Intel BX80605X3440 - Quad Core Xeon X3440, Xeon 3400 Series Reference

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Intel

Xeon® Processor 3400 Series

and LGA1156 Socket

Thermal/Mechanical Specifications and Design Guidelines

September 2009

Reference Number: 322374-001

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Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel

reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel

Xeon® Processor 3400 Series and LGA1156 socket may contain design defects or errors known as errata which may

cause the product to deviate from published specifications. Current characterized errata are available on request. ÄIntel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor

family, not across different processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, Xeon, Intel Flexible Display Interface, Intel Core, Intel Thermal Monitor, and the Intel logo are trademarks of Intel

2 Thermal/Mechanical Specifications and Design Guidelines

Contents

1Introduction..............................................................................................................7

1.1 References .........................................................................................................7

1.2 Definition of Terms..............................................................................................8

2 Package Mechanical and Storage Specifications....................................................... 11

2.1 Package Mechanical Specifications ....................................................................... 11

2.2 Processor Storage Specifications ......................................................................... 16

3 LGA1156 Socket ...................................................................................................... 17

3.1 Board Layout .................................................................................................... 19

3.2 LGA1156 Socket NCTF Solder Joints..................................................................... 20

3.3 Attachment to Motherboard ................................................................................ 21

3.4 Socket Components........................................................................................... 21

3.5 Package Installation / Removal ........................................................................... 23

3.6 Durability ......................................................................................................... 24

3.7 Markings.......................................................................................................... 25

3.8 Component Insertion Forces ............................................................................... 25

3.9 Socket Size ......................................................................................................25

4 Independent Loading Mechanism (ILM)................................................................... 27

4.1 Design Concept................................................................................................. 27

4.2 Assembly of ILM to a Motherboard.......................................................................30

4.3 ILM Interchangeability ....................................................................................... 31

4.4 Markings.......................................................................................................... 32

5 LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications .33

5.1 Component Mass............................................................................................... 33

5.2 Package/Socket Stackup Height .......................................................................... 33

5.3 Socket Maximum Temperature............................................................................33

5.4 Loading Specifications........................................................................................ 34

5.5 Electrical Requirements...................................................................................... 35

5.6 Environmental Requirements .............................................................................. 36

6 Thermal Specifications ............................................................................................ 37

6.1 Thermal Specifications ....................................................................................... 37

6.2 Processor Thermal Features................................................................................44

6.3 Platform Environment Control Interface (PECI)...................................................... 48

7 Sensor Based Thermal Specification Design Guidance.............................................. 51

7.1 Sensor Based Specification Overview ................................................................... 51

7.2 Sensor Based Thermal Specification..................................................................... 52

7.3 Thermal Solution Design Process......................................................................... 54

7.4 Fan Speed Control (FSC) design process............................................................... 56

7.5 System Validation ............................................................................................. 58

8 1U Collaboration Thermal Solution .......................................................................... 59

8.1 Performance Targets.......................................................................................... 59

8.2 Thermal Solution............................................................................................... 62

8.3 Assembly ......................................................................................................... 63

8.4 Geometric Envelope for 1U Thermal Mechanical Design .......................................... 64

8.5 Thermal Interface Material.................................................................................. 64

9 Thermal Solution Quality and Reliability Requirements............................................ 65

9.1 Collaboration Heatsink Thermal Verification .......................................................... 65

9.2 Mechanical Environmental Testing ....................................................................... 65

Thermal/Mechanical Specifications and Design Guidelines 3

9.3 Material and Recycling Requirements....................................................................67

10 Boxed Processor Specifications................................................................................69

10.1 Introduction......................................................................................................69

10.2 Mechanical Specifications....................................................................................70

10.3 Electrical Requirements ......................................................................................72

10.4 Thermal Specifications........................................................................................73

A Component Suppliers...............................................................................................77

B Mechanical Drawings ...............................................................................................79

C Socket Mechanical Drawings....................................................................................97

D Package Mechanical Drawings ...............................................................................103

Figures

2-1 Processor Package Assembly Sketch .......................................................................11

2-2 Package View ......................................................................................................12

2-3 Processor Top-Side Markings .................................................................................14

2-4 Processor Package Lands Coordinates .....................................................................15

3-1 LGA1156 Socket with Pick and Place Cover..............................................................17

3-2 LGA1156 Socket Contact Numbering (Top View of Socket).........................................18

3-3 LGA1156 Socket Land Pattern (Top View of Board) ...................................................19

3-4 LGA1156 Socket NCTF Solder Joints .......................................................................20

3-5 Attachment to Motherboard...................................................................................21

3-6 Pick and Place Cover.............................................................................................23

3-7 Package Installation / Removal Features .................................................................24

4-1 ILM Cover Assembly .............................................................................................28

4-2 Back Plate...........................................................................................................28

4-3 Shoulder Screw....................................................................................................29

4-4 ILM Assembly ......................................................................................................30

4-5 Pin 1 and ILM Lever..............................................................................................31

5-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology.............................36

6-1 Thermal Test Vehicle Thermal Profile for Intel

6-2 Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor 3400 Series (45W) .....41

6-3 TTV Case Temperature (TCASE) Measurement Location.............................................44

6-4 Frequency and Voltage Ordering ............................................................................46

6-5 Temperature Sensor Data Format...........................................................................49

7-1 Comparison of Case Temperature versus Sensor Based Specification...........................52

7-2 Intel

Xeon® Processor 3400 Series (95W) Thermal Profile........................................53

7-3 Required YCA for Various TAMBIENT Conditions........................................................55

8-1 1U Heatsink Performance Curves............................................................................60

8-2 1U Heatsink Performance Curves............................................................................61

8-3 1U Collaboration Heatsink Assembly .......................................................................63

8-4 KOZ 3-D Model (Top) in 1U Server .........................................................................64

10-1 Boxed Processor Fan Heatsink................................................................................69

10-2 Space Requirements for the Boxed Processor (side view)...........................................70

10-3 Space Requirements for the Boxed Processor (top view)............................................71

10-4 Space Requirements for the Boxed Processor (overall view) .......................................71

10-5 Boxed Processor Fan Heatsink Power Cable Connector Description ..............................72

10-6 Baseboard Power Header Placement Relative to Processor Socket ...............................73

10-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view) ...................74

10-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side view) ..................74

10-9 Boxed Processor Fan Heatsink Set Points.................................................................75

B-1 Socket / Heatsink / ILM Keepout Zone Primary Side for 1U(Top).................................80

B-2 Socket / Heatsink / ILM Keepout Zone Secondary Side for 1U(Bottom)........................81

Xeon® Processor 3400 Series (95W) .....39

4 Thermal/Mechanical Specifications and Design Guidelines

B-3 Socket / Processor / ILM Keepout Zone Primary Side for 1U(Top)............................... 82

B-4 Socket / Processor / ILM Keepout Zone Secondary Side for 1U(Bottom) ...................... 83

B-5 1U Collaboration Heatsink Assembly.......................................................................84

B-6 1U Collaboration Heatsink..................................................................................... 85

B-7 1U Collaboration Heatsink Screw............................................................................ 86

B-8 Heatsink Compression Spring ................................................................................87

B-9 Heatsink Load Cup ............................................................................................... 88

B-10 Heatsink Retaining Ring........................................................................................ 89

B-11 Heatsink Backplate Assembly ................................................................................90

B-12 Heatsink Backplate .............................................................................................. 91

B-13 Heatsink Backplate Insulator ................................................................................. 92

B-14 Heatsink Backplate Stud ....................................................................................... 93

B-15 Thermocouple Attach Drawing ...............................................................................94

B-16 1U ILM Shoulder Screw ........................................................................................ 95

B-17 1U ILM Standard 6-32 Thread Fastener...................................................................96

C-1 Socket Mechanical Drawing (Sheet 1 of 4)...............................................................98

C-2 Socket Mechanical Drawing (Sheet 2 of 4)...............................................................99

C-3 Socket Mechanical Drawing (Sheet 3 of 4)............................................................. 100

C-4 Socket Mechanical Drawing (Sheet 4 of 4)............................................................. 101

D-1 Processor Package Drawing (Sheet 1 of 2) ............................................................ 104

D-2 Processor Package Drawing (Sheet 2 of 2) ............................................................ 105

Tables

1-1 Reference Documents.............................................................................................7

1-2 Terms and Descriptions ..........................................................................................8

2-1 Processor Loading Specifications............................................................................ 13

2-2 Package Handling Guidelines ................................................................................. 13

2-3 Processor Materials .............................................................................................. 14

2-4 Storage Conditions............................................................................................... 16

5-1 Socket Component Mass....................................................................................... 33

5-2 1156-land Package and LGA1156 Socket Stackup Height .......................................... 33

5-3 Socket & ILM Mechanical Specifications................................................................... 34

5-4 Electrical Requirements for LGA1156 Socket............................................................ 35

6-1 Intel

6-2 Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor 3400 Series (95W) .... 40

6-3 Thermal Test Vehicle Thermal Profile for Intel 6-4 Thermal Solution Performance above TCONTROL for the Intel

6-5 Thermal Solution Performance above TCONTROL for the Intel

6-6 Supported PECI Command Functions and Codes ...................................................... 49

6-7 Error Codes and Descriptions................................................................................. 50

8-1 Boundary Conditions and Performance Targets ........................................................ 59

8-2 Comparison between TTV Thermal Profile and Thermal Solution Performance

9-1 Use Conditions (Board Level)................................................................................. 65

10-1 Fan Heatsink Power and Signal Specifications .......................................................... 73

10-2 Fan Heatsink Set Points ........................................................................................ 75

A-1 Collaboration Heatsink Enabled Components ........................................................... 77

A-2 LGA1156 Socket and ILM Components.................................................................... 77

A-3 Supplier Contact Information................................................................................. 77

B-1 Mechanical Drawing List........................................................................................ 79

C-1 Mechanical Drawing List........................................................................................ 97

D-1 Mechanical Drawing List...................................................................................... 103

Xeon® Processor 3400 Series Thermal Specifications ...................................... 38

Xeon® Processor 3400 Series (45W) .... 41

Processor 3400 Series (95W) ................................................................................42

Xeon®

Processor 3400 Series (45W) ................................................................................43

for Intel

Xeon® Processor 3400 Series (95W) ........................................................ 61

Thermal/Mechanical Specifications and Design Guidelines 5

Document

Number

322374 -001 • Initial release September 2009

Revision

Number

Description Revision Date

6 Thermal/Mechanical Specifications and Design Guidelines

Introduction

1 Introduction

This document differs from previous Thermal and Mechanical Design Guidelines. In this document, mechanical and thermal specifications for the processor and the associated socket are now included. The usual design guidance has been retained.

The components described in this document include:

• The thermal and mechanical specifications for the —Intel® Xeon® processor 3400 series

• The LGA1156 socket and the Independent Loading Mechanism (ILM) and back

plate.

• The collaboration design thermal solution (heatsink) for the processors and

associated retention hardware.

The Intel for clarity this document will use Intel® Xeon® processor 3400 series (95W) or Intel Xeon® processor 3400 series (45W).

Xeon® processor 3400 series has two thermal specifications. When required

Note: For Workstation segment, since boundary conditions, ILM assembly and reference

thermal solution etc. are similar to Desktop’s corresponding parts, user could refer to

Intel

Core™ i7-800 and i5-700 Desktop Processor Series and LGA1156 Socket

Thermal/Mechanical Specifications and Design Guidelines.

Note: When the information is applicable to all products, the this document will use

“processor” or “processors” to simplify the document.

1.1 References

Material and concepts available in the following documents may be beneficial when reading this document.

Table 1-1. Reference Documents

Document Location

Xeon® Processor 3400 Series Datasheet, Volume 1

Intel

Xeon® Processor 3400 Series Datasheet, Volume 2

Intel

Xeon® Processor 3400 Series Specification Update www.intel.com/Assets/

5 Series Chipset and Intel® 3400 Chipset Datasheet www.intel.com/Assets/

Intel

5 Series Chipset and Intel® 3400 Chipset Specification Update www.intel.com/Assets/

5 Series Chipset and Intel® 3400 Chipset – Thermal Mechanical

Intel Specifications and Design Guidelines

4-Wire Pulse Width Modulation (PWM) Controlled Fans http://

www.intel.com/Assets/

PDF/datasheet/322371.pdf

www.intel.com/Assets/

PDF/datasheet/322372.pdf

PDF/specupdate/

322173.pdf

PDF/datasheet/322169.pdf

PDF/specupdate/

322170.pdf

www.intel.com/Assets/

PDF/designguide/

322171.pdf

www.formfactors.org/

Thermal/Mechanical Specifications and Design Guidelines 9

1.2 Definition of Terms

Table 1-2. Terms and Descriptions (Sheet 1 of 2)

Term Description

Bypass Bypass is the area between a passive heatsink and any object that can act to form a

CTE Coefficient of Thermal Expansion. The relative rate a material expands during a thermal

DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC

FSC Fan Speed Control

IHS Integrated Heat Spreader: a component of the processor package used to enhance the

ILM Independent Loading Mechanism provides the force needed to seat the 1156-LGA land

PCH Platform Controller Hub. The PCH is connected to the processor via the Direct Media

LGA1156 socket The processor mates with the system board through this surface mount, 1156-land

PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides

CASE or TC

CASE_MAX

TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by

CONTROL

TDP Thermal Design Power: Thermal solution should be designed to dissipate this target

Thermal Monitor A power reduction feature designed to decrease temperature after the processor has

Thermal Profile Line that defines case temperature specification of the TTV at a given power level.

TIM Thermal Interface Material: The thermally conductive compound between the heatsink

duct. For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface.

event.

activation temperature.

thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface.

package onto the socket contacts.

Interface (DMI) and Intel

Flexible Display Interface (Intel® FDI).

socket.

a communication channel between Intel processor and chipset components to external monitoring devices.

Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance using total package power. Defined as (T Package Power. The heat source should always be specified for Ψ measurements.

Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package power. Defined as (T Power.

Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (T

The case temperature of the processor, measured at the geometric center of the topside of the TTV IHS.

The maximum case temperature as specified in a component specification.

using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits.

T trigger point for fan speed control. When DTS > T with the TTV thermal profile.

is a static value that is below the TCC activation temperature and used as a

CONTROL

power level. TDP is not the maximum power that the processor can dissipate.

reached its maximum operating temperature.

and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink.

– TLA) / Total

CASE

– TS) / Total Package

CASE

– TLA) / Total Package Power.

, the processor must comply

CONTROL

Introduction

10 Thermal/Mechanical Specifications and Design Guidelines

Introduction

Table 1-2. Terms and Descriptions (Sheet 2 of 2)

Term Description

TTV Thermal Test Vehicle. A mechanically equivalent package that contains a resistive heater

in the die to evaluate thermal solutions.

The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink.

The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets.

Thermal/Mechanical Specifications and Design Guidelines 11

Introduction

12 Thermal/Mechanical Specifications and Design Guidelines

Package Mechanical and Storage Specifications

IHS

Substrate

System Board

Capacitors

Core (die)

TIM

LGA1156 Socket

2 Package Mechanical and

Storage Specifications

2.1 Package Mechanical Specifications

The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with the motherboard via the LGA1156 socket. The package consists of a processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface for processor thermal solutions, such as a heatsink. Figure 2-1 shows a sketch of the processor package components and how they are assembled together. Refer to Chapter 3 and Chapter 4 for complete details on the LGA1156 socket.

The package components shown in Figure 2-1 include the following:

1. Integrated Heat Spreader (IHS)

2. Thermal Interface Material (TIM)

3. Processor core (die)

4. Package substrate

5. Capacitors

Figure 2-1. Processor Package Assembly Sketch

Note:

1. Socket and motherboard are included for reference and are not part of processor package.

2. For clarity the ILM is not shown.

Thermal/Mechanical Specifications and Design Guidelines 13

2.1.1 Package Mechanical Drawing

37.5

Figure 2-2 shows the basic package layout and dimensions. The detailed package

mechanical drawings are in Appendix D. The drawings include dimensions necessary to design a thermal solution for the processor. These dimensions include:

1. Package reference dimensions with tolerances (total height, length, width, and so forth.)

2. IHS parallelism and tilt

3. Land dimensions

4. Top-side and back-side component keep-out dimensions

5. Reference datums

6. All drawing dimensions are in mm.

Figure 2-2. Package View

Package Mechanical and Storage Specifications

2.1.2 Processor Component Keep-Out Zones

The processor may contain components on the substrate that define component keepout zone requirements. A thermal and mechanical solution design must not intrude into the required keep-out zones. Decoupling capacitors are typically mounted to either the topside or land-side of the package substrate. See Figure B-3 and Figure B-4 for keepout zones. The location and quantity of package capacitors may change due to manufacturing efficiencies but will remain within the component keep-in. This keep-in zone includes solder paste and is a post reflow maximum height for the components.

14 Thermal/Mechanical Specifications and Design Guidelines

Package Mechanical and Storage Specifications

2.1.3 Package Loading Specifications

Tab l e 2- 1 provides dynamic and static load specifications for the processor package.

These mechanical maximum load limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Also, any mechanical system or component testing should not exceed the maximum limits. The processor package substrate should not be used as a mechanical reference or load-bearing surface for

Table 2-1. Processor Loading Specifications

thermal and mechanical solution.

Parameter Minimum Maximum Notes

Static Compressive Load — 600 N [135 lbf] 1, 2, 3

Dynamic Compressive

Notes:

1. These specifications apply to uniform compressive loading in a direction normal to the processor IHS.

2. This is the maximum static force that can be applied by the heatsink and retention solution to maintain the

3. These specifications are based on limited testing for design characterization. Loading limits are for the

4. Dynamic loading is defined as an 50g shock load, 2X Dynamic Acceleration Factor with a 500g maximum

Load

heatsink and processor interface.

package only and do not include the limits of the processor socket.

thermal solution.

— 712 N [160 lbf] 1, 3, 4

2.1.4 Package Handling Guidelines

Tab l e 2- 2 includes a list of guidelines on package handling in terms of recommended

maximum loading on the processor IHS relative to a fixed substrate. These package handling loads may be experienced during heatsink removal.

Table 2-2. Package Handling Guidelines

Parameter Maximum Recommended Notes

Shear 311 N [70 lbf] 1, 4

Tensile 111 N [25 lbf] 2, 4

Torque 3.95 N-m [35 lbf-in] 3, 4

Notes:

1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.

2. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.

3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top surface.

4. These guidelines are based on limited testing for design characterization.

2.1.5 Package Insertion Specifications

The processor can be inserted into and removed from an LGA1156 socket 15 times. The socket should meet the LGA1156 socket requirements detailed in Chapter 5.

2.1.6 Processor Mass Specification

The typical mass of the processor is 21.5g (0.76 oz). This mass [weight] includes all the components that are included in the package.

Thermal/Mechanical Specifications and Design Guidelines 15

2.1.7 Processor Materials

Legend:

GRP1LINE1 GRP1LINE2 GRP1LINE3 GRP1LINE4 GRP1LINE5

Mark Text (Production Mark):

INTEL{M}{C}'08 PROC# BRAND SLxxx C00 SPEED/CACHE/ FMB

FPO

Legend:

GRP1LINE1 GRP1LINE2 GRP1LINE3 GRP1LINE4 GRP1LINE5

Mark Text (Engineering Mark):

INTEL{M}{C}'08 INTEL CONFIDENTIAL Qxxx ES C00 PRODUCT CODE

FPO

GRP1LINE1 GRP1LINE2 GRP1LINE3 GRP1LINE4 GRP1LINE5

LOT NO S/N

Package Mechanical and Storage Specifications

Tabl e 2 - 3 lists some of the package components and associated materials.

Table 2-3. Processor Materials

Component Material

Integrated Heat Spreader (IHS) Nickel Plated Copper

Substrate Fiber Reinforced Resin

Substrate Lands Gold Plated Copper

2.1.8 Processor Markings

Figure 2-3 shows the topside markings on the processor. This diagram is to aid in the

identification of the processor.

Figure 2-3. Processor Top-Side Markings

16 Thermal/Mechanical Specifications and Design Guidelines

Package Mechanical and Storage Specifications

1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31

33 35 37 39

2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32

34 36 38 40

2.1.9 Processor Land Coordinates

Figure 2-4. Processor Package Lands Coordinates

Thermal/Mechanical Specifications and Design Guidelines 17

Figure 2-4 shows the bottom view of the processor package.

Package Mechanical and Storage Specifications

2.2 Processor Storage Specifications

Tabl e 2 - 4 includes a list of the specifications for device storage in terms of maximum

and minimum temperatures and relative humidity. These conditions should not be

Table 2-4. Storage Conditions

exceeded in storage or transportation.

Parameter Description Min Max Notes

ABSOLUTE STORAGE

SUSTAINED STORAGE

TIME

SUSTAINED STORAGE

Notes:

1. Refers to a component device that is not assembled in a board or socket that is not to be electrically connected to a voltage reference or I/O signals.

2. Specified temperatures are based on data collected. Exceptions for surface mount reflow are specified in applicable JEDEC standard and MAS document. Non-adherence may affect processor reliability.

3. T

ABSOLUTE STORAGE

moisture barrier bags or desiccant.

4. Intel

5. The JEDEC, J-JSTD-020 moisture level rating and associated handling practices apply to all moisture

6. Nominal temperature and humidity conditions and durations are given and tested within the constraints

branded board products are certified to meet the following temperature and humidity limits that are given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C, Humidity: 50% to 90%, non-condensing with a maximum wet bulb of 28 °C). Post board attach storage temperature limits are not specified for non-Intel branded boards.

sensitive devices removed from the moisture barrier bag.

imposed by T

SUSTAINED

The non-operating device storage temperature. Damage (latent or otherwise) may occur when subjected to for any length of time.

The ambient storage temperature limit (in shipping media) for a sustained period of time.

The maximum device storage relative humidity for a sustained period of time.

A prolonged or extended period of time; typically associated with customer shelf life. 0 Months6 Months

applies to the unassembled component only and does not apply to the shipping media,

and customer shelf life in applicable Intel box and bags.

-55 °C 125 °C 1, 2, 3

-5 °C 40 °C 4, 5

60% @ 24 °C 5, 6

18 Thermal/Mechanical Specifications and Design Guidelines

LGA1156 Socket

3 LGA1156 Socket

This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the processors. The socket provides I/O, power, and ground contacts. The socket contains 1156 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard.

The contacts are arranged in two opposing L-shaped patterns within the grid array. The grid array is 40 x 40 with 24 x 16 grid depopulation in the center of the array and selective depopulation elsewhere.

The socket must be compatible with the package (processor) and the Independent Loading Mechanism (ILM). The ILM design includes a back plate that is integral to having a uniform load on the socket solder joints. Socket loading specifications are listed in Chapter 5.

Figure 3-1. LGA1156 Socket with Pick and Place Cover

Thermal/Mechanical Specifications and Design Guidelines 19

Figure 3-2. LGA1156 Socket Contact Numbering (Top View of Socket)

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW

B D F H K M P T V Y AB AD AF

AH AK

AM AP AT AV AY

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW

B D F H K M P T V Y AB AD AF

AH AK

AM AP AT AV AY

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AWA C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW

B D F H K M P T V Y AB AD AF

AH AK

AM AP AT AV AY

B D F H K M P T V Y AB AD AF

AH AK

AM AP AT AV AY

LGA1156 Socket

20 Thermal/Mechanical Specifications and Design Guidelines

LGA1156 Socket

A C E G J L N R U W AA ACAEAGAJ ALANAR AUAW

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY

A C E G J L N R U W AA AC AE A G AJ AL A N AR AU AW

122.6 mil (3.1144mm)

36mil (0.9144 mm)

A C E G J L N R U W AA ACAEAGAJ ALANAR AUAW

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY

A C E G J L N R U W AA AC AE A G AJ AL A N AR AU AW

122.6 mil (3.1144mm)

36mil (0.9144 mm)

3.1 Board Layout

The land pattern for the LGA1156 socket is 36 mils X 36 mils (X by Y) within each of the two L-shaped sections. Note that there is no round-off (conversion) error between socket pitch (0.9144 mm) and board pitch (36 mil) as these values are equivalent. The two L-sections are offset by 0.9144 mm (36 mil) in the x direction and 3.114 mm (122.6 mil) in the y direction (see Figure 3-3). This was to achieve a common package land to PCB land offset that ensures a single PCB layout for socket designs from the multiple vendors.

Figure 3-3. LGA1156 Socket Land Pattern (Top View of Board)

Thermal/Mechanical Specifications and Design Guidelines 21

3.2 LGA1156 Socket NCTF Solder Joints

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY

20 mil corner NCTF 20 mil corner CTF 14 x 18 mil oval pads

16.9 mil circular pads

Intel has defined selected solder joints of the socket as non-critical to function (NCTF) when evaluating package solder joints post environmental testing. The signals at NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality. Figure 3-4 identifies the NCTF solder joints.

Figure 3-4. LGA1156 Socket NCTF Solder Joints

LGA1156 Socket

22 Thermal/Mechanical Specifications and Design Guidelines

LGA1156 Socket

Load plate

Frame

Load Lever

Back Plate

Shoulder Screw

Load plate

Frame

Load Lever

Back Plate

Shoulder Screw

3.3 Attachment to Motherboard

The socket is attached to the motherboard by 1156 solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, etc.) to attach the socket.

As indicated in Figure 3-1, the Independent Loading Mechanism (ILM) is not present during the attach (reflow) process.

Figure 3-5. Attachment to Motherboard

3.4 Socket Components

The socket has two main components, the socket body and Pick and Place (PnP) cover, and is delivered as a single integral assembly. Refer to Appendix C for detailed drawings.

3.4.1 Socket Body Housing

The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable of withstanding 260 °C for 40 seconds, which is compatible with typical reflow/rework profiles. The socket coefficient of thermal expansion (in the XY plane), and creep properties, must be such that the integrity of the socket is maintained for the conditions listed in Chapter 5.

The color of the housing will be dark as compared to the solder balls to provide the contrast needed for pick and place vision systems.

Thermal/Mechanical Specifications and Design Guidelines 23

3.4.2 Solder Balls

A total of 1156 solder balls corresponding to the contacts are on the bottom of the socket for surface mounting with the motherboard. The socket solder ball has the following characteristics:

• Lead free SAC (SnAgCu) 305 solder alloy with a silver (Ag) content between 3% and 4% and a melting temperature of approximately 217 °C. The alloy must be compatible with immersion silver (ImAg) and Organic Solderability Protectant (OSP) motherboard surface finishes and a SAC alloy solder paste.

The co-planarity (profile) and true position requirements are defined in Appendix C.

3.4.3 Contacts

Base material for the contacts is high strength copper alloy.

For the area on socket contacts where processor lands will mate, there is a 0.381 μm [15 μinches] minimum gold plating over 1.27 μm [50 μinches] minimum nickel underplate.

No contamination by solder in the contact area is allowed during solder reflow.

LGA1156 Socket

3.4.4 Pick and Place Cover

The cover provides a planar surface for vacuum pick up used to place components in the Surface Mount Technology (SMT) manufacturing line. The cover remains on the socket during reflow to help prevent contamination during reflow. The cover can withstand 260 °C for 40 seconds (typical reflow/rework profile) and the conditions listed in Chapter 5 without degrading.

As indicated in Figure 3-6, the cover remains on the socket during ILM installation, and should remain on whenever possible to help prevent damage to the socket contacts.

Cover retention must be sufficient to support the socket weight during lifting, translation, and placement (board manufacturing), and during board and system shipping and handling. Covers can be removed without tools.

The socket vendors have a common interface on the socket body where the PnP cover attaches to the socket body. This should allow the PnP covers to be compatible between socket suppliers.

As indicated in Figure 3-6, a Pin1 indicator on the cover provides a visual reference for proper orientation with the socket.

24 Thermal/Mechanical Specifications and Design Guidelines

LGA1156 Socket

Pick & Place Cover

Pin 1

ILM Installation

Pick & Place Cover

Pin 1

ILM Installation

Figure 3-6. Pick and Place Cover

3.5 Package Installation / Removal

As indicated in Figure 3-7, access is provided to facilitate manual installation and removal of the package.

To assist in package orientation and alignment with the socket:

• The package Pin 1 triangle and the socket Pin1 chamfer provide visual reference for proper orientation.

• The package substrate has orientation notches along two opposing edges of the package, offset from the centerline. The socket has two corresponding orientation posts to physically prevent mis-orientation of the package. These orientation features also provide initial rough alignment of package to socket.

• The socket has alignment walls at the four corners to provide final alignment of the package.

Thermal/Mechanical Specifications and Design Guidelines 25

Pin 1 Chamfer

Package Pin 1 Indicator

Alignment Post (2 Places)

Finger Access (2 Places)

Orientation Notch (2 Places)

Figure 3-7. Package Installation / Removal Features

LGA1156 Socket

3.5.1 Socket Standoffs and Package Seating Plane

Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are specified in Appendix C.

Similarly, a seating plane on the top-side of the socket establishes the minimum package height. See Section 5.2 for the calculated IHS height above the motherboard.

3.6 Durability

The socket must withstand 20 cycles of processor insertion and removal. The max chain contact resistance from Tab l e 5- 4 must be met when mated in the 1st and 20th cycles.

The socket Pick and Place cover must withstand 15 cycles of insertion and removal.

26 Thermal/Mechanical Specifications and Design Guidelines

LGA1156 Socket

3.7 Markings

There are three markings on the socket:

• LGA1156: Font type is Helvetica Bold - minimum 6 point (2.125 mm).

• Manufacturer's insignia (font size at supplier's discretion).

• Lot identification code (allows traceability of manufacturing date and location).

All markings must withstand 260°C for 40 seconds (typical reflow/rework profile) without degrading, and must be visible after the socket is mounted on the motherboard.

LGA1156 and the manufacturer's insignia are molded or laser marked on the side wall.

3.8 Component Insertion Forces

Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/ Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force to insert the package into the socket.

3.9 Socket Size

Socket information needed for motherboard design is given in Appendix C.

This information should be used in conjunction with the reference motherboard keepout drawings provided in Appendix B to ensure compatibility with the reference thermal mechanical components.

Thermal/Mechanical Specifications and Design Guidelines 27

LGA1156 Socket

28 Thermal/Mechanical Specifications and Design Guidelines

Independent Loading Mechanism (ILM)

4 Independent Loading

Mechanism (ILM)

The Independent Loading Mechanism (ILM) provides the force needed to seat the 1156-LGA land package onto the socket contacts. The ILM is physically separate from the socket body. The assembly of the ILM to the board is expected to occur after wave solder. The exact assembly location is dependent on manufacturing preference and test flow. See the Manufacturing Advantage Service collateral for this platform for additional guidance.

Note: The ILM has two critical functions: deliver the force to seat the processor onto the

socket contacts and distribute the resulting compressive load evenly through the socket solder joints.

Note: The mechanical design of the ILM is integral to the overall functionality of the LGA1156

socket. Intel performs detailed studies on integration of processor package, socket and ILM as a system. These studies directly impact the design of the ILM. The Intel reference ILM will be “build to print” from Intel controlled drawings. Intel recommends using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from Intel's detailed studies and may not incorporate critical design parameters.

4.1 Design Concept

The ILM consists of two assemblies that will be procured as a set from the enabled vendors. These two components are ILM cover assembly and back plate. To secure the two assemblies, two types of fasteners are required a pair (2) of standard 6-32 thread screws and a custom 6-32 thread shoulder screw. The reference design incorporates a T-20 Torx* head fastener. The Torx* head fastener was chosen to ensure end users do not inadvertently remove the ILM assembly and for consistency with the LGA1366 socket ILM. The Torx* head fastener is also less susceptible to driver slippage. Once assembled the ILM is not required to be removed to install / remove the motherboard from a chassis.

4.1.1 ILM Cover Assembly Design Overview

The ILM Cover assembly consists of three major pieces: load lever, load plate and the hinge frame assembly.

All of the pieces in the ILM cover assembly except the hinge frame and the screws used to attach the back plate are fabricated from stainless steel. The hinge frame is plated. The frame provides the hinge locations for the load lever and load plate. An insulator is pre-applied to the bottom surface of the hinge frame.

The cover assembly design ensures that once assembled to the back plate the only features touching the board are the shoulder screw and the insulated hinge frame assembly. The nominal gap of the load plate to the board is ~1 mm.

Thermal/Mechanical Specifications and Design Guidelines 29

When closed, the load plate applies two point loads onto the IHS at the “dimpled”

Fasteners

Load Lever

Load Plate

Hinge / Frame Assy

Shoulder Screw

Pin 1 Indicator

Fasteners

Load Lever

Load Plate

Hinge / Frame Assy

Shoulder Screw

Pin 1 Indicator

Die Cut Insulator

Pierced & Extruded Thread Features

Assembly Orientation Feature

Die Cut Insulator

Pierced & Extruded Thread Features

Assembly Orientation Feature

features shown in Figure 4-1. The reaction force from closing the load plate is transmitted to the hinge frame assembly and through the fasteners to the back plate. Some of the load is passed through the socket body to the board inducing a slight compression on the solder joints.

A pin 1 indicator will be marked on the ILM cover assembly.

Figure 4-1. ILM Cover Assembly

Independent Loading Mechanism (ILM)

4.1.2 ILM Back Plate Design Overview

The back plate (see Figure 4-2) is a flat steel back plate with pierced and extruded features for ILM attach. A clearance hole is located at the center of the plate to allow access to test points and backside capacitors if required. An insulator is pre-applied. A notch is placed in one corner to assist in orienting the back plate during assembly.

Note: The Server ILM back plate is different from the Desktop design. Since Server

secondary-side clearance of 3.0 mm[0.118 inch] is generally available for leads and backside components, so Server ILM back plate is designed with 1.8 mm thickness and

2.2 mm entire height including punch protrusion length.

Figure 4-2. Back Plate

30 Thermal/Mechanical Specifications and Design Guidelines

Independent Loading Mechanism (ILM)

Shoulder

6-32 thread

Cap

4.1.3 Shoulder Screw and Fasteners Design Overview

The shoulder screw is fabricated from carbonized steel rod. The shoulder height and diameter are integral to the mechanical performance of the ILM. The diameter provides alignment of the load plate. The height of the shoulder ensures the proper loading of the IHS to seat the processor on the socket contacts. The design assumes the shoulder screw has a minimum yield strength of 235 MPa.

A dimensioned drawing of the shoulder screw is available for local sourcing of this component. Refer to Figure B-16 for the custom 6-32 thread shoulder screw drawing.

The standard fasteners can be sourced locally. The design assumes this fastener has a minimum yield strength of 235 MPa. Refer to Figure B-17 for the standard 6-32 thread fasteners drawing.

Note: The screws for Server ILM are different from Desktop design. The length of Server ILM

screws are shorter than the Desktop screw length to satisfy Server secondary-side clearance limitation.

Note: The reference design incorporates a T-20 Torx* head fastener. The Torx* head fastener

was chosen to ensure end users do not inadvertently remove the ILM assembly and for consistency with the LGA1366 socket ILM.

Figure 4-3. Shoulder Screw

Thermal/Mechanical Specifications and Design Guidelines 31

Independent Loading Mechanism (ILM)

Step 1 Step 2

Step 3

Step 4

Step 1 Step 2

Step 3

Step 4

Step 1 Step 2

Step 3

Step 4

4.2 Assembly of ILM to a Motherboard

The ILM design allows a bottoms up assembly of the components to the board. See

Figure 4-4 for step by step assembly sequence.

1. Place the back plate in a fixture. The motherboard is aligned with the fixture.

2. Install the shoulder screw in the single hole near Pin 1 of the socket. Torque to a minimum and recommended 8 inch-pounds, but not to exceed 10 inch-pounds.

3. Align and place the ILM cover assembly over the socket.

4. Install two (2) 6-32 fasteners. Torque to a minimum and recommended 8 inchpounds, but not to exceed 10 inch-pounds.

The thread length of the shoulder screw accommodates a nominal board thicknesses of

Figure 4-4. ILM Assembly

0.062”.

32 Thermal/Mechanical Specifications and Design Guidelines

Independent Loading Mechanism (ILM)

Alignment

Features

Load plate not

shown for

clarity

Pin 1

Shoulder Screw

Load Lever

As indicated in Figure 4-5, the shoulder screw, socket protrusion and ILM key features prevent 180 degree rotation of ILM cover assembly with respect to socket. The result is a specific Pin 1 orientation with respect to ILM lever.

Figure 4-5. Pin 1 and ILM Lever

4.3 ILM Interchangeability

ILM cover assemblies and ILM back plates built from the Intel controlled drawings are intended to be interchangeable. Interchangeability is defined as an ILM from Vendor A will demonstrate acceptable manufacturability and reliability with a socket body from Vendor A, B, or C. ILM cover assemblies and ILM back plates from all vendors are also interchangeable.

The ILMs are an integral part of the socket validation testing. ILMs from each vendor will be matrix tested with the socket bodies from each of the current vendors. The tests would include manufacturability, bake and thermal cycling.

See Appendix A for vendor part numbers that were tested.

Note: Desktop and Server ILM backplate/screws are NOT interchangeable. Note: ILMs that are not compliant with the Intel controlled ILM drawings can not be assured

to be interchangeable.

Thermal/Mechanical Specifications and Design Guidelines 33

4.4 Markings

There are four markings on the ILM:

• 115XLM: Font type is Helvetica Bold - minimum 6 point (2.125 mm).

• Manufacturer's insignia (font size at supplier's discretion).

• Lot identification code (allows traceability of manufacturing date and location).

• Pin 1 indicator on the load plate.

All markings must be visible after the ILM is assembled on the motherboard.

115XLM and the manufacturer's insignia can be ink stamped or laser marked on the side wall.

Independent Loading Mechanism (ILM)

34 Thermal/Mechanical Specifications and Design Guidelines

LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications

5 LGA1156 Socket and ILM

Electrical, Mechanical, and Environmental Specifications

This chapter describes the electrical, mechanical, and environmental specifications for the LGA1156 socket and the Independent Loading Mechanism.

5.1 Component Mass

Table 5-1. Socket Component Mass

Component Mass

Socket Body, Contacts and PnP Cover 10 g

ILM Cover 29 g

ILM Back Plate 38 g

5.2 Package/Socket Stackup Height

Tab l e 5- 2 provides the stackup height of a processor in the 1156-land LGA package and

LGA1156 socket with the ILM closed and the processor fully seated in the socket.

Table 5-2. 1156-land Package and LGA1156 Socket Stackup Height

Component Stackup Height Note

Integrated Stackup Height From Top of Board to Top of IHS

Socket Nominal Seating Plane Height 3.4 ± 0.2 mm 1

Package Nominal Thickness (lands to top of IHS) 4.381 ± 0.269 mm 1

Notes:

1. This data is provided for information only, and should be derived from: (a) the height of the socket seating plane above the motherboard after reflow, given in Appendix C, (b) the height of the package, from the package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that are given in the corresponding processor datasheet.

2. The integrated stackup height value is a RSS calculation based on current and planned processors that will use the ILM design.

(mm)

7.781 ± 0.335 mm 2

5.3 Socket Maximum Temperature

The power dissipated within the socket is a function of the current at the pin level and the effective pin resistance. The key temperature limit for the LGA1156 socket is:

• Socket contact interface with package < 100 °C.

Thermal/Mechanical Specifications and Design Guidelines 35

LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications

5.4 Loading Specifications

The socket will be tested against the conditions listed in Chapter 9 with heatsink and the ILM attached, under the loading conditions outlined in this section.

Tabl e 5 - 3 provides load specifications for the LGA1156 socket with the ILM installed.

The maximum limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Exceeding these limits during test may result in component failure. The socket body should not be used as a mechanical reference or load-bearing surface for thermal solutions.

Table 5-3. Socket & ILM Mechanical Specifications

Parameter Min Max Notes

ILM static compressive load on processor IHS 356 N [80 lbf] 600 N [135 lbf] 3, 4, 7, 8

Heatsink static compressive load 0 N [0 lbf] 222 N [50 lbf] 1, 2, 3

Total static compressive Load (ILM plus Heatsink)

Dynamic Compressive Load (with heatsink installed)

Pick & Place cover insertion force N/A 10.2 N [2.3 lbf] -

Pick & Place cover removal force 2.2N [0.5 lbf] 7.56 N [1.7 lbf] 9

Load lever actuation force N/A 38.3 N [8.6 lbf] in the

Maximum heatsink mass N/A 500g 10

356 N [80 lbf] 822 N [185 lbf] 3, 4, 7, 8

N/A 712 N [160 lbf] 1, 3, 5, 6

vertical direction

10.2 N [2.3 lbf] in the lateral direction.

Notes:

1. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface.

2. This is the minimum and maximum static force that can be applied by the heatsink and it’s retention solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated to these limits.

3. Loading limits are for the LGA1156 socket.

4. This minimum limit defines the static compressive force required to electrically seat the processor onto the socket contacts. The minimum load is a beginning of life load.

5. Dynamic loading is defined as a load a 4.3 m/s [170 in/s] minimum velocity change average load superimposed on the static load requirement.

6. Test condition used a heatsink mass of 500gm [1.102 lb] with 50 g acceleration (table input) and an assumed 2X Dynamic Acceleration Factor (DAF). The dynamic portion of this specification in the product application can have flexibility in specific values. The ultimate product of mass times acceleration plus static heatsink load should not exceed this limit.

7. The maximum BOL value and must not be exceeded at any point in the product life.

8. The minimum value is a beginning of life loading requirement based on load degradation over time.

9. The maximum removal force is the flick up removal upwards thumb force (measured at 45 to SMT operation for system assembly. Only the minimum removal force is applicable to vertical removal in SMT operation for system assembly.

10. The maximum heatsink mass includes the heatsink, screws, springs, rings and cups. This mass limit is evaluated using the heatsink attach to the PCB.

), not applicable

36 Thermal/Mechanical Specifications and Design Guidelines

LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications

5.5 Electrical Requirements

LGA1156 socket electrical requirements are measured from the socket-seating plane of the processor to the component side of the socket PCB to which it is attached. All specifications are maximum values (unless otherwise stated) for a single socket contact, but includes effects of adjacent contacts where indicated.

Table 5-4. Electrical Requirements for LGA1156 Socket

Parameter Value Comment

Mated loop inductance, Loop <3.6nH The inductance calculated for two contacts,

Socket Average Contact Resistance (EOL)

Max Individual Contact Resistance (EOL)

Bulk Resistance Increase ≤

Dielectric Withstand Voltage 360 Volts RMS

Insulation Resistance 800 MΩ

19 mOhm The socket average contact resistance target is

100 mOhm The specification listed is at room temperature

3 mΩ The bulk resistance increase per contact from

considering one forward conductor and one return conductor. These values must be satisfied at the worst-case height of the socket.

calculated from the following equation: sum (Ni X LLCRi) / sum (Ni)

• LLCRi is the chain resistance defined as the resistance of each chain minus resistance of shorting bars divided by number of lands in the daisy chain.

• Ni is the number of contacts within a chain.

• I is the number of daisy chain, ranging from 1 to 119 (total number of daisy chains).

The specification listed is at room temperature and has to be satisfied at all time.

and has to be satisfied at all time.

Socket Contact Resistance:

the socket contact, solderball, and interface resistance to the interposer land; gaps included.

25 °C to 100 °C.

The resistance of

Thermal/Mechanical Specifications and Design Guidelines 37

LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications

Establish the market/expected use environment for the technology

Develop Speculative stress conditions based on historical data, content experts, and literature search

Perform stressing to validate accelerated stressing assumptions and determine acceleration factors

Freeze stressing requirements and perform additional data turns

5.6 Environmental Requirements

Design, including materials, shall be consistent with the manufacture of units that meet the following environmental reference points.

The reliability targets in this section are based on the expected field use environment for these products. The test sequence for new sockets will be developed using the knowledge-based reliability evaluation methodology, which is acceleration factor dependent. A simplified process flow of this methodology can be seen in Figure 5-1.

Figure 5-1. Flow Chart of Knowledge-Based Reliability Evaluation Methodology

38 Thermal/Mechanical Specifications and Design Guidelines

A detailed description of this methodology can be found at: ftp://download.intel.com/ technology/itj/q32000/pdf/reliability.pdf.

Thermal Specifications

6 Thermal Specifications

The processor requires a thermal solution to maintain temperatures within its operating limits. Any attempt to operate the processor outside these operating limits may result in permanent damage to the processor and potentially other components within the system. Maintaining the proper thermal environment is key to reliable, long-term system operation.

A complete solution includes both component and system level thermal management features. Component level thermal solutions can include active or passive heatsinks attached to the processor integrated heat spreader (IHS).

This chapter provides data necessary for developing a complete thermal solution. For more information on 1U collaboration thermal solution design, refer to Chapter 8.

6.1 Thermal Specifications

To allow the optimal operation and long-term reliability of Intel processor-based systems, the processor must remain within the minimum and maximum case temperature (T Thermal solutions not designed to provide this level of thermal capability may affect the long-term reliability of the processor and system. For more details on thermal solution design, refer to the Chapter 8.

) specifications as defined by the applicable thermal profile.

CASE

The processors implement a methodology for managing processor temperatures which is intended to support acoustic noise reduction through fan speed control and to assure processor reliability. Selection of the appropriate fan speed is based on the relative temperature data reported by the processor’s Digital Temperature Sensor (DTS). The DTS can be read using the Platform Environment Control Interface (PECI) as described in Section 6.3. Alternatively, when PECI is monitored by the PCH, the processor temperature can be read from the PCH using the SMBus protocol defined in Embedded Controller Support Provided by Platform Controller Hub (PCH). The temperature reported over PECI is always a negative value and represents a delta below the onset of thermal control circuit (TCC) activation, as indicated by PROCHOT# (see Section 6.2, Processor Thermal Features). Systems that implement fan speed control must be designed to use this data. Systems that do not alter the fan speed only need to ensure the case temperature meets the thermal profile specifications.

A single integer change in the PECI value corresponds to approximately 1 °C change in processor temperature. Although each processors DTS is factory calibrated, the accuracy of the DTS will vary from part to part and may also vary slightly with temperature and voltage. In general, each integer change in PECI should equal a temperature change between 0.9 °C and 1.1 °C.

Analysis indicates that real applications are unlikely to cause the processor to consume maximum power dissipation for sustained time periods. Intel recommends that complete thermal solution designs target the Thermal Design Power (TDP), instead of the maximum processor power consumption. The Adaptive Thermal Monitor feature is intended to help protect the processor in the event that an application exceeds the TDP recommendation for a sustained time period. For more details on this feature, refer to

Document Number: 424077 Revision: 2.0Thermal/Mechanical Specifications and Design Guidelines 37

Section 6.2. To ensure maximum flexibility for future processors, systems should be

designed to the Thermal Solution Capability guidelines, even if a processor with lower power dissipation is currently planned.

Table 6-1. Intel® Xeon® Processor 3400 Series Thermal Specifications

Thermal Specifications

Product FMB

Xeon®

Intel processor 3400 series (95W)

Xeon®

Intel processor 3400 series (45W)

2009B

(09B)

2009A

(09A)

Max

Power

Package

C1E

1,2,5,9

(W)

28 22 5.5 95 5 Figure 6-1

21 17 4.0 45 Figure 6-2

Max

Power

Package

1,3,5,9

(W)

Max

Power

Package

1,4,5,9

(W)

TTV

Thermal

Design

Power

6,7

(W)

Min T

CASE

(°C)

& Tab le 6 -2

& Tab le 6 -3

Maximum

Notes:

1. The package C-state power is the worst case power in the system configured as follows:

- Memory configured for DDR3 1333 and populated with 2 DIMM per channel.

- DMI and PCIe links are at L1.

2. Specification at DTS = -50 and minimum voltage loadline.

3. Specification at DTS = -50 and minimum voltage loadline.

4. Specification at DTS = -64 and minimum voltage loadline.

5. These DTS values (in Notes 2-4) are based on the TCC Activation MSR having a value of 100, see

Section 6.2.1.

6. These values are specified at V Systems must be designed to ensure the processor is not to be subjected to any static V combination wherein V the EDS.

7. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the maximum power that the processor can dissipate. TDP is measured at DTS = -1. TDP is achieved with the Memory configured for DDR3 1333 and 2 DIMMs per channel.

8. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor frequency requirements. The FMB 2009B (09B) is equivalent to the thermal requirements for the Intel® Core™ 2 Quad Q9000 processor series. The FMB 2009A (09A) is equivalent to the thermal requirements for the Intel® Core™ 2 Duo E8000 processor series. Reuse of those thermal solutions is recommended with the updated mechanical attach to straddle the LGA1156 socket.

9. Not 100% tested. Specified by design characterization.

exceeds V

CCP

CC_MAX

and V

CCP_MAX

for all other voltage rails for all processor frequencies.

NOM

at specified I

. Please refer to the loadline specifications in

CCP

and ICC

TTV

TCASE

(°C)

38 Document Number: 424077 Revision: 2.0Thermal/Mechanical Specifications and Design Guidelines

Thermal Specifications

TTV Therma l Pr of i le

Y = Power x 0.29 + 45.1

40.0

45.0

50.0

55.0

60.0

65.0

70.0

75.0

0 20406080100

TTV Powe r (W)

TTV Case Tem p eratu re (°C)

6.1.1 Intel® Xeon® Processor 3400 Series (95W) Thermal Profile

Figure 6-1. Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor 3400 Series

(95W)

Notes:

1. Please refer to Tab le 6 -2 for discrete points that constitute the thermal profile.

2. Refer to Chapter 8 and Chapter 9 for system and environmental implementation details.

Document Number: 424077 Revision: 2.0Thermal/Mechanical Specifications and Design Guidelines 39

Thermal Specifications

Table 6-2. Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor 3400 Series

(95W)

Power (W) T

0 45.1 50 59.6

2 45.7 52 60.2

4 46.3 54 60.8

6 46.8 56 61.3

8 47.4 58 61.9

10 48.0 60 62.5

12 48.6 62 63.1

14 49.2 64 63.7

16 49.7 66 64.2

18 50.3 68 64.8

20 50.9 70 65.4

22 51.5 72 66.0

24 52.1 74 66.6

26 52.6 76 67.1

28 53.2 78 67.7

30 53.8 80 68.3

32 54.4 82 68.9

34 55.0 84 69.5

36 55.5 86 70.0

38 56.1 88 70.6

40 56.7 90 71.2

42 57.3 92 71.8

44 57.9 94 72.4

46 58.4 95 72.7

48 59.0

CASE_MAX

(° C) Power (W) T

CASE_MAX

(° C)

40 Document Number: 424077 Revision: 2.0Thermal/Mechanical Specifications and Design Guidelines

Thermal Specifications

6.1.2 Intel® Xeon® Processor 3400 Series (45W) Thermal Profile

Figure 6-2. Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor 3400 Series

(45W)

Notes:

1. Please refer to Tab le 6 -3 for discrete points that constitute the thermal profile.

2. Refer to Chapter 8 and Chapter 9 for system and environmental implementation details.

Table 6-3. Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor 3400 Series

(45W)

Power (W) T

0 45.2 24 52.2

2 45.8 26 52.7

4 46.4 28 53.3

6 46.9 30 53.9

8 47.5 32 54.5

10 48.1 34 55.1

12 48.7 36 55.6

14 49.3 38 56.2

16 49.8 40 56.8

18 50.4 42 57.4

20 51.0 44 58.0

22 51.6 45 58.3

CASE_MAX

(° C) Power (W) T

CASE_MAX

(° C)

Document Number: 424077 Revision: 2.0Thermal/Mechanical Specifications and Design Guidelines 41

Thermal Specifications

6.1.3 Processor Specification for Operation Where Digital Thermal Sensor Exceeds T

When the DTS value is less than T the speed of the thermal solution fan. This remains the same as with the previous guidance for fan speed control.

CONTROL

, the fan speed control algorithm can reduce

During operation, when the DTS value is greater than T algorithm must drive the fan speed to meet or exceed the target thermal solution performance (ΨCA) shown in Tabl e 6- 4 for the Intel® Xeon® processor 3400 series (95

W), Tab l e 6- 5 for the Intel

Xeon® processor 3400 series (45W) . To get the full

acoustic benefit of the DTS specification, ambient temperature monitoring is necessary.

Table 6-4. Thermal Solution Performance above T

3400 Series (95W)

AMBIENT

45.1 0.290 0.290

44.0 0.310 0.301

43.0 0.328 0.312

42.0 0.346 0.322

41.0 0.364 0.333

40.0 0.383 0.343

39.0 0.401 0.354

38.0 0.419 0.364

37.0 0.437 0.375

36.0 0.455 0.385

35.0 0.473 0.396

34.0 0.491 0.406

33.0 0.510 0.417

32.0 0.528 0.427

31.0 0.546 0.438

30.0 0.564 0.448

29.0 0.582 0.459

28.0 0.600 0.469

27.0 0.618 0.480

26.0 0.637 0.491

25.0 0.655 0.501

24.0 0.673 0.512

23.0 0.691 0.522

22.0 0.709 0.533

21.0 0.727 0.543

20.0 0.746 0.554

DTS = T

CONTROL

, the fan speed control

for the Intel® Xeon® Processor

DTS = -1

Notes:

1. The ambient temperature is measured at the inlet to the processor thermal solution.

2. This column can be expressed as a function of T

= 0.29 + (45.1 - T

3. This column can be expressed as a function of T

= 0.29 + (45.1 - T

42 Document Number: 424077 Revision: 2.0Thermal/Mechanical Specifications and Design Guidelines

AMBIENT

) x 0.0181

) x 0.0105

by the following equation:

AMBIENT

by the following equation:

AMBIENT

Thermal Specifications

Table 6-5. Thermal Solution Performance above T

3400 Series (45W)

AMBIENT

45.2 0.290 0.289

44.0 0.332 0.316

43.0 0.368 0.338

42.0 0.403 0.360

41.0 0.438 0.382

40.0 0.473 0.404

39.0 0.509 0.427

38.0 0.544 0.449

37.0 0.579 0.471

36.0 0.615 0.493

35.0 0.650 0.516

34.0 0.685 0.538

33.0 0.720 0.560

32.0 0.756 0.582

31.0 0.791 0.604

30.0 0.826 0.627

29.0 0.861 0.649

28.0 0.897 0.671

27.0 0.932 0.693

26.0 0.967 0.716

25.0 1.003 0.738

24.0 1.038 0.760

23.0 1.073 0.782

22.0 1.108 0.804

21.0 1.114 0.827

20.0 1.179 0.849

DTS = T

CONTROL

for the Intel® Xeon® Processor

DTS = -1

Notes:

1. The ambient temperature is measured at the inlet to the processor thermal solution.

2. This column can be expressed as a function of T

3. This column can be expressed as a function of T

= 0.29 + (45.2 - T

= 0.289 + (45.2 - T

AMBIENT

) x 0.0353

) x 0.0222

by the following equation:

AMBIENT

by the following equation:

AMBIENT

Document Number: 424077 Revision: 2.0Thermal/Mechanical Specifications and Design Guidelines 43

6.1.4 Thermal Metrology

37.5

Measure T

CASE

the geometric

center of the

package

Thermal Specifications

The maximum TTV case temperatures (T appropriate TTV thermal profile earlier in this chapter. The TTV T geometric top center of the TTV integrated heat spreader (IHS). Figure 6-3 illustrates the location where T

temperature measurements should be made. See Figure B-15

CASE

for drawings showing the thermocouple attach to the TTV package.

Figure 6-3. TTV Case Temperature (T

CASE-MAX

) Measurement Location

CASE

) can be derived from the data in the

is measured at the

CASE

Note: The following supplier can machine the groove and attach a thermocouple to the IHS.

The supplier is listed the table below as a convenience to Intel’s general customers and the list may be subject to change without notice. THERM-X OF CALIFORNIA, 1837 Whipple Road, Hayward, Ca 94544. Ernesto B Valencia +1-510-441-7566 Ext. 242 ernestov@therm-x.com. The vendor part number is XTMS1565.

6.2 Processor Thermal Features

6.2.1 Processor Temperature

A new feature in the processors is a software readable field in the IA32_TEMPERATURE_TARGET register that contains the minimum temperature at which the TCC will be activated and PROCHOT# will be asserted. The TCC activation temperature is calibrated on a part-by-part basis and normal factory variation may result in the actual TCC activation temperature being higher than the value listed in the register. TCC activation temperatures may change based on processor stepping,

6.2.2 Adaptive Thermal Monitor

frequency or manufacturing efficiencies.

The Adaptive Thermal Monitor feature provides an enhanced method for controlling the processor temperature when the processor silicon exceeds the Thermal Control Circuit (TCC) activation temperature. Adaptive Thermal Monitor uses TCC activation to reduce processor power via a combination of methods. The first method (Frequency/VID

44 Document Number: 424077 Revision: 2.0Thermal/Mechanical Specifications and Design Guidelines

Thermal Specifications

control, similar to Intel® Thermal Monitor 2 (TM2) in previous generation processors) involves the processor reducing its operating frequency (using the core ratio multiplier) and input voltage (using the VID signals). This combination of lower frequency and VID results in a reduction of the processor power consumption. The second method (clock modulation, known as Intel processors) reduces power consumption by modulating (starting and stopping) the internal processor core clocks. The processor intelligently selects the appropriate TCC method to use on a dynamic basis. BIOS is not required to select a specific method (as with previous-generation processors supporting TM1 or TM2). The temperature at which Adaptive Thermal Monitor activates the Thermal Control Circuit is factory calibrated and is not user configurable. Snooping and interrupt processing are performed in the normal manner while the TCC is active.

When the TCC activation temperature is reached, the processor will initiate TM2 in attempt to reduce its temperature. If TM2 is unable to reduce the processor temperature then TM1 will be also be activated. TM1 and TM2 will work together (clocks will be modulated at the lowest frequency ratio) to reduce power dissipation and temperature.

With a properly designed and characterized thermal solution, it is anticipated that the TCC would only be activated for very short periods of time when running the most power intensive applications. The processor performance impact due to these brief periods of TCC activation is expected to be so minor that it would be immeasurable. An under-designed thermal solution that is not able to prevent excessive activation of the TCC in the anticipated ambient environment may cause a noticeable performance loss, and in some cases may result in a T temperature and may affect the long-term reliability of the processor. In addition, a thermal solution that is significantly under-designed may not be capable of cooling the processor even when the TCC is active continuously. Refer to the appropriate Thermal Mechanical Design Guidelines for information on designing a compliant thermal solution.

Thermal Monitor 1 or TM1 in previous generation

that exceeds the specified maximum

CASE

The Intel Thermal Monitor does not require any additional hardware, software drivers, or interrupt handling routines. The following sections provide more details on the different TCC mechanisms used by the processor.

6.2.2.1 Frequency/VID Control

When the Digital Temperature Sensor (DTS) reaches a value of 0 (DTS temperatures reported using PECI may not equal zero when PROCHOT# is activated, see Section 6.3 for further details), the TCC will be activated and the PROCHOT# signal will be asserted. This indicates the processors' temperature has met or exceeded the factory calibrated trip temperature and it will take action to reduce the temperature.

Upon activation of the TCC, the processor will stop the core clocks, reduce the core ratio multiplier by 1 ratio, and restart the clocks. All processor activity stops during this frequency transition that occurs within 2 us. Once the clocks have been restarted at the new lower frequency, processor activity resumes while the voltage requested by the VID lines is stepped down to the minimum possible for the particular frequency. Running the processor at the lower frequency and voltage will reduce power consumption and should allow the processor to cool off. If after 1 ms the processor is still too hot (the temperature has not dropped below the TCC activation point, DTS still = 0, and PROCHOT# is still active), then a second frequency and voltage transition will

Document Number: 424077 Revision: 2.0Thermal/Mechanical Specifications and Design Guidelines 45

take place. This sequence of temperature checking and Frequency/VID reduction will

Temperatu re

MAX

VIDf

MAX

VID

Frequency

VIDf

PROCHOT#

Temperatu re

MAX

VIDf

MAX

VID

Frequency

VIDf

PROCHOT#

continue until either the minimum frequency has been reached or the processor temperature has dropped below the TCC activation point.

If the processor temperature remains above the TCC activation point even after the minimum frequency has been reached, then clock modulation (described below) at that minimum frequency will be initiated.

There is no end user software or hardware mechanism to initiate this automated TCC activation behavior.

A small amount of hysteresis has been included to prevent rapid active/inactive transitions of the TCC when the processor temperature is near the TCC activation temperature. Once the temperature has dropped below the trip temperature, and the hysteresis timer has expired, the operating frequency and voltage transition back to the normal system operating point using the intermediate VID/frequency points. Transition of the VID code will occur first, to insure proper operation as the frequency is increased. Refer to Tabl e 6- 4 for an illustration of this ordering.

Figure 6-4. Frequency and Voltage Ordering

Thermal Specifications

6.2.2.2 Clock Modulation

Clock modulation is a second method of thermal control available to the processor. Clock modulation is performed by rapidly turning the clocks off and on at a duty cycle that should reduce power dissipation by about 50% (typically a 30–50% duty cycle). Clocks often will not be off for more than 32 microseconds when the TCC is active. Cycle times are independent of processor frequency. The duty cycle for the TCC, when activated by the Intel

It is possible for software to initiate clock modulation with configurable duty cycles.

46 Document Number: 424077 Revision: 2.0Thermal/Mechanical Specifications and Design Guidelines

Thermal Monitor, is factory configured and cannot be modified.

Thermal Specifications

A small amount of hysteresis has been included to prevent rapid active/inactive transitions of the TCC when the processor temperature is near its maximum operating temperature. Once the temperature has dropped below the maximum operating temperature, and the hysteresis timer has expired, the TCC goes inactive and clock modulation ceases.

6.2.2.3 Immediate Transition to combined TM1 and TM2

As mentioned above, when the TCC is activated, the processor will sequentially step down the ratio multipliers and VIDs in an attempt to reduce the silicon temperature. If the temperature continues to increase and exceeds the TCC activation temperature by approximately 5 °C before the lowest ratio/VID combination has been reached, then the processor will immediately transition to the combined TM1/TM2 condition. The processor will remain in this state until the temperature has dropped below the TCC activation point. Once below the TCC activation temperature, TM1 will be discontinued and TM2 will be exited by stepping up to the appropriate ratio/VID state.

6.2.2.4 Critical Temperature Flag

If TM2 is unable to reduce the processor temperature, TM1 will also be activated. TM1 and TM2 will then work together to reduce power dissipation and temperature. It is expected that only a catastrophic thermal solution failure would create a situation where both TM1 and TM2 are active.

If TM1 and TM2 have both been active for greater than 20 ms and the processor temperature has not dropped below the TCC activation point, then the Critical Temperature Flag in the IA32_THERM_STATUS MSR will be set. This flag is an indicator of a catastrophic thermal solution failure and that the processor cannot reduce its temperature. Unless immediate action is taken to resolve the failure, the processor will probably reach the Thermtrip temperature (see Section 6.2.3 Thermtrip Signal) within a short time. In order to prevent possible permanent silicon damage, Intel recommends removing power from the processor within ½ second of the Critical Temperature Flag being set.

6.2.2.5 PROCHOT# Signal

An external signal, PROCHOT# (processor hot), is asserted when the processor core temperature has exceeded its specification. If Adaptive Thermal Monitor is enabled (note it must be enabled for the processor to be operating within specification), the TCC will be active when PROCHOT# is asserted.

The processor can be configured to generate an interrupt upon the assertion or deassertion of PROCHOT#.

Although the PROCHOT# signal is an output by default, it may be configured as bidirectional. When configured in bi-directional mode, it is either an output indicating the processor has exceeded its TCC activation temperature or it can be driven from an external source (such as a voltage regulator) to activate the TCC. The ability to activate the TCC using PROCHOT# can provide a means for thermal protection of system components.

As an output, PROCHOT# (Processor Hot) will go active when the processor temperature monitoring sensor detects that one or more cores has reached its maximum safe operating temperature. This indicates that the processor Thermal Control Circuit (TCC) has been activated, if enabled. As an input, assertion of PROCHOT# by the system will activate the TCC for all cores. TCC activation when PROCHOT# is asserted by the system will result in the processor immediately

Document Number: 424077 Revision: 2.0Thermal/Mechanical Specifications and Design Guidelines 47

Thermal Specifications

transitioning to the minimum frequency and corresponding voltage (using Freq/VID control). Clock modulation is not activated in this case. The TCC will remain active until the system de-asserts PROCHOT#.

Use of PROCHOT# in bi-directional mode can allow VR thermal designs to target maximum sustained current instead of maximum current. Systems should still provide proper cooling for the VR, and rely on PROCHOT# only as a backup in case of system cooling failure. The system thermal design should allow the power delivery circuitry to operate within its temperature specification even while the processor is operating at its Thermal Design Power.

6.2.3 THERMTRIP# Signal

Regardless of whether or not Adaptive Thermal Monitor is enabled, in the event of a catastrophic cooling failure, the processor will automatically shut down when the silicon has reached an elevated temperature. At this point, the THERMTRIP# signal will go active and stay active as described in the datasheet. THERMTRIP# activation is independent of processor activity. The temperature at which THERMTRIP# asserts is not user configurable and is not software visible.

6.3 Platform Environment Control Interface (PECI)

6.3.1 Introduction

The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices. The processor implements a PECI interface to allow communication of processor thermal and other information to other devices on the platform. The processor provides a digital thermal sensor (DTS) for fan speed control. The DTS is calibrated at the factory to provide a digital representation of relative processor temperature. Instantaneous temperature readings from the DTS are available using the IA32_TEMPXXXX MSR; averaged DTS values are read using the PECI interface.

The PECI physical layer is a self-clocked one-wire bus that begins each bit with a driven, rising edge from an idle level near zero volts. The duration of the signal driven high depends on whether the bit value is a logic '0' or logic '1'. PECI also includes variable data transfer rate established with every message. The single wire interface provides low board routing overhead for the multiple load connections in the congested routing area near the processor and chipset components. Bus speed, error checking, and low protocol overhead provides adequate link bandwidth and reliability to transfer critical device operating conditions and configuration information.

The PECI bus offers:

• A wide speed range from 2 Kbps to 2 Mbps

• CRC check byte used to efficiently and automatically confirm accurate data delivery

• Synchronization at the beginning of every message minimizes device timing accuracy requirements.

Generic PECI specification details are out of the scope of this document. What follows is a processor-specific PECI client definition, and is largely an addendum to the PECI Network Layer and Design Recommendations sections for the PECI 2.0 specification

For system temperature monitoring and fan speed control management purposes, the PECI 2.0

48 Document Number: 424077 Revision: 2.0Thermal/Mechanical Specifications and Design Guidelines

document.

Thermal Specifications

commands that are commonly implemented include Ping() , GetDIB() and GetTemp().

Table 6-6. Supported PECI Command Functions and Codes

Command Function

Ping() Yes 1

GetDIB() Yes 1

GetTemp() Yes 1

Note:

1. Thermal management related commands supported by the processor. Common command that will be implemented for system design.

6.3.2 PECI Client Capabilities

The processor PECI clients are designed to support processor thermal management.

Processor fan speed control is managed by comparing DTS temperature data against the processor-specific value stored in the static variable, T temperature data is less than T speed of the thermal solution fan. This remains the same as with the previous guidance for fan speed control. Refer to Section 6.1.3 for guidance where the DTS temperature data exceeds T

CONTROL

The DTS temperature data is delivered over PECI, in response to a GetTemp() command, and reported as a relative value to TCC activation target. The temperature data reported over PECI is always a negative value and represents a delta below the onset of thermal control circuit (TCC) activation, as indicated by PROCHOT#. Therefore, as the temperature approaches TCC activation, the value approaches zero degrees.

CONTROL

Supported on the

processor

CONTROL

Note

. When the DTS

, the fan speed control algorithm can reduce the

6.3.3 Temperature Data

6.3.3.1 Format

The temperature is formatted in a 16-bit, 2’s complement value representing a number of 1/64 degrees centigrade. This format allows temperatures in a range of ±512 °C to be reported to approximately a 0.016 °C resolution.

Figure 6-5. Temperature Sensor Data Format

MSB Upper nibble

S x x x x x x x x x x x x x x x

Sign Integer Value (0-511) Fractional Value (~0.016)

6.3.3.2 Interpretation

The resolution of the processor’s Digital Thermal Sensor (DTS) is approximately 1 °C. PECI temperatures are sent through a configurable low-pass filter prior to delivery in the GetTemp() response data. The output of this filter produces temperatures at the full 1/64 °C resolution even though the DTS itself is not this accurate.

MSB Lower nibble

LSB Upper nibble

LSB Lower nibble

Document Number: 424077 Revision: 2.0Thermal/Mechanical Specifications and Design Guidelines 49

Temperature readings from the processor are always negative in a 2’s complement format, and imply an offset from the reference TCC activation temperature. As an example, assume that the TCC activation temperature reference is 100 °C. A PECI thermal reading of -10 indicates that the processor is running at approximately 10 °C below the TCC activation temperature, or 90 °C. PECI temperature readings are not reliable at temperatures above TCC activation (since the processor is operating out of specification at this temperature). Therefore, the readings are never positive.

Note that changes in PECI data counts are approximately linear in relation to changes in temperature in degrees centigrade. A change of ‘1’ in the PECI count represents roughly a temperature change of 1 degree centigrade. This linearity is approximate and cannot be ensured over the entire range of PECI temperatures, especially as the delta from the maximum PECI temperature (zero) increases.

6.3.3.3 Processor Thermal Data Sample Rate and Filtering

The processor digital thermal sensor (DTS) provides an improved capability to monitor device hot spots, which inherently leads to more varying temperature readings over short time intervals. To reduce the sample rate requirements on PECI and improve thermal data stability versus time the processor DTS implements an averaging algorithm that filters the incoming data before reporting it over PECI.

6.3.3.4 Reserved Values

Thermal Specifications

Several values well out of the operational range are reserved to signal temperature sensor errors. These are summarized in Tabl e 6- 7 .

Table 6-7. Error Codes and Descriptions

Error Code Description

8000h General Sensor Error (GSE)

8002h

Sensor is operational, but has detected a temperature below its operational range (underflow)

50 Document Number: 424077 Revision: 2.0Thermal/Mechanical Specifications and Design Guidelines

Sensor Based Thermal Specification Design Guidance

7 Sensor Based Thermal

Specification Design Guidance

The sensor based thermal specification presents opportunities for the system designer to optimize the acoustics and simplify thermal validation. The sensor based specification uses the Digital Thermal Sensor information accessed using the PECI interface.

This chapter will review thermal solution design options, fan speed control design guidance and implementation options and suggestions on validation both with the TTV and the live die in a shipping system.

7.1 Sensor Based Specification Overview

Create a thermal specification that meets the following requirements:

• Use Digital Thermal Sensor (DTS) for real-time thermal specification compliance.

• Single point of reference for thermal specification compliance over all operating conditions.

• Does not require measuring processor power and case temperature during functional system thermal validation.

• Opportunity for acoustic benefits for DTS values between T

CONTROL

and -1.

Thermal specifications based on the processor case temperature have some notable gaps to optimal acoustic design. When the ambient temperature is less than the maximum design point, the fan speed control system (FSC) will over cool the processor. The FSC has no feedback mechanism to detect this over cooling, this is shown in the top half of Figure 7-1.

The sensor based specification will allow the FSC to be operated at the maximum allowable silicon temperature or T acoustics for operation above T

for the measured ambient. This will provide optimal

CONTROL

. See lower half of Figure 7-1.

Thermal/Mechanical Specifications and Design Guidelines 53

Sensor Based Thermal Specification Design Guidance

Power

Sensor Based Specification (DTS Temp)

TDP

Tcontrol

Ta = 30 C

Ψ-ca = 0.564

Ψ-ca = 0.448

Power

Current Specification (Case Temp)

TDP

Tcontrol

Ta = 45.1 °C

Ta = 30 °C Ψ-ca = 0.292

Power

Sensor Based Specification (DTS Temp)

TDP

Tcontrol

Ta = 30 C

Ψ-ca = 0.564

Ψ-ca = 0.448

Power

Current Specification (Case Temp)

TDP

Tcontrol

Ta = 45.1 °C

Ta = 30 °C Ψ-ca = 0.292

Figure 7-1. Comparison of Case Temperature versus Sensor Based Specif icati on

7.2 Sensor Based Thermal Specification

The sensor based thermal specification consists of two parts. The first is a thermal profile that defines the maximum TTV T thermal profile defines the boundary conditions for validation of the thermal solution.

The second part is a defined thermal solution performance (Ψ DTS value as reported over the PECI bus when DTS is greater than T defines the operational limits for the processor using the TTV validated thermal solution.

as a function of TTV power dissipation. The

CASE

) as a function of the

CONTROL

. This

54 Thermal/Mechanical Specifications and Design Guidelines

Sensor Based Thermal Specification Design Guidance

TTV Therma l Pr of i le

Y = Power x 0.29 + 45.1

40.0

45.0

50.0

55.0

60.0

65.0

70.0

75.0

0 20406080100

TTV Powe r (W)

TTV Case Tem p eratu re (°C)

7.2.1 TTV Thermal Profile

For the sensor-based specification the only reference made to a case temperature measurement is on the TTV. Functional thermal validation will not require the user to apply a thermocouple to the processor package or measure processor power.

Note: All functional compliance testing will be based on fan speed response to the reported

DTS values above T will be necessary.

A knowledge of the system boundary conditions is necessary to perform the heatsink validation. Section 7.3.1 will provide more detail on defining the boundary conditions. The TTV is placed in the socket and powered to the recommended value to simulate the TDP condition. See Figure 7-2 for an example of the Intel series (95W) TTV thermal profile.

Figure 7-2. Intel

CONTROL

Xeon® Processor 3400 Series (95W) Thermal Profile

. As a result no conversion of TTV T

Xeon® processor 3400

to processor T

CASE

Note: This graph is provided as a reference, the complete thermal specification is in

Chapter 6.

7.2.2 Specification When DTS value is Greater than T

Thermal/Mechanical Specifications and Design Guidelines 55

The product specification provides a table of ΨCA values at DTS = T DTS = -1 as a function of T points, a linear interpolation can be done for any DTS value reported by the processor.

The fan speed control algorithm has enough information using only the DTS value and T

AMBIENT

part on the thermal profile.

to command the thermal solution to provide just enough cooling to keep the

AMBIENT

(inlet to heatsink). Between these two defined

CONTROL

and

Sensor Based Thermal Specification Design Guidance

In the prior thermal specifications this region, DTS values greater than T defined by the processor thermal profile. This required the user to estimate the processor power and case temperature. Neither of these two data points are accessible in real time for the fan speed control system. As a result the designer had to assume the worst case T

AMBIENT

and drive the fans to accommodate that boundary condition.

7.3 Thermal Solution Design Process

Thermal solution design guidance for this specification is the same as with previous products. The initial design needs to take into account the target market and overall product requirements for the system. This can be broken down into several steps:

• Boundary condition definition

• Thermal design / modelling

•Thermal testing

CONTROL

, was

56 Thermal/Mechanical Specifications and Design Guidelines

Sensor Based Thermal Specification Design Guidance

0.0

10.0

20.0

30.0

40.0

50.0

60.0

70.0

80.0

0 20406080

TTV Pow er Dissi pation (W)

TTV Tcase (°C)

Ψ-ca = 0.45 Ta = 30 °C

Ψ-ca = 0.40 Ta = 35 °C

Ψ-ca = 0.34 Ta = 40 ° C

Ψ-ca = 0.29 Ta = 45.1 °C

7.3.1 Boundary Condition Definition

Using the knowledge of the system boundary conditions such as inlet air temperature, acoustic requirements, cost, design for manufacturing, package and socket mechanical specifications and chassis environmental test limits the designer can make informed thermal solution design decisions.

For the Intel for a 1U Server system are as follows:

•T

EXTERNAL

•T

RISE

•T

AMBIENT

Xeon® processor 3400 series (95W), the thermal boundary conditions

= 35 °C. This is typical of a maximum system operating environment

= 5 °C

= 40 °C (T

AMBIENT

= T

EXTERNAL

+ T

RISE

)

Based on the system boundary conditions the designer can select a T use in thermal modelling. The assumption of a T required Ψ assumed T

needed to meet TTV T

AMBIENT

can utilize a design with a higher ΨCA, which can have a lower cost.

Figure 7-3 shows a number of satisfactory solutions for the Intel® Xeon® processor

3400 series (95W).

Note: If the assumed T

thermal solution performance may not be sufficient to meet the product requirements.

AMBIENT

is inappropriate for the intended system environment, the

The results may be excessive noise from fans having to operate at a speed higher than intended. In the worst case this can lead to performance loss with excessive activation of the Thermal Control Circuit (TCC).

Figure 7-3. Required ΨCA for Various T

CASEMAX

AMBIENT

has a significant impact on the

at TDP. A system that can deliver lower

Conditions

and ΨCA to

Note: If an ambient of greater than 45.1 °C is necessary based on the boundary conditions a

thermal solution with a Ψ

lower than 0.29 °C/W will be required.

Thermal/Mechanical Specifications and Design Guidelines 57

Sensor Based Thermal Specification Design Guidance

7.3.2 Thermal Design and Modelling

Based on the boundary conditions the designer can now make the design selection of the thermal solution components. The major components that can be mixed are the fan, fin geometry, heat pipe or air duct design. There are cost and acoustic trade-offs the customer can make.

7.3.3 Thermal Solution Validation

7.3.3.1 Test for Compliance with the TTV Thermal Profile

This step is the same as previously suggested for prior products. The thermal solution is mounted on a test fixture with the TTV and tested at the following conditions:

• TTV is powered to the TDP condition

• Maximum airflow through heatsink

•T

AMBIENT

at the boundary condition from Section 7.3.1

The following data is collected: TTV power, TTV T calculate Ψ

which is defined as:

ΨCA = (TTV T

CASE

– T

AMBIENT

) / Power

CASE

, and T

AMBIENT

. This is used to

This testing is best conducted on a bench to eliminate as many variables as possible when assessing the thermal solution performance. The boundary condition analysis as described in Section 7.3.1 should help in making the bench test simpler to perform.

7.3.3.2 Thermal Solution Characterization for Fan Speed Control

The final step in thermal solution validation is to establish the thermal solution performance,ΨCA and acoustics as a function of fan speed. This data is necessary to allow the fan speed control algorithm developer to program the device. It also is needed to asses the expected acoustic impact of the processor thermal solution in the system.

The fan speed control device may modulate the thermal solution fan speed (RPM) by one of two methods. The first and preferred is pulse width modulation (PWM) signal compliant with the 4-Wire Pulse Width Modulation (PWM) Controlled Fans specification. the alternative is varying the input voltage to the fan. As a result the characterization data needs to also correlate the RPM to PWM or voltage to the thermal solution fan. The fan speed algorithm developer needs to associate the output command from the fan speed control device with the required thermal solution performance. Regardless of which control method is used, the term RPM will be used to indicate required fan speed in the rest of this document.

7.4 Fan Speed Control (FSC) design process

The next step is to incorporate the thermal solution characterization data into the algorithms for the device controlling the fans.

As a reminder, the requirements are:

• When the DTS value is at or below T

CONTROL

as with prior processors.

58 Thermal/Mechanical Specifications and Design Guidelines

, the fans can be slowed down — just

Sensor Based Thermal Specification Design Guidance

•When DTS is above T

CONTROL

, FSC algorithms will use knowledge of T

AMBIENT

and

ΨCA versus RPM to achieve the necessary level of cooling.

This chapter will discuss two implementations. The first is a FSC system that is not provided the T current T

AMBIENT

information and a FSC system that is provided data on the

. Either method will result in a thermally compliant solution and some acoustic benefit by operating the processor closer to the thermal profile. But only the T

AMBIENT

aware FSC system can fully use the specification for optimized acoustic

performance.

In the development of the FSC algorithm it should be noted that the T

AMBIENT

is expected to change at a significantly slower rate than the DTS value. The DTS value will be driven by the workload on the processor and the thermal solution will be required to respond to this much more rapidly than the changes in T

AMBIENT

An additional consideration in establishing the fan speed curves is to account for the thermal interface material performance degradation over time.

Thermal/Mechanical Specifications and Design Guidelines 59

7.5 System Validation

System validation should focus on ensuring the fan speed control algorithm is responding appropriately to the DTS values and T device being monitored for thermal compliance.

Since the processor thermal solution has already been validated using the TTV to the thermal specifications at the predicted T chassis is not expected to be necessary.

Once the heatsink has been demonstrated to meet the TTV Thermal Profile, it should be evaluated on a functional system at the boundary conditions.

In the system under test and Power/Thermal Utility Software set to dissipate the TDP workload confirm the following item:

• Verify if there is TCC activity by instrumenting the PROCHOT# signal from the processor. TCC activation in functional application testing is unlikely with a compliant thermal solution. Some very high power applications might activate TCC for short intervals this is normal.

• Verify fan speed response is within expectations — actual RPM (Ψ with DTS temperature and T

• Verify RPM versus PWM command (or voltage) output from the FSC device is within expectations.

• Perform sensitivity analysis to asses impact on processor thermal solution performance and acoustics for the following:

— Other fans in the system. — Other thermal loads in the system.

AMBIENT

Sensor Based Thermal Specification Design Guidance

data as well as any other

) is consistent

AMBIENT

, additional TTV based testing in the

In the same system under test, run real applications that are representative of the expected end user usage model and verify the following:

• Verify fan speed response vs. expectations as done using Power/Thermal Utility SW

• Validate system boundary condition assumptions: Trise, venting locations, other thermal loads and adjust models / design as required.

60 Thermal/Mechanical Specifications and Design Guidelines

1U Collaboration Thermal Solution

8 1U Collaboration Thermal

Solution

Note: The collaboration thermal mechanical solution information shown in this document

represents the current state of the data and may be subject to modification.The information represents design targets, not commitments by Intel.

This section describes the overall requirements for enabled thermal solutions designed to cool the Intel

Xeon® processor 3400 series including critical to function

dimensions, operating environment and validation criteria in 1U server system.

8.1 Performance Targets

Tab l e 8- 1 provides boundary conditions and performance targets for a 1U heatsink to

cool Intel® Xeon® processor 3400 series in 1U server. These values are used to provide guidance for heatsink design.

Table 8-1. Boundary Conditions and Performance Targets

Processor Altitude

Intel® Xeon®

Processor 3400

Series(95W)

Intel

Xeon®

Processor 3400

Series(45W)

Notes:

1. The values in Table 8 -1 are from final design review.

2. Max target (mean + 3 sigma) for thermal characterization parameter.

3. Airflow through the heatsink fins with zero bypass.

4. Max target for pressure drop (dP) measured in inches H

Sea Level 95W 40°C 0.34W/°C 15CFM 0.383

Sea Level 45W 40°C 0.40W/°C 15CFM 0.383

For 1U collaboration heatsink, see Appendix B for detailed drawings. Table 8-1 specifies

and pressure drop targets at 15.0 CFM. Figure 8-1 shows ΨCAand pressure drop for

the 1U heatsink versus the airflow provided. Best-fit equations are provided to prevent errors associated with reading the graph.

Thermal

Design Power

TTV Target

Ψca

Air Flow

Pressure

Drop

Figure 8-1. 1U Heatsink Performance Curves

1U Collaboration Thermal Solution

Collaboration thermal solution Ψca(mean+3sigma) is computed to 0.319°C/W at the airflow of 15 CFM. As the Tabl e 8 - 1 shown when T thermal solution of this heatsink is calculated as:

where,

Y=Processor T

X=Processor Power Value (W)

Tabl e 8 - 2 shows thermal solution performance is compliant with Intel

processor 3400 series(95W) TTV thermal profile specification. At the TDP(95W) with local ambient of 40°C, there is a 2.4 °C margin.

Note: Intel

LGA1156 Processors.

is 40 °C, equation representing

Y=0.319*X+40

Value (°C)

CASE

Xeon®

Xeon® processor 3400 series (95W) TTV thermal profile is the worst case of

1U Collaboration Thermal Solution

Figure 8-2. 1U Heatsink Performance Curves

Table 8-2. Comparison between TTV Thermal Profile and Thermal Solution Performance

for Intel® Xeon® Processor 3400 Series (95W) (Sheet 1 of 2)

Power (W)

TTV T

CASE_MAX

(°C)

Thermal Solution

CASE_MAX

(°C)

Power (W)

TTV T

CASE_MAX

(°C)

0 45.1 40.0 50 59.6 56.0

2 45.7 40.6 52 60.2 56.6

4 46.3 41.3 54 60.8 57.2

6 46.8 41.9 56 61.3 57.9

8 47.4 42.6 58 61.9 58.5

10 48.0 43.2 60 62.5 59.1

12 48.6 43.8 62 63.1 59.8

14 49.2 44.5 64 63.7 60.4

16 49.7 45.1 66 64.2 61.1

18 50.3 45.7 68 64.8 61.7

20 50.9 46.4 70 65.4 62.3

22 51.5 47.0 72 66.0 63.0

24 52.1 47.7 74 66.6 63.6

26 52.6 48.3 76 67.1 64.2

28 53.2 48.9 78 67.7 64.9

30 53.8 49.6 80 68.3 65.5

32 54.4 50.2 82 68.9 66.2

34 55.0 50.8 84 69.5 66.8

36 55.5 51.5 86 70.0 67.4

Thermal Solution

CASE_MAX

(°C)

1U Collaboration Thermal Solution

Table 8-2. Comparison between TTV Thermal Profile and Thermal Solution Performance

for Intel

Power (W)

Xeon® Processor 3400 Series (95W) (Sheet 2 of 2)

TTV T

CASE_MAX

(°C)

Thermal Solution

CASE_MAX

(°C)

Power (W)

TTV T

CASE_MAX

(°C)

Thermal Solution

CASE_MAX

(°C)

38 56.1 52.1 88 70.6 68.1

40 56.7 52.8 90 71.2 68.7

42 57.3 53.4 92 71.8 69.3

44 57.9 54.0 94 72.4 70.0

46 58.4 54.7 95 72.7 70.3

48 59.0 55.3

8.2 Thermal Solution

The collaboration thermal solution consists of two assemblies: heatsink assembly & back plate.

Heatsink is designed with the Aluminum base and Aluminum stack fin, which volumetrically is 95x95x24.85 mm. The heatpipe technology is used in the heatsink to improve thermal conduction.

Heatsink back plate is a 1.8 mm thick flat steel plate with threaded studs for heatsink attach. A clearance hole is located at the center of the heatsink backplate to accommodate the ILM back plate. An insulator is pre-applied.

Note: Heatsink back plate herein is only applicable to 1U server. Desktop has a specific

heatsink back plate for its form factor.

1U Collaboration Thermal Solution

8.3 Assembly

Figure 8-3. 1U Collaboration Heatsink Assembly

The assembly process for the 1U collaboration heatsink with application of thermal interface material begins with placing back plate in a fixture. The motherboard is aligned with fixture.

Next is to place the heatsink such that the heatsink fins are parallel to system airflow. While lowering the heatsink onto the IHS, align the four captive screws of the heatsink to the four holes of motherboard.

Using a #2 Phillips driver, torque the four captive screws to 8 inch-pounds.

This assembly process is designed to produce a static load compliant with the minimum preload requirement (26.7lbf) for the selected TIM and to not exceed the package design limit (50 lbf).

1U Collaboration Thermal Solution

2.5mm Maximum Component Height (6 places)

1.2mm Maximum Component Height (1 place)

1.6mm Maximum Component Height (2 places)

9.5mm Maximum Component Height (5 places)

2.07mm Maximum Component Height (1 place)

8.4 Geometric Envelope for 1U Thermal Mechanical Design

Figure 8-4. KOZ 3-D Model (Top) in 1U Server

8.5 Thermal Interface Material

A thermal interface material (TIM) provides conductivity between the IHS and heatsink. The collaboration thermal solution uses Honeywell PCM45F, which pad size is 35x35 mm.

TIM should be verified to be within its recommended shelf life before use. Surfaces should be free of foreign materials prior to application of TIM.

Thermal Solution Quality and Reliability Requirements

9 Thermal Solution Quality and

Reliability Requirements

9.1 Collaboration Heatsink Thermal Verification

Each motherboard, heatsink and attach combination may vary the mechanical loading of the component. Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume. The Intel collaboration thermal solution will be evaluated to the boundary conditions in Chapter 5.

The test results, for a number of samples, are reported in terms of a worst-case mean + 3σ value for thermal characterization parameter using the TTV.

9.2 Mechanical Environmental Testing

Each motherboard, heatsink and attach combination may vary the mechanical loading of the component. Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume. Some general recommendations are shown in Tab l e 9-1 .

The Intel collaboration heatsinks have been tested in an assembled LGA1156 socket and mechanical test package. Details of the environmental requirements, and associated stress tests, can be found in Tabl e 9- 1 are based on speculative use condition assumptions, and are provided as examples only.

Table 9-1. Use Conditions (Board Level)

Test

Mechanical Shock 3 drops each for + and - directions in each of 3

Random Vibration Duration: 10 min/axis, 3 axes

Thermal Cycling –25°C to +100°C;Ramp rate ~ 8C/minute; Cycle time:~30

Notes:

1. It is recommended that the above tests be performed on a sample size of at least ten assemblies from multiple lots of material.

2. Additional pass/fail criteria may be added at the discretion of the user.

perpendicular axes (i.e., total 18 drops) Profile: 50 g, Trapezoidal waveform, 4.3 m/s [170 in/s]

minimum velocity change

Frequency Range: 5 Hz to 500 Hz 5 Hz @ 0.01 g 20 Hz to 500 Hz @ 0.02 g Power Spectral Density (PSD) Profile: 3.13 g RMS

minutes per cycle for 500 cycles.

Requirement Pass/Fail Criteria

Visual Check and Electrical Functional Test

Visual Check and Electrical Functional

/Hz to 20 Hz @ 0.02 g2/Hz (slope up)

/Hz (flat)

Test

Visual Check and Thermal Performance Test

Thermal/Mechanical Specifications and Design Guidelines 67

Thermal Solution Quality and Reliability Requirements

9.2.1 Recommended Test Sequence

Each test sequence should start with components (that is, baseboard, heatsink assembly, and so forth) that have not been previously submitted to any reliability testing.

Prior to the mechanical shock & vibration test, the units under test should be preconditioned for 72 hours at 45 ºC. The purpose is to account for load relaxation during burn-in stage.

The test sequence should always start with a visual inspection after assembly, and BIOS/Processor/memory test. The stress test should be then followed by a visual inspection and then BIOS/Processor/memory test.

9.2.2 Post-Test Pass Criteria

The post-test pass criteria are:

1. No significant physical damage to the heatsink and retention hardware.

2. Heatsink remains seated and its bottom remains mated flatly against the IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware.

3. No signs of physical damage on baseboard surface due to impact of heatsink.

4. No visible physical damage to the processor package.

5. Successful BIOS/Processor/memory test of post-test samples.

6. Thermal compliance testing to demonstrate that the case temperature specification can be met.

9.2.3 Recommended BIOS/Processor/Memory Test Procedures

This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational baseboard that has not been exposed to any battery of tests prior to the test being considered.

Testing setup should include the following components, properly assembled and/or connected:

• Appropriate system baseboard.

• Processor and memory.

• All enabling components, including socket and thermal solution parts.

The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors. Intel PC Diags is an example of software that can be used for this test.

68 Thermal/Mechanical Specifications and Design Guidelines

Thermal Solution Quality and Reliability Requirements

9.3 Material and Recycling Requirements

Material shall be resistant to fungal growth. Examples of non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Synthetic materials such as PVC formulations, certain polyurethane compositions (such as polyester and some polyethers), plastics that contain organic fillers of laminating materials, paints, and varnishes also are susceptible to fungal growth. If materials are not fungal growth resistant, then MILSTD-810E, Method 508.4 must be performed to determine material performance.

Material used shall not have deformation or degradation in a temperature life test.

Any plastic component exceeding 25 grams should be recyclable per the European Blue Angel recycling standards.

The following definitions apply to the use of the terms lead-free, Pb-free, and RoHS compliant.

Lead (Pb)-free: Lead has not been intentionally added, but lead may still exist as an impurity below 1000 ppm.

RoHS compliant: Lead and other materials banned in RoHS Directive are either (1) below all applicable substance thresholds as proposed by the EU or (2) an approved/pending exemption applies.

Note: RoHS implementation details are not fully defined and may change.

Thermal/Mechanical Specifications and Design Guidelines 69

Thermal Solution Quality and Reliability Requirements

70 Thermal/Mechanical Specifications and Design Guidelines

Boxed Processor Specifications

10 Boxed Processor Specifications

10.1 Introduction

The processor will also be offered as an Intel boxed processor. Intel boxed processors are intended for system integrators who build systems from baseboards and standard components. The boxed processor will be supplied with a cooling solution. This chapter documents baseboard and system requirements for the cooling solution that will be supplied with the boxed processor. This chapter is particularly important for OEMs that manufacture baseboards for system integrators.

Note: Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and

inches [in brackets]. Figure 10-1 shows a mechanical representation of a boxed processor.

Note: The cooling solution that is supplied with the boxed processor will be halogen free

Note: Drawings in this chapter reflect only the specifications on the Intel boxed processor

Figure 10-1. Boxed Processor Fan Heatsink

compliant.

product. These dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system designers’ responsibility to consider their proprietary cooling solution when designing to the required keep-out zone on their system platforms and chassis.

Note: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.

Thermal/Mechanical Specifications and Design Guidelines 71

Boxed Processor Specifications

10.2 Mechanical Specifications

10.2.1 Boxed Processor Cooling Solution Dimensions

This section documents the mechanical specifications of the boxed processor. The boxed processor will be shipped with an unattached fan heatsink. Figure 10-1 shows a boxed processor fan heatsink.

Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The physical space requirements and dimensions for the boxed processor with assembled fan heatsink are shown in Figure 10-2 (side view), and Figure 10-3 (top view). The airspace requirements for the boxed processor fan heatsink must also be incorporated into new baseboard and system designs. Airspace requirements are shown in Figure 10-7 and Figure 10-8. Note that some figures have centerlines shown (marked with alphabetic designations) to clarify relative dimensioning.

Figure 10-2. Space Requirements for the Boxed Processor (side view)

72 Thermal/Mechanical Specifications and Design Guidelines

Boxed Processor Specifications

Figure 10-3. Space Requirements for the Boxed Processor (top view)

Note: Diagram does not show the attached hardware for the clip design and is provided only as a mechanical

representation.

Figure 10-4. Space Requirements for the Boxed Processor (overall view)

Thermal/Mechanical Specifications and Design Guidelines 73

Boxed Processor Specifications

Signal

2 3

GND

+12 V

SENSE CONTROL

Straight square pin, 4-pin terminal housing with polarizing ribs and friction locking ramp.

0.100" pitch, 0.025" square pin width.

Match with straight pin, friction lock header on mainboard.

10.2.2 Boxed Processor Fan Heatsink Weight

The boxed processor fan heatsink will not weigh more than 450 grams.

10.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly

The boxed processor thermal solution requires a heatsink attach clip assembly, to secure the processor and fan heatsink in the baseboard socket. The boxed processor will ship with the heatsink attach clip assembly.

10.3 Electrical Requirements

10.3.1 Fan Heatsink Power Supply

The boxed processor's fan heatsink requires a +12 V power supply. A fan power cable will be shipped with the boxed processor to draw power from a power header on the baseboard. The power cable connector and pinout are shown in Figure 10-5. Baseboards must provide a matched power header to support the boxed processor.

Tabl e 1 0 - 1 contains specifications for the input and output signals at the fan heatsink

connector.

The fan heatsink outputs a SENSE signal, which is an open-collector output that pulses at a rate of 2 pulses per fan revolution. A baseboard pull-up resistor provides V match the system board-mounted fan speed monitor requirements, if applicable. Use of the SENSE signal is optional. If the SENSE signal is not used, pin 3 of the connector should be tied to GND.

The fan heatsink receives a PWM signal from the motherboard from the 4th pin of the connector labeled as CONTROL.

The boxed processor's fanheat sink requires a constant +12 V supplied to pin 2 and does not support variable voltage control or 3-pin PWM control.

The power header on the baseboard must be positioned to allow the fan heatsink power cable to reach it. The power header identification and location should be documented in the platform documentation, or on the system board itself. Figure 10-6 shows the location of the fan power connector relative to the processor socket. The baseboard power header should be positioned within 110 mm [4.33 inches] from the center of the processor socket.

Figure 10-5. Boxed Processor Fan Heatsink Power Cable Connector Description

74 Thermal/Mechanical Specifications and Design Guidelines

Boxed Processor Specifications

NOTES:

R110 [4.33]

Table 10-1. Fan Heatsink Power and Signal Specifications

Description Min Typ Max Unit Notes

+12 V: 12 volt fan power supply 11.4 12.0 12.6 V —

IC:

• Maximum fan steady-state current draw

• Average steady-state fan current draw

• Maximum fan start-up current draw

• Fan start-up current draw maximum duration

SENSE: SENSE frequency — 2 — pulses per fan

CONTROL 21 25 28 kHz

1. Baseboard should pull this pin up to 5 V with a resistor.

2. Open drain type, pulse width modulated.

3. Fan will have pull-up resistor for this signal to maximum of 5.25 V.

— — — —

1.2

0.5

2.2

1.0

— — — —

Second

revolution

Figure 10-6. Baseboard Power Header Placement Relative to Processor Socket

—

A A

2, 3

10.4 Thermal Specifications

This section describes the cooling requirements of the fan heatsink solution used by the boxed processor.

10.4.1 Boxed Processor Cooling Requirements

The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's temperature specification is also a function of the thermal design of the entire system, and ultimately the responsibility of the system integrator. The processor temperature specification is found in Chapter 6 of this document. The boxed processor fan heatsink is able to keep the processor temperature within the specifications (see

Tab l e 6- 1) in chassis that provide good thermal management. For the boxed processor

fan heatsink to operate properly, it is critical that the airflow provided to the fan heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the fan heatsink. Airspace is required around the fan to ensure that the airflow through the fan heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and decreases fan life. Figure 10-7 and Figure 10-8 illustrate an acceptable airspace clearance for the fan heatsink. The air temperature

Thermal/Mechanical Specifications and Design Guidelines 75

entering the fan should be kept below 40ºC. Again, meeting the processor's temperature specification is the responsibility of the system integrator.

Boxed Processor Specifications

Figure 10-7. Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view)

Figure 10-8. Boxed Processor Fan Heatsink Airspace Keepout Requirements (side view)

76 Thermal/Mechanical Specifications and Design Guidelines

Boxed Processor Specifications

10.4.2 Variable Speed Fan

If the boxed processor fan heatsink 4-pin connector is connected to a 3-pin motherboard header, it will operate as follows:

The boxed processor fan will operate at different speeds over a short range of internal chassis temperatures. This allows the processor fan to operate at a lower speed and noise level, while internal chassis temperatures are low. If internal chassis temperature increases beyond a lower set point, the fan speed will rise linearly with the internal temperature until the higher set point is reached. At that point, the fan speed is at its maximum. As fan speed increases, so do fan noise levels. Systems should be designed to provide adequate air around the boxed processor fan heatsink that remains cooler then lower set point. These set points, represented in Figure 10-9 and Table 10-2, can vary by a few degrees from fan heatsink to fan heatsink. The internal chassis temperature should be kept below 40 ºC. Meeting the processor's temperature specification (see Chapter 6) is the responsibility of the system integrator.

The motherboard must supply a constant +12 V to the processor's power header to ensure proper operation of the variable speed fan for the boxed processor. Refer to

Table 10-1 for the specific requirements.

Figure 10-9. Boxed Processor Fan Heatsink Set Points

Table 10-2. Fan Heatsink Set Points

Boxed Processor Fan

Heatsink Set Point

Note:

1. Set point variance is approximately ± 1 ° C from fan heatsink to fan heatsink.

Thermal/Mechanical Specifications and Design Guidelines 77

ºC)

(

X ≤ 30

Y = 35

Z ≥ 40

When the internal chassis temperature is below or equal to this set point, the fan operates at its lowest speed. Recommended maximum internal chassis temperature for nominal operating environment.

When the internal chassis temperature is at this point, the fan operates between its lowest and highest speeds. Recommended maximum internal chassis temperature for worst-case operating environment.

When the internal chassis temperature is above or equal to this set point, the fan operates at its highest speed.

Boxed Processor Fan Speed Notes

Boxed Processor Specifications

If the boxed processor fan heatsink 4-pin connector is connected to a 4-pin motherboard header and the motherboard is designed with a fan speed controller with PWM output (CONTROL see Table 10-1) and remote thermal diode measurement capability, the boxed processor will operate as follows:

As processor power has increased the required thermal solutions have generated increasingly more noise. Intel has added an option to the boxed processor that allows system integrators to have a quieter system in the most common usage.

The 4th wire PWM solution provides better control over chassis acoustics. This is achieved by more accurate measurement of processor die temperature through the processor's Digital Thermal Sensors (DTS) and PECI. Fan RPM is modulated through the use of an ASIC located on the motherboard that sends out a PWM control signal to the 4th pin of the connector labeled as CONTROL. The fan speed is based on actual processor temperature instead of internal ambient chassis temperatures.

If the new 4-pin active fan heat sink solution is connected to an older 3-pin baseboard processor fan header, it will default back to a thermistor controlled mode, allowing compatibility with existing 3-pin baseboard designs. Under thermistor controlled mode, the fan RPM is automatically varied based on the Tinlet temperature measured by a thermistor located at the fan inlet.

78 Thermal/Mechanical Specifications and Design Guidelines

Component Suppliers

A Component Suppliers

Note: The part numbers listed below identifies the reference components. End-users are

responsible for the verification of the Intel enabled component offerings with the supplier. These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. Customers are responsible for thermal, mechanical, and environmental validation of these solutions. This list and/or these devices may be subject to change without notice.

Table A-1. Collaboration Heatsink Enabled Components

Item Intel PN AVC

1U heatsink Assembly E49069-001 SQ41900001

Heatsink Back Plate Assembly E49060-001 P209000071

Table A-2. LGA1156 Socket and ILM Components

Item Intel PN Foxconn Molex Tyco Lotes

LGA1156 Socket E51948-002 PE115627-

A1156 ILM E36142-002 PT44L11-6401 475969910 2013882-3 ACA-ZIF-078-

1U Back Plate (with Screws)

E66807-001 PT44P12-6401 N/A N/A DCA-HSK-157-

4041-01F

475961132

2013092-1 N/A

T02

T01

Table A-3. Supplier Contact Infor mation

Supplier Contact Phone Email

AVC (Asia Vital Components Co., Ltd.)

Foxconn Julia Jiang +1 408 919 6178 juliaj@foxconn.com

Lotes Co., Ltd. Windy Wong +1 604 721 1259 windy@lotesconn.com

Molex Carol Liang +86 21 504 80889 x3301 carol.liang@molex.com

Tyco Billy Hsieh +81 44 844 8292 billy.hsieh@tycoelectronics.com

David Chao +886 2 2299 6930 x7619 david_chao@avc.com.tw

The enabled components may not be currently available from all suppliers. Contact the supplier directly to verify time of component availability.

Component Suppliers

Mechanical Drawings

B Mechanical Drawings

Tab l e B- 1 lists the mechanical drawings included in this appendix.

Table B-1. Mechanical Drawing List

Drawing Description Figure Number

Socket / Heatsink / ILM Keepout Zone Primary Side for 1U(Top) Figure B-1

Socket / Heatsink / ILM Keepout Zone Secondary Side for 1U(Bottom) Figure B-2

Socket / Processor / ILM Keepout Zone Primary Side for 1U(Top) Figure B-3

Socket / Processor / ILM Keepout Zone Secondary Side for 1U(Bottom) Figure B-4

1U Collaboration Heatsink Assembly Figure B-5

1U Collaboration Heatsink Figure B-6

1U Collaboration Heatsink Screw Figure B-7

Heatsink Compression Spring Figure B-8

Heatsink Load Cup Figure B-9

Heatsink Retaining Ring Figure B-10

Heatsink Backplate Assembly Figure B-11

Heatsink Backplate Figure B-12

Heatsink Backplate Insulator Figure B-13

Heatsink Backplate Stud Figure B-14

Thermocouple Attach Drawing Figure B-15

1U ILM Shoulder Screw Figure B-16

1U ILM Standard 6-32 Thread Fastener Figure B-17

Mechanical Drawings

Figure B-1. Socket / Heatsink / ILM Keepout Zone Primary Side for 1U(Top)

Mechanical Drawings

Figure B-2. Socket / Heatsink / ILM Keepout Zone Secondary Side for 1U(Bottom)

Mechanical Drawings

DEPARTMENT

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

PST-TMI

TITLE

LGA1156 & 1155 SOCKET,

ILM & PROCESSOR KEEPIN

SIZE DRAWING NUMBER REV

E21320

SCALE:

1.000

DO NOT SCALE DRAWING

SHEET

51.00

70.37

17.00

7170.0

()15.16

8.12

49.50

3.75

11.75

9.26

8.97

6.55

3X 6.34

6.76

1.25

13.00

5.50

40.71

37.54

()78.25

CLEARANCE NEEDED

FOR WIRE TRAVEL

3.75

4.00

8130.0

618.72

27.33

3.18

15.92

19.50

()42.50

4.00

1.75

7.00 ()

TYP PCB THICKNESS

1.50

2.50

()49.50

2.50

28.12

42.50

21.25

()94.76

78.25

3X 2.58

3X 5.00

12.29

19.99

(R )65.21

(R )46.51

()37.54

()2.50

()1.50

NOTES:

1 SOCKET CENTER PLANES ARE REFERENCED FROM GEOMETRIC

CENTER OF SOCKET HOUSING CAVITY FOR CPU PACKAGE (ALIGNS

WITH DATUM REFERENCE GIVEN FOR BOARD COMPONENT KEEP-INS).

2 SOCKET KEEP-IN VOLUME VERTICAL HEIGHT ESTABLISHES LIMIT OF SOCKET

AND CPU PACKAGE ASSEMBLY IN THE SOCKET LOCKED DOWN POSITION.

IT ENCOMPASSES SOCKET AND CPU PACKAGE DIMENSIONAL TOLERANCES

AND DEFLECTION / SHAPE CHANGES DUE TO ILM LOAD.

3. SOCKET KEEP-IN VOLUME ENCOMPASS THE SOCKET NOMINAL VOLUME

AND ALLOWANCES FOR SIZE TOLERANCES. THERMAL/MECHANICAL COMPONENT

DEVELOPERS SHALL DESIGN TO THE OUTSIDE OF SOCKET KEEP IN VOLUME WITH

CLEARANCE MARGINS. SOCKET DEVELOPERS SHALL DESIGN TO THE INSIDE VOLUME.

4.DIMENSIONS ARE IN MILLIMETERS

5 NO COMPONENT BOUNDARY-FINGER ACCESS AREA

6 MOTHERBOARD BACKSIDE COMPONENT KEEP-IN

7 MAXIMUM OPEN ANGLE TO OPEN LOAD PLATE

8 MINIMUM OPEN ANGLE TO CLEAR LOAD PLATE

TOP SIDE

BOTTOM SIDE

SECTION A-A

SECTION B-B

SEE DETAIL A

MAX LEVER MOTION SPACE

TO LEVER STOP

LOAD PLATE OPENING

MOTION SPACE

MIN LEVER MOTION SPACE

TO OPEN LID

PRIMARY SIDE COMPONENT

CLEARANCE

LEVER UNLATCHED

POSITION

SECONDARY SIDE

COMPONENT CLEARANCE

SEE DETAIL A

Figure B-3. Socket / Processor / ILM Keepout Zone Primary Side for 1U(Top)

Mechanical Drawings

Figure B-4. Socket / Processor / ILM Keepout Zone Secondary Side for 1U(Bottom)

()18.12

17.00

LEVER UNLATCHED

10.97

()6.30

3.50

8.00

3.50

()11.78

()13.75

()15.83

TOP SIDE VIEW

DETAIL A

SHEET

DO NOT SCALE DRAWING

SIZE DRAWING NUMBER REV

A1 E21320 J

SCALE: NONE

TOP SIDE

PCB ILM SILKSCREEN

+0.05

-0.03

6.00

NO ROUTE ON

PRIMARY & SECONDARY SIDES

3 X 4.70 NO ROUTE ON

ALL OTHER LAYERS

COPPER PAD ON PRIMARY SIDE,

37.31

25.70

0.00

ADD SILKSCREEN OUTLINE

ON PCB PRIMARY SIDE

AS SHOWN

25.70

+0.05

-0.03

0.1 B C

NON-GROUNDED.

COPPER PAD CAN INSET MAXIMUM

OF .127MM FROM THE NO ROUTE EDGE

18.00

0.00

18.00

3X NPTH3.80

23.81

0.00

5 FINGER ACCESS

COMPONENT KEEPOUT

AREA

()10.50

()47.50

R3.50

25.50

TOP SIDE

PCB ILM MOUNTING HOLES

25.81

0.00

PIN 1

35.21

40.71

Figure B-5. 1U Collaboration Heatsink Assembly

E49069 1 B

DWG. NO SHT. REV

THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS

MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.

SHEET 1 OF 1DO NOT SCALE DRAWINGSCALE: 1:1

BE49069C

REVDRAWING NUMBERSIZE

ASSY, HEAT SINK, FOXHOLLOW, 1U

TITLE

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

EASD-SH

DEPARTMENT

SEE NOTESSEE NOTES

FINISHMATERIAL

DATEAPPROVED BY

DATECHECKED BY

07/15/08JUN LU

DATEDRAWN BY

07/15/08JUN LU

DATEDESIGNED BY

UNLESS OTHERWISE SPECIFIED

INTERPRET DIMENSIONS AND TOLERANCES

IN ACCORDANCE WITH ASME Y14.5M-1994

DIMENSIONS ARE IN INCHES

TOLERANCES:

.X 0.5 Angles 1.0

.XX 0.25

.XXX 0.127

THIRD ANGLE PROJECTION

PARTS LIST

DESCRIPTIONPART NUMBERITEM NOQTY

-E49069TOP

D8988214

D8988524

D9147234

E4905941

E5068654

PCM-45F61

REVISION HISTORY

ZONE REV DESCRIPTION DATE APPR

1 A INITIAL RELEASE 07/15/08 -

2 B UPDATE 09/20/08

30.5

+0.20

-0.25

NOTES:

1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED 3D DATABASE.

ALL DIMENSIONS AND TOLERENCES ON THIS DRAWING TAKE PRECEDENCE OVER

SUPPLIED DATABASE

2. PRIMARY DIMENSIONS STATED IN MILLINETERS. [BRACKETED] DIMESNIONS

STATED IN INCHS.

3 CRITICAL TO FUNCTION DIMENSION.

4. REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR SOLVENTS AFTER MACHINING

AND FIN ASSEMBLY

5 PART NUMBER AND TORGUE SPEC MARK:

PLACE PART NUMBER AND TORGUE SPEC IN ALLOWABLE AREA

EITHER SIDE OF PART WHERE SHOWN. BELOW PART NUMBER CALLOUT,

PLACE THE FOLLOW TEXT:

"RECOMMENDED SCREW TORQUE: 8 IN-LBF"

THE MARK CAN BE AN INK MARK, LASER MARK, PUNCH MARK

OR ANY OTHER PERMANENT MARK THAT IS READABLE AT 1.0X

MAGNIFICATION

6. PRESS FIT CUP LIP FLUSH TO TOP SURFACE OF HEAT SINK

7. MINIMUM PUSH OUT FORCE = 30LBF PER CUP

SPRING, COMPRESSION, PRELOAD

RING, RETAINING, 3.2MM GROOVE DIA

CUP, SPRING RETENTION

HEAT SINK, FOXHOLLOW, 1U

SCREW, SHOULDER, M3X0.5, FOXHOLLOW

TIM, 0.25x35x35MM, HONEYWELL

SEE DETAIL A

SECTION A-A

DETAIL A

SCALE 4:1

Mechanical Drawings

E49059 1 C

DWG. NO SHT. REV

THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS

MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.

SHEET 1 OF 1DO NOT SCALE DRAWINGSCALE: 1:1

CE49059C

REVDRAWING NUMBERSIZE

HEAT SINK, FOXHOLLOW, 1U

TITLE

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

EASD-SH

DEPARTMENT

SEE NOTESSEE NOTES

FINISHMATERIAL

DATEAPPROVED BY

DATECHECKED BY

07/15/08JUN LU

DATEDRAWN BY

07/15/08JUN LU

DATEDESIGNED BY

UNLESS OTHERWISE SPECIFIED

INTERPRET DIMENSIONS AND TOLERANCES

IN ACCORDANCE WITH ASME Y14.5M-1994

DIMENSIONS ARE IN MILLIMETERS

TOLERANCES:

.X 0.5 Angles 1.0

.XX 0.25

.XXX 0.025

THIRD ANGLE PROJECTION

PARTS LIST

DESCRIPTIONPART NUMBERITEM NOQTY

-E49059TOP

REVISION HISTORY

ZONE REV DESCRIPTION DATE APPR

1 A INITIAL RELEASE 07/15/08 -

2 B UPDATE 09/20/08

3 C HS TOLERANCE UPDATED TO 0/-0.4MM 11/01/08

0.076

395

-0.4

395

-0.4

375 0.15

3 PEDESTAL2.5 0.13

3 BASE THICKNESS5.5 0.13

4 X 8

-0.06

24.85

055.7

NOTES:

1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED 3D DATABASE.

ALL DIMENSIONS AND TOLERENCES ON THIS DRAWING TAKE PRECEDENCE OVER

SUPPLIED DATABASE

2. PRIMARY DIMENSIONS STATED IN MILLINETERS.

3 CRITICAL TO FUNCTION DIMENSION

4. FIN PARAMETERS CAN BE DECIDED BASED ON SUPPLIERS'SUGGESTION.

5. REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR SOLVENTS AFTER MACHINING

AND FIN ASSEMBLY

6 LOCAL FLATNESS ZONE .076 MM [0.003''] CENTERED ON HEAT SINK PEDESTAL

7. MECHANICAL STITCHING OR CONNECTION ALLOWED ON TOP SURFACE OF HEATSINK TO

INCREASE FIN STRUCTURAL STABILITY. OVERALL FIN HEIGHT MUST STILL BE MAINTAINED.

8. MATERIAL:ALUMINUM 6063-T5

FLATNESS ZONE 6

Figure B-6. 1U Collaboration Heatsink

((

Figure B-7. 1U Collaboration Heatsink Screw

E50686 1 B

DWG. NO SHT. REV

THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS

MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.

SHEET 1 OF 1DO NOT SCALE DRAWINGSCALE: 1:1

BE50686C

REVDRAWING NUMBERSIZE

SCREW,SHOULDER, M3 X 0.5, FOXHOLLOW

TITLE

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

EASD-SH

DEPARTMENT

SEE NOTESSEE NOTES

FINISHMATERIAL

DATEAPPROVED BY

DATECHECKED BY

07/20/08JUN LU

DATEDRAWN BY

07/20/08JUN LU

DATEDESIGNED BY

UNLESS OTHERWISE SPECIFIED

INTERPRET DIMENSIONS AND TOLERANCES

IN ACCORDANCE WITH ASME Y14.5M-1994

DIMENSIONS ARE IN MILLIMETERS

TOLERANCES:

.X 0.5 Angles 1.0

.XX 0.25

.XXX 0.025

THIRD ANGLE PROJECTION

PARTS LIST

DESCRIPTIONPART NUMBERITEM NOQTY

-E50686TOP

REVISION HISTORY

ZONE REV DESCRIPTION DATE APPR

1 A INITIAL RELEASE 07/20/08 -

ADDED MAJOR SCREW DIA AS CTF

UPDATED SHAFT INSPECTION CRITERIA

ADDED NOTE 7

ADDED SHOULDER NOTE

01/19/09

2 X 64.06 0.17

4 X MIN. 60.72

03.5 .000

511

0.13

514.5

0.13

019.5

.006

.007

.002

62 0.32

2.93 0.06 5

MAJOR DIA,

M3 x 0.5

TOLERANCE CLASS 6G

R0.2

50.64

+0.05

0.35

()14.5

573.9

-0.1

()5.6

NOTES:

1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED 3D DATABASE.

ALL DIMENSIONS AND TOLERENCES ON THIS DRAWING TAKE PRECEDENCE OVER

SUPPLIED DATABASE

2. PRIMARY DIMENSIONS STATED IN MILLINETERS. [BRACKETED] DIMESNIONS

STATED IN INCHS.

3. MATERIAL: 18-8 STAINLESS STEEL: AISI 303, 304, 305, J1S, SUS304

OR EQUIVALENT, MINIMUM TENSILE STRENGTH: 60,000 PSI

4. TORQUE TO FAILURE SHALL BE NOT LESS THEN 20 IN-LBF

5 CRITICAL TO FUNCTION DIMENSION

6 PER ASME B18,6,3-1998

7 INSPECT SHAFT DIAMETER IN THESE LOCATIONS

TYPE 1. CROSS RECESSED

#2 DRIVER 6

SEE DETAIL A

SEE DETAIL B

SEE DETAIL C

CRITICAL INTERFACE FEATURE:

THIS SHOULDER MUST BE SQUARE

SCALE 5:1

M3 X 0.5

EXTERNAL THREAD

SECTION A-A

DETAIL A

SCALE 15:1

DETAIL B

SCALE 25:1

DETAIL C

SCALE 40:1

0.5 X 45 ALL AROUND

Mechanical Drawings

Figure B-8. Heatsink Compression Spring

Figure B-9. Heatsink Load Cup

Mechanical Drawings

Figure B-10. Heatsink Retaining Ring

Figure B-11. Heatsink Backplate Assembly

E49060-001

DWG. NO SHT. REV

THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS

MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.

SHEET 1 OF 1DO NOT SCALE DRAWINGSCALE: 1:1

E49060-001

REVDRAWING NUMBERSIZE

ASSY, BACK PLATE, HS, FOXHOLLOW

TITLE

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

EASD-SH

DEPARTMENT

SEE NOTESSEE NOTES

FINISHMATERIAL

DATEAPPROVED BY

DATECHECKED BY

04/10/08JUN LU

DATEDRAWN BY

04/10/08JUN LU

DATEDESIGNED BY

UNLESS OTHERWISE SPECIFIED

INTERPRET DIMENSIONS AND TOLERANCES

IN ACCORDANCE WITH ASME Y14.5M-1994

DIMENSIONS ARE IN MILLIMETERS

TOLERANCES:

.X 0.5 Angles 0.5

.XX 0.25

.XXX 0.025

THIRD ANGLE PROJECTION

PARTS LIST

DESCRIPTIONPART NUMBERITEM NOQTY

-E49060-001TOP

HS BACKPLATEE49062-00111

HS BACKPLATE INSULATORE49058-00121

HS BACKPLATE STANDOFFE49063-00134

REVISION HISTORY

ZONE REV DESCRIPTION DATE APPR

1 A INITIAL RELEASE 04/10/08 -

2 B UPDATE

07/20/08

3 C ADDED PLATING CORROSION REQUIREMENT

01/21/09

()689.25

()692.25

()689.25 ()649.75

()668.55

()674.05

()660.25

4 X ( )3.52

()

AFTER INSULATOR

APPLICATION

2.03

4 X 3.8

NOTES:

1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED 3D DATABASE.

ALL DIMENSIONS AND TOLERENCES ON THIS DRAWING TAKE PRECEDENCE OVER

SUPPLIED DATABASE

2. PRIMARY DIMENSIONS STATED IN MILLINETERS. [BRACKETED] DIMESNIONS

STATED IN INCHS.

3 CRITICAL TO FUNCTION DIMENSION

4 INSTALL ALL STUDS FLUSH TO THIS SURFACE +0.00 / -0.25 3

5 HEAT SINK ATTACH STUDS:

-PUSHOUT FORCE > 100LBF 3

-TORQUE TO FAILURE > 20 IN-LBF 3

-FAILURE MODES: STUDS MUST NOT SHEAR, DEFORM, STRIP, CRACK, OR TORQUE OUT

BELOW THIS TORQUE LIMIT.

-LIMITS BASED ON A 3 SIGMA DISTRIBUTION

6 CRITICAL TO FUNCTION: NO METAL OF THE FLAT PLATE CAN BE EXPOSED

7. CLEAN AND DEGREASE BACKPLATE ASSEMBLY BEFORE ATTACHING INSULATION

8. AFTER APPLICATION THE INSULATOR MUST BE FREE OF BUBBLES, POCKETS,

GREASED, AND ANY OTHER DEFORMATIONS.

9. PLATING CORROSION REQUIREMENTS:

48 HRS 85 C / 85% HUMIDITY WITH NO VISIBLE CORROSION

SECTION A-A

SEE DETAIL A

DETAIL A

SCALE 8:1

Mechanical Drawings

Figure B-12. Heatsink Backplate

Figure B-13. Heatsink Backplate Insulator

Mechanical Drawings

Figure B-14. Heatsink Backplate Stud

REVISION HISTORY

1 A INITIAL RELEASE 04/10/08 -

ZONE REV DESCRIPTION DATE APPR

2 B REDEFINE THE HEIGHT OF STUD 07/15/08

3 C ADDED PLATING CORROSION REQUIREMENT 01/21/09

NOTES:

1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED 3D DATABASE.

ALL DIMENSIONS AND TOLERENCES ON THIS DRAWING TAKE PRECEDENCE

OVER SUPPLIED DATABASE

2. PRIMARY DIMENSIONS STATED IN MILLINETERS. [BRACKETED] DIMESNIONS

STATED IN INCHS.

3. MATERIAL: STEEL, MUST MEET LOAD, TORQUE, AND FAILURE REQUIREMENTS LISTED ON

ASSEMBLY DRAWING

4. FINISH: ZINC OR ELECTROLYTIC NICKEL PLATING PLUS CLEAR CHROMATE PER ASTM B

633 COLORLESS

5. MATERIAL PROPERTIES: YIELD 235 MPA MIN ULTINATE STRENGTH 395 MPA MIN

6 FEATURE DETAIL PER MANUFACTURE SPECS.PRESS FIT FLUSH MOUNT FOR > 100 LBF

7 CRITICAL TO FUNCTION DIMENSION

PULL OUT, AND >20 IN-LBF TORQUE TO FAILURE.

8. PLATING CORROSION REQUIREMENTS:

48 HRS 85 C / 85% HUMIDITY WITH NO VISIBLE CORROSION

DWG. NO SHT. REV

FOXHOLLOW_THICK_BP_STANDOFF

2200 MISSION COLLEGE BLVD.

DESCRIPTIONPART NUMBERITEM NOQTY

DEPARTMENT

PARTS LIST

DATEDESIGNED BY

-TOP

UNLESS OTHERWISE SPECIFIED

INTERPRET DIMENSIONS AND TOLERANCES

CE49063-001C

REVDRAWING NUMBERSIZE

SHEET 1 OF 1DO NOT SCALE DRAWINGSCALE: 1:1

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

EASD-SH

STUD, FEMALE, M3X0.5, FOXHOLLOW

TITLE

SEE NOTESSEE NOTES

FINISHMATERIAL

DATEAPPROVED BY

DATECHECKED BY

04/10/08JUN LU

DATEDRAWN BY

04/10/08JUN LU

THIRD ANGLE PROJECTION

IN ACCORDANCE WITH ASME Y14.5M-1994

DIMENSIONS ARE IN MILLIMETERS

TOLERANCES:

.X 0.5 Angles 0.5

.XX 0.25

.XXX 0.025

75.55 0.13

73.8 0.05

THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS

MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.

A A

M3 X 0.5 INTERNAL THREAD, THRU

SECTION A-A

Figure B-15. Thermocouple Attach Drawing

3$&.$*(&(17(5

5()(5(1&(')520

3$&.$*(('*(6

3$&.$*(

('*(6

127(',5(&7,212)0,//('*5229(

5(/$7,9(72$/,*10(17127&+(6

6(&7,21$$

 

 

 

 

'(7$,/%

6&$/(



 

 

 

 

 

 

'(7$,/&

6&$/(

3$&.$*(

&(17(5

;5 

 

'(7$,/'

6&$/(

127(681/(6627+(5:,6(63(&,),('

1250$/$1'/$7(5$//2$'6217+(,+60867%(

0,1,0,=(''85,1*0$&+,1,1*

0$&+,1(:,7+&/($1'5<$,521/<12)/8,'625

2,/6

$//0$&+,1('685)$&(672%(0,//),1,6+25

%(77(5

,+60$7(5,$/,61,&.(/3/$7('&233(5

&87',5(&7,2125,(17$7,212)*5229(,6$66+2:1

$//0$&+,1('('*(6$5(72%()5((2)%8556

7+('(37+$77+(3$&.$*(&(17(5,6&5,7,&$/





352-(&7,21

0$7(5,$/

7+,5'$1*/(



'21276&$/('5$:,1*

'5$:,1*180%(5



),1,6+

$33529('%<

&+(&.('%<

'5$:1%<

6&$/(

7,7/(

'$7(

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

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6+((72)

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

7+,6'5$:,1*&217$,16,17(/&25325$7,21&21),'(17,$/,1)250$7,2

1,7,6',6&/26('

,1&21),'(1&($1',76&217(1760$<127%(',6&/26('5(352'8&('

',63/$<('25

02',),(':,7+2877+(35,25:5,77(1&216(172),17(/&25325$7,2

1

':*12 6+ 5(9

'(3$570(17

72/;

$1*/(6 

;; 

;;;











(







81/(6627+(5:,6(63(&,),('

',0(16,216$5(,1,1&+(6

72/(5$1&(6

,17(535(7',0$1'72/3(5

$60(<0

/*$,+6*5229()2562/'(5

7+(502&283/($77$&+

Mechanical Drawings

8 7 6 5 4 3 2

8 7 6 5 4 3 2 1

A35.75± 0.05

0.1 A

37.25± 0.05

1.35±0.1

33.25± 0.05 3

6-32 UNC CLASS 2A THREAD

3.8± 0.2

45° X 0.35 ± 0.1

45° X 0.05

+0.2

THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS

MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.

REVISION HISTORY

ZONE REV DESCRIPTION DATE APPROVED

1 A INITIAL RELEASE 11/01/08

DECREASE .1MM TO SHOULDER HEIGHT;

UPDATED PLATING SPEC

02/20/09

3 C ADD CTF TO THREAD LENGTH 06/10/09

D UPDATED TO BLACK NICKEL PLATING 07/06/09

E49065-001 1 D

DWG. NO SHT. REV

DEPARTMENT

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

EASD-SH

TITLE

FOXHOLLOW SERVER ILM SHOULDER SCREW

SIZE DRAWING NUMBER REV

E49065-001

SCALE:

DO NOT SCALE DRAWING

SHEET

SEE NOTESSEE NOTES

FINISHMATERIAL

DATEAPPROVED BY

DATECHECKED BY

05/19/08JUN LU

DATEDRAWN BY

05/19/08JUN LU

DATEDESIGNED BY

UNLESS OTHERWISE SPECIFIED

INTERPRET DIMENSIONS AND TOLERANCES

IN ACCORDANCE WITH ASME Y14.5M-1994

DIMENSIONS ARE IN MILLIMETERS

ALL UNTOLERANCED LINEAR

DIMENSIONS ±0.1

ANGLES ±1

THIRD ANGLE PROJECTION

PARTS LIST

DESCRIPTIONPART NUMBERITEM NOQTY

FOXHOLLOW 1U ILM SHOULDER SCREWTOP

6 POINT T-20 DRIVE

HEAD DEPTH 2MM MIN

45° X 0.15+/- 0.1

NOTES:

1. THIS DRAWING TO BE USED IN CONJUNCTION WITH THE SUPPLIED 3D

DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING

TAKE PRECEDENCE OVER SUPPLIED FILE.

2. UNLESS OTHERWISE NOTED, TOLERANCES ON DIMENSIONED FEATURES

ARE AS IN TOLERANCE BLOCK.

3 CRITICAL TO FUNCTION (CTF).

4. MATERIAL: LOW CARBON STEEL,

MIN HARDNESS - ROCKEWELL HARDNESS B70.

5. PLATING: 2 MICRON MIN. ELECTROLYTIC "BLACK" NICKEL PLATING.

PROCESS TEST: 48 HRS. 85° C/85% HUMIDITY WITH NO VISIBLE CORROSION.

6. REMOVE ALL BURRS OR SHARP EDGES AROUND PERIMETER OF PART.

SHARPNESS OF EDGES SUBJECT TO HANDLING ARE REQUIRED TO MEET

UL1439 TEST.

7. BREAK ALL SHARP CORNERS, EDGES, AND BURRS TO 0.10MM MAX.

8. PART SHALL BE DEGREASED AND FREE OF OIL AND DIRT MARKS.

Figure B-16. 1U ILM Shoulder Screw

Figure B-17. 1U ILM Standard 6-32 Thread Fastener

Mechanical Drawings

E49066-001

DWG. NO SHT. REV

REVISION HISTORY

1 A INITIAL RELEASE 11/01/08-2 B UPDATED TO BLACK NICKEL PLATING 07/06/09

ZONE REV DESCRIPTION DATE APPR

6 POINT T-20 TORX DRIVE

RECESS DEPTH 2MM MIN

PARTIAL THREAD TAP IN TOOL RECESS OKAY

6-32 UNC - 2B THREAD

DESCRIPTIONPART NUMBERITEM NOQTY

E49066-001

TOP

2200 MISSION COLLEGE BLVD.

DEPARTMENT

PARTS LIST

DATEDESIGNED BY

UNLESS OTHERWISE SPECIFIED

SHEET

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

E49066-001

DO NOT SCALE DRAWING

SCR, PAN, T20, 6X32, 5.17MM L

EASD-SH

SIZE DRAWING NUMBER REV

TITLE

SCALE:

SEE NOTESSEE NOTES

FINISHMATERIAL-DATEAPPROVED BY

DATECHECKED BY

05/20/08JUN LU

DATEDRAWN BY

05/20/08JUN LU

ANGLES ±0.5

DIMENSIONS ±0.1

ALL UNTOLERANCED LINEAR

THIRD ANGLE PROJECTION

DIMENSIONS ARE IN MILLIMETERS

INTERPRET DIMENSIONS AND TOLERANCES

IN ACCORDANCE WITH ASME Y14.5M-1994

FEATURE SIZE TOLERANCE

0 - 1 mm +/- 0.15 mm

1 - 10 mm +/- 0.25 mm

8 7 6 5 4 3 2

DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE

PRECEDENCE OVER SUPPLIED FILE.

UNDIMENSIONED FEATURES ARE AS IN TABLE.

CRITICAL TO FUNCTION (CTF)

1. THIS DRAWING IS TO BE USED IN CONJUNCTION WITH THE SUPPLIED 3D

2. UNLESS OTHERWISE NOTED, TOLERANCES ON DIMENSIONS AND

NOTES:

THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS

MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.

4. SHARPNESS OF EDGES SUBJECT TO HANDLING ARE REQUIRED TO MEET UL1439

APPROVAL.

TEST.

a) LOW CARBON STEEL,

MIN HARDNESS - ROCKWELL HARDNESS B70

b) TENSILE YIELD STRENGTH (ASTM D638) >= 235 MPa

7. REFERENCE AND UNDIMENSIONED FEATURES MAY BE MODIFIED PER INTEL

8. DELETED

5. MATERIAL:

6. PLATING: 2 MICRON MIN. ELECTROLYTIC "BLACK" NICKEL PLATING.

6.86 3

MAX 2.41

PHYSICAL PAN HEAD HEIGHT

35.17± 0.2

8 7 6 5 4 3 2 1

Socket Mechanical Drawings

C Socket Mechanical Drawings

Tab l e C- 1 lists the mechanical drawings included in this appendix.

Table C-1. Mechanical Drawing List

Drawing Description Figure Number

“Socket Mechanical Drawing (Sheet 1 of 4)” Figure C-1

“Socket Mechanical Drawing (Sheet 2 of 4)” Figure C-2

“Socket Mechanical Drawing (Sheet 3 of 4)” Figure C-3

“Socket Mechanical Drawing (Sheet 4 of 4)” Figure C-4

Thermal/Mechanical Specifications and Design Guidelines 99

Figure C-1. Socket Mechanical Drawing (Sheet 1 of 4)

Socket Mechanical Drawings

E27147 1 4

DWG. NO SHT. REV

REVISION HISTORY

ZONE REV DESCRIPTION DATE APPROVED

- 1 PRELIMINARY RELEASE 10/23/07 -

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

SOCKET LGA1156

SIZE DRAWING NUMBER REV

DEPARTMENT

TITLE

DATECHECKED BY

02/28/07B. KNAPIK

DATEDRAWN BY

02/28/07L. YUPENG

DATEDESIGNED BY

THIRD ANGLE PROJECTION

SHEET

DO NOT SCALE DRAWING

A1 E27147 4

SCALE:

SEE NOTESSEE NOTES

FINISHMATERIAL--DATEAPPROVED BY

8 7 6 5 4 3 2

NOTES:

1. THE PURPOSE OF THIS DRAWING IS TO ESTABLISH THE

MECHANICAL FORM FACTOR OF THE SOCKET. THIS DRAWING IS

NOT INTENDED TO SHOW INTERNAL DETAIL OF THE SOCKET

WHICH MAY VARY FROM SUPPLIER TO SUPPLIER.

2. MATERIAL:

BASE AND CAP: HIGH TEMPERATURE THERMOPLASTIC. UL94V-0

CONTACT: HIGH STRENGTH COPPER ALLOY

POSTS: HIGH TEMPERATURE THERMOPLASTIC UL94V-0

SOLDER BALL: LEAD FREE SAC

3. FINISH: NONE

4. CONTACT MUST REMAIN ON LAND THROUGHOUT ACTUATION STROKE.

5. REMOVE ALL BURRS AND SHARP EDGES R0.05 MAX.

6 SOCKET NAME TO BE INDICATED IN THIS AREA.

7 LOT NUMBER SHALL BE INDICATED IN THIS AREA.

8 CHAMFER INDICATES THE CORNER CLOSEST TO PACKAGE PIN A1

9 CONTACT MUST REMAIN OUTSIDE THE CENTRAL CAVITY THROUGHOUT THE ACTUATION STROKE.

10 PICK-AND-PLACE TOOLING KEEP-IN ZONE. NO THOUGH HOLES ALLOWED IN THIS ZONE.

THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS

MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.

11 SOCKET MANUFACTURER NAME SHOWN ON SIDEWALL. OPPOSITE SIDEWALL CAN BE USED IF NEEDED.

12 ONLY THE LGA CONTACTS/SOLDER BALLS ALONG THE BOUNDARIES OF THE TWO "L" ARRAYS ARE SHOWN

IN THE DRAWINGS.

13 THE DIMENSION MEASURED FROM THE TOP OF THE ILM KEY-IN FEATURE TO THE TOP OF THE SOCKET

ALIGNMENT FEATURE.

14 DO NOT TOOL THIS KEY-IN FEATURE. MOLD TOOLING SHALL ALLOW THIS FEATURE TO BE ADDED IN THE

FUTURE NO LARGER THAN THE AREA SPECIFIED.

15 SOCKET SEAT PLANES.

8 7 6 5 4 3 2 1

100 Thermal/Mechanical Specifications and Design Guidelines

Socket Mechanical Drawings

8 7 6 5 4 3 2

8 7 6 5 4 3 2 1

0.1 A B

42.5ı#0.2

20.5 MIN THRU

0 ABC

12.8 MIN THRU

0 ACB

0.1 A C

42.5ı#0.2

B2X 37.6

2X 37.6

4X 1.7

2X 2.1ı#0.2

3.4ı#0.2 AFTER SMT

0.65 MAX

29X 0.9144

30X COLUMNS

39X 0.9144

40X ROWS

39X 0.9144

40 ROWS

16X 1 MIN

16X 7

2X 18.95

29X 0.9144

30X COLUMNS

2X 9

2X 1.6

6X 1

6X 19.75

4X 15.5

6X 19.1

4X 15.5

2.9

1.5

2.35

15.96

0.5

16.25

THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS

MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.

E27147 2 4

DWG. NO SHT. REV

DEPARTMENT

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

SIZE DRAWING NUMBER REV

A1 E27147 4

SCALE:

DO NOT SCALE DRAWING

SHEET

2 X 2 PIN A1

2X 1X3 CHAMFER

SECTION A-A

DETAIL ON SHEET 3

DETAIL

SCALE 10

1156X 0.6

SOLDER BALLS (LF)

1156X

CONTACT TIPS

DETAIL

SCALE 10

DETAIL

SCALE 10

DETAIL

SCALE 20

DETAIL ON SHEET 3

Figure C-2. Socket Mechanical Drawing (Sheet 2 of 4)

Thermal/Mechanical Specifications and Design Guidelines 101

(

8 7 6 5 4 3 2

8 7 6 5 4 3 2 1

39X 0.9144

40X ROWS

29X 0.9144

30X COLUMNS

39X 0.9144

40 ROWS

29X 0.9144

30X COLUMNS

0.75

17.3738

7.5868

8.2296

(3.1144)

18.9308

10.0584

18.2878

17.3738

8.2296

(3.1144)

7.5868

18.9308

18.2878

10.0584

0.75

THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS

MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.

E27147 3 4

DWG. NO SHT. REV

DEPARTMENT

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

SIZE DRAWING NUMBER REV

A1 E27147 4

SCALE:

DO NOT SCALE DRAWING

SHEET

DETAIL

SCALE 10

1156X SOLDER BALLS

DETAIL

SCALE 10

AY AW AVAU ATAR APAN AMAL AKAJ AHAG AFAE ADAC ABAA Y W V U T R P N M L K J H G F E D C B

1 3 5 7 9 11 13 15 17 19 21 23 25 27 29

2 4 6 8 10 12 14 16 18 20 22 24 26 28 30

31 33 35 37 39

32 34 36 38 40

0.3 A F G

0.25 A

TOP VIEW

SCALE 5

8X 0.4X0.5 CHAMFER

(0.4 HORIZONTAL 0.5 VERTICAL)

DETAIL H

SCALE 15

DETAIL

SCALE 15

0.3 A F G

0.25 A

Figure C-3. Socket Mechanical Drawing (Sheet 3 of 4)

Socket Mechanical Drawings

102 Thermal/Mechanical Specifications and Design Guidelines

Intel BX80605X3440 - Quad Core Xeon X3440, Xeon 3400 Series Reference

Specifications and Main Features

Frequently Asked Questions

User Manual

1 Introduction

1.1 References

1.2 Definition of Terms

Package Mechanical and Storage Specifications

2.1 Package Mechanical Specifications

2.1.1 Package Mechanical Drawing

2.1.2 Processor Component Keep-Out Zones

2.1.3 Package Loading Specifications

2.1.4 Package Handling Guidelines

2.1.5 Package Insertion Specifications

2.1.6 Processor Mass Specification

2.1.7 Processor Materials

2.1.8 Processor Markings

2.1.9 Processor Land Coordinates

2.2 Processor Storage Specifications

3 LGA1156 Socket

3.1 Board Layout

3.2 LGA1156 Socket NCTF Solder Joints

3.3 Attachment to Motherboard

3.4 Socket Components

3.4.1 Socket Body Housing

3.4.2 Solder Balls

3.4.3 Contacts

3.4.4 Pick and Place Cover

3.5 Package Installation / Removal

3.5.1 Socket Standoffs and Package Seating Plane

3.6 Durability

3.7 Markings

3.8 Component Insertion Forces

3.9 Socket Size

Independent Loading Mechanism (ILM)

4.1 Design Concept

4.1.1 ILM Cover Assembly Design Overview

4.1.2 ILM Back Plate Design Overview

4.1.3 Shoulder Screw and Fasteners Design Overview

4.2 Assembly of ILM to a Motherboard

4.3 ILM Interchangeability

4.4 Markings

LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications

5.1 Component Mass

5.2 Package/Socket Stackup Height

5.3 Socket Maximum Temperature

5.4 Loading Specifications

5.5 Electrical Requirements

5.6 Environmental Requirements

6 Thermal Specifications

6.1 Thermal Specifications

6.1.1 Intel® Xeon® Processor 3400 Series (95W) Thermal Profile

6.1.2 Intel® Xeon® Processor 3400 Series (45W) Thermal Profile

6.1.4 Thermal Metrology

6.2 Processor Thermal Features

6.2.1 Processor Temperature

6.2.2 Adaptive Thermal Monitor

6.2.3 THERMTRIP# Signal

6.3 Platform Environment Control Interface (PECI)

6.3.1 Introduction

6.3.2 PECI Client Capabilities

6.3.3 Temperature Data

Sensor Based Thermal Specification Design Guidance

7.1 Sensor Based Specification Overview

7.2 Sensor Based Thermal Specification

7.2.1 TTV Thermal Profile

7.3 Thermal Solution Design Process

7.3.1 Boundary Condition Definition

7.3.2 Thermal Design and Modelling

7.3.3 Thermal Solution Validation

7.4 Fan Speed Control (FSC) design process

7.5 System Validation

1U Collaboration Thermal Solution

8.1 Performance Targets

8.2 Thermal Solution

8.3 Assembly

8.4 Geometric Envelope for 1U Thermal Mechanical Design

8.5 Thermal Interface Material

Thermal Solution Quality and Reliability Requirements

9.1 Collaboration Heatsink Thermal Verification