Intel X58 User Manual
USER'S MANUAL
Of
Intel X58 Express Chipset
And
Intel ICH10R Chipset
Based
M/B for Intel Core i7 Processors
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are subject to
change at any time without notice, and should not be construed as a commitment by manufacturer.
NO. G03-BI600 -F
Rev: 2.0
Release date: April, 2009
i
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize pollution and
ensure environment protection of mother earth, please recycle.
ii
SAFETY ENVIROMENTAL INSTRUCTION ....................................................................iii
USER’S NOTICE.....................................................................................................................iv
MANUAL REVISION INFORMATION ..............................................................................iv
COOLING SOLUTIONS........................................................................................................iv
CHAPTER 1
INTRODUCTION OF X58 EXPRESS AND ICH10R MOTHERBOARDS
1-1 FEATURES OF MOTHERBOARD....................................................................................1
1-1.1 SPECIAL FEATURES OF MOTHERBOARD.................................................... 2
1-2 SPECIFICATION.................................................................................................................. 4
1-3 PERFORMANCE LIST........................................................................................................ 5
1-4 LAYOUT DIAGRAM ........................................................................................................... 6
CHAPTER 2 HARDWARE INSTALLATION
2-1 HARDWARE INSTALLATION STEPS............................................................................. 8
2-2 CHECKING MOTHERBOARD'S JUMPER SETTING.................................................. 8
2-3 INSTALL CPU....................................................................................................................... 9
2-3-1 GLOSSARY............................................................................................................. 9
2-3-2
ABOUT INTEL LGA 1366CPU
.......................................................................... 10
2-3-3 LGA 1366 CPU INSTALLATION GUIDE........................................................... 11
2-3-4 INTEL REFERENCE THERMAL SOLUTION ASSEMBLY........................... 13
2-4 INSTALLING MEMORY.................................................................................................... 14
2-5 EXPANSION CARDS........................................................................................................... 15
2-5-1 PROCEDURE FOR EXPANSION CARD INSTALLATION ............................ 15
2-5-2 ASSIGNING IRQ FOR EXPANSION CARD...................................................... 15
2-5-3 PCI-EXPRESS SLOT.............................................................................................. 16
2-5-4 INSTALLING THE CROSSFIRE BRIDGE CARD ............................................ 17
2-6 CONNECTORS, HEADERS................................................................................................ 19
2-6-1 CONNECTORS....................................................................................................... 19
2-6-2 HEADERS ............................................................................................................... 22
2-7 STARTING UP YOUR COMPUTER................................................................................. 25
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP.............................................................................................................. 26
3-2 GETTING HELP................................................................................................................... 26
3-3 THE MAIN MENU................................................................................................................ 27
3-4 STANDARD BIOS FEATURES........................................................................................... 28
3-5 ADVANCED BIOS FEATURES.......................................................................................... 29
3-6 ADVANCED CHIPSET FEATURES.................................................................................. 30
3-7 INTEGRATED PERIPHERALS......................................................................................... 30
3-7-1 ONBOARD SATA DEVICE .................................................................................. 30
3-7-2 ONBOARD DEVICE CONTROL......................................................................... 31
3-7-3 SUPER IO CONFIGURATION ............................................................................ 31
3-7-4 USB CONFIGURATION....................................................................................... 33
3-8 POWER MANAGEMENT FEATURES............................................................................. 33
3-9 MISCELLANEOUS CONTROL......................................................................................... 34
3-10 PC HEALTH STATUS.......................................................................................................... 35
3-10-1 SMART FAN CONFIGURATION.................................................................... 35
3-11 POWER USER OVERCLOCK SETTING......................................................................... 36
3-12 BIOS SECURITY FEATURES............................................................................................ 36
3-13 LOAD OPTIMIZED DEFAULTS/LOAD FAIL-SAFE DEFAULTS............................... 37
3-14 SAVE CHANGES AND EXIT/ DISCARD AND EXIT....................................................... 37
CHAPTER 4 DRIVER & FREE PROGRAM INSTALLATION
MAGIC INSTALL SUPPORTS WINDOWS 2000/XP ................................................................ 38
4-1 INF INSTALL INTELX58 CHIPSET SYSTEM DRIVER.................................... 39
4-2 SOUND INSTALL ALC 888 HD AUDIO CODEC DRIVER....................................... 40
4-3 LAN INSTALL REALTEK GIGABIT ETHERNET NIC DRIVER....................... 41
4-4 RAID INSTALL JMICRON RAID DRIVER............................................................ 41
4-5 NORTON INSTALL NORTON INTERNET SECURITY 2009.................................... 42
4-6 PC-HEALTH INSTALL MYGUARD HARDWARE MONITOR UTILITY .............. 43
4-7 RAID DISK INSTALL JMICRON RAID DISK.......................................................... 43
4-8 AHCI INSTALL INTEL AHCI DRIVER ...................................................................... 44
4-9 HOW TO UPDATE BIOS..................................................................................................... 45
4-10 INTEL PLATFORM RAID FUNCTION INTRODUCTION ........................................... 45
4-11 PRO MAGIC PLUS FUNCTION INTRODUCTION........................................................ 47
TABLE OF CONTENT
iii
4-12 G.P.I.FUNCTION LED DISPLAY ...................................................................................... 48
Safety Environmental Instruction
z Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
z 0 to 40 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
z Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
z The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
z Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS
MANUAL, INCLUDING THE PRODUCTS AND SOFTWARES DESCRIBED IN IT MAY BE
REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR
BY ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED FOR THE UTILIZATION OF X58
EXPRESS INTEL EDITION MOTHER-BOARDS TO MEET THE USER’S REQUIREMENTS. BUT
IT WILL CHANGE, CORRECT AT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES
THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR
ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING
DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND
THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S
BENEFIT, WITHOUT INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition Feb., 2009
Item Checklist
5
Intel X58 Express and ICH10R chipset based Motherboard
5
User’s Manual
5
CD for motherboard utilities
5
8 in 1 cable package
5
I/O Back Panel Shield
Intel Core Processor Family
Cooling Solutions
As processor technology pushes to faster speeds and higher performance, thermal management
becomes increasingly crucial while building computer systems. Maintaining the proper thermal
environment is the key to reliable, long-term system operation. The overall goal in providing the
proper thermal environment is keeping the processor below its specified maximum case temperature.
Heat sinks induce improved processor heat dissipation through increased surface area and
concentrated airflow from attached fans. In addition, interface materials allow effective transfers of
heat from the processor to the heat sink. For optimum heat transfer, Intel recommends the use of
thermal grease and mounting clips to attach the heat sink to the processor.
When selecting a thermal solution for your system, please refer to the website below for collection of
heat sinks evaluated and recommended by Intel for use with Intel processors. Note, those heat sinks
are recommended for maintaining the specified Maximum T case requirement. In addition, this
collection is not intended to be a comprehensive listing of all heat sinks that support Intel processors.
1
Chapter 1
Introduction of X58 Express and ICH10R chipset based Motherboards
1-1 Features of Motherboard
The X58 Express and ICH10R chipset based motherboard series are based on Intel X58
Express chipset and ICH10R chipsets technology which supports the innovative Intel®
Core™ i7-965 processor Extreme Edition, Intel® Core™ i7-940 processors and Intel®
Core™ i7-920 processors with QPI up to 6.4 GT/s.
The X58 Express and ICH10R chipset Based motherboard series deliver the revolutionary
levels of performance enabling vivid, high-definition experiences and multi-tasking
responsiveness from state-of-the-art Intel quad-core technologies, AMD CrossFire technology
through the high bandwidth of dual channel DDR3 1600/1333/1066 MHz system memories
which are expandable to 24 GB capacity and the new generation of PCI Express interface for
the latest graphics cards from both AMD and nVidea. The X58 Express and ICH10R chipset
motherboard series are absolutely the ultimate solution for game enthusiasts and applications,
and it also meets the demanding usage of computing of gaming, multimedia entertainment
and business applications.
The Intel X58 Express and ICH10R chipset motherboard series are embedded with ICH10R
chipset of providing six serial ATA2 interfaces of 3.0 Gb / s data transfer rate for six serial
ATA devices which supports RAID 0, 1,5,10 functions. More over, the motherboard provides
also extra 1 Ultra ATA interface for two IDE devices of 133 MB / s data transfer rate and two
external serial ATA interface of 3.0 Gb / s data transfer rate for two external serial ATA hard
disk devices.
Th e X58 Express and ICH10R chipset Ba se d motherboard provides Gigabit LAN function by
using two Realtek RTL8111C PCI Gigabit LAN chips which support 10M / 100M / 1Gbps
data transfer rate. Embedded 8-channel ALC888 HD CODEC is fully compatible with Sound
Blaster Pro® standards that offer you with the home cinema quality and absolutely software
compatibility.
The X58 Express chipset based motherboard series offer four PCI-Express2.0 x16 graphics
slots with PE1 and PE4 being PCI Express 2.0 x16@16 lane slots while PE3 and PE5 being
PCI Express 2.0 x16@ 8 lane slots. These four graphics slots are fully compatible with the
latest AMD CrossFireX Technology to guarantee the fully operational Multi-GPUs graphics
function and avoid the possible installation error. One PCI Express x4 I/O slot and one 32-bit
PCI slots guarantee the rich connectivity for the I/O of peripherals.
Embedded USB controllers as well as capability of expanding to 12 of USB2.0 functional
ports delivering 480Mb/s bandwidth of rich connectivity, these motherboards meet the future
USB demands which are also equipped with hardware monitor function on system to monitor
and protect your system and maintain your non-stop business computing.
Some special features---
CPU Thermal Throttling/ CPU Smart Fan/ CPU Vcore X-shift/
Debug Port/OC-CON／G.P.I. Function/DIY Clear/Power on Button/Reset Button
in this
motherboard are designed for power user to use the over-clocking function in more flexible
2
ways. But please be caution that the over-clocking may cause the failure in system reliability.
This motherboard provides the guaranteed performance and meets the demands of the next
generation computing. But if you insist to gain more system performance with variety
possibilities of the components you choose, please be careful and make sure to read the
detailed descriptions of these value added product features, please get them in the coming
section.
1-1.1 Special Features of motherboard
CPU Thermal Throttling Technology--- (The CPU Overheat Protection Technology)
To prevent the increasing heat from damage of CPU or accidental shutdown while at high
workload, the CPU Thermal Throttling Technology will force CPU to enter partially idle
mode from 87.5% to 12.5% according to preset CPU operating temperature in BIOS (from 40
℃ to 90℃). When the system senses the CPU operating temperature reaching the preset
value, the CPU operating bandwidth will be decreased to the preset idle percentage to cool
down the processor. When at throttling mode the beeper sound can be optionally selected to
indicate it is in working.
CPU Smart Fan
--- The Noise Management System
It’s never been a good idea to gain the performance of your system by sacrificing its acoustics.
CPU Smart Fan Noise Management System is the answer to control the noise level needed for
now-a-day’s high performance computing system. The system will automatically increase the
fan speed when CPU operating loading is high, after the CPU is in normal operating
condition, the system will low down the fan speed for the silent operating environment. The
system can provide the much longer life cycle for both CPU and the system fans for game use
and business requirements.
CPU Vcore X-Shift
--- Shift to Higher Performance
The CPU voltage can be adjusted up by 31 stages for the precisely over-clocking of extra
demanding computing performance.
Debug Port
--- The Professional Hardware Diagnosis System
Being bugged of abnormal system failure through the tossed and turned nights no more, the
embedded Hardware Debug Port offers you the real-time visual system healthy for the
demanding usage of computing. No more bugging by unknown system failure and no more
time wasted in the first moment of 24-hour nonstop ping business computing, the embedded
Debug Port will turn you into a well training hardware professional with the seeing system
situation. (The Post Code please refer Appendix)
OC-CON ---
High-polymer Solid Electrolysis Aluminum Capacitors (Optional for HI04
series only)
The working temperature is from 55 degrees Centigrade below zero to 125 degrees
Centigrade, OC-CON capacitors possess superior physical characteristics that can be while
reducing the working temperature between 20 degrees Centigrade each time, intact extension
10 times of effective product operation lives, at not rising degrees Centigrade of working
temperatures each time a relative one, life of product decline 10% only too.
3
G.P.I. Function—(Green power indicator function)
The full name of G.P.I technology is Green Power Indicator technology, obviously
technology utilized to low power consumption. G.P.I is a technology with remarkable power
saving function.
DIY Clear
The CMOS Button is to facilitate the clear COMS process for power user overclocking
function. The user can easily clear or restore COMS settings by pressing down the button,
without taking trouble to remove the case and locate the jumper for clear CMOS.
Power on Button
You can easily start the computer by pressing down this button for a few seconds, without
troubling yourself to locate the front panel jumpers to find the Power on jumper.
Reset Button
You can easily restart the computer by pressing down this button for a few seconds, without
troubling yourself to locate the front panel jumpers to find the reset jumper.
4
1-2 Specification
Spec Description
Design
∗ ATX form factor 6 layers PCB size: 30.5x24.5cm
Chipset
∗ Intel X58 Express Chipset
∗ Intel ICH10R chipset
CPU Socket
LGA 1366
∗ Supports the Intel® Core™ i7-965 processor Extreme Edition,
Intel® Core™ i7-940 processors and Intel® Core™ i7-920
processors.
∗ Support QPI up to 6.4 GT/s
Memory Sockets
∗ DDR3 Module sockets x 6，
∗ Support 6 pcs DDR3 1600 /DDR3 1333MHz/ DDR3 1066
memory modules expandable to 24GB.
∗ Support Dual- channel / Three-channel function
Expansion Slots
∗ PCI-Express2.0 x16 slot 4pcs
∗ PCI-Express2.0 x4 slot 1pcs
∗ 32-bit PCI slot x 1pcs
Integrate IDE and
Serial ATA2 RAID
∗ The Intel ICH10R supports six internal Serial ATA ports for six
SATA devices with RAID0, RAID1, RAID5 and PAID10
function providing 3.0 Gb/sec data transfer rate.
∗ JMB363 supports PCI Bus Mastering, ATA PIO/DMA and the
ULTRA DMA 66 / 100/133 functions that deliver the data
transfer rate up to 133 MB/s for two IDE Devices and two
external Serial ATA ports providing 3.0 Gb /sec data transfer
rate for two serial ATA devices
Gigabit LAN
∗ Integrated Realtek RTL8111C PCI-E Gigabit LAN function.
∗ Supports Fast Ethernet LAN function provide 10Mb/100Mb/
1Gb /s data transfer rate.
8CH-Audio
∗ Realtek ALC888 Azalia 8-channel HD Audio Codec integrated
∗ Support 8-channel 3D surround & Positioning Audio
∗ Audio driver and utility included
BIOS
∗ AMI 8MB SPI Flash ROM
Multi I/O
∗ PS/2 keyboard and PS/2 mouse connectors
∗ ESATA connectors x2, SATA connectors x6
∗ Coaxial S/PDIF Out connector x1
∗ USB2.0 port x 8 and headers x2
∗ RJ-45 LAN connector x2
∗ Audio connector x1 (8-CH Audio)
∗ Floppy disk drive connector x1,Hard disk drive connector x1
∗ Serial Port headerx1
∗ HDMI-SPDIF header x1
∗ IR header x 1
5
1-3 Performance List
The following performance data list is the testing result of some popular benchmark testing
programs. These data are just referred by users, and there is no responsibility for different
testing data values gotten by users (the different Hardware & Software configuration will
result in different benchmark testing results.)
Test Configuration:
CPU: Core i7 920
DRAM: Apacer DDR3 1333 2GB x2
VGA Card: ATI 3850
Hard Disk Driver: Seagat SATA 160GB
BIOS: T003
3D Mark 2001SE
34578
3D Mark 2003
13117
3D Mark 2005
7544
AQUAMRK3
N/G
PCMark2005
System / CPU / Memory
7324/8095/6354
Graph / HDD
5499/6247
Content Creation Winstone 2004
49.3
Business Winstone 2004
32.4
Winbench 99 V2.0:
Business /Hi-end Disk Winmark99
225001.3
SYSMark 2007: SISMark Rating(Internet Content Creation / Office Productivity )
E-learning
151
Video Creation
164
productively
138
3D
211
System Mark Preview Rating
164
DATA Analysis
296
SISOFT Sandra 2009 : 1.CPU Arithmetic Benchmark 2.CPU Multi-Media Benchmark 3.Memory bandwidth
Benchmark
1.DHRYSTON ALU GIPS
70.66GIPS
WHETSTONE ISSE2 GFLOPS
62.53GFlo
p
s
2. Int/Float Buffered iSSE2 MB/S
13.59GB/S
,
13.63GB/S
3. Integer/Floating-Point SSE2 IT/S
124.61
,
100.38 Mpixel/s
UT2003 Benchmark (flyby/botmatch)
542.181702/178.297337
Quake3 DEMO1 / DEMO2 FPS
N/A
Super Pi (1M) Second
15.34”
CPUZ System / CPU Clock
2.66GHZ
6
1-4 Layout Diagram
USB headers
PS/2Mouse
(Green)
Power LED ／
Speaker Headers
LGA 1366 CPU Socket
DDR3 1600 DIMMs
ATX Power Connecto
r
CD Audio In
32-bit PCI Slot
8-CH Azalia Audio Codec
PS2 KB/Mouse Port
CPU FAN
Audio Connector
KB/MS Power On Jumper(JP1)
ATX 12V Power Conn.
RJ45 Ports
Over USB Ports
PCI-E 2.0 x16 @ 16 lane
(PE1, PE4)
HDMI-SPDIF
RTL8111C
Gigabit LAN Chips
Intel
ICH10R
Chipset
RJ-45 Ports
Serial-ATA2 Connectors
(D-SATA1, D-SATA2,
D-SATA3)
Front Panel
Header
MIC-IN
（Pink）
Line OUT (Green)
Floppy Connector
USB Power On Jumper (JP3)
Line IN
(
Blue
)
ATA 133 IDE
Connector
PCI-E2.0 x4 slot
PS/2 Keyboard
（Purple）
Coaxial S/PDIF out.
CMOS2
SYS FAN1
USB connectors
E-SATA Ports
over USB Ports
Intel X58 Express
Chipset
Serial Port Header
8Mbit SPI Flash ROM BIOS
SPDIF-OUT1
CMOS2
PCI-E 2.0 x16 @ 8 lane
(PE3, PE5)
Clear CMOS (JBAT)
CEN/BASS
(Black)
Surrback
（Orange）
Surround (Gra
y
)
Reset Button
Power on Button
COMS1 Button
SYS FAN2
IR Header
USB Power On Jumper (JP4)
7
Jumpers
Jumper Name Description Page
JBAT CMOS RAM Clear 3-pin Block P.8
JP1 Keyboard Power On Enabled/Disabled 3-pin Block P.9
JP3/JP4 USB Power On Enabled/Disabled 3-pin Block P.9
Connectors
Connector Name Description Page
ATXPWR1 ATX Power Connector 24-pin Block P.18
ATX12V1 ATX 12V Power Connector 8-pin Block P.18
KB1 PS/2 Mouse & PS/2 Keyboard Connector 6-pin Female P.19
USB from CN1,CN2 and
UL1， UL2
USB 2.0 Port Connectors 4-pin Connector P.19
RJ45 LAN from UL1,UL2 RJ-45 LAN Port Over USB Connectors. RJ-45 Connector P.19
AUDIO1 8-CH Audio Connector 6 phone jack
Connector
P.19
FLOPPY1 Floppy Driver Connector 34-pin Block P.19
IDE1 IDE Connector 40-pin Block P.20
DSATA1,DSATA2,
DSATA3
Serial ATA2 Connector 7-pin Connector P.20
E-SATA from CN1,CN2 External Serial ATA2 Connectors 7-pin Connector P.21
SPDIF_ Out1 Coaxial S/PDIF Out Connector 1phone connector P.21
Headers
Header Name Description Page
FP_AUDIO1 SPEAKER, MIC header 9-pin Block P.21
USB1,USB2 USB Port Headers 9-pin Block P.21
SPEAK PC Speaker header 4-pin Block P.21
PWR LED Power LED header 3-pin Block P.21
JW_FP(PWR LED/Reset/
HD LED/PWR BTN)
Front Panel Header
(including Power LED/ IDE activity
LED/Reset switch / Power On Button lead)
9-pin Block P.21
CPUFAN1 CPUFAN Header 4-pin Block P.22
SYSFAN1, SYSFAN2 System FAN Headers 3-pin Block P.22
CDIN1 CD Audio-In Header 4-pin Block P.22
IR1 IR Header 5-pin Block P.23
COM1 Serial Port COM1 Header 9-pin Block P.23
HDMI-SPDIF1 SPDIF-Out header 2-pin Block P.23
Expansion Sockets
Socket/Slot Name Description Page
LGA 1366 Socket CPU Socket LGA 1366 CPU Socket
P.10
DIMM_A2/DIMM_A1/
DIMM_B2/DIMM_B1/
DIMM_C2/DIMM_C1
DDR3 Module Sockets 240-pin DDR3 Module Sockets
P.14
PCI1
PCI Slot 32-bit PCI Local Bus Expansion slots
P.16
PE2
PCI-Express2.0 x4 Slot PCI-Express2.0 x 4Expansion Slots
P.16
PE1,PE3,PE4,PE5
PCI-Express 2.0x 16
Slots
PCI-Express2.0 x16 Expansion Slots
P.16
8
Chapter 2
Hardware Installation
WARNING!
Turn off your power when adding or removing expansion cards or other
system components. Failure to do so may cause severe damage to both
your motherboard and expansion cards.
2-1 Hardware installation Steps
Before using your computer, you had better complete the following steps:
1. Check motherboard jumper setting
2. Install CPU and Fan
3. Install System Memory (DIMM)
4. Install Expansion cards
5. Connect IDE Front Panel /Back Panel cable
6. Connect ATX Power cable
7. Power-On and Load Standard Default
8. Reboot
9. Install Operating System
10. Install Driver and Utility
2-2 Checking Motherboard’s Jumper Setting
(1) CMOS RAM Clear (3-pin) : JBAT1
A battery must be used to retain the motherboard configuration in CMOS RAM short 1-2
pins of JBAT to store the CMOS data.
To clear the CMOS, follow the procedure below:
1. Turn off the system and unplug the AC power
2. Remove ATX power cable from ATX power connector
3. Locate JBAT and short pins 2-3 for a few seconds
4. Return JBAT to its normal setting by shorting pins 1-2
5. Connect ATX power cable back to ATX power connector
Note: When should clear CMOS
1. Troubleshooting
2. Forget password
3. After over clocking system boot fail
CMOS RAM Clear Setting
2-3 Closed Clear CMOS
JBATJBAT
1-2 Closed Normal
9
(2) Keyboard function Enabled/Disabled: JP1
(3) USB Power On function Enabled/Disabled: JP3/JP4
USB Power-On Setting
2-3 closed USB Power On Enabled
JP3 / JP4JP3 / JP4
1-2 closed USB Power On Disable
(Default)
2-3 Installing CPU
2-3-1 Glossary
Chipset (or core logic) - two or more integrated circuits which control the interfaces between
the system processor, RAM, I/O devises, and adapter cards.
Processor slot/socket - the slot or socket used to mount the system processor on the
motherboard.
Slot (PCI-E, PCI, RAM) - the slots used to mount adapter cards and system RAM.
PCI - Peripheral Component Interconnect - a high speed interface for video cards, sound
cards, network interface cards, and modems; runs at 33MHz.
PCI Express2.0- Peripheral Component Interconnect Express2.0, developed in 2003, the
speed of each line doubled from the previous PCI-E of 2.5Gbps to 5 Gbps.
Serial Port - a low speed interface typically used for mouse and external modems.
Parallel Port - a low speed interface typically used for printers.
PS/2 - a low speed interface used for mouse and keyboards.
USB - Universal Serial Bus - a medium speed interface typically used for mouse, keyboards,
scanners, and some digital cameras.
Sound (interface) - the interface between the sound card or integrated sound connectors and
speakers, MIC, game controllers, and MIDI sound devices.
LAN (interface) - Local Area Network - the interface to your local area network.
BIOS (Basic Input/Output System) - the program logic used to boot up a computer and
establish the relationship between the various components.
Driver - software, which defines the characteristics of a device for use by another device or
other software.
Keyboard/Mouse Power On Setting
2-3 Closed KB Power ON Enabled
JP1
JP1
1-2 Closed KB Power ON Disable (Default)
10
Processor - the "central processing unit" (CPU); the principal integrated circuit used for
doing the "computing" in "personal computer"
Front Side Bus Frequency -
the working frequency of the motherboard, which is generated
by the clock generator for CPU, DRAM and PCI BUS.
CPU L2 Cache -
the flash memory inside the CPU, normal it depend on CPU type.
2-3-2 About Intel LGA 1366 CPU
This motherboard provides a 1366-pin DIP, LGA 1366 Land Grid Array socket, referred to as
the LGA 1366 socket.
The CPU that comes with the motherboard should have a cooling FAN attached to prevent
overheating. If this is not the case, then purchase a correct cooling FAN before you turn on
your system.
NOTED!
Be sure that there is sufficient air circulation across the processor’s heat
sink and CPU cooling FAN is working correctly, otherwise it may cause
the processor and motherboard overheat and damage, you may install an
auxiliary cooling FAN, if necessary.
To install a CPU, first turn off your system and remove its cover. Locate the LGA 1366
socket and open it by first pulling the level sideways away from the socket then upward to a
135-degree angle. Insert the CPU with the correct orientation as shown below. The
notched corner should point toward the end of the level. Because the CPU has a corner pin
for two of the four corners, the CPU will only fit in the orientation as shown.
When you install the CPU into the LGA 1366 socket, there’s no force required CPU insertion;
then press the level to locate position slightly without any extra force.
Alignment key
Pin-1
Indicator
11
2-3-3 LGA 1366 CPU Installation Guide
1. Please make sure that CPU socket is facing towards
you and the level is on you left hand side.
2.
Press down the level and move iit to the left side to
make sure it is freed from the hook and then open it
upwards about 135 degree.
3. Pick up the lode plate upwards about 100 degree to
make sure it is moved upwards.
4. Remove the plastic protective cap from the socket.
( Put it to the original place if CPU is not installed . Do
not touch the metal contact point of the CPU socket).
12
5. Make sire that golden finger is on the left-down side as shown and match the two alignment keys
on the CPU with two points of the socket. CPU can only be correctly installed with this direction.
Incorrect installation might cause damage to CPU .
6．Put down the load plate.
7.
Press down the load level and move it rightwards make
sure it is locked under the notch.
Pin-1
Indicator
Alignment
Key
Alignment
Key
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