Intel BX80605X3440 - Quad Core Xeon X3440, Xeon 3400 Series Reference
Intel
Xeon® Processor 3400 Series
and LGA1156 Socket
Thermal/Mechanical Specifications and Design Guidelines
September 2009
®
Reference Number: 322374-001
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life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to them.
®
The Intel
Xeon® Processor 3400 Series and LGA1156 socket may contain design defects or errors known as errata which may
cause the product to deviate from published specifications. Current characterized errata are available on request.
ÄIntel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor
family, not across different processor families. See http://www.intel.com/products/processor_number for details. Over time
processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not
intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number
progression is not necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel, Xeon, Intel Flexible Display Interface, Intel Core, Intel Thermal Monitor, and the Intel logo are trademarks of Intel
Corporation in the U.S and other countries.
* Other brands and names may be claimed as the property of others.
Copyright © 2008-2009 Intel Corporation.
2 Thermal/Mechanical Specifications and Design Guidelines
Contents
1Introduction..............................................................................................................7
1.1 References .........................................................................................................7
1.2 Definition of Terms..............................................................................................8
2 Package Mechanical and Storage Specifications....................................................... 11
2.1 Package Mechanical Specifications ....................................................................... 11
2.2 Processor Storage Specifications ......................................................................... 16
3 LGA1156 Socket ...................................................................................................... 17
3.1 Board Layout .................................................................................................... 19
3.2 LGA1156 Socket NCTF Solder Joints..................................................................... 20
3.3 Attachment to Motherboard ................................................................................ 21
3.4 Socket Components........................................................................................... 21
3.5 Package Installation / Removal ........................................................................... 23
3.6 Durability ......................................................................................................... 24
3.7 Markings.......................................................................................................... 25
3.8 Component Insertion Forces ............................................................................... 25
3.9 Socket Size ......................................................................................................25
4 Independent Loading Mechanism (ILM)................................................................... 27
4.1 Design Concept................................................................................................. 27
4.2 Assembly of ILM to a Motherboard.......................................................................30
4.3 ILM Interchangeability ....................................................................................... 31
4.4 Markings.......................................................................................................... 32
5 LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications .33
5.1 Component Mass............................................................................................... 33
5.2 Package/Socket Stackup Height .......................................................................... 33
5.3 Socket Maximum Temperature............................................................................33
5.4 Loading Specifications........................................................................................ 34
5.5 Electrical Requirements...................................................................................... 35
5.6 Environmental Requirements .............................................................................. 36
6 Thermal Specifications ............................................................................................ 37
6.1 Thermal Specifications ....................................................................................... 37
6.2 Processor Thermal Features................................................................................44
6.3 Platform Environment Control Interface (PECI)...................................................... 48
7 Sensor Based Thermal Specification Design Guidance.............................................. 51
7.1 Sensor Based Specification Overview ................................................................... 51
7.2 Sensor Based Thermal Specification..................................................................... 52
7.3 Thermal Solution Design Process......................................................................... 54
7.4 Fan Speed Control (FSC) design process............................................................... 56
7.5 System Validation ............................................................................................. 58
8 1U Collaboration Thermal Solution .......................................................................... 59
8.1 Performance Targets.......................................................................................... 59
8.2 Thermal Solution............................................................................................... 62
8.3 Assembly ......................................................................................................... 63
8.4 Geometric Envelope for 1U Thermal Mechanical Design .......................................... 64
8.5 Thermal Interface Material.................................................................................. 64
9 Thermal Solution Quality and Reliability Requirements............................................ 65
9.1 Collaboration Heatsink Thermal Verification .......................................................... 65
9.2 Mechanical Environmental Testing ....................................................................... 65
Thermal/Mechanical Specifications and Design Guidelines 3
9.3 Material and Recycling Requirements....................................................................67
10 Boxed Processor Specifications................................................................................69
10.1 Introduction......................................................................................................69
10.2 Mechanical Specifications....................................................................................70
10.3 Electrical Requirements ......................................................................................72
10.4 Thermal Specifications........................................................................................73
A Component Suppliers...............................................................................................77
B Mechanical Drawings ...............................................................................................79
C Socket Mechanical Drawings....................................................................................97
D Package Mechanical Drawings ...............................................................................103
Figures
2-1 Processor Package Assembly Sketch .......................................................................11
2-2 Package View ......................................................................................................12
2-3 Processor Top-Side Markings .................................................................................14
2-4 Processor Package Lands Coordinates .....................................................................15
3-1 LGA1156 Socket with Pick and Place Cover..............................................................17
3-2 LGA1156 Socket Contact Numbering (Top View of Socket).........................................18
3-3 LGA1156 Socket Land Pattern (Top View of Board) ...................................................19
3-4 LGA1156 Socket NCTF Solder Joints .......................................................................20
3-5 Attachment to Motherboard...................................................................................21
3-6 Pick and Place Cover.............................................................................................23
3-7 Package Installation / Removal Features .................................................................24
4-1 ILM Cover Assembly .............................................................................................28
4-2 Back Plate...........................................................................................................28
4-3 Shoulder Screw....................................................................................................29
4-4 ILM Assembly ......................................................................................................30
4-5 Pin 1 and ILM Lever..............................................................................................31
5-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology.............................36
6-1 Thermal Test Vehicle Thermal Profile for Intel
6-2 Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor 3400 Series (45W) .....41
6-3 TTV Case Temperature (TCASE) Measurement Location.............................................44
6-4 Frequency and Voltage Ordering ............................................................................46
6-5 Temperature Sensor Data Format...........................................................................49
7-1 Comparison of Case Temperature versus Sensor Based Specification...........................52
7-2 Intel
®
Xeon® Processor 3400 Series (95W) Thermal Profile........................................53
7-3 Required YCA for Various TAMBIENT Conditions........................................................55
8-1 1U Heatsink Performance Curves............................................................................60
8-2 1U Heatsink Performance Curves............................................................................61
8-3 1U Collaboration Heatsink Assembly .......................................................................63
8-4 KOZ 3-D Model (Top) in 1U Server .........................................................................64
10-1 Boxed Processor Fan Heatsink................................................................................69
10-2 Space Requirements for the Boxed Processor (side view)...........................................70
10-3 Space Requirements for the Boxed Processor (top view)............................................71
10-4 Space Requirements for the Boxed Processor (overall view) .......................................71
10-5 Boxed Processor Fan Heatsink Power Cable Connector Description ..............................72
10-6 Baseboard Power Header Placement Relative to Processor Socket ...............................73
10-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view) ...................74
10-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side view) ..................74
10-9 Boxed Processor Fan Heatsink Set Points.................................................................75
B-1 Socket / Heatsink / ILM Keepout Zone Primary Side for 1U(Top).................................80
B-2 Socket / Heatsink / ILM Keepout Zone Secondary Side for 1U(Bottom)........................81
®
Xeon® Processor 3400 Series (95W) .....39
4 Thermal/Mechanical Specifications and Design Guidelines
B-3 Socket / Processor / ILM Keepout Zone Primary Side for 1U(Top)............................... 82
B-4 Socket / Processor / ILM Keepout Zone Secondary Side for 1U(Bottom) ...................... 83
B-5 1U Collaboration Heatsink Assembly.......................................................................84
B-6 1U Collaboration Heatsink..................................................................................... 85
B-7 1U Collaboration Heatsink Screw............................................................................ 86
B-8 Heatsink Compression Spring ................................................................................87
B-9 Heatsink Load Cup ............................................................................................... 88
B-10 Heatsink Retaining Ring........................................................................................ 89
B-11 Heatsink Backplate Assembly ................................................................................90
B-12 Heatsink Backplate .............................................................................................. 91
B-13 Heatsink Backplate Insulator ................................................................................. 92
B-14 Heatsink Backplate Stud ....................................................................................... 93
B-15 Thermocouple Attach Drawing ...............................................................................94
B-16 1U ILM Shoulder Screw ........................................................................................ 95
B-17 1U ILM Standard 6-32 Thread Fastener...................................................................96
C-1 Socket Mechanical Drawing (Sheet 1 of 4)...............................................................98
C-2 Socket Mechanical Drawing (Sheet 2 of 4)...............................................................99
C-3 Socket Mechanical Drawing (Sheet 3 of 4)............................................................. 100
C-4 Socket Mechanical Drawing (Sheet 4 of 4)............................................................. 101
D-1 Processor Package Drawing (Sheet 1 of 2) ............................................................ 104
D-2 Processor Package Drawing (Sheet 2 of 2) ............................................................ 105
Tables
1-1 Reference Documents.............................................................................................7
1-2 Terms and Descriptions ..........................................................................................8
2-1 Processor Loading Specifications............................................................................ 13
2-2 Package Handling Guidelines ................................................................................. 13
2-3 Processor Materials .............................................................................................. 14
2-4 Storage Conditions............................................................................................... 16
5-1 Socket Component Mass....................................................................................... 33
5-2 1156-land Package and LGA1156 Socket Stackup Height .......................................... 33
5-3 Socket & ILM Mechanical Specifications................................................................... 34
5-4 Electrical Requirements for LGA1156 Socket............................................................ 35
6-1 Intel
6-2 Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor 3400 Series (95W) .... 40
6-3 Thermal Test Vehicle Thermal Profile for Intel
6-4 Thermal Solution Performance above TCONTROL for the Intel
6-5 Thermal Solution Performance above TCONTROL for the Intel
6-6 Supported PECI Command Functions and Codes ...................................................... 49
6-7 Error Codes and Descriptions................................................................................. 50
8-1 Boundary Conditions and Performance Targets ........................................................ 59
8-2 Comparison between TTV Thermal Profile and Thermal Solution Performance
9-1 Use Conditions (Board Level)................................................................................. 65
10-1 Fan Heatsink Power and Signal Specifications .......................................................... 73
10-2 Fan Heatsink Set Points ........................................................................................ 75
A-1 Collaboration Heatsink Enabled Components ........................................................... 77
A-2 LGA1156 Socket and ILM Components.................................................................... 77
A-3 Supplier Contact Information................................................................................. 77
B-1 Mechanical Drawing List........................................................................................ 79
C-1 Mechanical Drawing List........................................................................................ 97
D-1 Mechanical Drawing List...................................................................................... 103
®
Xeon® Processor 3400 Series Thermal Specifications ...................................... 38
®
Xeon® Processor 3400 Series (45W) .... 41
Processor 3400 Series (95W) ................................................................................42
®
Xeon®
®
Xeon®
Processor 3400 Series (45W) ................................................................................43
®
for Intel
Xeon® Processor 3400 Series (95W) ........................................................ 61
Thermal/Mechanical Specifications and Design Guidelines 5
Document
Number
322374 -001 • Initial release September 2009
Revision
Number
Description Revision Date
§
6 Thermal/Mechanical Specifications and Design Guidelines
Introduction
1 Introduction
This document differs from previous Thermal and Mechanical Design Guidelines. In this
document, mechanical and thermal specifications for the processor and the associated
socket are now included. The usual design guidance has been retained.
The components described in this document include:
• The thermal and mechanical specifications for the
—Intel® Xeon® processor 3400 series
• The LGA1156 socket and the Independent Loading Mechanism (ILM) and back
plate.
• The collaboration design thermal solution (heatsink) for the processors and
associated retention hardware.
®
The Intel
for clarity this document will use Intel® Xeon® processor 3400 series (95W) or Intel
Xeon® processor 3400 series (45W).
Xeon® processor 3400 series has two thermal specifications. When required
®
Note: For Workstation segment, since boundary conditions, ILM assembly and reference
thermal solution etc. are similar to Desktop’s corresponding parts, user could refer to
®
Intel
Core™ i7-800 and i5-700 Desktop Processor Series and LGA1156 Socket
Thermal/Mechanical Specifications and Design Guidelines.
Note: When the information is applicable to all products, the this document will use
“processor” or “processors” to simplify the document.
1.1 References
Material and concepts available in the following documents may be beneficial when
reading this document.
Table 1-1. Reference Documents
Document Location
®
Xeon® Processor 3400 Series Datasheet, Volume 1
Intel
®
Intel
Xeon® Processor 3400 Series Datasheet, Volume 2
®
Intel
Xeon® Processor 3400 Series Specification Update www.intel.com/Assets/
®
5 Series Chipset and Intel® 3400 Chipset Datasheet www.intel.com/Assets/
Intel
®
Intel
5 Series Chipset and Intel® 3400 Chipset Specification Update www.intel.com/Assets/
®
5 Series Chipset and Intel® 3400 Chipset – Thermal Mechanical
Intel
Specifications and Design Guidelines
4-Wire Pulse Width Modulation (PWM) Controlled Fans http://
www.intel.com/Assets/
PDF/datasheet/322371.pdf
www.intel.com/Assets/
PDF/datasheet/322372.pdf
PDF/specupdate/
322173.pdf
PDF/datasheet/322169.pdf
PDF/specupdate/
322170.pdf
www.intel.com/Assets/
PDF/designguide/
322171.pdf
www.formfactors.org/
Thermal/Mechanical Specifications and Design Guidelines 9
1.2 Definition of Terms
Table 1-2. Terms and Descriptions (Sheet 1 of 2)
Term Description
Bypass Bypass is the area between a passive heatsink and any object that can act to form a
CTE Coefficient of Thermal Expansion. The relative rate a material expands during a thermal
DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC
FSC Fan Speed Control
IHS Integrated Heat Spreader: a component of the processor package used to enhance the
ILM Independent Loading Mechanism provides the force needed to seat the 1156-LGA land
PCH Platform Controller Hub. The PCH is connected to the processor via the Direct Media
LGA1156 socket The processor mates with the system board through this surface mount, 1156-land
PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides
Ψ
CA
Ψ
CS
Ψ
SA
T
CASE or TC
T
CASE_MAX
TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by
T
CONTROL
TDP Thermal Design Power: Thermal solution should be designed to dissipate this target
Thermal Monitor A power reduction feature designed to decrease temperature after the processor has
Thermal Profile Line that defines case temperature specification of the TTV at a given power level.
TIM Thermal Interface Material: The thermally conductive compound between the heatsink
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
event.
activation temperature.
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
package onto the socket contacts.
®
Interface (DMI) and Intel
Flexible Display Interface (Intel® FDI).
socket.
a communication channel between Intel processor and chipset components to external
monitoring devices.
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
Package Power. The heat source should always be specified for Ψ measurements.
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
Power.
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
The case temperature of the processor, measured at the geometric center of the topside
of the TTV IHS.
The maximum case temperature as specified in a component specification.
using clock modulation and/or operating frequency and input voltage adjustment when
the die temperature is very near its operating limits.
T
trigger point for fan speed control. When DTS > T
with the TTV thermal profile.
is a static value that is below the TCC activation temperature and used as a
CONTROL
power level. TDP is not the maximum power that the processor can dissipate.
reached its maximum operating temperature.
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
– TLA) / Total
CASE
– TS) / Total Package
CASE
– TLA) / Total Package Power.
S
, the processor must comply
CONTROL
Introduction
10 Thermal/Mechanical Specifications and Design Guidelines
Introduction
Table 1-2. Terms and Descriptions (Sheet 2 of 2)
Term Description
TTV Thermal Test Vehicle. A mechanically equivalent package that contains a resistive heater
T
LA
T
SA
in the die to evaluate thermal solutions.
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet
for an active heatsink.
The system ambient air temperature external to a system chassis. This temperature is
usually measured at the chassis air inlets.
§
Thermal/Mechanical Specifications and Design Guidelines 11
Introduction
12 Thermal/Mechanical Specifications and Design Guidelines
Package Mechanical and Storage Specifications
IHS
Substrate
System Board
Capacitors
Core (die)
TIM
LGA1156 Socket
2 Package Mechanical and
Storage Specifications
2.1 Package Mechanical Specifications
The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with
the motherboard via the LGA1156 socket. The package consists of a processor
mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to
the package substrate and core and serves as the mating surface for processor thermal
solutions, such as a heatsink. Figure 2-1 shows a sketch of the processor package
components and how they are assembled together. Refer to Chapter 3 and Chapter 4
for complete details on the LGA1156 socket.
The package components shown in Figure 2-1 include the following:
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Figure 2-1. Processor Package Assembly Sketch
Note:
1. Socket and motherboard are included for reference and are not part of processor package.
2. For clarity the ILM is not shown.
Thermal/Mechanical Specifications and Design Guidelines 13
2.1.1 Package Mechanical Drawing
37.5
37.5
Figure 2-2 shows the basic package layout and dimensions. The detailed package
mechanical drawings are in Appendix D. The drawings include dimensions necessary to
design a thermal solution for the processor. These dimensions include:
1. Package reference dimensions with tolerances (total height, length, width, and so
forth.)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
6. All drawing dimensions are in mm.
Figure 2-2. Package View
Package Mechanical and Storage Specifications
2.1.2 Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component keepout zone requirements. A thermal and mechanical solution design must not intrude into
the required keep-out zones. Decoupling capacitors are typically mounted to either the
topside or land-side of the package substrate. See Figure B-3 and Figure B-4 for keepout zones. The location and quantity of package capacitors may change due to
manufacturing efficiencies but will remain within the component keep-in. This keep-in
zone includes solder paste and is a post reflow maximum height for the components.
14 Thermal/Mechanical Specifications and Design Guidelines
Package Mechanical and Storage Specifications
2.1.3 Package Loading Specifications
Tab l e 2- 1 provides dynamic and static load specifications for the processor package.
These mechanical maximum load limits should not be exceeded during heatsink
assembly, shipping conditions, or standard use condition. Also, any mechanical system
or component testing should not exceed the maximum limits. The processor package
substrate should not be used as a mechanical reference or load-bearing surface for
.
Table 2-1. Processor Loading Specifications
thermal and mechanical solution.
Parameter Minimum Maximum Notes
Static Compressive Load — 600 N [135 lbf] 1, 2, 3
Dynamic Compressive
Notes:
1. These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
2. This is the maximum static force that can be applied by the heatsink and retention solution to maintain the
3. These specifications are based on limited testing for design characterization. Loading limits are for the
4. Dynamic loading is defined as an 50g shock load, 2X Dynamic Acceleration Factor with a 500g maximum
Load
heatsink and processor interface.
package only and do not include the limits of the processor socket.
thermal solution.
— 712 N [160 lbf] 1, 3, 4
2.1.4 Package Handling Guidelines
Tab l e 2- 2 includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
Table 2-2. Package Handling Guidelines
Parameter Maximum Recommended Notes
Shear 311 N [70 lbf] 1, 4
Tensile 111 N [25 lbf] 2, 4
Torque 3.95 N-m [35 lbf-in] 3, 4
Notes:
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
4. These guidelines are based on limited testing for design characterization.
2.1.5 Package Insertion Specifications
The processor can be inserted into and removed from an LGA1156 socket 15 times. The
socket should meet the LGA1156 socket requirements detailed in Chapter 5.
2.1.6 Processor Mass Specification
The typical mass of the processor is 21.5g (0.76 oz). This mass [weight] includes all
the components that are included in the package.
Thermal/Mechanical Specifications and Design Guidelines 15
2.1.7 Processor Materials
Legend:
GRP1LINE1
GRP1LINE2
GRP1LINE3
GRP1LINE4
GRP1LINE5
Mark Text (Production Mark):
INTEL{M}{C}'08 PROC#
BRAND
SLxxx C00
SPEED/CACHE/ FMB
FPO
Legend:
GRP1LINE1
GRP1LINE2
GRP1LINE3
GRP1LINE4
GRP1LINE5
Mark Text (Engineering Mark):
INTEL{M}{C}'08
INTEL CONFIDENTIAL
Qxxx ES C00
PRODUCT CODE
FPO
e4
e4
GRP1LINE1
GRP1LINE2
GRP1LINE3
GRP1LINE4
GRP1LINE5
GRP1LINE1
GRP1LINE2
GRP1LINE3
GRP1LINE4
GRP1LINE5
LOT NO S/N
Package Mechanical and Storage Specifications
Tabl e 2 - 3 lists some of the package components and associated materials.
Table 2-3. Processor Materials
Component Material
Integrated Heat Spreader (IHS) Nickel Plated Copper
Substrate Fiber Reinforced Resin
Substrate Lands Gold Plated Copper
2.1.8 Processor Markings
Figure 2-3 shows the topside markings on the processor. This diagram is to aid in the
identification of the processor.
Figure 2-3. Processor Top-Side Markings
16 Thermal/Mechanical Specifications and Design Guidelines
Package Mechanical and Storage Specifications
AY
AV
AT
AP
AM
AK
AH
AF
AD
AB
Y
V
T
P
M
K
H
F
D
B
AW
AU
AR
AN
AL
AJ
AG
AE
AC
AA
W
U
N
R
K
J
G
E
C
A
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31
33 35 37 39
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32
34 36 38 40
2.1.9 Processor Land Coordinates
.
Figure 2-4. Processor Package Lands Coordinates
Thermal/Mechanical Specifications and Design Guidelines 17
Figure 2-4 shows the bottom view of the processor package.
Package Mechanical and Storage Specifications
2.2 Processor Storage Specifications
Tabl e 2 - 4 includes a list of the specifications for device storage in terms of maximum
and minimum temperatures and relative humidity. These conditions should not be
.
Table 2-4. Storage Conditions
exceeded in storage or transportation.
Parameter Description Min Max Notes
T
ABSOLUTE STORAGE
T
SUSTAINED STORAGE
RH
SUSTAINED STORAGE
TIME
SUSTAINED STORAGE
Notes:
1. Refers to a component device that is not assembled in a board or socket that is not to be electrically
connected to a voltage reference or I/O signals.
2. Specified temperatures are based on data collected. Exceptions for surface mount reflow are specified in
applicable JEDEC standard and MAS document. Non-adherence may affect processor reliability.
3. T
ABSOLUTE STORAGE
moisture barrier bags or desiccant.
®
4. Intel
5. The JEDEC, J-JSTD-020 moisture level rating and associated handling practices apply to all moisture
6. Nominal temperature and humidity conditions and durations are given and tested within the constraints
branded board products are certified to meet the following temperature and humidity limits that are
given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C, Humidity: 50% to 90%,
non-condensing with a maximum wet bulb of 28 °C). Post board attach storage temperature limits are not
specified for non-Intel branded boards.
sensitive devices removed from the moisture barrier bag.
imposed by T
SUSTAINED
The non-operating device storage
temperature. Damage (latent or otherwise)
may occur when subjected to for any length of
time.
The ambient storage temperature limit (in
shipping media) for a sustained period of time.
The maximum device storage relative humidity
for a sustained period of time.
A prolonged or extended period of time;
typically associated with customer shelf life. 0 Months6 Months
applies to the unassembled component only and does not apply to the shipping media,
and customer shelf life in applicable Intel box and bags.
-55 °C 125 °C 1, 2, 3
-5 °C 40 °C 4, 5
60% @ 24 °C 5, 6
6
§
18 Thermal/Mechanical Specifications and Design Guidelines
LGA1156 Socket
3 LGA1156 Socket
This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the
processors. The socket provides I/O, power, and ground contacts. The socket contains
1156 contacts arrayed about a cavity in the center of the socket with lead-free solder
balls for surface mounting on the motherboard.
The contacts are arranged in two opposing L-shaped patterns within the grid array. The
grid array is 40 x 40 with 24 x 16 grid depopulation in the center of the array and
selective depopulation elsewhere.
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). The ILM design includes a back plate that is integral to
having a uniform load on the socket solder joints. Socket loading specifications are
listed in Chapter 5.
Figure 3-1. LGA1156 Socket with Pick and Place Cover
Thermal/Mechanical Specifications and Design Guidelines 19
Figure 3-2. LGA1156 Socket Contact Numbering (Top View of Socket)
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
B D F H K M P T V Y AB AD AF
AH AK
AM AP AT AV AY
1
3
7
5
9
11
15
13
17
19
23
21
25
27
29
2
8
4
6
10
16
12
14
18
24
20
22
26
28
30
15
11
13
17
23
19
21
25
31
27
29
33
39
35
37
32
14
12
16
18
22
20
24
26
30
28
34
38
36
40
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
B D F H K M P T V Y AB AD AF
AH AK
AM AP AT AV AY
1
3
7
5
9
11
15
13
17
19
23
21
25
27
29
2
8
4
6
10
16
12
14
18
24
20
22
26
28
30
15
11
13
17
23
19
21
25
31
27
29
33
39
35
37
32
14
12
16
18
22
20
24
26
30
28
34
38
36
40
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AWA C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
B D F H K M P T V Y AB AD AF
AH AK
AM AP AT AV AY
B D F H K M P T V Y AB AD AF
AH AK
AM AP AT AV AY
1
3
7
5
9
11
15
13
17
19
23
21
25
27
29
1
3
7
5
9
11
15
13
17
19
23
21
25
27
29
2
8
4
6
10
16
12
14
18
24
20
22
26
28
30
2
8
4
6
10
16
12
14
18
24
20
22
26
28
30
15
11
13
17
23
19
21
25
31
27
29
33
39
35
37
15
11
13
17
23
19
21
25
31
27
29
33
39
35
37
32
14
12
16
18
22
20
24
26
30
28
34
38
36
40
32
14
12
16
18
22
20
24
26
30
28
34
38
36
40
LGA1156 Socket
20 Thermal/Mechanical Specifications and Design Guidelines
LGA1156 Socket
A C E G J L N R U W AA ACAEAGAJ ALANAR AUAW
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
1
3
7
5
9
11
15
13
17
19
23
21
25
27
29
2
8
4
6
10
16
12
14
18
24
20
22
26
28
30
32
15
11
14
12
13
16
17
23
19
18
22
20
21
24
25
31
27
26
30
28
29
33
39
35
34
38
36
37
40
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
A C E G J L N R U W AA AC AE A G AJ AL A N AR AU AW
122.6 mil (3.1144mm)
36mil (0.9144 mm)
A C E G J L N R U W AA ACAEAGAJ ALANAR AUAW
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
1
3
7
5
9
11
15
13
17
19
23
21
25
27
29
1
3
7
5
9
11
15
13
17
19
23
21
25
27
29
2
8
4
6
10
16
12
14
18
24
20
22
26
28
30
2
8
4
6
10
16
12
14
18
24
20
22
26
28
30
32
15
11
14
12
13
16
17
23
19
18
22
20
21
24
25
31
27
26
30
28
29
33
39
35
34
38
36
37
40
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
A C E G J L N R U W AA AC AE A G AJ AL A N AR AU AW
122.6 mil (3.1144mm)
36mil (0.9144 mm)
3.1 Board Layout
The land pattern for the LGA1156 socket is 36 mils X 36 mils (X by Y) within each of the
two L-shaped sections. Note that there is no round-off (conversion) error between
socket pitch (0.9144 mm) and board pitch (36 mil) as these values are equivalent. The
two L-sections are offset by 0.9144 mm (36 mil) in the x direction and 3.114 mm
(122.6 mil) in the y direction (see Figure 3-3). This was to achieve a common package
land to PCB land offset that ensures a single PCB layout for socket designs from the
multiple vendors.
Figure 3-3. LGA1156 Socket Land Pattern (Top View of Board)
Thermal/Mechanical Specifications and Design Guidelines 21
3.2 LGA1156 Socket NCTF Solder Joints
1
3
7
5
9
11
15
13
17
19
23
21
25
27
29
2
8
4
6
10
16
12
14
18
24
20
22
26
28
30
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
32
15
11
14
12
13
16
17
23
19
18
22
20
21
24
25
31
27
26
30
28
29
33
39
35
34
38
36
37
40
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
1
3
7
5
9
11
15
13
17
19
23
21
25
27
29
2
8
4
6
10
16
12
14
18
24
20
22
26
28
30
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
32
15
11
14
12
13
16
17
23
19
18
22
20
21
24
25
31
27
26
30
28
29
33
39
35
34
38
36
37
40
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
1
3
7
5
9
11
15
13
17
19
23
21
25
27
29
2
8
4
6
10
16
12
14
18
24
20
22
26
28
30
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
32
15
11
14
12
13
16
17
23
19
18
22
20
21
24
25
31
27
26
30
28
29
33
39
35
34
38
36
37
40
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
20 mil corner NCTF
20 mil corner CTF
14 x 18 mil oval pads
16.9 mil circular pads
Intel has defined selected solder joints of the socket as non-critical to function (NCTF)
when evaluating package solder joints post environmental testing. The signals at NCTF
locations are typically redundant ground or non-critical reserved, so the loss of the
solder joint continuity at end of life conditions will not affect the overall product
functionality. Figure 3-4 identifies the NCTF solder joints.
Figure 3-4. LGA1156 Socket NCTF Solder Joints
LGA1156 Socket
22 Thermal/Mechanical Specifications and Design Guidelines
LGA1156 Socket
Load plate
Frame
Load Lever
Back Plate
Shoulder
Screw
Load plate
Frame
Load Lever
Back Plate
Shoulder
Screw
3.3 Attachment to Motherboard
The socket is attached to the motherboard by 1156 solder balls. There are no additional
external methods (that is, screw, extra solder, adhesive, etc.) to attach the socket.
As indicated in Figure 3-1, the Independent Loading Mechanism (ILM) is not present
during the attach (reflow) process.
Figure 3-5. Attachment to Motherboard
3.4 Socket Components
The socket has two main components, the socket body and Pick and Place (PnP) cover,
and is delivered as a single integral assembly. Refer to Appendix C for detailed
drawings.
3.4.1 Socket Body Housing
The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable
of withstanding 260 °C for 40 seconds, which is compatible with typical reflow/rework
profiles. The socket coefficient of thermal expansion (in the XY plane), and creep
properties, must be such that the integrity of the socket is maintained for the
conditions listed in Chapter 5.
The color of the housing will be dark as compared to the solder balls to provide the
contrast needed for pick and place vision systems.
Thermal/Mechanical Specifications and Design Guidelines 23
3.4.2 Solder Balls
A total of 1156 solder balls corresponding to the contacts are on the bottom of the
socket for surface mounting with the motherboard. The socket solder ball has the
following characteristics:
• Lead free SAC (SnAgCu) 305 solder alloy with a silver (Ag) content between 3%
and 4% and a melting temperature of approximately 217 °C. The alloy must be
compatible with immersion silver (ImAg) and Organic Solderability Protectant
(OSP) motherboard surface finishes and a SAC alloy solder paste.
The co-planarity (profile) and true position requirements are defined in Appendix C.
3.4.3 Contacts
Base material for the contacts is high strength copper alloy.
For the area on socket contacts where processor lands will mate, there is a 0.381 μm
[15 μinches] minimum gold plating over 1.27 μm [50 μinches] minimum nickel
underplate.
No contamination by solder in the contact area is allowed during solder reflow.
LGA1156 Socket
3.4.4 Pick and Place Cover
The cover provides a planar surface for vacuum pick up used to place components in
the Surface Mount Technology (SMT) manufacturing line. The cover remains on the
socket during reflow to help prevent contamination during reflow. The cover can
withstand 260 °C for 40 seconds (typical reflow/rework profile) and the conditions
listed in Chapter 5 without degrading.
As indicated in Figure 3-6, the cover remains on the socket during ILM installation, and
should remain on whenever possible to help prevent damage to the socket contacts.
Cover retention must be sufficient to support the socket weight during lifting,
translation, and placement (board manufacturing), and during board and system
shipping and handling. Covers can be removed without tools.
The socket vendors have a common interface on the socket body where the PnP cover
attaches to the socket body. This should allow the PnP covers to be compatible between
socket suppliers.
As indicated in Figure 3-6, a Pin1 indicator on the cover provides a visual reference for
proper orientation with the socket.
24 Thermal/Mechanical Specifications and Design Guidelines
LGA1156 Socket
Pick & Place Cover
Pin 1
ILM Installation
Pick & Place Cover
Pin 1
ILM Installation
Figure 3-6. Pick and Place Cover
3.5 Package Installation / Removal
As indicated in Figure 3-7, access is provided to facilitate manual installation and
removal of the package.
To assist in package orientation and alignment with the socket:
• The package Pin 1 triangle and the socket Pin1 chamfer provide visual reference for
proper orientation.
• The package substrate has orientation notches along two opposing edges of the
package, offset from the centerline. The socket has two corresponding orientation
posts to physically prevent mis-orientation of the package. These orientation
features also provide initial rough alignment of package to socket.
• The socket has alignment walls at the four corners to provide final alignment of the
package.
Thermal/Mechanical Specifications and Design Guidelines 25
.
Pin 1
Chamfer
Package
Pin 1
Indicator
Alignment
Post
(2 Places)
Finger
Access
(2 Places)
Orientation
Notch
(2 Places)
Figure 3-7. Package Installation / Removal Features
LGA1156 Socket
3.5.1 Socket Standoffs and Package Seating Plane
Standoffs on the bottom of the socket base establish the minimum socket height after
solder reflow and are specified in Appendix C.
Similarly, a seating plane on the top-side of the socket establishes the minimum
package height. See Section 5.2 for the calculated IHS height above the motherboard.
3.6 Durability
The socket must withstand 20 cycles of processor insertion and removal. The max
chain contact resistance from Tab l e 5- 4 must be met when mated in the 1st and 20th
cycles.
The socket Pick and Place cover must withstand 15 cycles of insertion and removal.
26 Thermal/Mechanical Specifications and Design Guidelines
LGA1156 Socket
3.7 Markings
There are three markings on the socket:
• LGA1156: Font type is Helvetica Bold - minimum 6 point (2.125 mm).
• Manufacturer's insignia (font size at supplier's discretion).
• Lot identification code (allows traceability of manufacturing date and location).
All markings must withstand 260°C for 40 seconds (typical reflow/rework profile)
without degrading, and must be visible after the socket is mounted on the
motherboard.
LGA1156 and the manufacturer's insignia are molded or laser marked on the side wall.
3.8 Component Insertion Forces
Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/
Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table
R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force
to insert the package into the socket.
3.9 Socket Size
Socket information needed for motherboard design is given in Appendix C.
This information should be used in conjunction with the reference motherboard keepout drawings provided in Appendix B to ensure compatibility with the reference thermal
mechanical components.
§
Thermal/Mechanical Specifications and Design Guidelines 27
LGA1156 Socket
28 Thermal/Mechanical Specifications and Design Guidelines
Independent Loading Mechanism (ILM)
4 Independent Loading
Mechanism (ILM)
The Independent Loading Mechanism (ILM) provides the force needed to seat the
1156-LGA land package onto the socket contacts. The ILM is physically separate from
the socket body. The assembly of the ILM to the board is expected to occur after wave
solder. The exact assembly location is dependent on manufacturing preference and test
flow. See the Manufacturing Advantage Service collateral for this platform for additional
guidance.
Note: The ILM has two critical functions: deliver the force to seat the processor onto the
socket contacts and distribute the resulting compressive load evenly through the socket
solder joints.
Note: The mechanical design of the ILM is integral to the overall functionality of the LGA1156
socket. Intel performs detailed studies on integration of processor package, socket and
ILM as a system. These studies directly impact the design of the ILM. The Intel
reference ILM will be “build to print” from Intel controlled drawings. Intel recommends
using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from Intel's
detailed studies and may not incorporate critical design parameters.
4.1 Design Concept
The ILM consists of two assemblies that will be procured as a set from the enabled
vendors. These two components are ILM cover assembly and back plate. To secure the
two assemblies, two types of fasteners are required a pair (2) of standard 6-32 thread
screws and a custom 6-32 thread shoulder screw. The reference design incorporates a
T-20 Torx* head fastener. The Torx* head fastener was chosen to ensure end users do
not inadvertently remove the ILM assembly and for consistency with the LGA1366
socket ILM. The Torx* head fastener is also less susceptible to driver slippage. Once
assembled the ILM is not required to be removed to install / remove the motherboard
from a chassis.
4.1.1 ILM Cover Assembly Design Overview
The ILM Cover assembly consists of three major pieces: load lever, load plate and the
hinge frame assembly.
All of the pieces in the ILM cover assembly except the hinge frame and the screws used
to attach the back plate are fabricated from stainless steel. The hinge frame is plated.
The frame provides the hinge locations for the load lever and load plate. An insulator is
pre-applied to the bottom surface of the hinge frame.
The cover assembly design ensures that once assembled to the back plate the only
features touching the board are the shoulder screw and the insulated hinge frame
assembly. The nominal gap of the load plate to the board is ~1 mm.
Thermal/Mechanical Specifications and Design Guidelines 29
When closed, the load plate applies two point loads onto the IHS at the “dimpled”
Fasteners
Load
Lever
Load
Plate
Hinge /
Frame
Assy
Shoulder Screw
Pin 1 Indicator
Fasteners
Load
Lever
Load
Plate
Hinge /
Frame
Assy
Shoulder Screw
Pin 1 Indicator
Die Cut
Insulator
Pierced & Extruded
Thread Features
Assembly
Orientation
Feature
Die Cut
Insulator
Pierced & Extruded
Thread Features
Assembly
Orientation
Feature
features shown in Figure 4-1. The reaction force from closing the load plate is
transmitted to the hinge frame assembly and through the fasteners to the back plate.
Some of the load is passed through the socket body to the board inducing a slight
compression on the solder joints.
A pin 1 indicator will be marked on the ILM cover assembly.
Figure 4-1. ILM Cover Assembly
Independent Loading Mechanism (ILM)
4.1.2 ILM Back Plate Design Overview
The back plate (see Figure 4-2) is a flat steel back plate with pierced and extruded
features for ILM attach. A clearance hole is located at the center of the plate to allow
access to test points and backside capacitors if required. An insulator is pre-applied. A
notch is placed in one corner to assist in orienting the back plate during assembly.
Note: The Server ILM back plate is different from the Desktop design. Since Server
secondary-side clearance of 3.0 mm[0.118 inch] is generally available for leads and
backside components, so Server ILM back plate is designed with 1.8 mm thickness and
2.2 mm entire height including punch protrusion length.
Figure 4-2. Back Plate
30 Thermal/Mechanical Specifications and Design Guidelines
Independent Loading Mechanism (ILM)
Shoulder
6-32 thread
Cap
4.1.3 Shoulder Screw and Fasteners Design Overview
The shoulder screw is fabricated from carbonized steel rod. The shoulder height and
diameter are integral to the mechanical performance of the ILM. The diameter provides
alignment of the load plate. The height of the shoulder ensures the proper loading of
the IHS to seat the processor on the socket contacts. The design assumes the shoulder
screw has a minimum yield strength of 235 MPa.
A dimensioned drawing of the shoulder screw is available for local sourcing of this
component. Refer to Figure B-16 for the custom 6-32 thread shoulder screw drawing.
The standard fasteners can be sourced locally. The design assumes this fastener has a
minimum yield strength of 235 MPa. Refer to Figure B-17 for the standard 6-32 thread
fasteners drawing.
Note: The screws for Server ILM are different from Desktop design. The length of Server ILM
screws are shorter than the Desktop screw length to satisfy Server secondary-side
clearance limitation.
Note: The reference design incorporates a T-20 Torx* head fastener. The Torx* head fastener
was chosen to ensure end users do not inadvertently remove the ILM assembly and for
consistency with the LGA1366 socket ILM.
Figure 4-3. Shoulder Screw
Thermal/Mechanical Specifications and Design Guidelines 31
Independent Loading Mechanism (ILM)
Step 1 Step 2
Step 3
Step 4
Step 1 Step 2
Step 3
Step 4
Step 1 Step 2
Step 3
Step 4
4.2 Assembly of ILM to a Motherboard
The ILM design allows a bottoms up assembly of the components to the board. See
Figure 4-4 for step by step assembly sequence.
1. Place the back plate in a fixture. The motherboard is aligned with the fixture.
2. Install the shoulder screw in the single hole near Pin 1 of the socket. Torque to a
minimum and recommended 8 inch-pounds, but not to exceed 10 inch-pounds.
3. Align and place the ILM cover assembly over the socket.
4. Install two (2) 6-32 fasteners. Torque to a minimum and recommended 8 inchpounds, but not to exceed 10 inch-pounds.
The thread length of the shoulder screw accommodates a nominal board thicknesses of
.
Figure 4-4. ILM Assembly
0.062”.
32 Thermal/Mechanical Specifications and Design Guidelines
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