Intel X5550 - Quad Core Xeon Design Manual

Intel® Xeon® Processor 5500/5600 Series

Thermal/Mechanical Design Guide

March 2010

Reference Number: 321323-002

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel

reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel® Xeon® processor 5500 series, 5600 series and LGA1366 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family,

not across different processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details.

Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see www.intel.com.

Intel, Xeon, and the Intel logo are trademarks of Intel Corporation in the U.S and other countries. * Other brands and names may be claimed as the property of others. Copyright © 2009, Intel Corporation.

2 Thermal/Mechanical Design Guide

Contents

1 Introduction ..............................................................................................................9

1.1 References ....................................................................................................... 10

1.2 Definition of Terms ............................................................................................ 10

2 LGA1366 Socket ...................................................................................................... 13

2.1 Board Layout.................................................................................................... 15

2.2 Attachment to Motherboard ................................................................................ 16

2.3 Socket Components........................................................................................... 16

2.3.1 Socket Body Housing .............................................................................. 16

2.3.2 Solder Balls ........................................................................................... 16

2.3.3 Contacts ............................................................................................... 17

2.3.4 Pick and Place Cover............................................................................... 17

2.4 Package Installation / Removal ........................................................................... 18

2.4.1 Socket Standoffs and Package Seating Plane.............................................. 18

2.5 Durability......................................................................................................... 19

2.6 Markings .......................................................................................................... 19

2.7 Component Insertion Forces ............................................................................... 19

2.8 Socket Size ...................................................................................................... 19

2.9 LGA1366 Socket NCTF Solder Joints..................................................................... 20

3 Independent Loading Mechanism (ILM)................................................................... 21

3.1 Design Concept................................................................................................. 21

3.1.1 ILM Cover Assembly Design Overview ....................................................... 21

3.1.2 ILM Back Plate Design Overview............................................................... 22

3.2 Assembly of ILM to a Motherboard....................................................................... 23

4 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications . 27

4.1 Component Mass............................................................................................... 27

4.2 Package/Socket Stackup Height .......................................................................... 27

4.3 Socket Maximum Temperature............................................................................ 27

4.4 Loading Specifications........................................................................................ 28

4.5 Electrical Requirements...................................................................................... 28

4.6 Environmental Requirements ..............................................................................29

5 Thermal Solutions ................................................................................................... 31

5.1 Performance Targets.......................................................................................... 31

5.1.1 25.5 mm Tall Heatsink............................................................................ 32

5.2 Heat Pipe Considerations.................................................................................... 33

5.3 Assembly ......................................................................................................... 34

5.3.1 Thermal Interface Material (TIM).............................................................. 35

5.4 Structural Considerations ...................................................................................35

5.5 Thermal Design................................................................................................. 35

5.5.1 Thermal Characterization Parameter ......................................................... 35

5.5.2 Dual Thermal Profile ............................................................................... 36

5.6 Thermal Features .............................................................................................. 37

5.6.1 Fan Speed Control.................................................................................. 37

5.6.2 PECI Averaging and Catastrophic Thermal Management............................... 38

5.6.3 Intel® Turbo Boost Technology................................................................ 39

5.7 Thermal Guidance ............................................................................................. 39

5.7.1 Thermal Excursion Power for Processors with Dual Thermal Profile ................ 39

5.7.2 Thermal Excursion Power for Processors with Single Thermal Profile.............. 40

5.7.3 Absolute Processor Temperature .............................................................. 40

6 Quality and Reliability Requirements ....................................................................... 41

6.1 Test Conditions ................................................................................................. 41

Thermal/Mechanical Design Guide 3

6.2 Intel Reference Component Validation ..................................................................43

6.2.1 Board Functional Test Sequence ...............................................................43

6.2.2 Post-Test Pass Criteria.............................................................................43

6.2.3 Recommended BIOS/Processor/Memory Test Procedures .............................44

6.3 Material and Recycling Requirements....................................................................44

A Component Suppliers...............................................................................................45

A.1 Intel Enabled Supplier Information .......................................................................45

A.1.1 Intel Reference Thermal Solution ..............................................................45

A.1.2 Intel Collaboration Thermal Solution..........................................................45

A.1.3 Alternative Thermal Solution ....................................................................46

A.1.4 Socket and ILM Components ....................................................................47

B Mechanical Drawings ...............................................................................................49

C Socket Mechanical Drawings ....................................................................................83

D Heatsink Load Metrology..........................................................................................89

E Embedded Thermal Solutions...................................................................................91

E.1 Performance Targets..........................................................................................91

E.2 Thermal Design Guidelines..................................................................................92

E.2.1 NEBS Thermal Profile ..............................................................................92

E.2.2 Custom Heat Sinks For UP ATCA ...............................................................93

E.3 Mechanical Drawings and Supplier Information ......................................................96

F Processor Installation Tool ....................................................................................101

Figures

1-1 Intel® Xeon® 5500 Platform Socket Stack............................................................. 9

2-1 LGA1366 Socket with Pick and Place Cover Removed..............................................13

2-2 LGA1366 Socket Contact Numbering (Top View of Socket) ......................................14

2-3 LGA1366 Socket Land Pattern (Top View of Board).................................................15

2-4 Attachment to Motherboard.................................................................................16

2-5 Pick and Place Cover ..........................................................................................17

2-6 Package Installation / Removal Features ...............................................................18

2-7 LGA1366 NCTF Solder Joints ...............................................................................20

3-1 ILM Cover Assembly...........................................................................................22

3-2 Back Plate ........................................................................................................23

3-3 ILM Assembly....................................................................................................24

3-4 Pin1 and ILM Lever ............................................................................................25

4-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology...........................30

5-1 Best-fit Equations ..............................................................................................32

5-2 TTV Die Size and Orientation...............................................................................33

5-3 1U Reference Heatsink Assembly .........................................................................34

5-4 Processor Thermal Characterization Parameter Relationships ...................................36

5-5 Dual Thermal Profile...........................................................................................37

6-1 Example Thermal Cycle - Actual profile will vary ....................................................43

B-1 Board Keepin / Keepout Zones (Sheet 1 of 4) ........................................................50

B-2 Board Keepin / Keepout Zones (Sheet 2 of 4) ........................................................51

B-3 Board Keepin / Keepout Zones (Sheet 3 of 4) ........................................................52

B-4 Board Keepin / Keepout Zones (Sheet 4 of 4) ........................................................53

B-5 1U Reference Heatsink Assembly (Sheet 1 of 2).....................................................54

B-6 1U Reference Heatsink Assembly (Sheet 2 of 2).....................................................55

B-7 1U Reference Heatsink Fin and Base (Sheet 1 of 2) ................................................56

B-8 1U Reference Heatsink Fin and Base (Sheet 2 of 2) ................................................57

4 Thermal/Mechanical Design Guide

B-9 Heatsink Shoulder Screw (1U, 2U and Tower) ....................................................... 58

B-10 Heatsink Compression Spring (1U, 2U and Tower) ................................................. 59

B-11 Heatsink Retaining Ring (1U, 2U and Tower)......................................................... 60

B-12 Heatsink Load Cup (1U, 2U and Tower) ................................................................ 61

B-13 2U Collaborative Heatsink Assembly (Sheet 1 of 2)................................................ 62

B-14 2U Collaborative Heatsink Assembly (Sheet 2 of 2)................................................ 63

B-15 2U Collaborative Heatsink Volumetric (Sheet 1 of 2) .............................................. 64

B-16 2U Collaborative Heatsink Volumetric (Sheet 2 of 2) .............................................. 65

B-17 Tower Collaborative Heatsink Assembly (Sheet 1 of 2) ........................................... 66

B-18 Tower Collaborative Heatsink Assembly (Sheet 2 of 2) ........................................... 67

B-19 Tower Collaborative Heatsink Volumetric (Sheet 1 of 2).......................................... 68

B-20 Tower Collaborative Heatsink Volumetric (Sheet 2 of 2).......................................... 69

B-21 1U Reference Heatsink Assembly with TIM (Sheet 1 of 2) ....................................... 70

B-22 1U Reference Heatsink Assembly with TIM (Sheet 2 of 2) ....................................... 71

B-23 2U Reference Heatsink Assembly with TIM (Sheet 1 of 2) ....................................... 72

B-24 2U Reference Heatsink Assembly with TIM (Sheet 2 of 2) ....................................... 73

B-25 Tower Reference Heatsink Assembly with TIM (Sheet 1 of 2)................................... 74

B-26 Tower Reference Heatsink Assembly with TIM (Sheet 2 of 2)................................... 75

B-27 25.5mm Reference Heatsink Assembly (Sheet 1 of 2) ............................................ 76

B-28 25.5mm Reference Heatsink Assembly (Sheet 2 of 2) ............................................ 77

B-29 25.5mm Reference Heatsink Fin and Base (Sheet 1 of 2)........................................ 78

B-30 25.5mm Reference Heatsink Fin and Base (Sheet 2 of 2)........................................ 79

B-31 25.5mm Reference Heatsink Assembly with TIM (Sheet 1 of 2)................................ 80

B-32 25.5mm Reference Heatsink Assembly with TIM (Sheet 2 of 2)................................ 81

C-1 Socket Mechanical Drawing (Sheet 1 of 4) ............................................................ 84

C-2 Socket Mechanical Drawing (Sheet 2 of 4) ............................................................ 85

C-3 Socket Mechanical Drawing (Sheet 3 of 4) ............................................................ 86

C-4 Socket Mechanical Drawing (Sheet 4 of 4) ............................................................ 87

D-1 Intel Xeon Processor 5500 Series Load Cell Fixture ................................................ 90

E-1 ATCA Heatsink Performance Curves ..................................................................... 92

E-2 NEBS Thermal Profile......................................................................................... 93

E-3 UP ATCA Thermal Solution.................................................................................. 94

E-4 UP ATCA System Layout..................................................................................... 94

E-5 UP ATCA Heat Sink Drawing................................................................................ 95

E-6 ATCA Reference Heat Sink Assembly (Sheet 1 of 2) ............................................... 97

E-7 ATCA Reference Heat Sink Assembly (Sheet 2 of 2) ............................................... 98

E-8 ATCA Reference Heatsink Fin and Base (Sheet 1 of 2) ............................................ 99

E-9 ATCA Reference Heatsink Fin and Base (Sheet 2 of 2) .......................................... 100

F-1 Processor Installation Tool................................................................................ 102

Thermal/Mechanical Design Guide 5

Tables

1-1 Reference Documents.........................................................................................10

1-2 Terms and Descriptions ......................................................................................10

4-1 Socket Component Mass.....................................................................................27

4-2 1366-land Package and LGA1366 Socket Stackup Height ........................................27

4-3 Socket and ILM Mechanical Specifications .............................................................28

4-4 Electrical Requirements for LGA1366 Socket..........................................................29

5-1 Boundary Conditions and Performance Targets for

Intel® Xeon® Processor 5500 Series ...................................................................31

5-2 Boundary Conditions and Performance Targets for

Intel Xeon processor 5600 series .........................................................................31

5-3 Performance Expectations for Intel Xeon Processor 5500

Series with 25.5 mm Tall Heatsink .......................................................................32

5-4 Fan Speed Control, TCONTROL and DTS Relationship..............................................37

5-5 T

6-1 Heatsink Test Conditions and Qualification Criteria .................................................41

A-1 Suppliers for the Intel Reference Thermal Solution .................................................45

A-2 Suppliers for the Intel Collaboration Thermal Solution.............................................46

A-3 Suppliers for the Alternative Thermal Solution .......................................................46

A-4 LGA1366 Socket and ILM Components..................................................................47

B-1 Mechanical Drawing List......................................................................................49

C-1 Mechanical Drawing List......................................................................................83

E-1 Boundary Conditions and Performance Targets for

E-2 Boundary Conditions and Performance Targets for

E-3 Embedded Heatsink Component Suppliers.............................................................96

E-4 Mechanical Drawings List ....................................................................................96

CONTROL

Intel® Xeon® Processor 5500 Series ...................................................................91

Intel® Xeon® Processor 5600 Series ...................................................................91

Guidance.............................................................................................38

6 Thermal/Mechanical Design Guide

Revision History

Document

Number

321323 001 Public Release March 2009

321323 002

Revision

Number

Description

Updates / additions in this revision include:

• Changed to reflect addition of Intel® Xeon® Processor 5600 Series

• Figure 1-1: replaced to show ILM load plate with cut out

• Table 1-1: Updated References

• Figures 2-4, 2-5: replaced to show ILM load plate with cut out

• Section 2.3.4: Added Pick_and_Place_Removal_Tool

• Section 3.1.1: fasteners are low carbon steel

• Figures 3-1, 3-3, 3-4: replaced to show ILM load plate with cut out

• Figure 3-2: replaced to show studs without knurled feature

• Section 3.2: Changed torque from 8 ± 2 to 9 ± 1 inch-pounds

• Table 4-3: min static load changed from 106 lbf to 100 lbf

• Table 4-3: clarified Parameter as Target Pick and Place Cover allowable removal force and updated the force associated with it

• Table 5-1: Changed dP for 2U and Tower heatsink

• Table 5-2: Added Boundary Conditions and Performance Targets for Intel® Xeon® Processor 5600 Series

• Figure 5-1: replaced curves for 1U with equations for 1U, 2U and Tower

• Table 5-3: specified for Intel® Xeon® Processor 5500 Series Processors

• Table 5-3: updated PSIca and dP values

• Figure 5-3: replaced to show ILM load plate with cut out

• Section 5.3: added Fastener sequencing statement (may mitigate against cross threading).

• Table 5-5: added Tcontrol Guidance for Intel® Xeon® Processor 5600 Series

• Section 5.7: added Thermal Excursion for Intel® Xeon® Processor 5600 Series

• Table 6-1: added reference to Table 5-2 for Intel® Xeon® Processor 5600 Series

• Appendix A: added heatsink info for Intel® Xeon® Processor 5600 Series

• Table A-4, A-5: updated supplier info

• Appendix B: Added Figures B-27 to B-32 for 25.5mm heatsink

• Table E-1: updated PSIca for 60W

• Table E-2: added Boundary Conditions and Performance Targets for Intel® Xeon® Processor 5600 Series

Revision Date

March 2010

Thermal/Mechanical Design Guide 7

8 Thermal/Mechanical Design Guide

Introduction

1 Introduction

This document provides guidelines for the design of thermal and mechanical solutions for 2-socket server and 2-socket Workstation processors listed in the Intel® Xeon®

Processor 5500 Series Datasheet, Volume 1 and in the Intel® Xeon® Processor 5600 Series Datasheet, Volume 1. The components described in this document include:

• The processor thermal solution (heatsink) and associated retention hardware.

• The LGA1366 socket and the Independent Loading Mechanism (ILM) and back plate.

Processors in 1-socket Workstation platforms are covered in the Intel® Core™ i7-900

Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series, Intel® Xeon® Processor 3500 Series and LGA1366 Socket Thermal / Mechanical Design Guide.

Figure 1-1. Intel® Xeon® 5500 Platform Socket Stack

The goals of this document are:

• To assist board and system thermal mechanical designers.

• To assist designers and suppliers of processor heatsinks.

Thermal profiles and other processor specifications are provided in the Datasheet.

Thermal/Mechanical Design Guide 9

1.1 References

Material and concepts available in the following documents may be beneficial when reading this document.

Table 1-1. Reference Documents

Document Location Notes

European Blue Angel Recycling Standards 2 Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 321321 1 Intel® Xeon® Processor 5600 Series Datasheet, Volume 1 323369 1 Intel® Xeon® Processor 5500 Series Mechanical Model 321326 1 Intel® Xeon® Processor 5500 Series Thermal Model 321327 1 Entry-level Electronics Bay Specification 3

Notes:

1. Document numbers indicated in Location column are subject to change. See the appropriate Electronic Design Kit (EDK) for the most up-to-date Document number.

2. Available at http://www.blauer-engel.de

3. Available at http://ssiforum.org/

1.2 Definition of Terms

Introduction

Table 1-2. Terms and Descriptions (Sheet 1 of 2)

Term Description

Bypass Bypass is the area between a passive heatsink and any object that can act to form a

DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC

FSC Fan Speed Control IHS Integrated Heat Spreader: a component of the processor package used to enhance the

ILM Independent Loading Mechanism provides the force needed to seat the 1366-LGA land

LGA1366 socket The processor mates with the system board through this surface mount, 1366-contact

PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides

CASE

CASE_MAX

duct. For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface.

activation temperature.

thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface.

package onto the socket contacts.

socket.

a communication channel between Intel processor and chipset components to external monitoring devices.

Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance using total package power. Defined as (T Package Power. Heat source should always be specified for measurements.

Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package power. Defined as (T Package Power.

Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (TS – TLA) / Total Package Power.

The case temperature of the processor measured at the geometric center of the topside of the IHS.

The maximum case temperature as specified in a component specification.

– TLA) / Total

CASE

– TS) / Total

CASE

10 Thermal/Mechanical Design Guide

Introduction

Table 1-2. Terms and Descriptions (Sheet 2 of 2)

Term Description

TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature

CONTROL

TDP Thermal Design Power: Thermal solution should be designed to dissipate this target

Thermal Monitor A power reduction feature designed to decrease temperature after the processor has

Thermal Profile Line that defines case temperature specification of a processor at a given power level. TIM Thermal Interface Material: The thermally conductive compound between the heatsink

U A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U

by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits.

T control.

power level. TDP is not the maximum power that the processor can dissipate.

reached its maximum operating temperature.

and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink.

The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink.

The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets.

equals 3.50 in, etc.

is a static value below TCC activation used as a trigger point for fan speed

CONTROL

Thermal/Mechanical Design Guide 11

Introduction

12 Thermal/Mechanical Design Guide

LGA1366 Socket

2 LGA1366 Socket

This chapter describes a surface mount, LGA (Land Grid Array) socket intended for processors in the Intel® Xeon® 5500 Platform. The socket provides I/O, power and ground contacts. The socket contains 1366 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard.

The socket has 1366 contacts with 1.016 mm X 1.016 mm pitch (X by Y) in a 43x41 grid array with 21x17 grid depopulation in the center of the array and selective depopulation elsewhere.

The socket must be compatible with the package (processor) and the Independent Loading Mechanism (ILM). The design includes a back plate which is integral to having a uniform load on the socket solder joints. Socket loading specifications are listed in

Chapter 4.

Figure 2-1. LGA1366 Socket with Pick and Place Cover Removed

package socket

package

cavity

socket

Thermal/Mechanical Design Guide 13

Figure 2-2. LGA1366 Socket Contact Numbering (Top View of Socket)

LGA1366 Socket

14 Thermal/Mechanical Design Guide

LGA1366 Socket

131417

192321

2731293033

353937

2.1 Board Layout

The land pattern for the LGA1366 socket is 40 mils X 40 mils (X by Y), and the pad size is 18 mils. Note that there is no round-off (conversion) error between socket pitch (1.016 mm) and board pitch (40 mil) as these values are equivalent.

Figure 2-3. LGA1366 Socket Land Pattern (Top View of Board)

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY

40 38 36 34 32

28 26

24 22 20 18 16

Thermal/Mechanical Design Guide 15

2.2 Attachment to Motherboard

The socket is attached to the motherboard by 1366 solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, and so on) to attach the socket.

As indicated in Figure 2-4, the Independent Loading Mechanism (ILM) is not present during the attach (reflow) process.

Figure 2-4. Attachment to Motherboard

LGA1366 Socket

2.3 Socket Components

The socket has two main components, the socket body and Pick and Place (PnP) cover, and is delivered as a single integral assembly. Refer to Appendix C for detailed drawings.

2.3.1 Socket Body Housing

The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable of withstanding 260 °C for 40 seconds (typical reflow/rework). The socket coefficient of thermal expansion (in the XY plane), and creep properties, must be such that the integrity of the socket is maintained for the conditions listed in the LGA1366 Socket Validation Reports.

The color of the housing will be dark as compared to the solder balls to provide the contrast needed for pick and place vision systems.

2.3.2 Solder Balls

A total of 1366 solder balls corresponding to the contacts are on the bottom of the socket for surface mounting with the motherboard.

The socket has the following solder ball material:

• Lead free SAC (SnAgCu) solder alloy with a silver (Ag) content between 3% and 4% and a melting temperature of approximately 217 °C. The alloy must be

16 Thermal/Mechanical Design Guide

LGA1366 Socket

compatible with immersion silver (ImAg) motherboard surface finish and a SAC alloy solder paste.

The co-planarity (profile) and true position requirements are defined in Appendix C.

2.3.3 Contacts

Base material for the contacts is high strength copper alloy. For the area on socket contacts where processor lands will mate, there is a 0.381 m

[15 inches] minimum gold plating over 1.27 m [50 inches] minimum nickel underplate.

No contamination by solder in the contact area is allowed during solder reflow.

2.3.4 Pick and Place Cover

The cover provides a planar surface for vacuum pick up used to place components in the Surface Mount Technology (SMT) manufacturing line. The cover remains on the socket during reflow to help prevent contamination during reflow. The cover can withstand 260 °C for 40 seconds (typical reflow/rework profile) and the conditions listed in the LGA1366 Socket Validation Reports without degrading.

As indicated in Figure 2-5, the cover remains on the socket during ILM installation, and should remain on whenever possible to help prevent damage to the socket contacts.

Cover retention must be sufficient to support the socket weight during lifting, translation, and placement (board manufacturing), and during board and system shipping and handling.

The covers are designed to be interchangeable between socket suppliers. As indicated in Figure 2-5, a Pin1 indicator on the cover provides a visual reference for proper orientation with the socket.

See LGA1366_Socket_Pick_and_Place_Removal_Tool_rev2.0 for a drawing of a tool designed to provide mechanical assistance during cover installation and removal.

Figure 2-5. Pick and Place Cover

Thermal/Mechanical Design Guide 17

2.4 Package Installation / Removal

As indicated in Figure 2-6, access is provided to facilitate manual installation and removal of the package.

To assist in package orientation and alignment with the socket:

• The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for proper orientation.

• The package substrate has orientation notches along two opposing edges of the package, offset from the centerline. The socket has two corresponding orientation posts to physically prevent mis-orientation of the package. These orientation features also provide initial rough alignment of package to socket.

• The socket has alignment walls at the four corners to provide final alignment of the package.

See Appendix F for information regarding a tool designed to provide mechanical

Figure 2-6. Package Installation / Removal Features

assistance during processor installation and removal.

LGA1366 Socket

orientation

orientation notch

notch

alignment

Pin1 triangle

access

orientation

orientation post

post

Pin1 chamfer

alignment walls

walls

2.4.1 Socket Standoffs and Package Seating Plane

Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are specified in Appendix C.

Similarly, a seating plane on the topside of the socket establishes the minimum package height. See Section 4.2 for the calculated IHS height above the motherboard.

18 Thermal/Mechanical Design Guide

LGA1366 Socket

2.5 Durability

The socket must withstand 30 cycles of processor insertion and removal. The max chain contact resistance from Table 4-4 must be met when mated in the 1st and 30th cycles.

The socket Pick and Place cover must withstand 15 cycles of insertion and removal.

2.6 Markings

There are three markings on the socket:

• LGA1366: Font type is Helvetica Bold - minimum 6 point (2.125 mm).

• Manufacturer's insignia (font size at supplier's discretion).

• Lot identification code (allows traceability of manufacturing date and location).

All markings must withstand 260°C for 40 seconds (typical reflow/rework profile) without degrading, and must be visible after the socket is mounted on the motherboard.

LGA1366 and the manufacturer's insignia are molded or laser marked on the side wall.

2.7 Component Insertion Forces

Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/ Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force to insert the package into the socket.

2.8 Socket Size

Socket information needed for motherboard design is given in Appendix C. This information should be used in conjunction with the reference motherboard keep-

out drawings provided in Appendix B to ensure compatibility with the reference thermal mechanical components.

Thermal/Mechanical Design Guide 19

2.9 LGA1366 Socket NCTF Solder Joints

131417

1923212225

2731293033

353937

Intel has defined selected solder joints of the socket as non-critical to function (NCTF) for post environmental testing. The processor signals at NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality. Figure 2-7

Figure 2-7. LGA1366 NCTF Solder Joints

identifies the NCTF solder joints.

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY

LGA1366 Socket

40 38 36 34 32

28 26 24

20 18 16

Note: For platforms supporting the DP processor land C3 is CTF.

20 Thermal/Mechanical Design Guide

Independent Loading Mechanism (ILM)

3 Independent Loading

Mechanism (ILM)

The Independent Loading Mechanism (ILM) provides the force needed to seat the 1366-LGA land package onto the socket contacts. The ILM is physically separate from the socket body. The assembly of the ILM to the board is expected to occur after wave solder. The exact assembly location is dependent on manufacturing preference and test flow.

Note: The ILM has two critical functions: deliver the force to seat the processor onto the

socket contacts and distribute the resulting compressive load evenly through the socket solder joints.

Note: The mechanical design of the ILM is integral to the overall functionality of the LGA1366

socket. Intel performs detailed studies on integration of processor package, socket and ILM as a system. These studies directly impact the design of the ILM. The Intel reference ILM will be “build to print” from Intel controlled drawings. Intel recommends using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from Intel's detailed studies and may not incorporate critical design parameters.

3.1 Design Concept

The ILM consists of two assemblies that will be procured as a set from the enabled vendors. These two components are ILM cover assembly and back plate.

3.1.1 ILM Cover Assembly Design Overview

The ILM Cover assembly consists of four major pieces: load lever, load plate, frame and the captive fasteners.

The load lever and load plate are stainless steel. The frame is high carbon steel with appropriate plating. The fasteners are fabricated from a low carbon steel. The frame provides the hinge locations for the load lever and load plate.

The cover assembly design ensures that once assembled to the back plate and the load lever is closed, the only features touching the board are the captive fasteners. The nominal gap of the frame to the board is ~1 mm when the load plate is closed on the empty socket or when closed on the processor package.

When closed, the load plate applies two point loads onto the IHS at the “dimpled” features shown in Figure 3-1. The reaction force from closing the load plate is transmitted to the frame and through the captive fasteners to the back plate. Some of the load is passed through the socket body to the board inducing a slight compression on the solder joints.

Thermal/Mechanical Design Guide 21

Figure 3-1. ILM Cover Assembly

Independent Loading Mechanism (ILM)

3.1.2 ILM Back Plate Design Overview

The unified back plate for 2-socket server and 2-socket Workstation products consists of a flat steel back plate with threaded studs for ILM attach, and internally threaded nuts for heatsink attach. The threaded studs have a smooth surface feature that provides alignment for the back plate to the motherboard for proper assembly of the ILM around the socket. A clearance hole is located at the center of the plate to allow access to test points and backside capacitors. An additional cut-out on two sides provides clearance for backside voltage regulator components. An insulator is preapplied.

Back plates for processors in 1-socket Workstation platforms are covered in the Intel

Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series, Intel® Xeon® Processor 3500 Series and LGA1366 Socket Thermal / Mechanical Design Guide.

22 Thermal/Mechanical Design Guide

Independent Loading Mechanism (ILM)

Figure 3-2. Back Plate

3.2 Assembly of ILM to a Motherboard

The ILM design allows a bottoms up assembly of the components to the board. In step 1, (see Figure 3-3), the back plate is placed in a fixture. Holes in the motherboard provide alignment to the threaded studs. In step 2, the ILM cover assembly is placed over the socket and threaded studs. Using a T20 Torx* driver fasten the ILM cover assembly to the back plate with the four captive fasteners. Torque to 9 ± 1 inchpounds. The length of the threaded studs accommodate board thicknesses from

0.062” to 0.100”.

Thermal/Mechanical Design Guide 23

Figure 3-3. ILM Assembly

Independent Loading Mechanism (ILM)

24 Thermal/Mechanical Design Guide

Independent Loading Mechanism (ILM)

As indicated in Figure 3-4, socket protrusion and ILM key features prevent 180-degree rotation of ILM cover assembly with respect to the socket. The result is a specific Pin 1 orientation with respect to the ILM lever.

Figure 3-4. Pin1 and ILM Lever

Thermal/Mechanical Design Guide 25

Independent Loading Mechanism (ILM)

26 Thermal/Mechanical Design Guide

LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications

4 LGA1366 Socket and ILM

Electrical, Mechanical, and Environmental Specifications

This chapter describes the electrical, mechanical, and environmental specifications for the LGA1366 socket and the Independent Loading Mechanism.

4.1 Component Mass

Table 4-1. Socket Component Mass

Component Mass

Socket Body, Contacts and PnP Cover 15 gm ILM Cover 43 gm ILM Back Plate for dual processor server products 100 gm

4.2 Package/Socket Stackup Height

Table 4-2 provides the stackup height of a processor in the 1366-land LGA package and

LGA1366 socket with the ILM closed and the processor fully seated in the socket.

Table 4-2. 1366-land Package and LGA1366 Socket Stackup Height

Integrated Stackup Height (mm) From Top of Board to Top of IHS

Notes:

1. This data is provided for information only, and should be derived from: (a) the height of the socket seating plane above the motherboard after reflow, given in Appendix C, (b) the height of the package, from the package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that are given in the corresponding processor EMTS.

2. This value is a RSS calculation.

7.729 ± 0.282 mm

4.3 Socket Maximum Temperature

The power dissipated within the socket is a function of the current at the pin level and the effective pin resistance. To ensure socket long term reliability, Intel defines socket maximum temperature using a via on the underside of the motherboard. Exceeding the temperature guidance may result in socket body deformation, or increases in thermal and electrical resistance which can cause a thermal runaway and eventual electrical failure. The guidance for socket maximum temperature is listed below:

• Via temperature under socket < 96 °C

Thermal/Mechanical Design Guide 27

LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications

4.4 Loading Specifications

The socket will be tested against the conditions listed in the LGA1366 Socket Validation Reports with heatsink and the ILM attached, under the loading conditions outlined in this chapter.

Table 4-3 provides load specifications for the LGA1366 socket with the ILM installed.

The maximum limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Exceeding these limits during test may result in component failure. The socket body should not be used as a mechanical reference or load-bearing surface for thermal solutions.

Table 4-3. Socket and ILM Mechanical Specifications

Parameter Min Max Notes

Static compressive load from ILM cover to

processor IHS Heatsink Static Compressive Load 0 N [0 lbf] 266 N [60 lbf] 1, 2, 3 Total Static Compressive Load

(ILM plus Heatsink) Dynamic Compressive Load

(with heatsink installed) Target Pick and Place Cover allowable removal

force Load Lever actuation force N/A 38.3 N [8.6 lbf] in the

445 N [100 lbf] 623 N [140 lbf] 3, 4

445 N (100 lbf) 890 N (200 lbf) 3, 4

N/A 890 N [200 lbf] 1, 3, 5, 6

N/A 4.45 - 6.68 N [1.0 -

1.5 lbf]

vertical direction

10.2 N [2.3 lbf] in the lateral direction.

Notes:

1. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface.

2. This is the minimum and maximum static force that can be applied by the heatsink and it’s retention solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated to these limits.

3. Loading limits are for the LGA1366 socket.

4. This minimum limit defines the compressive force required to electrically seat the processor onto the socket contacts.

5. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement.

6. Test condition used a heatsink mass of 550 gm [1.21 lb] with 50 g acceleration measured at heatsink mass. The dynamic portion of this specification in the product application can have flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this dynamic load.

4.5 Electrical Requirements

LGA1366 socket electrical requirements are measured from the socket-seating plane of the processor to the component side of the socket PCB to which it is attached. All specifications are maximum values (unless otherwise stated) for a single socket contact, but includes effects of adjacent contacts where indicated.

28 Thermal/Mechanical Design Guide

LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications

Table 4-4. Electrical Requirements for LGA1366 Socket

Parameter Value Comment

Mated loop inductance, Loop

Mated partial mutual inductance, L

Maximum mutual capacitance, C. Socket Average Contact Resistance

(EOL)

Max Individual Contact Resistance (EOL)

Bulk Resistance Increase

Dielectric Withstand Voltage Insulation Resistance

<3.9nH

<1 pF

15.2 m

100 m

3 m

360 Volts RMS

800 M

The inductance calculated for two contacts, considering one forward conductor and one return conductor. These values must be satisfied at the worst-case height of the socket.

The inductance on a contact due to any single neighboring contact.

The capacitance between two contacts The socket average contact resistance target is

derived from average of every chain contact resistance for each part used in testing, with a chain contact resistance defined as the resistance of each chain minus resistance of shorting bars divided by number of lands in the daisy chain.

The specification listed is at room temperature and has to be satisfied at all time.

Socket Contact Resistance: The resistance of the socket contact, solderball, and interface resistance to the interposer land.

The specification listed is at room temperature and has to be satisfied at all time.

Socket Contact Resistance: The resistance of the socket contact, solderball, and interface resistance to the interposer land; gaps included.

The bulk resistance increase per contact from 24 °C to 107 °C

4.6 Environmental Requirements

Design, including materials, shall be consistent with the manufacture of units that meet the following environmental reference points.

The reliability targets in this chapter are based on the expected field use environment for these products. The test sequence for new sockets will be developed using the knowledge-based reliability evaluation methodology, which is acceleration factor dependent. A simplified process flow of this methodology can be seen in Figure 4-1.

Thermal/Mechanical Design Guide 29

LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications

Figure 4-1. Flow Chart of Knowledge-Based Reliability Evaluation Methodology

Establish the market/expected use environment for the technology

Develop Speculative stress conditions based on historical data, content experts, and literature search

Freeze stressing requirements and perform additional data turns

Perform stressing to validate accelerated stressing assumptions and determine acceleration factors

A detailed description of this methodology can be found at:

ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf.

30 Thermal/Mechanical Design Guide

Thermal Solutions

5 Thermal Solutions

This section describes a 1U reference heatsink, design targets for 2U and Tower heatsinks, performance expectations for a 25.5 mm tall heatsink, and thermal design guidelines for processors in the Intel® Xeon® 5500 Platform.

5.1 Performance Targets

Values for boundary conditions and performance targets are used to generate processor thermal specifications and to provide guidance for heatsink design.

Table 5-1. Boundary Conditions and Performance Targets for Intel® Xeon® Processor

5500 Series

Parameter Value

Altitude, system ambient temp

TDP 60W 80W 95W, Profile B 95W, Profile A 130W, WS

Airflow

System height (form factor)

Heatsink volumetric

Heatsink technology

49oC 49oC 49oC 55oC 40oC

0.335oC/W 0.336oC/W 0.337oC/W 0.201oC/W 0.201oC/W

9.7 CFM @

0.20” dP 1U (EEB) 1U (EEB) 1U (EEB)

9.7 CFM @

0.20” dP

90 x 90 x 27mm (1U)

Cu base, Al fins Cu/Al base, Al fins with heatpipes

Sea level, 35oC

9.7 CFM @

0.20” dP

30 CFM @

0.173” dP 2U (EEB) Pedestal (EEB)

90 x 90 x 64mm

6,7

(2U)

30 CFM @

0.173” dP

90 x 90 x 99mm

(Tower)

Table 5-2. Boundary Conditions and Performance Targets for Intel Xeon processor 5600

series

Parameter Value

Altitude, system ambient temp

TDP 40W 60W 80W 95W, Profile B 95W, Profile A 130W

(6 core) n/a 0.340ºC/W 0.340ºC/W 0.340ºC/W 0.200ºC/W 0.196ºC/W

(4 core) 0.353ºC/W n/a 0.357ºC/W 0.357oC/W 0.217oC/W 0.211oC/W

Airflow

System height (form factor)

Heatsink volumetric

Heatsink technology

Notes:

1. Local ambient temperature of the air entering the heatsink.

2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (Section 5.5.1).

Thermal/Mechanical Design Guide 31

90 x 90 x 27mm (1U)

49oC 55oC 53oC

9.7 CFM @ 0.20” dP 30 CFM @

1U (EEB) 2U (EEB)

Cu base, Al fins Cu/Al base, Al fins with

Sea level, 35oC

0.173” dP

90 x 90 x 64mm (2U)

heatpipes

35 CFM @

0.214” dP

6,7

3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches H2O.

4. Reference system configuration. Processor is downstream from memory in EEB (Entry-Level Electronics Bay).

Ducting is utilized to direct airflow.

5. The 1U heatsink can also meet Profile B for the 95W processor in TEB (Thin Electronics Bay) under the

following conditions: TLA = 40ºC, CA = 0.275ºC/W, airflow = 16 CFM @ 0.344” dP (these TEB values are not used to generate processor thermal specifications). Processor is not downstream from memory in TEB. Ducting is utilized to direct airflow.

6. Dimensions of heatsink do not include socket or processor.

7. The 2U heatsink height (64mm) + socket/processor height (7.729 mm, Table 4-2) complies with 76.2 mm

max height for EEB monoplanar boards (http://ssiforum.org/).

8. Passive heatsinks. PCM45F thermal interface material.

9. WS = Workstation.

Table 5-1 and Table 5-2 specify CA and pressure drop targets for specific airflows. To

determine CA and pressure drop targets for other airflows, use Best-fit equations in

Figure 5-1. Heatsink detailed drawings are in Appendix B.

Figure 5-1. Best-fit Equations

Thermal Solutions

5.1.1 25.5 mm Tall Heatsink

For the 25.5 mm tall heatsink, Table 5-3 provides guidance regarding performance expectations. These values are not used to generate processor thermal specifications.

Table 5-3. Performance Expectations for Intel Xeon Processor 5500 Series with 25.5 mm

Tall Heatsink

Parameter Value

Altitude, system ambient temp

TDP 95W, Profile B

Airflow System height

(form factor)

Heatsink volumetric

Heatsink technology

Notes:

1. Local ambient temperature of the air entering the heatsink.

2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (Section 5.5.1).

3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches H

4. Reference system configuration. Processor is downstream from memory in SSI blade and EEB (Entry-Level

Electronics Bay), not in TEB (Thin Electronics Bay). Ducting is utilized to direct airflow.

13.3 CFM @ 0.329” dP 10 CFM @ 0.239” dP 16 CFM @ 0.406” dP

50oC 49oC 40oC

0.296oC/W 0.333oC/W 0.278oC/W

SSI blade 1U (EEB) 1U (TEB)

Sea level, 35oC

90 x 90 x 25.5mm (1U)

Cu base, Al fins

32 Thermal/Mechanical Design Guide

Thermal Solutions

5. Dimensions of heatsink do not include socket or processor. The 25.5 mm heatsink height + socket/processor height (7.729 mm, Table 4-2) complies with 33.5mm max height for SSI blade boards (http://ssiforum.o

6. Passive heatsinks. Dow Corning TC-1996 thermal interface material.

rg/).

5.2 Heat Pipe Considerations

Figure 5-2 shows the orientation and position of the TTV die. The TTV die is sized and

positioned similarly to the processor die.

Figure 5-2. TTV Die Size and Orientation

Figure 1 - Side Views of Package with IHS (not to scale)

Cache Cache Cache Cache

Cache

Die CL

Package CL

1.0

Core

19.3

NOT TO SCALE

All Dimensions in mm

Thermal/Mechanical Design Guide 33

5.3 Assembly

Figure 5-3. 1U Reference Heatsink Assembly

Thermal Solutions

The assembly process for the 1U reference heatsink begins with application of Honeywell PCM45F thermal interface material to improve conduction from the IHS. Tape and roll format is recommended. Pad size is 35 x 35mm, thickness is 0.25mm.

Next, position the heatsink such that the heatsink fins are parallel to system airflow. While lowering the heatsink onto the IHS, align the four captive screws of the heatsink to the four threaded nuts of the back plate.

Using a #2 Phillips driver, torque the four captive screws to 8 inch-pounds. Fastener sequencing (starting threads on all four screws before torquing) may mitigate against cross threading.

This assembly process is designed to produce a static load of 39 - 51 lbf, for 0.062" -

0.100" board thickness respectively. Honeywell PCM45F is expected to meet the performance targets in Table 5-1 from 30 - 60 lbf. From Table 4-3, the Heatsink Static Compressive Load of 0 - 60 lbf allows for designs that vary from the 1U reference heatsink. Example: A customer’s unique heatsink with very little static load (as little as 0 lbf) is acceptable from a socket loading perspective as long as the T

specification

CASE

is met. Compliance to Board Keepout Zones in Appendix B is assumed for this assembly

process.

34 Thermal/Mechanical Design Guide

Thermal Solutions

5.3.1 Thermal Interface Material (TIM)

TIM should be verified to be within its recommended shelf life before use. Surfaces should be free of foreign materials prior to application of TIM. Use isopropyl alcohol and a lint free cloth to remove old TIM before applying new TIM.

5.4 Structural Considerations

Mass of the 1U reference heatsink and the target mass for 2U and Tower heatsinks does not exceed 500 gm.

From Table 4-3, the Dynamic Compressive Load of 200 lbf max allows for designs that exceed 500 gm as long as the mathematical product does not exceed 200 lbf. Example: A heatsink of 2-lb mass (908 gm) x 50 g (acceleration) x 2.0 Dynamic Amplification Factor = 200 lbf. The Total Static Compressive Load (Table 4-3) should also be considered in dynamic assessments.

The heatsink limit of 500 gm and use of back plate have eliminated the need for Direct Chassis Attach retention (as used previously with the Intel® Xeon® processor 5000 sequence). Direct contact between back plate and chassis pan will help minimize board deflection during shock.

Placement of board-to-chassis mounting holes also impacts board deflection and resultant socket solder ball stress. Customers need to assess shock for their designs as their heatsink retention (back plate), heatsink mass and chassis mounting holes may vary.

5.5 Thermal Design

5.5.1 Thermal Characterization Parameter

The case-to-local ambient Thermal Characterization Parameter (CA) is defined by:

Equation 5-1.CA = (T

Where:

CASE

TDP = TDP (W) assumes all power dissipates through the integrated heat

Equation 5-2.

Where:

- TLA) / TDP

CASE

= Processor case temperature (°C). For T

appropriate datasheet.

= Local ambient temperature in chassis at processor (°C).

spreader. This inexact assumption is convenient for heatsink design. TTVs are often used to dissipate TDP. Correction offsets account for differences in temperature distribution between processor and TTV.

= Thermal characterization parameter of the TIM (°C/W) is dependent

on the thermal conductivity and thickness of the TIM.

= Thermal characterization parameter from heatsink-to-local ambient

(°C/W) is dependent on the thermal conductivity and geometry of the heatsink and dependent on the air velocity through the heatsink fins.

specification see the

CASE

Figure 5-4 illustrates the thermal characterization parameters.

Thermal/Mechanical Design Guide 35

Figure 5-4. Processor Thermal Characterization Parameter Relationships

5.5.2 Dual Thermal Profile

Thermal Solutions

Processors that offer dual thermal profile are specified in the appropriate datasheet. Dual thermal profile helps mitigate limitations in volumetrically constrained form

factors and allows trade-offs between heatsink cost and TCC activation risk. For heatsinks that comply to Profile B, yet do not comply to Profile A (1U heatsink in

Figure 5-5), the processor has an increased probability of TCC activation and an

associated measurable performance loss. Measurable performance loss is defined to be any degradation in processor performance greater than 1.5%. 1.5% is chosen as the baseline since run-to-run variation in a performance benchmark is typically between 1 and 2%.

36 Thermal/Mechanical Design Guide

Thermal Solutions



Figure 5-5. Dual Thermal Profile























Compliance to Profile A ensures that no measurable performance loss will occur due to TCC activation. It is expected that TCC would only be activated for very brief periods of time when running a worst-case real world application in a worst-case thermal condition. A worst-case real world application is a commercially available, useful application which dissipates power above TDP for a thermally relevant timeframe. One example of a worst-case thermal condition is when the processor local ambient temperature is above the y-axis intercept for Profile A.

5.6 Thermal Features

More information regarding processor thermal features is contained in the appropriate datasheet.

5.6.1 Fan Speed Control

There are many ways to implement fan speed control. Using processor ambient temperature (in addition to Digital Thermal Sensor) to scale fan speed can improve acoustics when DTS > T

Table 5-4. Fan Speed Control, T

Condition FSC Scheme

DTS T

CONTROL

DTS T

CONTROL

FSC can adjust fan speed to maintain DTS T

FSC should adjust fan speed to keep T specification (increased acoustic region).

and DTS Relationship

CASE

(low acoustic region).

CONTROL

at or below the Thermal Profile

Thermal/Mechanical Design Guide 37

Thermal Solutions

5.6.1.1 T

Table 5-5. T

CONTROL

Factory configured T

Guidance

CONTROL

values are available in the appropriate Dear Customer Letter or may be extracted by issuing a Mailbox or an RDMSR instruction. See the appropriate datasheet for more information.

Due to increased thermal headroom based on thermal characterization on the latest processors, customers have the option to reduce T

CONTROL

to values lower than the

factory configured values. In some situations, use of reduced T

CONTROL

Guidance can reduce average fan power and improve acoustics. There are no plans to change Intel's specification or the factory configured T

CONTROL

To implement this guidance, customers must re-write code to set T

values on individual processors.

CONTROL

to the reduced values provided in the table below. Implementation is optional. Alternately, the factory configured T

CONTROL

configured and Guidance. Regardless of T

values can still be used, or some value between factory

CONTROL

values used, BIOS needs to identify

the processor type.

CONTROL

TDP

130W See Note 1 Intel® Xeon® Processor 5500 Series 95W -10 Intel® Xeon® Processor 5500 Series with 2.93 GHz Max Core Frequency 95W -1 Intel® Xeon® Processor 5500 Series frequencies lower than 2.93 GHz 80W -1 Intel® Xeon® Processor 5500 Series 2.53 GHz or lower, except Embedded (NEBS) 60W -1 Intel® Xeon® Processor 5500 Series 2.26 GHz or lower, except Embedded (NEBS) 130W See Note 1 Intel Xeon processor 5600 series (6 core and 4 core) 95W -1 Intel Xeon processor 5600 series (6 core) 2.93 GHz or lower 95W -1 Intel Xeon processor 5600 series (4 core) 3.06 GHz or lower 80W -1 Intel Xeon processor 5600 series (4 core) 2.66 GHz or lower, except Embedded 60W -1 Intel Xeon processor 5600 series (6 core) 2.26 GHz or lower, except Embedded 40W -1 Intel Xeon processor 5600 series (4 core) 2.13 GHz or lower, except Embedded

Guidance

CONTROL

Guidance

Comment

Notes:

1. Use factory configured T

Implementation of T

CONTROL

(based on modeling of the Intel Reference Design). Implementation of T

values.

CONTROL

Guidance above maintains Intel standards of reliability

CONTROL

of -1 may increase risk of throttling (Thermal Control Circuit activation). Increased TCC activation may or may not result in measurable performance loss.

Thermal Profile still applies. If PECI >= T

CONTROL

Guidance, then the case temperature

must meet the Thermal Profile.

5.6.2 PECI Averaging and Catastrophic Thermal Management

By averaging DTS over PECI, thermal solution failure can be detected and a soft shutdown can be initiated to help prevent loss of data.

Thermal data is averaged over a rolling window of 256 mS by default (X=8):

AVGN = AVG

38 Thermal/Mechanical Design Guide

* (1 – 1/2X) + Temperature * 1/2

N-1

Thermal Solutions

Using a smaller averaging constant could cause premature detection of failure. The Critical Temperature threshold generally triggers somewhere between PECI of

-0.75 and -0.50. To avoid false shutdowns, initiate soft shutdown at -0.25. Since customer designs, boundary conditions, and failure scenarios differ, above

guidance should be tested in the customer’s system to prevent loss of data during shutdown.

5.6.3 Intel® Turbo Boost Technology

Intel® Turbo Boost Technology (Intel® TBT) is a new feature available on certain processor SKUs that opportunistically, and automatically, allows the processor to run faster than the marked frequency if the part is operating below its power, temperature and current limits.

Heatsink performance (lower CA as described in Section 5.5.1) is one of several factors that can impact the amount of Intel TBT frequency benefit. Intel TBT performance is also constrained by ICC, and VCC limits.

Increased IMON accuracy may provide more Intel TBT benefit on TDP limited applications, as compared to lower CA, as temperature is not typically the limiter for these workloads.

With Intel TBT enabled, the processor may run more consistently at higher power levels (but still within TDP), and be more likely to operate above T when Intel TBT is disabled. This may result in higher acoustics.

With Intel TBT enabled, processors with dual thermal profiles (described in

Section 5.5.2, have greater potential for performance delta between Profile A and

Profile B platforms, as compared to previous platforms.

CONTROL

, as compared to

5.7 Thermal Guidance

5.7.1 Thermal Excursion Power for Processors with Dual Thermal Profile

Under fan failure or other anomalous thermal excursions, Tcase may exceed Thermal Profile B for a duration totaling less than 360 hours per year without affecting long term reliability (life) of the processor. For more typical thermal excursions, Thermal Monitor is expected to control the processor power level as long as conditions do not allow the Tcase to exceed the temperature at which Thermal Control Circuit (TCC) activation initially occurred. Under more severe anomalous thermal excursions when the processor temperature cannot be controlled at or below this Tcase level by TCC activation, then data integrity is not assured. At some higher threshold, THERMTRIP# will enable a shut down in an attempt to prevent permanent damage to the processor. Thermal Test Vehicle (TTV) may be used to check anomalous thermal excursion compliance by ensuring that the processor Tcase value, as measured on the TTV, does not exceed Tcase_max_B at the anomalous power level for the environmental condition of interest. This anomalous power level is equal to 75% of the TDP limit.

This guidance can be applied to 95W Intel Xeon processor 5500 series and 95W Intel Xeon processor 5600 series.

Thermal/Mechanical Design Guide 39

Thermal Solutions

5.7.2 Thermal Excursion Power for Processors with Single Thermal Profile

Under fan failure or other anomalous thermal excursions, Tcase may exceed the thermal profile for a duration totaling less than 360 hours per year without affecting long term reliability (life) of the processor. For more typical thermal excursions, Thermal Monitor is expected to control the processor power level as long as conditions do not allow the Tcase to exceed the temperature at which Thermal Control Circuit (TCC) activation initially occurred. Under more severe anomalous thermal excursions when the processor temperature cannot be controlled at or below this Tcase level by TCC activation, then data integrity is not assured. At some higher threshold, THERMTRIP# will enable a shut down in an attempt to prevent permanent damage to the processor. Thermal Test Vehicle (TTV) may be used to check anomalous thermal excursion compliance by ensuring that the processor Tcase value, as measured on the TTV, does not exceed Tcase_max at the anomalous power level for the environmental condition of interest. This anomalous power level is equal to 75% of the TDP limit.

This guidance can be applied to 80 W Intel Xeon processor 5500 series, 80W Intel Xeon processor 5600 series and 130 W Intel Xeon processor 5600 series.

5.7.3 Absolute Processor Temperature

Intel does not test any third party software that reports absolute processor temperature. As such, Intel cannot recommend the use of software that claims this capability. Since there is part-to-part variation in the TCC (thermal control circuit) activation temperature, use of software that reports absolute temperature can be misleading.

See the appropriate datasheet for details regarding use of IA32_TEMPERATURE_TARGET register to determine the minimum absolute temperature at which the TCC will be activated and PROCHOT# will be asserted.

40 Thermal/Mechanical Design Guide

Quality and Reliability Requirements

6 Quality and Reliability

Requirements

6.1 Test Conditions

The Test Conditions provided in Table 6-1 address processor heatsink failure mechanisms only. Test Conditions, Qualification and Visual Criteria vary by customer;

Table 6-1 applies to Intel requirements.

Socket Test Conditions are provided in the LGA1366 Socket Validation Reports available from socket suppliers listed in Appendix A.

Table 6-1. Heatsink Test Conditions and Qualification Criteria (Sheet 1 of 2)

Assessment Test Condition Qualification Criteria

1) Humidity Non-operating, 500 hours, +85°C and 85%

2) Board-Level UnPackaged Shock

3) Board-Level UnPackaged Vibration

4) First Article Inspection

5) Shipping Media: Packaged Shock

6) Shipping Media: Packaged Vibration

7) Gravitational Evaluation

R.H.

50G+/-10%; 170+/-10% in/sec; 3 drops per face, 6 faces.

5 Hz @ 0.01 g2/Hz to 20 Hz @ 0.02 g2/Hz (slope up).

20 Hz to 500 Hz @ 0.02 g2/Hz (flat). Input acceleration is 3.13 g RMS. 10 minutes/axis for all 3 axes on all samples. Random control limit tolerance is ±3 dB.

Not Applicable Meet all dimensions on 5 samples.

Drop height determined by weight and may vary by customer; Intel requirement in General Supplier Packaging Spec.

10 drops (6 sides, 3 edges, 1 corner)

0.015 g2/Hz @ 10-40 Hz, sloping to 0.0015 g2/Hz @ 500 Hz, 1.03 gRMS, 1 hour/axis for 3 axes

Required for heatpipe designs. 3 orientations (0°, +90°, -90°)

No visual defects. As verified in wind tunnel:

• Mean CA + 3s + offset not to exceed value in Table 5-1 and Table 5-2.

• Pressure drop not to exceed value in

Table 5-1 and Table 5-2.

No damage to heatsink base or pipe. No visual defects. As verified in wind tunnel:

• Mean CA + 2.54s + offset not to exceed value in Table 5-1 and

Table 5-2.

• Pressure drop not to exceed value in

Table 5-1 and Table 5-2.

No damage to heatsink base or pipe. No visual defects. As verified in wind tunnel:

• Mean CA + 2.54s + offset not to exceed value in Table 5-1 and

Table 5-2

• Pressure drop not to exceed value in

Table 5-1 and Table 5-2

Meet all CTF dimensions on 32 additional samples with 1.33 Cpk (mean + 4s).

If samples are soft-tooled, a hard tool plan must be defined.

No visual defects 1 box

As verified in wind tunnel, mean CA + 3s + offset not to exceed value in Table 5-1 and Table 5-2

Min

Sample

Size

Thermal/Mechanical Design Guide 41

Quality and Reliability Requirements

Table 6-1. Heatsink Test Conditions and Qualification Criteria (Sheet 2 of 2)

Assessment Test Condition Qualification Criteria

8a) Thermal Performance for Intel® Xeon® Processor 5500 Series

Using 1U heatsink and 1U airflow from

Table 5-1:

1) TTV @ 95W (Profile B), Note 1. Using 2U heatsink and 2U airflow from

Table 5-1:

2) TTV @ 95W (Profile A), Note 1.

3) TTV @ 80W.

As verified in wind tunnel:

1) mean CA+ 3s + offset not to exceed

Table 5-1 value for 95W in 1U.

2-4) mean

Table 5-1 value for 2U.

5-8) mean

Table 5-1 value for Tower.

+ 3s + offset not to exceed

4) TTV @ 60W. Using Tower heatsink and Tower airflow from Table 5-1:

Min

Sample

Size

5 heatsinks X 8 tests by

supplier.

Note 1: 30

heatsinks X

3 tests by

Intel.

5) TTV @ 130W, Note 1.

6) TTV @ 95W (Profile A).

7) TTV @ 80W.

8) TTV @ 60W.

8b) Thermal Performance for Intel® Xeon® Processor 5600 Series

Using 1U heatsink and 1U airflow from

Table 5-2:

1) TTV @ 95W (Profile B), Note 1. Using 2U heatsink and 2U airflow from

Table 5-2:

2) TTV @ 130W, Note 1.

3) TTV @ 95W (Profile A).

4) TTV @ 80W.

As verified in wind tunnel:

1) mean CA+ 3s + offset not to exceed

Table 5-2 value for 95W in 1U.

2-5) mean CA + 3s + offset not to exceed

Table 5-2 value for 2U.

Thermal Test data re-assessed from Intel® Xeon® Processor 5500 Series Qualification

5) TTV @ 60W.

9) Thermal Cycling Required for heatpipe designs. Temperature range at pipe in heatsink assembly: -25C to +100C for 500 cycles. Cycle time is 30 minutes per full cycle, divided into half cycle in hot zone and half in cold zone, with minimum 1min soak at each temperature extreme for each cycle.

As verified in wind tunnel:

• Mean CA + 3s + offset not to exceed value in Table 5-1 and Table 5-2.

• Pressure drop not to exceed value in

Table 5-1 and Table 5-2.

See Figure 6-1 for example profile.

10) Heat Pipe Burst Continuously raise oven temperature and record the burst/leak temperatures of fully assembled heatsinks

No failures at minimum of 300C @ 20 minutes

32 pipes

11) Heatsink Mass Design Target < 500 g All samples < 550 g 30

12) Heatsink Load Design Targets:

0.062" board = 38.7 ± 7.2 lbf (Fmin =

31.5 lbf).

0.100" board = 51.4 ± 7.9 lbf (Fmax =

59.3 lbf).

No samples < 30 lbf on 0.062" board. 5 highest load samples (from 0.062" test) < 60 lbf on 0.100" board

42 Thermal/Mechanical Design Guide

Quality and Reliability Requirements

Figure 6-1. Example Thermal Cycle - Actual profile will vary

6.2 Intel Reference Component Validation

Intel tests reference components both individually and as an assembly on mechanical test boards, and assesses performance to the envelopes specified in previous sections by varying boundary conditions.

While component validation shows that a reference design is tenable for a limited range of conditions, customers need to assess their specific boundary conditions and perform reliability testing based on their use conditions.

Intel reference components are also used in board functional tests to assess performance for specific conditions.

6.2.1 Board Functional Test Sequence

Each test sequence should start with components (baseboard, heatsink assembly, and so on) that have not been previously submitted to any reliability testing.

The test sequence should always start with a visual inspection after assembly and BIOS/Processor/memory test. The stress test should be then followed by a visual inspection and then BIOS/Processor/memory test.

6.2.2 Post-Test Pass Criteria

The post-test pass criteria are:

1. No significant physical damage to the heatsink and retention hardware.

Thermal/Mechanical Design Guide 43

Quality and Reliability Requirements

2. Heatsink remains seated and its bottom remains mated flat against the IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware.

3. No signs of physical damage on baseboard surface due to impact of heatsink.

4. No visible physical damage to the processor package.

5. Successful BIOS/Processor/memory test.

6. Thermal compliance testing to demonstrate that the case temperature specification can be met.

6.2.3 Recommended BIOS/Processor/Memory Test Procedures

This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational baseboard that has not been exposed to any battery of tests prior to the test being considered.

The testing setup should include the following components, properly assembled and/or connected:

• Appropriate system baseboard.

• Processor and memory.

• All enabling components, including socket and thermal solution parts.

The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors.

6.3 Material and Recycling Requirements

Material shall be resistant to fungal growth. Examples of non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Synthetic materials such as PVC formulations, certain polyurethane compositions (for example, polyester and some polyethers), plastics which contain organic fillers of laminating materials, paints, and varnishes also are susceptible to fungal growth. If materials are not fungal growth resistant, then MILSTD-810E, Method 508.4 must be performed to determine material performance.

Any plastic component exceeding 25 gm should be recyclable per the European Blue Angel recycling standards.

The following definitions apply to the use of the terms lead-free, Pb-free, and RoHS compliant.

Lead-free and Pb-free: Lead has not been intentionally added, but lead may still exist as an impurity below 1000 ppm.

RoHS compliant: Lead and other materials banned in RoHS Directive are either (1) below all applicable substance thresholds as proposed by the EU or (2) an approved/pending exemption applies.

Note: RoHS implementation details are not fully defined and may change.

44 Thermal/Mechanical Design Guide

Component Suppliers

A Component Suppliers

Various suppliers have developed support components for processors in the Intel® Xeon® 5500 Platform. These suppliers and components are listed as a convenience to customers. Intel does not guarantee quality, reliability, functionality or compatibility of these components. The supplier list and/or the components may be subject to change without notice. Customers are responsible for the system thermal, mechanical, and environmental verification of the components with the supplier.

A.1 Intel Enabled Supplier Information

Performance targets for heatsinks are described in Section 5.1. Mechanical drawings are provided in Appendix B. Mechanical models are listed in Table 1-1. Heatsinks assemble to server back plate Table A-4.

A.1.1 Intel Reference Thermal Solution

The Intel reference thermal solutions have been verified to meet the criteria outlined in

Table 6-1. Customers can purchase the Intel reference thermal solutions from the

suppliers listed in Table A-1.

Table A-1. Suppliers for the Intel Reference Thermal Solution

Assembly Component Description Supplier PN Supplier Contact Info

Assembly, Heat Sink, 1U

1U URS Intel Reference Heatsink p/n

E32409-001

1U URS SSI Blade Reference Heatsink p/n

E39069-001 refers to E22056 Rev 02 + Snap Cover

27 mm 1U Aluminum Fin, Copper Base, includes TIM, 95W capable

25.5mm 1U Aluminum Fin, Copper Base, includes TIM and Snap Cover, 95W capable.

Thermal Interface Material

Fujikura

HSA-8078 Rev A

Fujikura

HSA-8083C

Honeywell PCM45F Honeywell International, Inc.

Fujikura America Yuji Yasuda

yuji@fujikura.com 408-748-6991

Fujikura Taiwan Branch Yao-Hsien Huang

yeohsien@fujikuratw.com.tw 886(2)8788-4959

Judy Oles (Customer Service) Judy.Oles@Honeywell.com

509-252-8605

Andrew S.K. Ho (APAC) andrew.ho@honeywell.com (852) 9095-4593

Andy Delano (Technical) Andrew.Delano@Honeywell.co m 509-252-2224

A.1.2 Intel Collaboration Thermal Solution

The Intel collaboration thermal solutions have been verified to meet the criteria outlined in Table 6-1. Customers can purchase the Intel collaboration thermal solutions from the suppliers listed in Table A-2.

Thermal/Mechanical Design Guide 45

Component Suppliers

Table A-2. Suppliers for the Intel Collaboration Thermal Solution

Assembly Component Description Supplier PN Supplier Contact Info

Assembly, Heatsink, Intel® Xeon® Processor 5500 Series and Intel® Xeon® Processor 5600 Series, 2U

Assembly, Heatsink, Intel® Xeon® Processor 5500 Series and Intel® Xeon® Processor 5600 Series, Pedestal

2U URS Heatsink

Intel Collaboration Heatsink p/n

E32410-001

Tower URS Heatsink

Intel Collaboration Heatsink p/n

E32412-001

Supplier Designed Solution with Intel-specified retention, includes TIM, 130W capable

Foxconn

pn 1A016500

Chaun-Choung

Technology Corp

(CCI)

pn 0007029401

Foxconn

Ray Wang ray.wang@foxconn.com (512) 670-2638 ext 273

Chaun-Choung Technology Corp (CCI) Monica Chih monica_chih@ccic.com.tw +886 (2) 2995-2666 x1131

Harry Lin hlinack@aol.com 714 739-5797

A.1.3 Alternative Thermal Solution

The alternative thermal solutions are preliminary and are not verified by Intel to meet the criteria outlined in Table 6-1. Customers can purchase the alternative thermal solutions from the suppliers listed in Table A-3.

Table A-3. Suppliers for the Alternative Thermal Solution (Sheet 1 of 2)

Assembly Component Description Supplier PN

Assembly, Heat Sink, 1U

Assembly Heatsink, 1U

1U SSI Blade Alternative URS Heatsink

1U Alternative URS Heatsink

Standard TaiSol Corporation

1A1-9031000960-A

www.Taisol.com

Standard Thermaltake

CL-P0484

www.Thermaltake.com

Standard CoolerMaster

Standard Aavid Thermalloy

Performance Aavid Thermalloy

Standard

Performance

S1N-PJFCS-07-GP

www.CoolerMaster.com

050073

www.AavidThermalloy.com

050231

www.AavidThermalloy.com

CoolJag

JYC0B39CTA

www.CoolJag.com Taiwan Microloops

99-520040-M03

www.Microloops.com

Vapro, Inc.

MS109AH-Cu

www.VaproInc.com

Intel® Xeon®

Processor

5500 Series

95W capable 95W capable

Intel® Xeon®

Processor

5600 Series

46 Thermal/Mechanical Design Guide

Component Suppliers

Table A-3. Suppliers for the Alternative Thermal Solution (Sheet 2 of 2)

Assembly Component Description Supplier PN

Assembly, Heatsink, 2U

Assembly, Heatsink, Tower

Assembly, Heatsink

2U Alternative URS Heatsink

Tower Alternative URS Heatsink

Pedestal/2U Active Heatsink

Standard Asia Vital Components

Standard Thermaltake

www.Thermaltake.com

Standard CoolerMaster

www.CoolerMaster.com

Standard TaiSol Corporation

Low Cost Dynatron Corporation

www.Dynatron-Corp.com

Low Cost

Standard TaiSol Corporation

Standard Thermaltake

www.Thermaltake.com

Active

Dynatron Corporation*

www.Dynatron-Corp.com

(AVC)

SR40400001

www.AVC.com.tw

CL-P0486

S2N-PJMHS-07-GP

1A0-9041000960-A

www.Taisol.com

(Top Motor/Dynaeon)

G520

CoolJag

JAC0B40A

www.CoolJag.com

1A0-9051000960-A

www.Taisol.com

CL-P0485

(Top Motor/Dynaeon)

G555

Intel® Xeon®

Processor

5500 Series

95W capable 130W capable

95W capable 95W capable

95W capable 80W capable

95W capable 130W capable

80W capable 80W capable

130W capable 130W capable

80W capable 80W capable

Intel® Xeon®

Processor

5600 Series

Notes:

1) Standard - Design and technology similar to Intel Reference or Collaboration designs, however, may not meet thermal requirements for all processor SKUs.

2) Performance - 1U Heatsink designed with premium materials or technology expected to provide optimum thermal performance for all processor SKUs.

3) Low Cost - 2U Cost-Optimized Heatsink, expected to meet thermal targets for lower power processor SKUs.

A.1.4 Socket and ILM Components

The LGA1366 Socket and ILM Components are described in Chapter 2 and Chapter 3, respectively. Socket mechanical drawings are provided in Appendix C. Mechanical models are listed in Table 1-1.

Table A-4. LGA1366 Socket and ILM Components

Item Intel PN Foxconn Tyco Molex

ILM Cover Assembly D92428-003 PT44L13-4101 1554105-1 475939000 Server Back Plate D92433-002 PT44P12-4101 1981467-1 475937000 LGA1366 Socket D86205-002 PE136627-4371-01F 1939737-1 475940001

Thermal/Mechanical Design Guide 47

Component Suppliers

48 Thermal/Mechanical Design Guide

Mechanical Drawings

B Mechanical Drawings

Table B-1. Mechanical Drawing List

Description Figure

Board Keepin / Keepout Zones (Sheet 1 of 4) Figure B-1 Board Keepin / Keepout Zones (Sheet 2 of 4) Figure B-2 Board Keepin / Keepout Zones (Sheet 3 of 4) Figure B-3 Board Keepin / Keepout Zones (Sheet 4 of 4) Figure B-4 1U Reference Heatsink Assembly (Sheet 1 of 2) Figure B-5 1U Reference Heatsink Assembly (Sheet 2 of 2) Figure B-6 1U Reference Heatsink Fin and Base (Sheet 1 of 2) Figure B-7 1U Reference Heatsink Fin and Base (Sheet 2 of 2) Figure B-8 Heatsink Shoulder Screw (1U, 2U and Tower) Figure B-9 Heatsink Compression Spring (1U, 2U and Tower) Figure B-10 Heatsink Retaining Ring (1U, 2U and Tower) Figure B-11 Heatsink Load Cup (1U, 2U and Tower) Figure B-12 2U Collaborative Heatsink Assembly (Sheet 1 of 2) Figure B-13 2U Collaborative Heatsink Assembly (Sheet 2 of 2) Figure B-14 2U Collaborative Heatsink Volumetric (Sheet 1 of 2) Figure B-15 2U Collaborative Heatsink Volumetric (Sheet 2 of 2) Figure B-16 Tower Collaborative Heatsink Assembly (Sheet 1 of 2) Figure B-17 Tower Collaborative Heatsink Assembly (Sheet 2 of 2) Figure B-18 Tower Collaborative Heatsink Volumetric (Sheet 1 of 2) Figure B-19 Tower Collaborative Heatsink Volumetric (Sheet 2 of 2) Figure B-20 1U Reference Heatsink Assembly with TIM (Sheet 1 of 2) Figure B-21 1U Reference Heatsink Assembly with TIM (Sheet 2 of 2) Figure B-22 2U Reference Heatsink Assembly with TIM (Sheet 1 of 2) Figure B-23 2U Reference Heatsink Assembly with TIM (Sheet 2 of 2) Figure B-24 Tower Reference Heatsink Assembly with TIM (Sheet 1 of 2) Figure B-25 Tower Reference Heatsink Assembly with TIM (Sheet 2 of 2) Figure B-26

25.5mm Reference Heatsink Assembly (Sheet 1 of 2) Figure B-27

25.5mm Reference Heatsink Assembly (Sheet 2 of 2) Figure B-28

25.5mm Reference Heatsink Fin and Base (Sheet 1 of 2) Figure B-29

25.5mm Reference Heatsink Fin and Base (Sheet 2 of 2) Figure B-30

25.5mm Reference Heatsink Assembly with TIM (Sheet 1 of 2) Figure B-31

25.5mm Reference Heatsink Assembly with TIM (Sheet 2 of 2) Figure B-32

Thermal/Mechanical Design Guide 49

Figure B-1. Board Keepin / Keepout Zones (Sheet 1 of 4)

Mechanical Drawings

50 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-2. Board Keepin / Keepout Zones (Sheet 2 of 4)

 



 

 

 

 

 



 



 



 



 



 

 



 



 



 



 



 



Thermal/Mechanical Design Guide 51

Figure B-3. Board Keepin / Keepout Zones (Sheet 3 of 4)

Mechanical Drawings

 



  

 



 



 



 



 



52 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-4. Board Keepin / Keepout Zones (Sheet 4 of 4)

Thermal/Mechanical Design Guide 53

Figure B-5. 1U Reference Heatsink Assembly (Sheet 1 of 2)

Mechanical Drawings

54 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-6. 1U Reference Heatsink Assembly (Sheet 2 of 2)

Thermal/Mechanical Design Guide 55

Figure B-7. 1U Reference Heatsink Fin and Base (Sheet 1 of 2)

Mechanical Drawings

56 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-8. 1U Reference Heatsink Fin and Base (Sheet 2 of 2)

Thermal/Mechanical Design Guide 57

Figure B-9. Heatsink Shoulder Screw (1U, 2U and Tower)

Mechanical Drawings

58 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-10. Heatsink Compression Spring (1U, 2U and Tower)

Thermal/Mechanical Design Guide 59

Figure B-11. Heatsink Retaining Ring (1U, 2U and Tower)

Mechanical Drawings

60 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-12. Heatsink Load Cup (1U, 2U and Tower)

Thermal/Mechanical Design Guide 61

Figure B-13. 2U Collaborative Heatsink Assembly (Sheet 1 of 2)

Mechanical Drawings

62 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-14. 2U Collaborative Heatsink Assembly (Sheet 2 of 2)

Thermal/Mechanical Design Guide 63

Figure B-15. 2U Collaborative Heatsink Volumetric (Sheet 1 of 2)

Mechanical Drawings

64 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-16. 2U Collaborative Heatsink Volumetric (Sheet 2 of 2)

Thermal/Mechanical Design Guide 65

Figure B-17. Tower Collaborative Heatsink Assembly (Sheet 1 of 2)

Mechanical Drawings

66 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-18. Tower Collaborative Heatsink Assembly (Sheet 2 of 2)

Thermal/Mechanical Design Guide 67

Figure B-19. Tower Collaborative Heatsink Volumetric (Sheet 1 of 2)

Mechanical Drawings

68 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-20. Tower Collaborative Heatsink Volumetric (Sheet 2 of 2)

Thermal/Mechanical Design Guide 69

Figure B-21. 1U Reference Heatsink Assembly with TIM (Sheet 1 of 2)

Mechanical Drawings

70 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-22. 1U Reference Heatsink Assembly with TIM (Sheet 2 of 2)

Thermal/Mechanical Design Guide 71

Figure B-23. 2U Reference Heatsink Assembly with TIM (Sheet 1 of 2)

Mechanical Drawings

72 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-24. 2U Reference Heatsink Assembly with TIM (Sheet 2 of 2)

Thermal/Mechanical Design Guide 73

Figure B-25. Tower Reference Heatsink Assembly with TIM (Sheet 1 of 2)

Mechanical Drawings

74 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-26. Tower Reference Heatsink Assembly with TIM (Sheet 2 of 2)

Thermal/Mechanical Design Guide 75

Figure B-27. 25.5mm Reference Heatsink Assembly (Sheet 1 of 2)

Mechanical Drawings

76 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-28. 25.5mm Reference Heatsink Assembly (Sheet 2 of 2)

Thermal/Mechanical Design Guide 77

Figure B-29. 25.5mm Reference Heatsink Fin and Base (Sheet 1 of 2)

Mechanical Drawings

78 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-30. 25.5mm Reference Heatsink Fin and Base (Sheet 2 of 2)

Thermal/Mechanical Design Guide 79

Figure B-31. 25.5mm Reference Heatsink Assembly with TIM (Sheet 1 of 2)

Mechanical Drawings

80 Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-32. 25.5mm Reference Heatsink Assembly with TIM (Sheet 2 of 2)

Thermal/Mechanical Design Guide 81

Mechanical Drawings

82 Thermal/Mechanical Design Guide

Socket Mechanical Drawings

C Socket Mechanical Drawings

Table C-1 lists the mechanical drawings included in this appendix.

Table C-1. Mechanical Drawing List

Drawing Description Figure Number

“Socket Mechanical Drawing (Sheet 1 of 4)” Figure C-1 “Socket Mechanical Drawing (Sheet 2 of 4)” Figure C-2 “Socket Mechanical Drawing (Sheet 3 of 4)” Figure C-3 “Socket Mechanical Drawing (Sheet 4 of 4)” Figure C-4

Thermal/Mechanical Design Guide 83

Figure C-1. Socket Mechanical Drawing (Sheet 1 of 4)

Socket Mechanical Drawings

84 Thermal/Mechanical Design Guide

Socket Mechanical Drawings

Figure C-2. Socket Mechanical Drawing (Sheet 2 of 4)

Thermal/Mechanical Design Guide 85

Figure C-3. Socket Mechanical Drawing (Sheet 3 of 4)

Socket Mechanical Drawings

86 Thermal/Mechanical Design Guide

Socket Mechanical Drawings

Figure C-4. Socket Mechanical Drawing (Sheet 4 of 4)

Thermal/Mechanical Design Guide 87

Socket Mechanical Drawings

88 Thermal/Mechanical Design Guide

Heatsink Load Metrology

D Heatsink Load Metrology

To ensure compliance to max socket loading value listed in Table 4-3, and to meet the performance targets for Thermal Interface Material in Table 5.3, the Heatsink Static Compressive Load can be assessed using the items listed below:

• HP34970A DAQ

• Omegadyne load cell, 100 lbf max (LCKD-100)

• Test board (0.062") with ILM & back plate installed

• 8 in-lbf pneumatic driver

• Heatsink

• Intel Xeon processor 5500 series Load Cell Fixture (Figure D-1)

Thermal/Mechanical Design Guide 89

Figure D-1. Intel Xeon Processor 5500 Series Load Cell Fixture

Heatsink Load Metrology

90 Thermal/Mechanical Design Guide

Embedded Thermal Solutions

E Embedded Thermal Solutions

This section describes the LV processors and Embedded reference heatsinks for NEBS (Network Equipment Building Systems) compliant ATCA (Advanced Telecommunications Computing Architecture) systems. These LV processors are good for any form factor that needs to meet NEBS requirements.

E.1 Performance Targets

Table E-1 and Table E-2 provide boundary conditions and performance targets for 1U

and ATCA heatsinks. These values are used to generate processor thermal specifications and to provide guidance for heatsink design.

Table E-1. Boundary Conditions and Performance Targets for Intel® Xeon® Processor

5500 Series

Parameter Value Value

Altitude, system ambient temp Nominal/Short-term

TDP 60 W 38 W

1,4

System height (form factor)31U (EEB) or ATCA ATCA

Heatsink volumetric

Heatsink technology

Sea level, 40oC/55C Sea level, 40oC/55C

51.9/66.9oC 50/65oC

0.336oC/W 0.532oC/W

1U (90 x 90 x 27) or Custom ATCA (90 x 90 x 13mm + heat exchanger)

Cu base, Cu fins

ATCA (90 x 90 x 13 mm)

Table E-2. Boundary Conditions and Performance Targets for Intel® Xeon® Processor

5600 Series

Parameter Value Value

Altitude, system ambient temp Nominal/Short-term

TDP 60 W 40W

1,4

System height (form factor)31U (EEB) or ATCA ATCA

Heatsink volumetric

Heatsink technology

Sea level, 40oC/55C Sea level, 40oC/55C

51.7/66.7oC 50/65oC

0.306oC/W 0.548oC/W

1U (90 x 90 x 27) or Custom ATCA (90 x 90 x 13mm + heat exchanger)

Cu base, Cu fins

ATCA (90 x 90 x 13 mm)

NOTES:

1. Local ambient temperature of the air entering the heatsink.

2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (Section 5.5.1).

3. Reference system configuration. In a single wide ATCA blade the 60 W processor should be used in single

Thermal/Mechanical Design Guide 91

socket only and the 38 W processor can be used in dual socket.

4. Local Ambient Temperature written 50/65o C means 50oC under Nominal conditions but 65oC is allowed for Short-Term NEBS excursions.

5. Passive heatsinks with TIM.

6. See Section 5.1 for standard 1U solutions that do not need to meet NEBS.

Detailed drawings for the ATCA reference heatsink can be found in Section E.3.

Table E-1 and Table E-2 above specify CA targets. Figure E-1 below shows CA and

pressure drop for the ATCA heatsink versus the airflow provided. Best-fit equations are provided to prevent errors associated with reading the graph.

Figure E-1. ATCA Heatsink Performance Curves

Embedded Thermal Solutions

2.5

P = 1.3e-04CFM2 +1.1e-02CFM

1.5

0.5

Mean ca= 0.337 + 1.625 CFM

0 5 10 15 20 25 30 35

CFM Through Fins

Other LGA1366 compatible thermal solutions may work with the same retention.

E.2 Thermal Design Guidelines

1.6

1.2

0.8

0.4

-0.939

E.2.1 NEBS Thermal Profile

Processors that offer a NEBS compliant thermal profile are specified in the appropriate Datasheet.

NEBS thermal profiles help relieve thermal constraints for Short-Term NEBS conditions. To help reliability, processors must meet the nominal thermal profile under standard operating conditions and can only rise up to the Short-Term spec for NEBS excursions (see Figure E-2). The definition of Short-Term time is clearly defined for NEBS Level 3 conditions but the key is that it cannot be longer than 360 hours per year.

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Figure E-2. NEBS Thermal Profile

Short-term Thermal Profile may only be used for short term excursions to higher ambient temperatures, not to exceed 360

hours per year

Thermal Profile

Short-Term Thermal Profile Tc = 0.302 * P + 66.9

0 5 10 15 20 25 30 35 40 45 50 55 60

Power [W]

NOTES:

1.) The thermal specifications shown in this graph are for reference only. See the appropriate Datasheet for the Thermal Profile specifications. In case of conflict, the data in the datasheet supersedes any data in this figure.

2.) The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do not require NEBS Level 3 compliance.

3.) The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating temperatures, not to exceed 360 hours per year as compliant with NEBS Level 3.

4.) Implementation of either thermal profile should result in virtually no TCC activation.

5.) Utilization of a thermal solution that exceeds the Short-Term Thermal Profile, or which operates at the ShortTerm Thermal Profile for a duration longer than the limits specified in Note 3 above, do not meet the processor thermal specifications and may result in permanent damage to the processor.

E.2.2 Custom Heat Sinks For UP ATCA

The Embedded specific 60W SKU is targeted for NEBS compliant 1U+ systems and UP ATCA configurations with custom thermal solutions. In order to cool this part in a single wide ATCA slot, a custom thermal solution will be required. Since solutions like this will be very configuration specific, this heat sink was not fully designed with retention and keep-out definitions.

Nominal Thermal Profile Tc = 0.302* P + 51.9

In order to cool the additional power of a 60W processor in ATCA, the heat sink volume was increased. The assumption was that the heat sink could not grow wider because of VR and Memory placement, so a Remote Heat Exchanger (RHE) was used. The RHE is attached to the main heat sink with a heat pipe. The RHE gives additional convective surface area and gives the thermal solution access to more air. Samples of the following design were ordered and tested for thermal performance only.

Flotherm analysis shows that the following design can cool an LGA1366 TTV in an ATCA blade at 30CFM. The heat sink ca would be 0.50C/W at 55C ambient which falls below the thermal profile for the 60W processor.

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Figure E-3. UP ATCA Thermal Solution

Embedded Thermal Solutions

NOTES:Thermal sample only, retention not production ready.

Figure E-4. UP ATCA System Layout

NOTES:Heat sink should be optimized for the layout.

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Figure E-5. UP ATCA Heat Sink Drawing

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E.3 Mechanical Drawings and Supplier Information

See Appendix B for retention and keep out drawings. The part number below represent Intel reference designs for a DP ATCA heatsink.

Customer implementation of these components may be unique and require validation by the customer. Customers can obtain these components directly from the supplier below.

Table E-3. Embedded Heatsink Component Suppliers

Assembly Component Description Supplier PN Supplier Contact Info

Fujikura America Ash Ooe

a_ooe@fujikura.com 408-748-6991

Fujikura Taiwan Branch Yao-Hsien Huang

yeohsien@fujikuratw.com .tw 886(2)8788-4959

Assembly, Heat Sink, Nehalem-EP, ATCA

ATCA Reference heatsink

Intel P/N E65918-001

ATCA Copper Fin, Copper Base

Fujikura

HSA-7901

Table E-4. Mechanical Drawings List

Parameter Value

ATCA Reference Heat Sink Assembly (Sheet 1 of 2) Figure E-6 ATCA Reference Heat Sink Assembly (Sheet 2 of 2) Figure E-7 ATCA Reference Heatsink Fin and Base (Sheet 1 of 2) Figure E-8 ATCA Reference Heatsink Fin and Base (Sheet 2 of 2) Figure E-9

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