-1 ATCA Heatsink Performance Curves............................................................................88

E-2 NEBS Thermal Profile................................................................................................89

E-3 UP ATCA Thermal Solution......... .. .. .......................... .. .. ......................... .. ...................90

E-4 UP ATCA System Layout ............................ .. ......................... ... .. ......................... .. .. ..90

E-5 UP ATCA Heat Sink Drawing ......................................................................................91

E-6 ATCA Reference Heat Sink Assembly (Sheet 1 of 2)......................................................93

E-7 ATCA Reference Heat Sink Assembly (Sheet 2 of 2)......................................................94

E-8 ATCA Reference Heatsink Fin and Base (Sheet 1 of 2)...................................................95

E-9 ATCA Reference Heatsink Fin and Base (Sheet 2 of 2)...................................................96

F-1 Processor Installation Tool.............................. .. .. ... ........................... .. .. .. ...................98

Thermal/Mechanical Design Guide 5

Tables

1-1 Reference Documents ......................................................... .. .......................... .. ........10

1-2 Terms and Descriptions.............................................................................................10

4-1 Socket Component Mass............................................................................................27

4-2 1366-land Package and LGA1366 Socket Stackup Height ...............................................27

4-3 Socket and ILM Mechanical Specifications ....................................................................28

4-4 Electrical Requirements for LGA1366 Socket ................................................................29

5-1 Boundary Conditions and Performance Targets.............................................................31

5-2 Performance Expectations for 25.5 mm Tall Heatsink.....................................................33

5-3 Fan Speed Control, TCONTROL and DTS Relationship ....................................................39

5-4 T

CONTROL

6-1 Heatsink Test Conditions and Qualification Criteria........................................................43

A-1 Suppliers for the Intel Reference Thermal Solution........................................................47

A-2 Suppliers for the Intel Collaboration Thermal Solution ...................................................48

A-3 Suppliers for the Alternative Thermal Solution..............................................................48

A-4 LGA1366 Socket and ILM Components ........................................................................49

B-1 Mechanical Drawing List ............................................................................................51

C-1 Mechanical Drawing List ............................................................................................79

E-1 Boundary Conditions and Performance Targets.............................................................87

E-2 Embedded Heatsink Component Suppliers ...................................................................92

E-3 Mechanical Drawings List...........................................................................................92

Guidance ............. ......................... .. ......................... ... ......................... .. ....39

6 Thermal/Mechanical Design Guide

Revision History

Document Number Revision Number Description Revision Date

321323 001 Public Release March 2009

Thermal/Mechanical Design Guide 7

8 Thermal/Mechanical Design Guide

Introduction

1 Introduction

This document provides guidelines for the design of thermal and mechanical solutions for 2-socket server and 2-socket Workstation processors in the Intel® Xeon® 5500 Platform. The processors covered include those listed in the Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 and the follow-on processors. The design guidelines apply to the follow-on processors in their current stage of development and are not expected to change as they mature. The components described in this document include:

• The processor thermal solution (heatsink) and associated retention hardware.

• The LGA1366 socket and the Independent Loading Mechanism (ILM) and back plate.

Processors in 1-socket Workstation platforms are covered in the Intel® Xeon® Processor 3500 Series Thermal/Mechanical Design Guide.

Figure 1-1. Intel® Xeon® 5500 Platform Socket Stack

Heatsink

Socket and IL M

Back Plate

The goals of this document are:

• To assist board and system thermal mechanical designers.

• To assist designers and suppliers of processor heatsinks.

Thermal profiles and other processor specifications are provided in the Datasheet.

Thermal/Mechanical Design Guide 9

1.1 References

Material and concepts available in the following documents may be beneficial when reading this document.

Table 1-1. Reference Documents

Document Location Notes

European Blue Angel Recycling Standards 2 Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 321321 1 Intel® Xeon® Processor 5500 Series Mechanical Model 321326 1 Intel® Xeon® Processor 5500 Series Thermal Model 321327 1 Entry-level Electronics Bay Specification 3

Notes:

1. Document numbers indicated in Location column are subject to change. See the appropriate Electronic Design Kit (EDK) for the most up-to-date Document number.

2. Available at http://www.blauer-engel.de

3. Available at http://ssiforum.oaktree.com/

Introduction

1.2 Definition of Terms

Table 1-2. Terms and Descriptions (Sheet 1 of 2)

Term Description

Bypass Bypass is the area between a passive heatsink and any object that can act to form a

DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC

FSC Fan Speed Control IHS Integrated Heat Spreader: a component of the processor pac k age used to enhance the

ILM Independent Loading Mechanism provides the force needed to seat the 1366-LGA land

LGA1366 socket The processor mates with the system board through this surface mount, 1366-contact

PECI The Platform Environment Control Interface (PECI) is a one- wire in terface that pro vides

CASE

CASE_MAX

TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature

duct. For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface.

activation temperature.

thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface.

package onto the socket contacts.

socket.

a communication channel between Intel processor and chipset components to external monitoring devices.

Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance using t otal package power. Defined as (T Package Power. Heat source should always be specified for Ψ measurements.

Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package po wer. Defined as (T Package Power.

Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (T

The case temperature of the processo r measured at the geom etric ce nter of the t opside of the IHS.

The maximum case temperature as specified in a component specification.

by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits.

– TLA) / Total

CASE

– TS) / Total

CASE

– TLA) / Total Package Power.

10 Thermal/Mechanical Design Guide

Introduction

Table 1-2. Terms and Descriptions (Sheet 2 of 2)

Term Description

CONTROL

TDP Thermal Design Power: Thermal solution should be designed to dissipate this target

Thermal Monitor A power reduction feature designed to decrease temperature after the processor has

Thermal Profile Line that defines case temperature specification of a processor at a given power level. TIM Thermal Interface Material: The thermally conductive compound between the heatsink

U A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U

T control.

power level. TDP is not the maximum power that the processor can dissipate.

reached its maximum operating temperature.

and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink.

The measured ambient temperature locally surrounding the proces sor. The ambient temperature should be measured just upstream of a p assive he atsink or at the fan inle t for an active heatsink.

The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets.

equals 3.50 in, etc.

is a static value below TCC activation used as a trigger point for fan speed

CONTROL

Thermal/Mechanical Design Guide 11

Introduction

12 Thermal/Mechanical Design Guide

LGA1366 Socket

2 LGA1366 Socket

This chapter describes a surface mount, LGA (Land Grid Array) socket intended for processors in the Intel® Xeon® 5500 Platform. The socket provides I/O, power and ground contacts. The socket contains 1366 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard.

The socket has 1366 contacts with 1.016 mm X 1.016 mm pitch (X by Y) in a 43x41 grid array with 21x17 grid depopulation in the center of the array and selective depopulation elsewhere.

The socket must be compatible with the package (processor) and the Independent Loading Mechanism (ILM). The design includes a back plate which is integral to having a uniform load on the socket solder joints. Socket loading specifications are listed in

Chapter 4.

Figure 2-1. LGA1366 Socket with Pick and Place Cover Removed

package socket

package

cavity

socket

Thermal/Mechanical Design Guide 13

Figure 2-2. LGA1366 Socket Contact Numbering (Top View of Socket)

31 29 27 25 23 21 19 17 15 13 11 9 7 5

32 30 28 26 24 22 20 18 16 14 12 10 8 6 4

LGA1366 Socket

43 41 39 37 35 33 31 29 27 25 23 21 19 17 15 13

42 40 38 36 34 32 30 28 26 24 22 20 18 16 14 12

14 Thermal/Mechanical Design Guide

LGA1366 Socket

2.1 Board Layout

The land pattern for the LGA1366 socket is 40 mils X 40 mils (X by Y), and the pad size is 18 mils. Note that there is no round-off (conversion) error between socket pitch (1.016 mm) and board pitch (40 mil) as these values are equivalent.

Figure 2-3. LGA1366 Socket Land Pattern (Top View of Board)

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY

Thermal/Mechanical Design Guide 15

2.2 Attachment to Motherboard

The socket is attached to the motherboard by 1366 solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, and so on) to attach the socket.

As indicated in Figure 2-4, the Independent Loading Mechanism (ILM) is not present during the attach (reflow) process.

Figure 2-4. Attachment to Motherboard

LGA1366 Socket

ILM

LGA 1366 Socket

2.3 Socket Components

The socket has two main components, the socket body and Pick and Place (PnP) cover, and is delivered as a single integral assembly. Refer to Appendix C for detailed drawings.

2.3.1 Socket Body Housing

The housing material is thermoplastic or equivalent with UL 94 V -0 flame rating capable of withstanding 260 °C for 40 seconds (typical reflow/rework). The socket coefficient of thermal expansion (in the XY plane), and creep properties, must be such that the integrity of the socket is maintained for the conditions listed in the LGA1366 Socket Validation Re ports.

The color of the housing will be dark as compared to the solder balls to provide the contrast needed for pick and place vision systems.

2.3.2 Solder Balls

A total of 1366 solder balls corresponding to the contacts are on the bottom of the socket for surface mounting with the motherboard.

The socket has the following solder ball material:

• Lead free SAC (SnAgCu) solder alloy with a silver (Ag) content between 3% and 4% and a melting temperature of approximately 217 °C. The alloy must be compatible with immersion silver (ImAg) motherboard surface finish and a SAC alloy solder paste.

16 Thermal/Mechanical Design Guide

LGA1366 Socket

The co-planarity (profile) and true position requirements are defined in Appendix C.

2.3.3 Contacts

Base material for the contacts is high strength copper alloy. For the area on socket contacts where processor lands will mate, there is a 0.381 μm

[15 μinches] minimum gold plating over 1.27 μm [50 μinches] minimum nickel underplate.

No contamination by solder in the contact area is allowed during solder reflow.

2.3.4 Pick and Place Cover

The cover provides a planar surface for vacuum pick up used to place components in the Surface Mount Technology (SMT) manufacturing line. The cover remains on the socket during reflow to help prevent contamination during reflow. The cover can withstand 260 °C for 40 seconds (typical reflow/rework profile) and the conditions listed in the LGA1366 Socket Validation Reports without degrading.

As indicated in Figure 2-5, the cover remains on the socket during ILM installation, and should remain on whenever possible to help prevent damage to the socket contacts.

Cover retention must be sufficient to support the socket weight during lifting, translation, and placement (board manufacturing), and during board and system shipping and handling.

The covers are designed to be interchangeable between socket suppliers. As indicated in Figure 2-5, a Pin1 indicator on the cover provides a visual reference for proper orientation with the socket.

Figure 2-5. Pick and Place Cover

ILM

Installation

Pin 1 Pin 1

Thermal/Mechanical Design Guide 17

Pick and

Place Cover

2.4 Package Installation / Removal

As indicated in Figure 2-6, access is provided to facilitate manual installation and removal of the package.

To assist in package orientation and alignment with the socket:

• The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for proper orientation.

• The package substrate has orientation notches along two opposing edges of the package, offset from the centerline. The socket has two corresponding orientation posts to physically prevent mis-orientation of the package. These orientation features also provide initial rough alignment of package to socket.

• The socket has alignment walls at the four corners to provide final alignment of the package.

See Appendix F for information regard ing a tool designed to provide mechanical

Figure 2-6. Package Installation / Removal Features

assistance during processor installation and removal.

LGA1366 Socket

orientation

orientation notch

notch

alignment

Pin1 triangle

access

orientation

orientation post

post

Pin1 chamfer

alignment walls

walls

2.4.1 Socket Standoffs and Package Seating Plane

Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are specified in Appendix C.

Similarly, a seating plane on the topside of the socket establishes the minimum package height. See Section 4.2 for the calculated IHS height above the motherboard.

18 Thermal/Mechanical Design Guide

LGA1366 Socket

2.5 Durability

The socket must withstand 30 cycles of processor insertion and removal. The max chain contact resistance from Table 4-4 must be met when mated in the 1st and 30th cycles.

The socket Pick and Place cover must withstand 15 cycles of insertion and removal.

2.6 Markings

There are three markings on the socket:

• LGA1366: Font type is Helvetica Bold - minimum 6 point (2.125 mm).

• Manufacturer's insignia (font size at supplier's discretion).

• Lot identification code (allows traceability of manufacturing date and location).

All markings must withstand 260 °C for 40 seconds (typical reflow/rework profile) without degrading, and must be visible after the socket is mounted on the motherboard.

LGA1366 and the manufacturer's insignia are molded or laser marked on the side wall.

2.7 Component Insertion Forces

Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/ Human Factors Engineering of Semiconductor Manu facturing Equipment, example Table R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force to insert the package into the socket.

2.8 Socket Size

Socket information needed for motherboard design is given in Appendix C. This information should be used in conjunction with the reference motherboard keep-

out drawings provided in Appendix B to ensure compatibility with the reference thermal mechanical components.

Thermal/Mechanical Design Guide 19

2.9 LGA1366 Socket NCTF Solder Joints

Intel has defined selected solder joints of the socket as non-critical to function (NCTF) for post environmental testing. The processor signals at NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality. Figure 2-7

Figure 2-7. LGA1366 NCTF Solder Joints

identifies the NCTF solder joints.

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY

LGA1366 Socket

Note: For platforms supporting the DP processor land C3 is CTF.

20 Thermal/Mechanical Design Guide

Independent Loading Mechanism (ILM)

3 Independent Loading

Mechanism (ILM)

The Independent Loading Mechanism (ILM) provides the force needed to seat the 1366-LGA land package onto the socket contacts. The ILM is physically separate from the socket body. The assembly of the ILM to the board is expected to occur after wave solder. The exact assembly location is dependent on manufacturing preference and test flow.

Note: The ILM has two critical functions: deliver the force to seat the processor onto the

socket contacts and distribute the resulting compressive load evenly through the socket solder joints.

Note: The mechanical design of the ILM is integral to the overall functionality of the LGA1366

socket. Intel performs detailed studies on integration of processor package, socket and ILM as a system. These studies directly impact the design of the ILM. The Intel reference ILM will be “build to print” from Intel controlled drawings. Intel recommends using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from Intel's detailed studies and may not incorporate critical design parameters.

3.1 Design Concept

The ILM consists of two assemblies that will be procured as a set from the enabled vendors. These two components are ILM cover assembly and back plate.

3.1.1 ILM Cover Assembly Design Overview

The ILM Cover assembly consists of four major pieces: load lever, load plate, frame and the captive fasteners.

The load lever and load plate are stainless steel. The frame and fasteners are high carbon steel with appropriate plating. The fasteners are fabricated from a high carbon steel. The frame provides the hinge locations for the load lever and load plate.

The cover assembly design ensures that once assembled to the back plate and the load lever is closed, the only features touching the board are the captive fasteners. The nominal gap of the frame to the board is ~1 mm when the load plate is closed on the empty socket or when closed on the processor package.

When closed, the load plate applies two point loads onto the IHS at the “dimpled” features shown in Figure 3-1. The reaction force from closing the load plate is transmitted to the frame and through the captive fasteners to the back plate. Some of the load is passed through the socket body to the board inducing a slight compression on the solder joints.

Thermal/Mechanical Design Guide 21

Figure 3-1. ILM Cover Assembly

Load Lever

Load Plate

Independent Loading Mechanism (IL M )

Captive Fastener (4x)

Frame

3.1.2 ILM Back Plate Design Overview

The unified back plate for 2-socket server and 2-socket Workstation products consists of a flat steel back plate with threaded studs for ILM attach, and internally threaded nuts for heatsink attach. The threaded studs have a smooth surface feature that provides alignment for the back plate to the motherboard for proper assembly of the ILM around the socket. A clearance hole is located at the center of the plate to allow access to test points and backside capacitors. An additional cut-out on two sides provides clearance for backside voltage regulator components. An insulator is preapplied.

Back plates for processors in 1-socket Workstation platforms are covered in the Intel® Xeon® Processor 3500 Series Thermal/Mechanical Design Guide.

22 Thermal/Mechanical Design Guide

Independent Loading Mechanism (ILM)

Figure 3-2. Back Plate

Threaded studs

Clearance hole

Threaded nuts

3.2 Assembly of ILM to a Motherboard

The ILM design allows a bottoms up assembly of the components to the board. In step 1, (see Figure 3-3), the back plate is placed in a fixture. Holes in the motherboard provide alignment to the threaded studs. In step 2, the ILM cover assembly is placed over the socket and threaded studs. Using a T20 Torx* driver fasten the ILM cover assembly to the back plate with the four captive fasteners. Torque to 8 ± 2 inchpounds. The length of the threaded studs accommodate board thicknesses from

0.062” to 0.100”.

Thermal/Mechanical Design Guide 23

Figure 3-3. ILM Assembly

Independent Loading Mechanism (IL M )

Step 1: W ith so c k et b ody reflowe d on

Step 1: W ith so c k et b ody reflowe d on board, and back plate in fixture, align

board, and back plate in fixture, align board holes to back plate studs.

board holes to back plate studs.

Step 2: With back plate against bottom of

Step 2: With back plate against bottom of board, align ILM cover assembly to back

board, align ILM cover assembly to back plate studs.

plate studs.

24 Thermal/Mechanical Design Guide

Independent Loading Mechanism (ILM)

As indicated in Figure 3-4, socket protrusion and ILM key features prevent 180-degree rotation of ILM cover assembly with respect to the socket. The result is a specific Pin 1 orientation with respect to the ILM lever.

Figure 3-4. Pin1 and ILM Lever

Protrusion

ILM Key

ILM Lever

Pin 1

Thermal/Mechanical Design Guide 25

Independent Loading Mechanism (IL M )

26 Thermal/Mechanical Design Guide

LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications

4 LGA1366 Socket and ILM

Electrical, Mechanical, and Environmental Specifications

This chapter describes the electrical, mechanical, and environmental specifications for the LGA1366 socket and the Independent Loading Mechanism.

4.1 Component Mass

Table 4-1. Socket Component Mass

Component Mass

Socket Body, Contacts and PnP Cover 15 gm ILM Cover 43 gm ILM Back Plate for dual processor server products 100 gm

4.2 Package/Socket Stackup Height

Table 4-2 provides the stackup height of a processor in the 1366-land LGA package and

LGA1366 socket with the ILM closed and the processor fully seated in the socket.

Table 4-2. 1366-land Package and LGA1366 Socket Stackup Height

Integrated Stackup Height (mm) From Top of Board to Top of IHS

Notes:

1. This data is provided for information only , and shou ld be deri v ed from: (a) the h eight of the s ocke t seating plane above the motherboard after reflow, given in Appendix C, (b) the height of the package, from the package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that are given in the corresponding processor EMTS.

2. This value is a RSS calculation.

7.729 ± 0.282 mm

4.3 Socket Maximum Temperature

The power dissipated within the socket is a function of the current at the pin level and the effective pin resistance. To ensure socket long term reliability, Intel defines socket maximum temperature using a via on the underside of the motherboard. Exceeding the temperature guidance may result in socket body deformation, or increases in thermal and electrical resistance which can cause a thermal runaway and eventual electrical failure. The guidance for socket maximum temperature is listed below:

• Via temperature under socket < 96 °C

Thermal/Mechanical Design Guide 27

LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications

4.4 Loading Specifications

The socket will be tested against the conditions listed in the LGA1366 Socket Validation Reports with heatsink and the ILM attached, under the loading conditions outlined in this chapter.

Table 4-3 provides load specifications for the LGA1366 socket with the ILM installed.

The maximum limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Exceeding these limits during test may result in component failure. The socket body should not be used as a mechanical reference or load-bearing surface for thermal solutions.

Table 4-3. Socket and ILM Mechanical Specifications

Parameter Min Max Notes

Static compressive load from ILM cover to processor IHS

Heatsink Static Compressive Load 0 N [0 lbf] 266 N [60 lbf] 1, 2, 3 Total Static Compressive Load

(ILM plus Heatsink) Dynamic Compressive Load

(with heatsink installed) Pick and Place Cover Insertion / Removal force N/A 10.2 N [2.3 lbf] Load Lever actuation force N/A 38.3 N [8.6 lbf] in the

470 N [106 lbf] 623 N [140 lbf] 3, 4

470 N (106 lbf) 890 N (200 lbf) 3, 4

N/A 890 N [200 lbf] 1, 3, 5, 6

vertical direction

10.2 N [2.3 lbf] in the lateral direction.

Notes:

1. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface.

2. This is the minimum and maximum static force that can be applied by the heatsink and it’s retention solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated to these limits.

3. Loading limits are for the LGA1366 socket.

4. This minimum limit defines the compress ive forc e required to electrically seat the processor onto the sock et contacts.

5. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement.

6. T est condition used a heatsink mass of 550 gm [1.21 lb] with 50 g acceler ation measured at heatsi nk mass. The dynamic portion of this specification in the product application can have flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this dynamic load.

4.5 Electrical Requirements

LGA1366 socket electrical requirements are measured from the socket-seating plane of the processor to the component side of the socket PCB to which it is attached. All specifications are maximum values (unless otherwise stated) for a single socket contact, but includes effects of adjacent contacts where indicated.

28 Thermal/Mechanical Design Guide

LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications

Table 4-4. Electrical Requirements for LGA1366 Socket

Parameter Value Comment

Mated loop inductance, Loop

Mated partial mutual inductance, L

Maximum mutual capacitance, C. Socket Average Contact R esistance

(EOL)

Max Individual Contact Resistance (EOL)

Bulk Resistance Increase

Dielectric Withstand Voltage Insulation Resistance

<3.9nH

<1 pF

15.2 mΩ

≤ 100 mΩ

≤ 3 mΩ

360 Volts RMS

800 MΩ

The inductance calculated for two contacts, considering one forward conductor an d one return conductor. These values must be satisfied at the worst-case height of the socket.

The inductance on a contact due to any single neighboring contact.

The capacitance between two contacts The socket average contact resistance target is

derived from average of every chain contact resistance for each part used in testing, with a chain contact resistance defined as the resistance of each chain minus resistance of shorting bars divided by number of lands in the daisy chain.

The specification listed is at room temperature and has to be satisfied at all time.

Socket Contact Resistance: The resistance of the socket contact, solderball, and interface resistance to the interposer land.

The specification listed is at room temperature and has to be satisfied at all time.

Socket Contact Resistance: The resistance of the socket contact, solderball, and interface resistance to the interposer land; gaps included.

The bulk resistance increase per contact from 24 °C to 107 °C

4.6 Environmental Requirements

Design, including materials, shall be consistent with the manufacture of units that meet the following environmental reference points.

The reliability targets in this chapter are based on the expected field use environment for these products. The test sequence for new sockets will be developed using the knowledge-based reliability evaluation methodology, which is acceleration factor dependent. A simplified process flow of this methodology can be seen in Figure 4-1.

Thermal/Mechanical Design Guide 29

LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications

Figure 4-1. Flow Chart of Knowledge-Based Reliability Evaluation Methodology

Establish the market/expected use environment for the technology

Develop Speculative stress conditions based on historical data, content experts, and literature search

Freeze stressing requirements and perform additional data turns

Perform stressing to validate accelerated stressing assumptions and determine acceleration factors

A detailed description of this methodology can be found at:

ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf.

30 Thermal/Mechanical Design Guide

Thermal Solutions

5 Thermal Solutions

This section describes a 1U reference heatsink, design targets for 2U and Tower heatsinks, performance expectations for a 25.5 mm tall heatsink, and thermal design guidelines for Intel® Xeon® Processor 5500 Series and the follow-on processors.

5.1 Performance Targets

Table 5-1 provides boundary conditions and performance targets for 1U, 2U and T ower

heatsinks. These values are used to generate processor thermal specifications and to provide guidance for heatsink design.

Table 5-1. Boundary Conditions and Performance Targets

Parameter Value

Altitude, system ambient temp

TDP 60W 80W 95W, Profile B 95W, Profile A 130W, WS

Airflow

System height (form factor)

Heatsink volumetric

Heatsink technology

49oC49

0.335oC/W 0.336oC/W 0.337oC/W 0.201oC/W 0.201oC/W

9.7 CFM @

0.20” dP 1U (EEB) 1U (EEB) 1U (EEB)

C49

9.7 CFM @

0.20” dP

90 x 90 x 27mm (1U)

Cu base, Al fins Cu/Al base, Al fins with heatpipes

Sea level, 35

C55

9.7 CFM @

0.20” dP

C40

30 CFM @

0.205” dP

2U (EEB) Pedestal (EEB)

90 x 90 x 64mm

6,7

(2U)

30 CFM @

0.205” dP

90 x 90 x 99mm

(Tower)

Notes:

1. Local ambient temperature of the air entering the heatsink.

2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (Section 5.5.1).

3. Airflow through the heatsink fins with zero bypass. Max target for pr essure drop (dP) measured in inc hes H

4. Reference system configuration . Processor is downstream from memory in EEB (Entry-L evel Electronics Bay). Ducting is utilized to direct airflow.

5. The 1U heatsink can also meet Profile B for the 95W processor in TEB (Thin Electronics Bay) under the following conditions: TLA = 40ºC, ΨCA = 0.275ºC/W, airflow = 16 CFM @ 0.344” dP (these TEB values are not used to generate processor thermal specifications). Processor is not downstream from memory in TEB. Ducting is utilized to direct airflow.

6. Dimensions of heatsink do not include socket or processor.

7. The 2U heatsink height (64mm) + socket/processor height (7.729 mm, Table 4-2) complies with 76.2 mm max height for EEB monoplanar boards (http://ssiforum.oaktree.com/

8. Passive heatsinks. PCM45F thermal interface material.

9. WS = Workstation.

Thermal/Mechanical Design Guide 31

For 1U reference heatsink, see Appendix B for detailed drawings. Table 5-1 specifies

and pressure drop targets at 9.7 CFM. Figure 5-1 shows ΨCA and pressure drop for

the 1U heatsink versus the airflow provided. Best-fit equations are provided to prevent errors associated with reading the graph.

Figure 5-1. 1U Heatsink Performance Curves

Thermal Solutions

For 2U and Tower heatsink, see Appendix B for volumetric dr awings. Table 5-1 specifies

and pressure drop targets at 30 CFM. At airflows other than 30 CFM, ΨCA and

pressure drop will differ between suppliers as their heatpipe and fin geometries will vary.

32 Thermal/Mechanical Design Guide

Thermal Solutions

5.1.1 25.5 mm Tall Heatsink

For the 25.5 mm tall heatsink, Table 5-2 provides guidance regarding performance expectations. These values are not used to generate processor thermal specifications.

Table 5-2. Performance Expectations for 25.5 mm Tall Heatsink

Parameter Value

Altitude, system ambient temp

Sea level, 35

TDP 95W, Profile B

Airflow System height

(form factor) Heatsink

volumetric Heatsink

technology

Notes:

1. Local ambient temperature of the air entering the heatsink.

2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (Section 5.5.1).

3. Airflow through the heatsink fins with zero bypass. Max target for pr essure drop (dP) measured in inc hes H

4. Reference system configuration. Processor is downstream from memory in SSI blade and EEB (Entry-Level

5. Dimensions of he atsink do not include socket or pr oce ssor. The 25.5 mm heatsi nk height + socket /processo r

6. Passive heatsinks. Dow Corning TC-1996 thermal interface material.

Electronics Bay), not in TEB (Thin Electronics Bay). Ducting is utilized to direct airflow. height (7.729 mm, Table 4-2) complies with 33.5mm max height for SSI blade boards

(http://ssiforum.oaktree.com/

13.3 CFM @ 0.334” dP 10 CFM @ 0.210” dP 16 CFM @ 0.354” dP

50oC49

0.287oC/W 0.337oC/W 0.275oC/W

SSI blade 1U (EEB) 1U (TEB)

90 x 90 x 25.5mm (1U)

Cu base, Al fins

C40

Thermal/Mechanical Design Guide 33

5.2 Heat Pipe Considerations

Figure 5-2 shows the orientation and position of the TTV die. The TTV die is sized and

positioned similarly to the processor die.

Figure 5-2. TTV Die Size and Orientation

Figure 1 - Side Views of Package with IHS (not to scale)

Cache Cache Cache Cache

Cache

Die CL

Package CL

1.0

Core

Core 1

Core 2

Thermal Solutions

13.2

Core 4

Core 3

Uncore

42.5

19.3

NOT TO SCALE

All Dimensions in mm

34 Thermal/Mechanical Design Guide

Thermal Solutions

5.3 Assembly

Figure 5-3. 1U Reference Heatsink Assembly

1U Reference Heatsink

Captive Screw

Thermal Interface Material:

Thermal Interface Material: Honeywell PCM45F

Honeywell PCM45F

IHS: Integrated

IHS: Integrated Heat Spreader

Heat Spreader

Threaded Nut

Reference Back Plate

Reference Back Plate (Unified Back Plate)

(Unified Back Plate)

The assembly process for the 1U reference heatsink begins with application of Honeywell PCM45F thermal interface material to improve conduction from the IHS. Tape and roll format is recommended. Pad size is 35 x 35mm, thickness is 0.25mm.

Next, position the heatsink such that the heatsink fins are parallel to system airflow. While lowering the heatsink onto the IHS, align the four captive screws of the heatsink to the four threaded nuts of the back plate.

Using a #2 Phillips driver, torque the four captive screws to 8 inch-pounds. This assembly process is designed to produce a static load of 39 - 51 lbf, for 0.062" -

0.100" board thickness respectively. Honeywell PCM45F is expected to meet the

performance targets in Table 5-1 from 30 - 60 lbf. From Table 4-3, the Heatsink Static Compressive Load of 0 - 60 lbf allows for designs that v ary from the 1U reference heatsink. Example: A customer’s unique heatsink with very little static load (as little as 0 lbf) is acceptable from a socket loading perspective as long as the T is met.

Compliance to Board Keepout Zones in Appendix B is assumed for this assembly process.

specification

CASE

Thermal/Mechanical Design Guide 35

5.3.1 Thermal Interface Material (TIM)

TIM should be verified to be within its recommended shelf life before use. Surfaces should be free of foreign materials prior to application of TIM. Use isopropyl alcohol and a lint free cloth to remove old TIM before applying new TIM.

5.4 Structural Considerations

Mass of the 1U reference heatsink and the target mass for 2U and Tower heatsinks does not exceed 500 gm.

From Table 4-3, the Dynamic Compressive Load of 200 lbf max allows for designs that exceed 500 gm as long as the mathematical product does not exceed 200 lbf. Example: A heatsink of 2-lb mass (908 gm) x 50 g (acceleration) x 2.0 Dynamic Amplification Factor = 200 lbf. The Total Static Compressive Load (Table 4-3) should also be considered in dynamic assessments.

The heatsink limit of 500 gm and use of back plate have eliminated the need for Direct Chassis Attach retention (as used previously with the Intel® Xeon® processor 5000 sequence). Direct contact between back plate and chassis pan will help minimize board deflection during shock.

Thermal Solutions

Placement of board-to-chassis mounting holes also impacts board deflection and resultant socket solder ball stress. Customers need to assess shock for their designs as their heatsink retention (back plate), heatsink mass and chassis mounting holes may vary.

5.5 Thermal Design

5.5.1 Thermal Characterization Parameter

The case-to-local ambient Thermal Characterization Parameter (ΨCA) is defined by:

Equation 5-1.Ψ

Where:

Equation 5-2.Ψ

Where:

= (T

CASE

TDP = TDP (W) assumes all power dissipates through the integrated heat

= ΨCS + ΨSA

CASE

- TLA) /

TDP

= Processor case temperature (°C). For T

appropriate Datasheet.

= Local ambient temperature in chassis at processor (°C).

spreader. This inexact assumption is convenient for heatsink design. TTVs are often used to dissipate TDP. Correction offsets account for differences in temperature distribution between processor and TTV.

= Thermal characterization parameter of the TIM (°C/W) is dependent

on the thermal conductivity and thickness of the TIM.

= Thermal characterization parameter from heatsink-to-local ambient

(°C/W) is dependent on the thermal conductivity and geometry of the heatsink and dependent on the air velocity through the heatsink fins.

specification see the

CASE

Figure 5-4 illustrates the thermal characterization parameters.

36 Thermal/Mechanical Design Guide

Thermal Solutions

Figure 5-4. Processor Thermal Characterization Parameter Relationships

5.5.2 Dual Thermal Profile

Processors that offer dual thermal profile are specified in the appropriate Datasheet.

Dual thermal profile helps mitigate limitations in volumetrically constrained form factors and allows trade-offs between heatsink cost and TCC activation risk. For heatsinks that comply to Profile B, yet do not comply to Profile A (1U heatsink in

Figure 5-5), the processor has an increased probability of TCC activation and an

associated measurable performance loss. Measurable performance loss is defined to be any degradation in processor performance greater than 1.5%. 1.5% is chosen as the baseline since run-to-run variation in a performance benchmark is typically between 1 and 2%.

Thermal/Mechanical Design Guide 37

Figure 5-5. Dual Thermal Profile

_MAX_B

CASE

_MAX_A

CASE

Thermal Solutions

1U Heatsink

TEMPERATURE

40C

0W TDP

Compliance to Profile A ensures that no measurable performance loss will occur due to TCC activation. It is expected that T CC would only be activated for very brief periods of time when running a worst-case real world application in a worst-case thermal condition. A worst-case real world application is a commercially available, useful application which dissipates power above TDP for a thermally relevant timeframe. One example of a worst-case thermal condition is when the processor local ambient temperature is above the y-axis intercept for Profile A.

5.6 Thermal Features

More information regarding processor thermal features is contained in the appropriate Datasheet.

2U Heatsink

POWER

38 Thermal/Mechanical Design Guide

Thermal Solutions

5.6.1 Fan Speed Control

There are many ways to implement fan speed control. Using processor ambient temperature (in addition to Digital Thermal Sensor) to scale fan speed can improve acoustics when DTS > T

CONTROL

Table 5-3. Fan Speed Control, T

Condition FSC Scheme

DTS ≤ T

CONTROL

DTS > T

CONTROL

5.6.1.1 T

CONTROL

Factory configured T

Guidance

CONTROL

Letter or may be extracted by issuing a Mailbox or an RDMSR instruction. See the Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 for more information.

Due to increased thermal headroom based on thermal characterization on the latest stepping of Intel® Xeon® Processor 5500 Series production processors, customers have the option to reduce T

In some situations, use of reduced T and improve acoustics. Implementation is optional. Alternately, the factory configured T

CONTROL

values can still be used. There are no plans to change Intel's specification or

the factory configured T To implement this guidance, customers must re-write code to set T

reduced values provided in the table below.

Table 5-4. T

CONTROL

Guidance

CONTROL

FSC can adjust fan speed to maintain DTS ≤ T

FSC should adjust fan speed to keep T specification (increased acoustic region).

and DTS Relationship

CASE

(low acoustic region).

CONTROL

at or below the Thermal Profile

values are available in the appropriate Dear Customer

CONTROL

to values lower than the factory configured values.

CONTROL

Guidance can reduce average fan power

values on individual processors.

CONTROL

to the

TDP

95W -10 Intel® Xeon® Processor 5500 Series with 2.93 GHz Max Core Frequency 95W -1 Intel® Xeon® Processor 5500 Series frequencies lower than 2.93 GHz 80W -1 Intel® Xeon® Processor 5500 Series 2.53 GHz or lower, except Embedded (NEBS) 60W -1 Intel® Xeon® Processor 5500 Series 2.26 GHz or lower, except Embedded (NEBS)

CONTROL

Guidance

Implementation of T (based on modeling of the Intel Reference Design). Implementation of T

CONTROL

Comment

Guidance above maintains Intel standards of reliability

CONTROL

of -1 may increase risk of throttling (Thermal Control Circuit activation). Increased TCC activation may or may not result in measurable performance loss.

Thermal Profile still applies. If PECI >= T

CONTROL

Guidance, then the case temperature

must meet the Thermal Profile. T

CONTROL

the factory configured T Regardless of T

values for the follow-on processor are TBD but expected to be in the range of

values for Intel® Xeon® Processor 5500 Series.

CONTROL

values used in Intel® Xeon® Processor 5500 Series, BIOS needs to identify the processor type. For the follow-on processor, the fan speed control algorithm needs to use the follow-on processor's factory configured T

Thermal/Mechanical Design Guide 39

CONTROL

values.

Thermal Solutions

5.6.2 PECI Averaging and Catastrophic Thermal Management

By averaging DTS over PECI, thermal solution failure can be detected and a soft shutdown can be initiated to help prevent loss of data.

Thermal data is averaged over a rolling window of 256mS by default (X=8):

AVG

= AVG

* (1 – 1/2X) + Temperature * 1/2

N-1

Using a smaller averaging constant could cause premature detection of failure. The Critical Temperature threshold generally triggers somewhere between PECI of

-0.75 and -0.50. To avoid false shutdowns, initiate soft shutdown at -0.25. Since customer designs, boundary conditions, and failure scenarios differ, above

guidance should be tested in the customer’s system to prevent loss of data during shutdown.

5.6.3 Intel® Turbo Boost Technology

Intel® Turbo Boost Technology (Intel® TBT) is a new feature available on certain processor SKUs that opportunistically, and automatically, allows the processor to run faster than the marked frequency if the part is operating below its power, temperature and current limits.

Heatsink performance (lower Ψ

as described in Section 5.5.1) is one of several

factors that can impact the amount of Intel® TBT frequency benefit. Intel® TBT performance is also constrained by ICC, and VCC limits.

Increased IMON accuracy may provide more Intel® TBT benefit on TDP limited applications, as compared to lower Ψ

, as temperature is not typically the limiter for

these workloads. With Intel® TBT enabled, the processor may run more consistently at higher power

levels (but still within TDP), and be more likely to operate above T compared to when Intel® TBT is disabled. This may result in higher acoustics.

With Intel® TBT enabled, processors with dual thermal profiles (described in

Section 5.5.2, have greater potential for performance delta between Profile A and

Profile B platforms, as compared to previous platforms.

5.7 Thermal Guidance

5.7.1 Thermal Excursion Power for 95 W Processor

Under fan failure or other anomalous thermal excursions, Tcase may exceed Thermal Profile B for a duration totaling less than 360 hours per year witho ut affecting long term reliability (life) of the processor. For more typical thermal excursions, Thermal Monitor is expected to control the processor power level as long as conditions do not allow the Tcase to exceed the temperature at which Thermal Control Circuit (TCC) activation initially occurred. Under more severe anomalous thermal excursions when the processor temperature cannot be controlled at or below this Tcase level by TCC activation, then data integrity is not assured. At some higher threshold, THERMTRIP# will enable a shut down in an attempt to prevent permanent damage to the processor. Thermal Test Vehicle (TTV) may be used to check anomalous thermal excursion

CONTROL

, as

40 Thermal/Mechanical Design Guide

Thermal Solutions

compliance by ensuring that the processor Tcase value, as measured on the TTV, does not exceed T case_max_B at the anomalous power level for the environmen tal condition of interest. This anomalous power level is equal to 75% of the TDP limit.

5.7.2 Thermal Excursion Power for 80 W Processor

Under fan failure or other anomalous thermal excursions, Tcase may exceed the thermal profile for a duration totaling less than 360 hours per year without affecting long term reliability (life) of the processor. For more typical thermal excursions, Thermal Monitor is expected to control the processor power level as long as conditions do not allow the Tcase to exceed the temperature at which Thermal Control Circuit (TCC) activation initially occurred. Under more severe anomalous thermal excursions when the processor temperature cannot be controlled at or below this Tcase level by TCC activation, then data integrity is not assured. At some higher threshold, THERMTRIP# will enable a shut down in an attempt to prevent permanent damage to the processor. Thermal Test Vehicle (TTV) may be used to check anomalous thermal excursion compliance by ensuring that the processor Tcase value, as measured on the TTV, does not exceed Tcase_max at the anomalous power level for the environmental condition of interest. This anomalous power level is equal to 75% of the TDP limit.

5.7.3 Absolute Processor Temperature

Intel does not test any third party software that reports absolute processor temperature. As such, Intel cannot recommend the use of software that claims this capability. Since there is part-to-part variation in the TCC (thermal control circuit) activation temperature, use of software that reports absolute temperature can be misleading.

See the Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 for details regarding use of IA32_TEMPERATURE_TA RGET register to determine the minimum absolute temperature at which the TCC will be activated and PROCHOT# will be asserted.

Thermal/Mechanical Design Guide 41

Thermal Solutions

42 Thermal/Mechanical Design Guide

Quality and Reliability Requirements

6 Quality and Reliability

Requirements

6.1 Test Conditions

The Test Conditions provided in Table 6-1 address processor heatsink failure mechanisms only. Test Conditions, Qualification and Visual Criteria vary by customer;

Table 6-1 applies to Intel requirements.

Socket T est Conditions are pro vided in the LGA1366 Socket V alidation Reports av ailable from socket suppliers listed in Appendix A.

Table 6-1. Heatsink Test Conditions and Qualification Criteria (Sheet 1 of 2)

Assessment Test Condition Qualification Criteria

1) Humidity Non-operating, 500 hours, +85°C and 85%

2) Board-Level UnPackaged Shock

3) Board-Level UnPackaged Vibration

4) First Article Inspection

5) Shipping Media: Packaged Shock

6) Shipping Media: Packaged Vibration

7) Gravitational Evaluation

R.H.

50G+/-10%; 170+/-10% in/sec; 3 drops per face, 6 faces.

5 Hz @ 0.01 g2/Hz to 20 Hz @ 0.02 g2/Hz (slope up). 20 Hz to 500 Hz @ 0.02 g2/Hz (flat). Input acceleration is 3.13 g RMS. 10 minutes/axis for all 3 axes on all samples. Random control limit tolerance is ±3 dB.

Not Applicable Meet all dimensions on 5 samples.

Drop height determined by weight and may vary by customer; Intel requirement in General Supplier Packaging Spec.

10 drops (6 sides, 3 edges, 1 corner)

0.015 g2/Hz @ 10-40 Hz, sloping to

0.0015 g2/Hz @ 500 Hz, 1.03 gRMS, 1 hour/axis for 3 axes

Required for heatpipe designs. 3 orientations (0°, +90°, -90°)

No visual defects. As verified in wind tunnel:

•Mean Ψ value in Table 5-1.

• Pressure drop not to exceed value in

Table 5-1.

No damage to heatsink base or pipe. No visual defects. As verified in wind tunnel:

•Mean Ψ exceed value in Table 5-1.

• Pressure drop not to exceed value in

Table 5-1.

No damage to heatsink base or pipe. No visual defects. As verified in wind tunnel:

•Mean Ψ exceed value in Table 5-1

• Pressure drop not to exceed value in

Table 5-1

Meet all CTF dimensions on 32 additional samples with 1.33 Cpk (mean + 4s).

If samples are soft-tooled, a hard tool plan must be defined.

No visual defects 1 box

As verified in wind tunnel, mean Ψ + offset not to exceed value in Table 5-1

+ 3s + offset not to exceed

+ 2.54s + offset not to

+ 3s

Min

Sample

Size

Thermal/Mechanical Design Guide 43

Quality and Reliability Requirements

Table 6-1. Heatsink Test Conditions and Qualification Criteria (Sheet 2 of 2)

Assessment Test Condition Qualification Criteria

8) Thermal Performance

Using 1U heatsink and 1U airflow from

Table 5-1:

1) TTV @ 95W (Profile B), Note 1. Using 2U heatsink and 2U airflow from

Table 5-1:

2) TTV @ 95W (Profile A), Note 1.

3) TTV @ 80W.

As verified in wind tunnel:

1) mean Ψ

Table 5-1 value for 95W in 1U.

2-4) mean Ψ

Table 5-1 value for 2U.

5-8) mean Ψ

Table 5-1 value for Tower.

+ 3s + offset not to exceed

4) TTV @ 60W. Using Tower heatsink and Tower airflow

from Table 5-1:

Min

Sample

Size

5 heatsinks X 8 tests by

supplier.

Note 1: 30

heatsinks X

3 tests by

Intel.

5) TTV @ 130W, Note 1.

6) TTV @ 95W (Profile A).

7) TTV @ 80W.

8) TTV @ 60W.

9) Thermal Cycling Required for heatpipe designs. Temperature range at pipe in heatsink assembly: -25C to +100C for 500 cycles. Cycle time is 30 minutes per full cycle,

divided into half cycle in hot zone and half in cold zone, with minimum 1min soak at

As verified in wind tunnel:

•Mean Ψ value in Table 5 -1.

• Pressure drop not to exceed value in

Table 5-1.

+ 3s + offset not to exceed

each temperature extreme for each cycle. See Figure 6-1 for example profile.

10) Heat Pipe Burst Continuously raise oven temperature and record the burst/leak temperatures of fully assembled heatsinks

No failures at minimum of 300C @ 20 minutes

32 pipes

11) Heatsink Mass Design Target < 500 g All samples < 550 g 30

12) Heatsink Load Design Targets:

0.062" board = 38.7 ± 7.2 lbf (Fmin =

31.5 lbf).

0.100" board = 51.4 ± 7.9 lbf (Fmax =

59.3 lbf).

No samples < 30 lbf on 0.062" board. 5 highest load samples (from 0.062" test)

< 60 lbf on 0.100" board

44 Thermal/Mechanical Design Guide

Quality and Reliability Requirements

Figure 6-1. Example Thermal Cycle - Actual profile will vary

6.2 Intel Reference Component Validation

Intel tests reference components both individually and as an assembly on mechanical test boards, and assesses performance to the envelopes specified in previous sections by varying boundary conditions.

While component validation shows that a reference design is tenable for a limited range of conditions, customers need to assess their specific boundary conditions and perform reliability testing based on their use conditions.

Intel reference components are also used in board functional tests to assess performance for specific conditions.

6.2.1 Board Functional Test Sequence

Each test sequence should start with components (baseboard, heatsink assembly, and so on) that have not been previously submitted to any reliability testing.

The test sequence should always start with a visual inspection after assembly and BIOS/Processor/memory test. The stress test should be then followed by a visual inspection and then BIOS/Processor/memory test.

6.2.2 Post-Test Pass Criteria

The post-test pass criteria are:

1. No significant physical damage to the heatsink and retention hardware.

Thermal/Mechanical Design Guide 45

Quality and Reliability Requirements

2. Heatsink remains seated and its bottom remains mated flat against the IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware.

3. No signs of physical damage on baseboard surface due to impact of heatsink.

4. No visible physical damage to the processor package.

5. Successful BIOS/Processor/memory test.

6. Thermal compliance testing to demonstrate that the case temperature specification can be met.

6.2.3 Recommended BIOS/Processor/Memory Test Procedures

This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational baseboard that has not been exposed to any battery of tests prior to the test being considered.

The testing setup should include the following components, properly assembled and/or connected:

• Appropriate system baseboard.

• Processor and memory.

• All enabling components, including socket and thermal solution parts.

The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors.

6.3 Material and Recycling Requirements

Material shall be resistant to fungal growth. Examples of non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Synthetic materials such as PVC formulations, certain polyurethane compositions (for example, polyester and some polyethers), plastics which contain organic fillers of laminating materials, paints, and varnishes also are susceptible to fungal growth. If materials are not fungal growth resistant, then MILSTD-810E, Method 508.4 must be performed to determine material performance.

Any plastic component exceeding 25 gm should be recyclable per the European Blue Angel recycling standards.

The following definitions apply to the use of the terms lead-free, Pb-free, and RoHS compliant.

Lead-free and Pb-free: Lead has not been intentionally added, but lead may still exist as an impurity below 1000 ppm.

RoHS compliant: Lead and other materials banned in RoHS Directive are either (1) below all applicable substance thresholds as proposed by the EU or (2) an approved/pending exemption applies.

Note: RoHS implementation details are not fully defined and may change.

46 Thermal/Mechanical Design Guide

Component Suppliers

A Component Suppliers

Various suppliers have developed support components for processors in the Intel® Xeon® 5500 Platform. These suppliers and components are listed as a convenience to customers. Intel does not guarantee quality, reliability, functionality or compatibility of these components. The supplier list and/or the components may be subject to change without notice. Customers are responsible for the thermal, mechanical, and environmental verification of the components with the supplier.

A.1 Intel Enabled Supplier Information

Performance targets for heatsinks are described in Section 5.1. Mechanical drawings are provided in Appendix B. Mechanical models are listed in Table 1-1. Heatsinks assemble to server back plate Table A-4.

A.1.1 Intel Reference Thermal Solution

The Intel reference thermal solutions has been verified to meet the criteria outline d in

Table 6-1. Customers can purchase the Intel reference thermal solutions from the

suppliers listed in Table A-1.

Table A-1. Suppliers for the Intel Reference Thermal Solution

Assembly Component Description Supplier PN Supplier Contact Info

Assembly, Heat Sink, 1U

1U URS Intel Reference Heatsink p/n

E32409-001

1U URS SSI Blade Reference Heatsink p/n

E39069-001 refers to E22056 Rev 02 + Snap Cover

27 mm 1U Aluminum Fin, Copper Base, includes TIM, 95W capable

25.5mm 1U Aluminum Fin, Copper Base, includes TIM and Snap Cover, 95W capable.

Fujikura

HSA-8078 Rev A

Fujikura

HSA-8083C

Fujikura America Yuji Yasuda

yuji@fujikura.com 408-748-6991

Fujikura Taiwan Branch Yao-Hsien Huang

yeohsien@fujikuratw.com.tw 886(2)8788-4959

A.1.2 Intel Collaboration Thermal Solution

The Intel collaboration thermal solutions are preliminary and may not be verified to meet the criteria outlined in Table 6-1. Customers can purchase the Intel collaboration thermal solutions from the suppliers listed in Table A-2.

Thermal/Mechanical Design Guide 47

Component Suppliers

Table A-2. Suppliers for the Intel Collaboration Thermal Solution

Assembly Component Description Supplier PN Supplier Contact Info

Assembly, Heatsink, Intel® Xeon® Processor 5500 Series, 2U

Assembly, Heatsink, Intel® Xeon® Processor 5500 Series, Pedestal

2U URS Heatsink

Intel Collaboration Heatsink p/n

E32410-001

Tower URS Heatsink

Intel Collaboration Heatsink p/n

E32412-001

Supplier Designed Solution with Intel-specified retention, includes TIM, 95W capable

Supplier Designed Solution with Intel-specified retention, includes TIM, 130W capable

Foxconn

pn 1A016500

Chaun-Choung

Technology Corp

(CCI)

pn 0007029401

Foxconn

Wanchi Chen (worldwide) wanchi.chen@foxconn.com (408) 919-6135

Chaun-Choung Technology Corp (CCI) Monica Chih monica_chih@ccic.com.tw +886 (2) 2995-2666 x1131

Harry Lin hlinack@aol.com 714 739-5797

A.1.3 Alternative Thermal Solution

The alternative thermal solutions are preliminary and are not verified by Intel to meet the criteria outlined in Table 6-1. Customers can purchase the alternative thermal solutions from the suppliers listed in Table A-3.

Table A-3. Suppliers for the Alternative Thermal Solution

Assembly Component Description Supplier PN Supplier Contact Info

Assembly, Heat Sink, 1U

Assembly Heatsink, Intel® Xeon® Processor 5500 Series, 1U

1U SSI Blade Alternative URS Heatsink

1U Alternative URS Heatsink

Supplier Designed Solution, Cu base, Al fins, 95W capable

Supplier Designed Solution, Cu base, Al fins, includes TIM, 95W capable

TaiSol Corporation

1A1-9031000960-A

Thermaltake

CL-P0484

CoolerMaster

S1N-PJFCS-07-GP

Aavid Thermalloy

050073

TaiSol Corporation Janice Chiu janice.chiu@taisol.com.tw +866-2-2656-2658

Thermaltake Sean Li sean@thermaltake.com.tw +886-2-26626501 EXT.235

CoolerMaster Isaac Chu isaac_chu@coolermaster.com.tw +886 2 32340050 x11182

Aavid Thermalloy Chris Chapman chapman@aavid.com 603-223-1728

George Lee george.lee@aavid.com.tw +886 (2) 2698-9888 x603

48 Thermal/Mechanical Design Guide

Component Suppliers

Table A-3. Suppliers for the Alternative Thermal Solution

Assembly Component Description Supplier PN Supplier Contact Info

Assembly, Heatsink, Intel® Xeon® Processor 5500 Series, 2U

Assembly, Heatsink, Intel® Xeon® Processor 5500 Series, Tower

2U Alternative URS Heatsink

Tower Alternative URS Heatsink

Supplier Designed Solution, Aluminum base, Cu insert, Al fins, heatpipes, includes TIM, 95W capable

Supplier Designed Solution, Cu base, Al fins, heatpipes, includes TIM, 95W capable

Supplier Designed Solution, Aluminum Extrusion, includes TIM, 80W capable

Supplier Designed Solution, Al fins, heatpipes, 130W capable

Asia Vital

Components (AVC)

SR40400001

Thermaltake

CL-P0486

CoolerMaster

S2N-PJMHS-07-GP

TaiSol Corporation

1A0-9041000960-A

Dynatron

Corporation

G520

TaiSol Corporation

1A0-9051000960-A

Thermaltake

CL-P0485

Asia Vital Components (AVC)

David Chao david_chao@avc.com.tw +886 (2) 2299-6930 x7619

Thermaltake Sean Li sean@thermaltake.com.tw +886-2-26626501 EXT.235

CoolerMaster Isaac Chu isaac_chu@coolermaster.com.tw +886 2 32340050 x11182

TaiSol Corporation Janice Chiu janice.chiu@taisol.com.tw +886-2-2656-3658

Dynatron Corporation Ian Lee ian@dynatron-corp.com 510-498-8888 x137

TaiSol Corporation Janice Chiu janice.chiu@taisol.com.tw +886-2-2656-3658

Thermaltake Sean Li sean@thermaltake.com.tw +886-2-26626501 EXT.235

A.1.4 Socket and ILM Components

The LGA1366 Socket and ILM Components are described in Chapter 2 and Chapter 3, respectively. Socket mechanical drawings are provided in Appendix C. Mechanical models are listed in Table 1-1.

Table A-4. LGA1366 Socket and ILM Components

Item Intel PN Foxconn Tyco

ILM Cover Assembly D92428-002 PT44L12-4101 1939738-1 Server Back Plate D92433-002 PT44P12-4101 1981467-1 LGA1366 Socket D86205-002 PE136627-4371-01F 1939737-1

Billy Hsieh billy.hsieh@tycoelectronics.com +81 44 844 8292

Supplier Contact Info

Julia Jiang juliaj@foxconn.com 408-919-6178

Thermal/Mechanical Design Guide 49

Component Suppliers

50 Thermal/Mechanical Design Guide

Mechanical Drawings

B Mechanical Drawings

Table B-1. Mechanical Drawing List

Description Figure

Board Keepin / Keepout Zones (Sheet 1 of 4) Figure B-1 Board Keepin / Keepout Zones (Sheet 2 of 4) Figure B-2 Board Keepin / Keepout Zones (Sheet 3 of 4) Figure B-3 Board Keepin / Keepout Zones (Sheet 4 of 4) Figure B-4 1U Reference Heatsink Assembly (Sheet 1 of 2) Figure B-5 1U Reference Heatsink Assembly (Sheet 2 of 2) Figure B-6 1U Reference Heatsink Fin and Base (Sheet 1 of 2) Figure B-7 1U Reference Heatsink Fin and Base (Sheet 2 of 2) Figure B-8 Heatsink Shoulder Screw (1U, 2U and Tower) Figure B-9 Heatsink Compression Spring (1U, 2U and Tower) Figure B-10 Heatsink Retaining Ring (1U, 2U and Tower) Figure B-11 Heatsink Load Cup (1U, 2U and Tower) Figure B-12 2U Collaborative Heatsink Assembly (Sheet 1 of 2) Figure B-13 2U Collaborative Heatsink Assembly (Sheet 2 of 2) Figure B-14 2U Collaborative Heatsink Volumetric (Sheet 1 of 2) Figure B-15 2U Collaborative Heatsink Volumetric (Sheet 2 of 2) Figure B-16 Tower Collaborative Heatsink Assembly (Sheet 1 of 2) Figure B-17 Tower Collaborative Heatsink Assembly (Sheet 2 of 2) Figure B-18 Tower Collaborative Heatsink Volumetric (Sheet 1 of 2) Figure B-19 Tower Collaborative Heatsink Volumetric (Sheet 2 of 2) Figure B-20 1U Reference Heatsink Assembly with TIM (Sh eet 1 of 2) Figure B-21 1U Reference Heatsink Assembly with TIM (Sh eet 2 of 2) Figure B-22 2U Reference Heatsink Assembly with TIM (Sh eet 1 of 2) Figure B-23 2U Reference Heatsink Assembly with TIM (Sh eet 2 of 2) Figure B-24 Tower Reference Heatsink Assembly with TIM (Sheet 1 of 2) Figure B-25 Tower Reference Heatsink Assembly with TIM (Sheet 2 of 2) Figure B-26

Thermal/Mechanical Design Guide 51

Figure B-1. Board Keepin / Keepout Zones (Sheet 1 of 4)

Mechanical Drawings

102

D77712

NOTES:

1. THIS DRAWING TO BE USED IN CORELATION WITH SUPPLIED

3D DATA BASE FILE. ALL DIMENSIONS AND TOLERANCES

ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.

2. PRIMARY DIMENSIONS STATED IN MILLIMETERS. [BRACKATED]

DIMENSIONS STATED IN INCHES

3. SOCKET KEEP OUT DIMENSIONS SHOWN FOR REFERNCE ONLY

PLEASE REFER TO THE SOCKET B KEEPOUT / KEEPIN DRAWING

DWG. NO SHT. REV

FOR EXACT DIMENSIONS

5678

4 BALL 1 LOCATION WITH RESPECT TO SOCKET BALL ARRAY IS

FORMED BY INTERSECTION OF ROW A & COLUMN 1. MAXIMUM

OUTLINE OF SOCKET SOLDERBALL ARRAY MUST BE PLACED

SYMMETRIC TO THE ILM HOLE PATTERN (INNER PATTERN) FOR

PROPER ILM & SOCKET FUNCTION.

5. A HEIGHT RESTRICTION ZONE IS DEFINED AS ONE WHERE

ALL COMPONENTS PLACED ON THE SURFACE OF THE MOTHERBOARD

MUST HAVE A MAXIMUM HEIGHT NO GREATER THAN THE HEIGHT

DEFINED BY THAT ZONE.

ALL ZONES DEFINED WITHIN THE 90 X 90 MM

OUTLINE REPRESENT SPACE THAT RESIDES BENEATH THE HEAT

SINK FOOTPRINT.

UNLESS OTHERWISE NOTED ALL VIEW DIMENSION ARE NOMINAL.

ALL HEIGHT RESTRICTIONS ARE MAXIMUMS. NEITHER ARE

DRIVEN BY IMPLIED TOLERANCES.

A HEIGHT RESTRICTION OF 0.0 MM REPRESENTS

THE TOP (OR BOTTOM) SURFACE OF THE MOTHERBOARD AS

THE MAXIMUM HEIGHT.

SEE NOTE 7 FOR ADDITIONAL DETAILS.

7 COMBINED COMPONENT AND SOLDER PASTE HEIGHT INCLUDING

6. SEE SHEET 4 FOR REVISION HISTORY.

TOLERANCES AFTER REFLOW.

90.00

[3.543]

MAX THERMAL

RETENTION OUTLINE

80.00

[3.150]

HOLE PATTERN

THERMAL RETENTION

ZONE 1:

0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT,

SOCKET, ILM, AND FINGER ACCESS KEEPIN ZONE

ZONE 2:

7.0 MM MAX COMPONENT HEIGHT 7

ZONE 3:

3.0 MM MAX COMPONENT HEIGHT 7

ZONE 4:

0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT

RETENTION MODULE OR HEAT SINK TOUCH ZONE

LEGEND, THIS SHEET ONLY

61.20

[2.409]

SOCKET ILM

HOLE PATTERN

49.90

[1.965]

FOR REFERENCE ONLY

SOCKET BODY OUTLINE,

44.70

[1.760]

SOCKET BALL ARRAY

CENTERLINE OF OUTER

REV

SHEET 1 OF 4DO NOT SCALE DRAWINGSCALE: 3.000

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

DEPARTMENT

DATEDESIGNED BY

ZONE 5:

0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT,

NO ROUTE ZONE

ZONE 6:

1.97 MM MAX COMPONENT HEIGHT, SOCKET CAVITY 7

UNLESS OTHERWISE SPECIFIED

INTERPRET DIMENSIONS AND TOLERANCES

D77712

THURLEY & GAINESTOWN

ENABLING KEEPIN / KEEPOUT

DRAWING NUMBER

EASD / PTMI

SIZE

TITLE

FINISHMATERIAL

DATEAPPROVED BY

11/03/06J. WILLIAMS

DATECHECKED BY

09/28/06N. ULEN

DATEDRAWN BY

09/28/06N. ULEN

THIRD ANGLE PROJECTION

IN ACCORDANCE WITH ASME Y14.5-1994

DIMENSIONS ARE IN MILLIMETERS

TOLERANCES:

.X # 0.0 Angles # 0.0

.XX # 0.00

.XXX # 0.000

123

5678

90.00

[3.543]

THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS

MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.

52 Thermal/Mechanical Design Guide

MAX THERMAL

RETENTION OUTLINE

80.00

[3.150]

HOLE PATTERN

THERMAL RETENTION

47.50

[1.870]

FOR REFERENCE ONLY

SOCKET BODY OUTLINE,

41.66

[1.640]

SOCKET BALL ARRAY

CENTERLINE OF OUTER

36.00

[1.417]

SOCKET ILM

HOLE PATTERN

FOR REFERENCE ONLY

SOCKET BODY OUTLINE

FOR REFERENCE ONLY

BALL 1 POSITION 4

LINE REPRESENTS OF

OUTERMOST ROWS AND COLUMNS

OF SOCKET BALL ARRAY OUTLINE.

OF THE MOTHERBOARD

AS VIEWED FROM PRIMARY SIDE

Mechanical Drawings

Figure B-2. Board Keepin / Keepout Zones (Sheet 2 of 4)

+0.002

-0.001

+0.06

-0.03

0.159

[]

4.03

4X NPTH

THERMAL RETENTION

D77712 2 02

DWG. NO SHT. REV

+0.002

-0.001

+0.06

-0.03

0.150

[]

3.80

4X NPTH

SOCKET ILM

MOUNTING HOLES

0.236[]

6.00 NO ROUTE

COPPER PAD ON SURFACE

MOUNTING HOLES

0.236[]

4X 6.00

DETAIL A

SCALE 6.000

ZONE 1:

0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT,

SOCKET, ILM, AND FINGER ACCESS KEEPIN ZONE

ZONE 2:

7.0 MM MAX COMPONENT HEIGHT 7

LEGEND, THIS SHEET ONLY

REVDRAWING NUMBERSIZEDEPARTMENT

ZONE 3:

3.0 MM MAX COMPONENT HEIGHT 7

ZONE 4:

0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT

RETENTION MODULE OR HEAT SINK TOUCH ZONE

ZONE 5:

0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT,

NO ROUTE ZONE

ZONE 6:

1.97 MM MAX COMPONENT HEIGHT, SOCKET CAVITY 7

SEE DETAIL A

02D77712D

123

SHEET 2 OF 4DO NOT SCALE DRAWINGSCALE: 3.000

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

EASD / PTMI

3.346[]

85.00

3.150[]

5678

THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS

MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.

2X 80.00

2.854[] 2X 72.50

2.665[]

67.70

2.2835[]

58.000

1.856[]

47.15

1.293[]

32.85

0.8661[]

22.000

BALL 1 4

0.755[]

19.17

0.484[]

12.30

0.378[]

9.60

0.295[] 2X 7.50

0.000[] 2X 0.00

0.197[]

5.00

0.000[]

0.130[]

0.197[]

0.295[]

3.30

5.00

2X 0.00

2X 7.50

2X 9.400

0.3701[]

0.3898[]

9.900

1.177[]

29.90

30.600

1.205[]

1.945[]

49.40

2.456[]

62.39 BALL 1 4

2.7795[]

2X 72.50

2X 70.600

3.067[]

2.854[]

77.90

3.150[]

3X 80.00

3.346[]

85.00

5678

(DETAILS)

OF THE MOTHERBOARD

AS VIEWED FROM PRIMARY SIDE

Thermal/Mechanical Design Guide 53

Figure B-3. Board Keepin / Keepout Zones (Sheet 3 of 4)

Mechanical Drawings

2.474[]

62.83

2.953[]

75.00

3.346[]

85.00

REVDRAWING NUMBERSIZEDEPARTMENT

02D77712D

123

SHEET 3 OF 4DO NOT SCALE DRAWINGSCALE: 3.000

ZONE 7:

NO COMPONENT PLACEMENT, STIFFENING PLATE CONTACT AREA

ZONE 8:

1.8 MM MAX COMPONENT HEIGHT 7

ZONE 9:

NO COMPONENT PLACEMENT & NO ROUTE ZONE

LEGEND, THIS SHEET ONLY

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

EASD / PTMI

D77712 3 02

DWG. NO SHT. REV

0.197[]

0.676[]

0.000[]

5.00

0.00

5.00

0.197[]

5.00

0.000[]

0.00

0.374[]

9.50

17.17

1.205[]

30.60

1.945[]

49.40

1.293[]

5678

32.85

[1.850]

[3.543]

(47.00 )

1.856[]

47.15

(90.00 )

5678

(DETAILS)

OF THE MOTHERBOARD

THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS

MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.

2.776[]

70.50

3.346[]

85.00

REFERENCE ONLY

KEEPIN SHOWN FOR

DESKTOP BACKPLATE

0.236[]

[2.843]

(72.20 )

[3.543]

(90.00 )

8X 6.00

AS VIEWED FROM SECONDARY SIDE

54 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-4. Board Keepin / Keepout Zones (Sheet 4 of 4)

02/27/07

01/12/07

01/19/07

01/22/07

11/30/06

12/18/06

11/03/06

10/05/06

D77712 4 02

REVISION HISTORY

DWG. NO SHT. REV

DRAWING RE-DO, ADDED BALL PATTERN, SOCKET

BODY, BALL 1, BACKSIDE WINDOW, GENERAL

DRAWING CLARIFICATIONS.

M.B COMPONENT HEIGHT RESTRICTION

CHANGED FROM 2.5MM TO 7MM

C ADDED ADDITION KO FOR RM, SHEET 1 10/27/06

A ORIGINAL RELEASE 09/29/06-B

ZONE REV DESCRIPTION DATE APPROVED

TO THE LEFT AND RIGHT OF SOCKET OUTLINE

CORRECTED SOCKET SOLDERBALL ARRAY & POS

41.66 --> 40.64 (ARRAY SIZE)

44.85 --> 44.70 (ARRAY SIZE)

62.43 --> 62.39 (ARRAY POSITION)

RECENT CHANGES. SEE KEEPIN ZONE 1

OUTLINE, SHEETS 1 & 2.

RADIUS VALUE. 1.9 --> 3.8

UPDATED BACKPLATE HOLE DIAMTER SIZE FOR DT

E UPDATED SOCKET KEEPIN OUTLINE TO REFLECT

F CORRECTED ILM HOLE DIAMETER. WAS SHOWING

2D3

2C1

19.17 --> 19.67 (ARRAY POSITION)

COMPATIBILITY. DIAMETER 4.0 --> 4.03

G REMOVED 3.0 MM HEIGHT RESTRICTION ZONE

H MOVED REVISION HISTORY TABLE TO SHEET 4

1C6

1B5

2B8

2D6

THIS HEIGHT REPRESENTS AN ARBITRARY

MOTHERBOARD THICKNESS

02/06/07

ADDED TOPSIDE CU PAD CALLOUT FOR ILM HOLES

SEE DETAIL A, SHEET 2

X DIRECTION SIZE AND POSITION TO REV G.

40.64 --> 41.66 (ARRAY WIDTH)

19.67 --> 19.17 (ARRAY POSITION)

SOLDERBALL ARRAY OUTLINE REPRESENTS THE

CENTERLINE OF THE OUTER BALL ROWS/COLS

MOVED ISO VEWS TO SHEET 4

MODIFIED BACKSIDE HEIGHT RESTRICTIONS FOR

NEW BACKPLATE GEOMETRY

I REVERTED SOCKET SOLDERBALL ARRAY

2D4

ADDED NOTE 5 DETAILING HEIGHT RESTRICTION

J ADDED ISO VIEW OF SECONDARY SIDE

1C6

2D6

SHT 4

SHT 3

SHT 1

02/24/09

TO ALLOW MORE SOCKET LEVER ARM ACCESS,

LEFT SIDE OF ZONE

NOMENCLATURE

ADDED NOTE 7

REMOVED TOLERANCE BLOCK VALUES,

SEE NOTE 5

K UPDATED ZONE 1 KEEPOUT ON SHEETS 1 & 2

01 PRODUCTION RELEASE 08/02/07

02 ZONE 6 HEIGHT FROM 1.8MM --> 1.97MM

ALL ZONES, SEE NOTE 5

REVDRAWING NUMBERSIZEDEPARTMENT

123

SHEET 4 OF 4DO NOT SCALE DRAWINGSCALE: 2.500

D77712D

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

EASD / PTMI

5678

PRIMARY SIDE

SECONDARY SIDE

THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS

MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.

3D HEIGHT RESTRICTION ZONES

Thermal/Mechanical Design Guide 55

Figure B-5. 1U Reference Heatsink Assembly (Sheet 1 of 2)

Mechanical Drawings

56 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-6. 1U Reference Heatsink Assembly (Sheet 2 of 2)

Thermal/Mechanical Design Guide 57

Figure B-7. 1U Reference Heatsink Fin and Base (Sheet 1 of 2)

Mechanical Drawings

58 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-8. 1U Reference Heatsink Fin and Base (Sheet 2 of 2)

Thermal/Mechanical Design Guide 59

Figure B-9. Heatsink Shoulder Screw (1U, 2U and Tower)

Mechanical Drawings

04/27/07

03/22/07

REVISION HISTORY

D89880 1 03

SCREW LENGTH INCREASED BY 1.0 MM.

C REDUCED SHAFT DIAMETER TO 3.9, ADDED TOLERANCE.

B UPDATED NOTE 3 AND ADDED NOTE 4.

DWG. NO SHT. REV

- A SUPPLIER FEEDBACK 02/12/07 -

ZONE REV DESCRIPTION DATE APPROVED

09/08/08

07/13/07

ADDED NOTE 7

ADDED SHOULDER NOTE

INCREASED THREAD LENGTH TO 5MM

E-RING GROOVE DEPTH CHANGED TO 0.35

ADDED PHILLIPS HEAD DETAILS PER ASME B18.6.2-1998

03 UPDATED SHAFT INSPECTION CRITERIA

01 PRODUCTION RELEASE

A3 02 ADDED MAJOR SCREW DIA AS CTF 12/18/07

B3 D ADDED CTF 05/15/07

NOTES

SEC A-A

NOTES:

1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED

3D DATABASE. ALL DIMENSIONS AND TOLERANCES ON THIS

DRAWING TAKE PRECEDENCE OVER SUPPLIED DATABASE.

2. PRIMARY DIMENSIONS STATED IN MILLIMETERS.

5 CRITICAL TO FUNCTION DIMENSION

6 PER ASME B18.6.3-1998

7 INSPECT SHAFT DIAMETER IN THESE LOCATIONS

[BRACKETED] DIMENSIONS STATED IN INCHES.

3. MATERIAL: 18-8 STAINLESS STEEL; AISI 303, 304, 305; JIS SUS304;

OR EQUIVALENT. MINIMUM TENSILE STRENGTH = 60,000 PSI.

4. TORQUE TO FAILURE SHALL BE NO LESS THAN 20 IN-LBF.

0.079[]

2.00

0.276[]

0.236[]

7.00

6.00

62.00 0.32

0.079 0.012[]

0.220[]

()5.60

M3 X 0.5

EXTERNAL THREAD

0.532[]

()13.50

511.00 0.13

573.90

+0.000

-0.003

-0.10

0.154

[]

513.50 0.13

0.115 0.002[] MAJOR DIA,

M3 x 0.5

TOLERANCE CLASS 6G

2.93 0.06

SECTION A-A

REVDRAWING NUMBERSIZE

03D89880D

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

SCREW, SHOULDER, M3 X 0.5

DEPARTMENT

EASD / PTMI

TITLE

FINISHMATERIAL

DATEAPPROVED BY

02/14/07W. SCHULZ

DATECHECKED BY

02/12/07N. ULEN

DATEDRAWN BY

02/12/07N. ULEN

DATEDESIGNED BY

THIRD ANGLE PROJECTION

UNLESS OTHERWISE SPECIFIED

INTERPRET DIMENSIONS AND TOLERANCES

IN ACCORDANCE WITH ASME Y14.5-1994

DIMENSIONS ARE IN MILLIMETERS

TOLERANCES:

.X .5 Angles 1.0

.XX 0.25

.XXX 0.127

SHEET 1 OF 1DO NOT SCALE DRAWINGSCALE: 1

SEE NOTESSEE NOTES

123

0.000[]

0.138[]

0.00

5678

#2 DRIVER 6

TYPE 1, CROSS RECESSED

THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS

MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.

0.160 0.006[]

2X 64.06 0.17

0.028[]

4X MIN. 60.72

0.008[]

R0.20

3.50

SEE DETAIL B

DETAIL B

SCALE 40.000

SEE DETAIL C

50.64

+0.001

-0.000

+0.05

0.025

[]

0.532 0.005[]

0.433 0.005[]

THIS SHOULDER MUST

CRITICAL INTERFACE FEATURE:

DETAIL C

SCALE 40.000

0.014[]

0.35

BE SQUARE

0.728[]

18.50

5678

SEE DETAIL A

DETAIL A

SCALE 40.000

0.5 X 45 ALL AROUND

60 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-10. Heatsink Compression Spring (1U, 2U and Tower)

Thermal/Mechanical Design Guide 61

Figure B-11. Heatsink Retaining Ring (1U, 2U and Tower)

Mechanical Drawings

62 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-12. Heatsink Load Cup (1U, 2U and Tower)

Thermal/Mechanical Design Guide 63

Figure B-13. 2U Collaborative Heatsink Assembly (Sheet 1 of 2)

Mechanical Drawings

64 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-14. 2U Collaborative Heatsink Assembly (Sheet 2 of 2)

Thermal/Mechanical Design Guide 65

Figure B-15. 2U Collaborative Heatsink Volumetric (Sheet 1 of 2)

Mechanical Drawings

66 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-16. 2U Collaborative Heatsink Volumetric (Sheet 2 of 2)

Thermal/Mechanical Design Guide 67

Figure B-17. Tower Collaborative Heatsink Assembly (Sheet 1 of 2)

Mechanical Drawings

68 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-18. Tower Collaborative Heatsink Assembly (Sheet 2 of 2)

Thermal/Mechanical Design Guide 69

Figure B-19. Tower Collaborative Heatsink Volumetric (Sheet 1 of 2)

Mechanical Drawings

70 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-20. Tower Collaborative Heatsink Volumetric (Sheet 2 of 2)

Thermal/Mechanical Design Guide 71

Figure B-21. 1U Reference Heatsink Assembly with TIM (Sheet 1 of 2)

Mechanical Drawings

REVISION HISTORY

E32409 1 01

DWG. NO SHT. REV

ZONE REV DESCRIPTION DATE APPROVED

01 PRODUCTION RELEASE 12/14/07

NOTES:

5 PART NUMBER AND TORQUE SPEC MARK.

1. THIS DRAWING TO BE USED IN CORRELATION WITH

SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES

ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.

2. PRIMARY DIMENSIONS STATED IN MILLIMETERS,

[BRACKETED] DIMENSIONS STATED IN INCHES.

CRITICAL TO FUNCTION DIMENSION.

3. ALL DIMENSION AND TOLERANCES PER ANSI Y14.5-1994.

4. REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR

SOLVENTS AFTER FINAL ASSEMBLY.

PLACE PART NUMBER AND TORQUE SPEC IN ALLOWABLE AREA,

EITHER SIDE OF PART WHERE SHOWN. BELOW PART NUMBER

CALLOUT, PLACE THE FOLLOWING TEXT:

"RECOMMENDED SCREW TORQUE: 8 IN-LBF"

8 CRITICAL TO FUNCTION DIMENSION.

9 HONEYWELL PCM-45F THERMAL INTERFACE MATERIAL,

THE MARK CAN BE AN INK MARK, LASER MARK, PUNCH MARK

OR ANY OTHER PERMANENT MARK THAT IS READABLE AT 1.0X

MAGNIFICATION.

6. NA

7. NA

WITH CLEAR PROTECTIVE LINER REMOVABLE BY HAND. LINER

ORIENTATION AND REMOVAL DIRECTION NON-CRITICAL.

SEE PARTS LIST, ITEM 2.

CLEAR PROTECTIVE LINER NOT SHOWN IN THIS VIEW.

HEAT SINK, CU BASE, AL FINS, 1UD8500311

TIM, 0.250x35x35MM, HONEYWELL (SEE NOTE 9)PCM-45F21

2200 MISSION COLLEGE BLVD.

DESCRIPTIONPART NUMBERITEM NOQTY

DEPARTMENT

PARTS LIST

DATEDESIGNED BY

ASSEMBLY, HEAT SINK, THURLEY, 1U WITH TIME32409TOP

UNLESS OTHERWISE SPECIFIED

INTERPRET DIMENSIONS AND TOLERANCES

REVDRAWING NUMBERSIZE

01E32409D

123

SHEET 1 OF 2DO NOT SCALE DRAWINGSCALE: 1.500

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

1U WITH TIM

ASSEMBLY, HEAT SINK, THURLEY

EASD / PTMI

TITLE

SEE NOTESSEE NOTES

FINISHMATERIAL

DATEAPPROVED BY

12/14/07D. LLAPITAN

DATECHECKED BY

12/14/07N. ULEN

DATEDRAWN BY

12/14/07N. ULEN

THIRD ANGLE PROJECTION

IN ACCORDANCE WITH ASME Y14.5-1994

DIMENSIONS ARE IN MILLIMETERS

TOLERANCES:

.X # 0.5 Angles # 1.0 $

.XX # 0.25

.XXX # 0.127

5678

THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS

MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.

72 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-22. 1U Reference Heatsink Assembly with TIM (Sheet 2 of 2)

E32409 2 01

DWG. NO SHT. REV

1.38 #0.03[]

35.0 #1.0

1.38 #0.03[]

35.0 #1.0

1.08 #0.01[]

27.5 #0.5

REVDRAWING NUMBERSIZEDEPARTMENT

01E32409D

123

SHEET 2 OF 2DO NOT SCALE DRAWINGSCALE: 1.500

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

EASD / PTMI

5678

1.08 #0.01[]

THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS

MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.

27.5 #0.5

SEE NOTE 9

PROTECTIVE LINER NOT SHOWN.

INSTALL PER MANUFACTURER'S RECOMMENDATION.

SEE PARTS LIST, SHEET 1, ITEM 2

THERMAL INTERFACE APPLICATION

5678

Thermal/Mechanical Design Guide 73

Figure B-23. 2U Reference Heatsink Assembly with TIM (Sheet 1 of 2)

Mechanical Drawings

REVISION HISTORY

E32410 1 01

DWG. NO SHT. REV

01 PRODUCTION RELEASE 12/14/07

ZONE REV DESCRIPTION DATE APPROVED

NOTES:

5 PART NUMBER AND TORQUE SPEC MARK.

1. THIS DRAWING TO BE USED IN CORRELATION WITH

SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES

ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.

2. PRIMARY DIMENSIONS STATED IN MILLIMETERS,

[BRACKETED] DIMENSIONS STATED IN INCHES.

CRITICAL TO FUNCTION DIMENSION.

3. ALL DIMENSION AND TOLERANCES PER ANSI Y14.5-1994.

4. REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR

SOLVENTS AFTER FINAL ASSEMBLY.

PLACE PART NUMBER AND TORQUE SPEC IN ALLOWABLE AREA,

EITHER SIDE OF PART WHERE SHOWN. BELOW PART NUMBER

CALLOUT, PLACE THE FOLLOWING TEXT:

"RECOMMENDED SCREW TORQUE: 8 IN-LBF"

8 CRITICAL TO FUNCTION DIMENSION.

9 HONEYWELL PCM-45F THERMAL INTERFACE MATERIAL,

THE MARK CAN BE AN INK MARK, LASER MARK, PUNCH MARK

OR ANY OTHER PERMANENT MARK THAT IS READABLE AT 1.0X

MAGNIFICATION.

6. NA

7. NA

WITH CLEAR PROTECTIVE LINER REMOVABLE BY HAND. LINER

ORIENTATION AND REMOVAL DIRECTION NON-CRITICAL.

SEE PARTS LIST, ITEM 2.

CLEAR PROTECTIVE LINER NOT SHOWN IN THIS VIEW.

TIM, 0.250x35x35MM, HONEYWELL (SEE NOTE 9)PCM-45F21

ASSEMBLY, HEAT SINK, THURLEY, 2U TALL WITH TIME32410TOP

HEAT SINK, 2U TALLD9312711

REVDRAWING NUMBERSIZE

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

DESCRIPTIONPART NUMBERITEM NOQTY

2U TALL WITH TIM

ASSEMBLY, HEAT SINK, THURLEY,

DEPARTMENT

EASD / PTMI

TITLE

PARTS LIST

DATEAPPROVED BY

12/14/07D. LLAPITAN

DATECHECKED BY

12/14/07N. ULEN

DATEDRAWN BY

12/14/07N. ULEN

DATEDESIGNED BY

01E32410D

FINISHMATERIAL

SHEET 1 OF 2DO NOT SCALE DRAWINGSCALE: 1.500

SEE NOTESSEE NOTES

123

THIRD ANGLE PROJECTION

UNLESS OTHERWISE SPECIFIED

INTERPRET DIMENSIONS AND TOLERANCES

IN ACCORDANCE WITH ASME Y14.5-1994

DIMENSIONS ARE IN MILLIMETERS

TOLERANCES:

.X # 0.5 Angles # 1.0 $

.XX # 0.25

.XXX # 0.127

5678

THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS

MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.

5678

74 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-24. 2U Reference Heatsink Assembly with TIM (Sheet 2 of 2)

E32410 2 01

DWG. NO SHT. REV

1.38 #0.03[]

35.0 #1.0

1.38 #0.03[]

35.0 #1.0

1.08 #0.01[]

27.5 #0.5

REVDRAWING NUMBERSIZEDEPARTMENT

01E32410D

123

SHEET 2 OF 2DO NOT SCALE DRAWINGSCALE: 1.500

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

EASD / PTMI

5678

THERMAL INTERFACE APPLICATION

PROTECTIVE LINER NOT SHOWN.

INSTALL PER MANUFACTURER'S RECOMMENDATION.

SEE PARTS LIST, SHEET 1, ITEM 2.

1.08 #0.01[]

27.5 #0.5

THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS

MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.

SEE NOTE 9

5678

Thermal/Mechanical Design Guide 75

Figure B-25. Tower Reference Heatsink Assembly with TIM (Sheet 1 of 2)

Mechanical Drawings

REVISION HISTORY

E32412 1 01

DWG. NO SHT. REV

ZONE REV DESCRIPTION DATE APPROVED

01 PRODUCTION RELEASE 12/14/07

NOTES:

5 PART NUMBER AND TORQUE SPEC MARK.

1. THIS DRAWING TO BE USED IN CORRELATION WITH

SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES

ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.

2. PRIMARY DIMENSIONS STATED IN MILLIMETERS,

[BRACKETED] DIMENSIONS STATED IN INCHES.

CRITICAL TO FUNCTION DIMENSION.

3. ALL DIMENSION AND TOLERANCES PER ANSI Y14.5-1994.

4. REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR

SOLVENTS AFTER FINAL ASSEMBLY.

PLACE PART NUMBER AND TORQUE SPEC IN THE ALLOWABLE AREA.

BELOW PART NUMBER CALLOUT, PLACE THE FOLLOWING TEXT:

"RECOMMENDED SCREW TORQUE: 8 IN-LBF"

8 CRITICAL TO FUNCTION DIMENSION.

9 HONEYWELL PCM-45F THERMAL INTERFACE MATERIAL,

THE MARK CAN BE AN INK MARK, LASER MARK, PUNCH MARK

OR ANY OTHER PERMANENT MARK THAT IS READABLE AT 1.0X

MAGNIFICATION.

6. NA

7. NA

WITH CLEAR PROTECTIVE LINER REMOVABLE BY HAND. LINER

ORIENTATION AND REMOVAL DIRECTION NON-CRITICAL.

SEE PARTS LIST, ITEM 2.

CLEAR PROTECTIVE LINER NOT SHOWN IN THIS VIEW.

REVDRAWING NUMBERSIZE

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

01E32412D

123

SHEET 1 OF 2DO NOT SCALE DRAWINGSCALE: 1.500

TOWER WITH TIM

DESCRIPTIONPART NUMBERITEM NOQTY

ASSEMBLY, HEAT SINK, THURLEY,

DEPARTMENT

EASD / PTMI

TITLE

PARTS LIST

DATEDRAWN BY

12/14/07N. ULEN

DATEDESIGNED BY

ASSEMBLY, HEAT SINK, THURLEY, TOWER WITH TIME32412TOP

HEAT SINK, THURLEY, TOWERD8500911

TIM, 0.250x35x35MM, HONEYWELL (SEE NOTE 9)PCM-45F21

UNLESS OTHERWISE SPECIFIED

INTERPRET DIMENSIONS AND TOLERANCES

IN ACCORDANCE WITH ASME Y14.5-1994

DIMENSIONS ARE IN MILLIMETERS

DATEAPPROVED BY

12/14/07D. LLAPITAN

DATECHECKED BY

12/14/07N. ULEN

THIRD ANGLE PROJECTION

TOLERANCES:

.X # 0.5 Angles # 1.0 $

.XX # 0.25

.XXX # 0.127

FINISHMATERIAL

SEE NOTESSEE NOTES

5678

THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS

MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.

5678

76 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-26. Tower Reference Heatsink Assembly with TIM (Sheet 2 of 2)

E32412 2 01

DWG. NO SHT. REV

1.38 #0.03[]

35.0 #1.0

REVDRAWING NUMBERSIZEDEPARTMENT

01E32412D

123

SHEET 2 OF 2DO NOT SCALE DRAWINGSCALE: 1.500

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

EASD / PTMI

1.38 #0.03[]

5678

THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS

MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.

35.0 #1.0

1.08 #0.01[]

27.5 #0.5

SEE NOTE 9

1.08 #0.01[]

27.5 #0.5

PROTECTIVE LINER NOT SHOWN.

INSTALL PER MANUFACTURER'S RECOMMENDATION.

SEE PARTS LIST, SHEET 1, ITEM 2.

THERMAL INTERFACE APPLICATION

5678

Thermal/Mechanical Design Guide 77

Mechanical Drawings

78 Thermal/Mechanical Design Guide

Socket Mechanical Drawings

C Socket Mechanical Drawings

Table C-1 lists the mechanical drawings included in this appendix.

Table C-1. Mechanical Drawing List

Drawing Description Figure Number

“Socket Mechanical Drawing (Sheet 1 of 4)” Figure C-1 “Socket Mechanical Drawing (Sheet 2 of 4)” Figure C-2 “Socket Mechanical Drawing (Sheet 3 of 4)” Figure C-3 “Socket Mechanical Drawing (Sheet 4 of 4)” Figure C-4

Thermal/Mechanical Design Guide 79

Figure C-1. Socket Mechanical Drawing (Sheet 1 of 4)

Socket Mechanical Drawings

80 Thermal/Mechanical Design Guide

Socket Mechanical Drawings

Figure C-2. Socket Mechanical Drawing (Sheet 2 of 4)

Thermal/Mechanical Design Guide 81

Figure C-3. Socket Mechanical Drawing (Sheet 3 of 4)

Socket Mechanical Drawings

82 Thermal/Mechanical Design Guide

Socket Mechanical Drawings

Figure C-4. Socket Mechanical Drawing (Sheet 4 of 4)

Thermal/Mechanical Design Guide 83

Socket Mechanical Drawings

84 Thermal/Mechanical Design Guide

Heatsink Load Metrology

D Heatsink Load Metrology

To ensure compliance to max socket loading value listed in Table 4-3, and to meet the performance targets for Thermal Interface Material in Section 5.3, the Heatsink Static Compressive Load can be assessed using the items listed below:

• HP34970A DAQ

• Omegadyne load cell, 100 lbf max (LCKD-100)

• Test board (0. 062") with ILM & back plate installed

• 8 in-lbf pneumatic driver

•Heatsink

• Gainestown Load Cell Fixture (Figure D-1)

Thermal/Mechanical Design Guide 85

Figure D-1. Intel® Xeon® Processor 5500 Series Load Cell Fixture

Heatsink Load Metrology

86 Thermal/Mechanical Design Guide

Embedded Thermal Solutions

E Embedded Thermal Solutions

This section describes the LV processors and Embedded reference heatsinks for NEBS (Network Equipment Building Systems) compliant AT CA (Advanced Telecommunications Computing Architecture) systems. These LV processors are good for any form factor that needs to meet NEBS requirements.

E.1 Performance Targets

Table E-1 provides boundary conditions and performance targets for 1U and ATCA

heatsinks. These values are used to generate processor thermal specifications and to provide guidance for heatsink design.

Table E-1. Boundary Conditions and Performance Targets

Parameter Value Value

Altitude, system ambient temp Nominal/Short-term

TDP 60 W 38 W

1,4

System height (form factor) Heatsink volumetric 1U (90 x 90 x 27) or Custom AT CA

Heatsink technology

Sea level, 40

51.9/66.9o C 50/65o C

0.302o C/W 0.532o C/W 1U (EEB) or ATCA ATCA

(90 x 90 x 13mm + heat exchanger)

C/55C Sea level, 40o C/55C

ATCA (90 x 90 x 13 mm)

Cu base, Cu fins

Notes:

1. Local ambient temperature of the air entering the heatsink.

2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (Section 5.5.1).

3. Reference system configuration. In a single wide ATCA blade the 60 W processor should be used in single socket only and the 38 W processor can be used in d ual socket.

4. Local Ambient Temperature written 50/65 Short-Term NEBS excursions.

5. Passive heatsinks with TIM.

6. See Section 5.1 for standard 1U solutions that do not need to meet NEBS.

Thermal/Mechanical Design Guide 87

C means 50o C under Nominal conditions but 65o C is allowed for

Detailed drawings for the ATCA reference heatsink can be found in Section E.3.

Table E-1 above specifies ΨCA and pressure drop targets and Figure E-1 below shows

and pressure drop for the ATCA heatsink versus the airflow provided. Best-fit

equations are provided to prevent errors associated with reading the graph.

Figure E-1. ATCA Heatsink Performance Curves

Embedded Thermal Solutions

2.5

ΔP = 1.3e-04CFM2 +1.1e-02CFM

1.5

Ψca, C/W

0.5

Mean Ψca= 0.337 + 1.625 CFM

0 5 10 15 20 25 30 35

CFM Through Fins

Other LGA1366 compatible thermal solutions may work with the same retention.

E.2 Thermal Design Guidelines

1.6

1.2

0.8

ΔP, inch water

0.4

-0.939

E.2.1 NEBS Thermal Profile

Processors that offer a NEBS compliant thermal profile are specified in the Intel® Xeon® Processor 5500 Series Datasheet, Volume 1.

NEBS thermal profiles help relieve thermal constraints for Short- Term NEBS conditions. To help reliability, processors must meet the nominal thermal profile under standard operating conditions and can only rise up to the Short-Term spec for NEBS excursions (see Figure E-2). The definition of Short-Term time is clearly defined for NEBS Level 3 conditions but the key is that it cannot be longer than 360 hours per year.

88 Thermal/Mechanical Design Guide

Embedded Thermal Solutions

Figure E-2. NEBS Thermal Profile

Short-term Thermal Profile may only be used for short term excursions to higher ambient temperatures, not to exceed 360

hours per year

Thermal Profile

Tcase [C]

Short-Term Thermal Profile Tc = 0.302 * P + 66.9

0 5 10 15 20 25 30 35 40 45 50 55 60

Power [ W ]

Notes:

1.) The thermal specifications shown in this graph are for reference only. See the Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 for the Thermal Profile specifications. In case of conflict, the data in the datasheet supersedes any data in this figure.

2.) The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do not require NEBS Level 3 compliance.

3.) The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating temperatures, not to exceed 360 hours per year as compliant with NEBS Level 3.

4.) Implementation of either thermal profile should result in virtually no TCC activation.

5.) Utilization of a thermal solution that exceeds the Short-Term Thermal Profile, or which operate s at the Shor tTerm Thermal Profile for a duration longer than the limits specified in Note 3 above, do not meet the processo r thermal specifications and may result in permanent damage to the processor.

E.2.2 Custom Heat Sinks For UP ATCA

The Embedded specific 60W SKU is targeted for NEBS compliant 1U+ systems and UP AT CA configurations with custom thermal solutions. In order to cool this part in a single wide ATCA slot, a custom thermal solution will be required. Since solutions like this will be very configuration specific, this heat sink was not fully designed with retention and keep-out definitions.

Nominal Thermal Profile Tc = 0.302* P + 51.9

In order to cool the additional power of a 60W processor in A TCA, the heat sink volume was increased. The assumption was that the heat sink could not grow wider because of VR and Memory placement, so a Remote Heat Exchanger (RHE) was used. The RHE is attached to the main heat sink with a heat pipe. The RHE gives additional convective surface area and gives the thermal solution access to more air. Samples of the following design were ordered and tested for thermal performance only.

Flotherm analysis shows that the following design can cool an LGA1366 TTV in an AT CA blade at 30CFM. The heat sink Ψca would be 0.50C/W at 55C ambient which falls below the thermal profile for the 60W processor.

Thermal/Mechanical Design Guide 89

Figure E-3. UP ATCA Thermal Solution

Embedded Thermal Solutions

Notes: Thermal sample only, retention not production ready.

Figure E-4. UP ATCA System Layout

Notes: Heat sink should be optimized for the layout.

90 Thermal/Mechanical Design Guide

Embedded Thermal Solutions

Figure E-5. UP ATCA Heat Sink Drawing

Thermal/Mechanical Design Guide 91

Embedded Thermal Solutions

E.3 Mechanical Drawings and Supplier Information

See Appendix B for retention and keep out drawings. The part number below represent Intel reference designs for a DP ATCA heatsink.

Customer implementation of these components may be unique and require validation by the customer. Customers can obtain these components directly from the supplier below.

Table E-2. Embedded Heatsink Component Suppliers

Assembly Component Description Supplier PN Supplier Contact Info

Assembly, Heat Sink, Nehalem-EP, ATCA

ATCA Reference heatsink

Intel P/N E65918-001

Table E-3. Mechanical Drawings List

Parameter Value

ATCA Reference Heat Sink Assembly (Sheet 1 of 2) Figure E-6 ATCA Reference Heat Sink Assembly (Sheet 2 of 2) Figure E-7 ATCA Reference Heatsink Fin and Base (Shee t 1 of 2) Figure E-8 ATCA Reference Heatsink Fin and Base (Shee t 2 of 2) Figure E-9

ATCA Copper Fin, Copper Base

Fujikura

HSA-7901

Fujikura America Ash Ooe

a_ooe@fujikura.com 408-748-6991

Fujikura Taiwan Branch Yao-Hsien Huang

yeohsien@fujikuratw.com.tw 886(2)8788-4959

92 Thermal/Mechanical Design Guide

Embedded Thermal Solutions

Figure E-6. ATCA Reference Heat Sink Assembly (Sheet 1 of 2)

Thermal/Mechanical Design Guide 93

Figure E-7. ATCA Reference Heat Sink Assembly (Sheet 2 of 2)

Embedded Thermal Solutions

94 Thermal/Mechanical Design Guide

Embedded Thermal Solutions

Figure E-8. ATCA Reference Heatsink Fin and Base (Sheet 1 of 2)

Thermal/Mechanical Design Guide 95

Figure E-9. ATCA Reference Heatsink Fin and Base (Sheet 2 of 2)

Embedded Thermal Solutions

96 Thermal/Mechanical Design Guide

Processor Installation Tool

F Processor Installation Tool

The following optional tool is designed to provide mechanical assistance during processor installation and removal.

Contact the supplier for availability:

Billy Hsieh

billy.hsieh@tycoelectronics.com

+81 44 844 8292

Thermal/Mechanical Design Guide 97

Figure F-1. Processor Installation Tool

Processor Installation Tool

98 Thermal/Mechanical Design Guide

Intel Xeon 5500 Series Design Manual

Specifications and Main Features

Frequently Asked Questions

User Manual