Intel X5550 - Quad Core Xeon Design Manual
Intel® Xeon® Processor 5500/5600
Series
Thermal/Mechanical Design Guide
March 2010
Reference Number: 321323-002
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,
BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
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PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or
life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to them.
The Intel® Xeon® processor 5500 series, 5600 series and LGA1366 socket may contain design defects or errors known as errata
which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family,
not across different processor families. See http://www.intel.com/products/processor_number for details. Over time processor
numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not intended to
represent proportional or quantitative increases in any particular feature. Current roadmap processor number progression is not
necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details.
Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost
Technology performance varies depending on hardware, software and overall system configuration. Check with your PC
manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see www.intel.com.
Intel, Xeon, and the Intel logo are trademarks of Intel Corporation in the U.S and other countries.
* Other brands and names may be claimed as the property of others.
Copyright © 2009, Intel Corporation.
2 Thermal/Mechanical Design Guide
Contents
1 Introduction ..............................................................................................................9
1.1 References ....................................................................................................... 10
1.2 Definition of Terms ............................................................................................ 10
2 LGA1366 Socket ...................................................................................................... 13
2.1 Board Layout.................................................................................................... 15
2.2 Attachment to Motherboard ................................................................................ 16
2.3 Socket Components........................................................................................... 16
2.3.1 Socket Body Housing .............................................................................. 16
2.3.2 Solder Balls ........................................................................................... 16
2.3.3 Contacts ............................................................................................... 17
2.3.4 Pick and Place Cover............................................................................... 17
2.4 Package Installation / Removal ........................................................................... 18
2.4.1 Socket Standoffs and Package Seating Plane.............................................. 18
2.5 Durability......................................................................................................... 19
2.6 Markings .......................................................................................................... 19
2.7 Component Insertion Forces ............................................................................... 19
2.8 Socket Size ...................................................................................................... 19
2.9 LGA1366 Socket NCTF Solder Joints..................................................................... 20
3 Independent Loading Mechanism (ILM)................................................................... 21
3.1 Design Concept................................................................................................. 21
3.1.1 ILM Cover Assembly Design Overview ....................................................... 21
3.1.2 ILM Back Plate Design Overview............................................................... 22
3.2 Assembly of ILM to a Motherboard....................................................................... 23
4 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications . 27
4.1 Component Mass............................................................................................... 27
4.2 Package/Socket Stackup Height .......................................................................... 27
4.3 Socket Maximum Temperature............................................................................ 27
4.4 Loading Specifications........................................................................................ 28
4.5 Electrical Requirements...................................................................................... 28
4.6 Environmental Requirements ..............................................................................29
5 Thermal Solutions ................................................................................................... 31
5.1 Performance Targets.......................................................................................... 31
5.1.1 25.5 mm Tall Heatsink............................................................................ 32
5.2 Heat Pipe Considerations.................................................................................... 33
5.3 Assembly ......................................................................................................... 34
5.3.1 Thermal Interface Material (TIM).............................................................. 35
5.4 Structural Considerations ...................................................................................35
5.5 Thermal Design................................................................................................. 35
5.5.1 Thermal Characterization Parameter ......................................................... 35
5.5.2 Dual Thermal Profile ............................................................................... 36
5.6 Thermal Features .............................................................................................. 37
5.6.1 Fan Speed Control.................................................................................. 37
5.6.2 PECI Averaging and Catastrophic Thermal Management............................... 38
5.6.3 Intel® Turbo Boost Technology................................................................ 39
5.7 Thermal Guidance ............................................................................................. 39
5.7.1 Thermal Excursion Power for Processors with Dual Thermal Profile ................ 39
5.7.2 Thermal Excursion Power for Processors with Single Thermal Profile.............. 40
5.7.3 Absolute Processor Temperature .............................................................. 40
6 Quality and Reliability Requirements ....................................................................... 41
6.1 Test Conditions ................................................................................................. 41
Thermal/Mechanical Design Guide 3
6.2 Intel Reference Component Validation ..................................................................43
6.2.1 Board Functional Test Sequence ...............................................................43
6.2.2 Post-Test Pass Criteria.............................................................................43
6.2.3 Recommended BIOS/Processor/Memory Test Procedures .............................44
6.3 Material and Recycling Requirements....................................................................44
A Component Suppliers...............................................................................................45
A.1 Intel Enabled Supplier Information .......................................................................45
A.1.1 Intel Reference Thermal Solution ..............................................................45
A.1.2 Intel Collaboration Thermal Solution..........................................................45
A.1.3 Alternative Thermal Solution ....................................................................46
A.1.4 Socket and ILM Components ....................................................................47
B Mechanical Drawings ...............................................................................................49
C Socket Mechanical Drawings ....................................................................................83
D Heatsink Load Metrology..........................................................................................89
E Embedded Thermal Solutions...................................................................................91
E.1 Performance Targets..........................................................................................91
E.2 Thermal Design Guidelines..................................................................................92
E.2.1 NEBS Thermal Profile ..............................................................................92
E.2.2 Custom Heat Sinks For UP ATCA ...............................................................93
E.3 Mechanical Drawings and Supplier Information ......................................................96
F Processor Installation Tool ....................................................................................101
Figures
1-1 Intel® Xeon® 5500 Platform Socket Stack............................................................. 9
2-1 LGA1366 Socket with Pick and Place Cover Removed..............................................13
2-2 LGA1366 Socket Contact Numbering (Top View of Socket) ......................................14
2-3 LGA1366 Socket Land Pattern (Top View of Board).................................................15
2-4 Attachment to Motherboard.................................................................................16
2-5 Pick and Place Cover ..........................................................................................17
2-6 Package Installation / Removal Features ...............................................................18
2-7 LGA1366 NCTF Solder Joints ...............................................................................20
3-1 ILM Cover Assembly...........................................................................................22
3-2 Back Plate ........................................................................................................23
3-3 ILM Assembly....................................................................................................24
3-4 Pin1 and ILM Lever ............................................................................................25
4-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology...........................30
5-1 Best-fit Equations ..............................................................................................32
5-2 TTV Die Size and Orientation...............................................................................33
5-3 1U Reference Heatsink Assembly .........................................................................34
5-4 Processor Thermal Characterization Parameter Relationships ...................................36
5-5 Dual Thermal Profile...........................................................................................37
6-1 Example Thermal Cycle - Actual profile will vary ....................................................43
B-1 Board Keepin / Keepout Zones (Sheet 1 of 4) ........................................................50
B-2 Board Keepin / Keepout Zones (Sheet 2 of 4) ........................................................51
B-3 Board Keepin / Keepout Zones (Sheet 3 of 4) ........................................................52
B-4 Board Keepin / Keepout Zones (Sheet 4 of 4) ........................................................53
B-5 1U Reference Heatsink Assembly (Sheet 1 of 2).....................................................54
B-6 1U Reference Heatsink Assembly (Sheet 2 of 2).....................................................55
B-7 1U Reference Heatsink Fin and Base (Sheet 1 of 2) ................................................56
B-8 1U Reference Heatsink Fin and Base (Sheet 2 of 2) ................................................57
4 Thermal/Mechanical Design Guide
B-9 Heatsink Shoulder Screw (1U, 2U and Tower) ....................................................... 58
B-10 Heatsink Compression Spring (1U, 2U and Tower) ................................................. 59
B-11 Heatsink Retaining Ring (1U, 2U and Tower)......................................................... 60
B-12 Heatsink Load Cup (1U, 2U and Tower) ................................................................ 61
B-13 2U Collaborative Heatsink Assembly (Sheet 1 of 2)................................................ 62
B-14 2U Collaborative Heatsink Assembly (Sheet 2 of 2)................................................ 63
B-15 2U Collaborative Heatsink Volumetric (Sheet 1 of 2) .............................................. 64
B-16 2U Collaborative Heatsink Volumetric (Sheet 2 of 2) .............................................. 65
B-17 Tower Collaborative Heatsink Assembly (Sheet 1 of 2) ........................................... 66
B-18 Tower Collaborative Heatsink Assembly (Sheet 2 of 2) ........................................... 67
B-19 Tower Collaborative Heatsink Volumetric (Sheet 1 of 2).......................................... 68
B-20 Tower Collaborative Heatsink Volumetric (Sheet 2 of 2).......................................... 69
B-21 1U Reference Heatsink Assembly with TIM (Sheet 1 of 2) ....................................... 70
B-22 1U Reference Heatsink Assembly with TIM (Sheet 2 of 2) ....................................... 71
B-23 2U Reference Heatsink Assembly with TIM (Sheet 1 of 2) ....................................... 72
B-24 2U Reference Heatsink Assembly with TIM (Sheet 2 of 2) ....................................... 73
B-25 Tower Reference Heatsink Assembly with TIM (Sheet 1 of 2)................................... 74
B-26 Tower Reference Heatsink Assembly with TIM (Sheet 2 of 2)................................... 75
B-27 25.5mm Reference Heatsink Assembly (Sheet 1 of 2) ............................................ 76
B-28 25.5mm Reference Heatsink Assembly (Sheet 2 of 2) ............................................ 77
B-29 25.5mm Reference Heatsink Fin and Base (Sheet 1 of 2)........................................ 78
B-30 25.5mm Reference Heatsink Fin and Base (Sheet 2 of 2)........................................ 79
B-31 25.5mm Reference Heatsink Assembly with TIM (Sheet 1 of 2)................................ 80
B-32 25.5mm Reference Heatsink Assembly with TIM (Sheet 2 of 2)................................ 81
C-1 Socket Mechanical Drawing (Sheet 1 of 4) ............................................................ 84
C-2 Socket Mechanical Drawing (Sheet 2 of 4) ............................................................ 85
C-3 Socket Mechanical Drawing (Sheet 3 of 4) ............................................................ 86
C-4 Socket Mechanical Drawing (Sheet 4 of 4) ............................................................ 87
D-1 Intel Xeon Processor 5500 Series Load Cell Fixture ................................................ 90
E-1 ATCA Heatsink Performance Curves ..................................................................... 92
E-2 NEBS Thermal Profile......................................................................................... 93
E-3 UP ATCA Thermal Solution.................................................................................. 94
E-4 UP ATCA System Layout..................................................................................... 94
E-5 UP ATCA Heat Sink Drawing................................................................................ 95
E-6 ATCA Reference Heat Sink Assembly (Sheet 1 of 2) ............................................... 97
E-7 ATCA Reference Heat Sink Assembly (Sheet 2 of 2) ............................................... 98
E-8 ATCA Reference Heatsink Fin and Base (Sheet 1 of 2) ............................................ 99
E-9 ATCA Reference Heatsink Fin and Base (Sheet 2 of 2) .......................................... 100
F-1 Processor Installation Tool................................................................................ 102
Thermal/Mechanical Design Guide 5
Tables
1-1 Reference Documents.........................................................................................10
1-2 Terms and Descriptions ......................................................................................10
4-1 Socket Component Mass.....................................................................................27
4-2 1366-land Package and LGA1366 Socket Stackup Height ........................................27
4-3 Socket and ILM Mechanical Specifications .............................................................28
4-4 Electrical Requirements for LGA1366 Socket..........................................................29
5-1 Boundary Conditions and Performance Targets for
Intel® Xeon® Processor 5500 Series ...................................................................31
5-2 Boundary Conditions and Performance Targets for
Intel Xeon processor 5600 series .........................................................................31
5-3 Performance Expectations for Intel Xeon Processor 5500
Series with 25.5 mm Tall Heatsink .......................................................................32
5-4 Fan Speed Control, TCONTROL and DTS Relationship..............................................37
5-5 T
6-1 Heatsink Test Conditions and Qualification Criteria .................................................41
A-1 Suppliers for the Intel Reference Thermal Solution .................................................45
A-2 Suppliers for the Intel Collaboration Thermal Solution.............................................46
A-3 Suppliers for the Alternative Thermal Solution .......................................................46
A-4 LGA1366 Socket and ILM Components..................................................................47
B-1 Mechanical Drawing List......................................................................................49
C-1 Mechanical Drawing List......................................................................................83
E-1 Boundary Conditions and Performance Targets for
E-2 Boundary Conditions and Performance Targets for
E-3 Embedded Heatsink Component Suppliers.............................................................96
E-4 Mechanical Drawings List ....................................................................................96
CONTROL
Intel® Xeon® Processor 5500 Series ...................................................................91
Intel® Xeon® Processor 5600 Series ...................................................................91
Guidance.............................................................................................38
6 Thermal/Mechanical Design Guide
Revision History
Document
Number
321323 001 Public Release March 2009
321323 002
Revision
Number
Description
Updates / additions in this revision include:
• Changed to reflect addition of Intel® Xeon® Processor 5600 Series
• Figure 1-1: replaced to show ILM load plate with cut out
• Table 1-1: Updated References
• Figures 2-4, 2-5: replaced to show ILM load plate with cut out
• Section 2.3.4: Added Pick_and_Place_Removal_Tool
• Section 3.1.1: fasteners are low carbon steel
• Figures 3-1, 3-3, 3-4: replaced to show ILM load plate with cut out
• Figure 3-2: replaced to show studs without knurled feature
• Section 3.2: Changed torque from 8 ± 2 to 9 ± 1 inch-pounds
• Table 4-3: min static load changed from 106 lbf to 100 lbf
• Table 4-3: clarified Parameter as Target Pick and Place Cover allowable removal
force and updated the force associated with it
• Table 5-1: Changed dP for 2U and Tower heatsink
• Table 5-2: Added Boundary Conditions and Performance Targets for Intel®
Xeon® Processor 5600 Series
• Figure 5-1: replaced curves for 1U with equations for 1U, 2U and Tower
• Table 5-3: specified for Intel® Xeon® Processor 5500 Series Processors
• Table 5-3: updated PSIca and dP values
• Figure 5-3: replaced to show ILM load plate with cut out
• Section 5.3: added Fastener sequencing statement (may mitigate against cross
threading).
• Table 5-5: added Tcontrol Guidance for Intel® Xeon® Processor 5600 Series
• Section 5.7: added Thermal Excursion for Intel® Xeon® Processor 5600 Series
• Table 6-1: added reference to Table 5-2 for Intel® Xeon® Processor 5600 Series
• Appendix A: added heatsink info for Intel® Xeon® Processor 5600 Series
• Table A-4, A-5: updated supplier info
• Appendix B: Added Figures B-27 to B-32 for 25.5mm heatsink
• Table E-1: updated PSIca for 60W
• Table E-2: added Boundary Conditions and Performance Targets for Intel®
Xeon® Processor 5600 Series
Revision
Date
March 2010
§
Thermal/Mechanical Design Guide 7
8 Thermal/Mechanical Design Guide
Introduction
1 Introduction
This document provides guidelines for the design of thermal and mechanical solutions
for 2-socket server and 2-socket Workstation processors listed in the Intel® Xeon®
Processor 5500 Series Datasheet, Volume 1 and in the Intel® Xeon® Processor 5600
Series Datasheet, Volume 1. The components described in this document include:
• The processor thermal solution (heatsink) and associated retention hardware.
• The LGA1366 socket and the Independent Loading Mechanism (ILM) and back
plate.
Processors in 1-socket Workstation platforms are covered in the Intel® Core™ i7-900
Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor
Series, Intel® Xeon® Processor 3500 Series and LGA1366 Socket Thermal / Mechanical
Design Guide.
Figure 1-1. Intel® Xeon® 5500 Platform Socket Stack
The goals of this document are:
• To assist board and system thermal mechanical designers.
• To assist designers and suppliers of processor heatsinks.
Thermal profiles and other processor specifications are provided in the Datasheet.
Thermal/Mechanical Design Guide 9
1.1 References
Material and concepts available in the following documents may be beneficial when
reading this document.
Table 1-1. Reference Documents
Document Location Notes
European Blue Angel Recycling Standards 2
Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 321321 1
Intel® Xeon® Processor 5600 Series Datasheet, Volume 1 323369 1
Intel® Xeon® Processor 5500 Series Mechanical Model 321326 1
Intel® Xeon® Processor 5500 Series Thermal Model 321327 1
Entry-level Electronics Bay Specification 3
Notes:
1. Document numbers indicated in Location column are subject to change. See the appropriate Electronic
Design Kit (EDK) for the most up-to-date Document number.
2. Available at http://www.blauer-engel.de
3. Available at http://ssiforum.org/
1.2 Definition of Terms
Introduction
Table 1-2. Terms and Descriptions (Sheet 1 of 2)
Term Description
Bypass Bypass is the area between a passive heatsink and any object that can act to form a
DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC
FSC Fan Speed Control
IHS Integrated Heat Spreader: a component of the processor package used to enhance the
ILM Independent Loading Mechanism provides the force needed to seat the 1366-LGA land
LGA1366 socket The processor mates with the system board through this surface mount, 1366-contact
PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides
CA
CS
SA
T
CASE
T
CASE_MAX
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
activation temperature.
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
package onto the socket contacts.
socket.
a communication channel between Intel processor and chipset components to external
monitoring devices.
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
Package Power. Heat source should always be specified for measurements.
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
Package Power.
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (TS – TLA) / Total Package Power.
The case temperature of the processor measured at the geometric center of the topside
of the IHS.
The maximum case temperature as specified in a component specification.
– TLA) / Total
CASE
– TS) / Total
CASE
10 Thermal/Mechanical Design Guide
Introduction
Table 1-2. Terms and Descriptions (Sheet 2 of 2)
Term Description
TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature
T
CONTROL
TDP Thermal Design Power: Thermal solution should be designed to dissipate this target
Thermal Monitor A power reduction feature designed to decrease temperature after the processor has
Thermal Profile Line that defines case temperature specification of a processor at a given power level.
TIM Thermal Interface Material: The thermally conductive compound between the heatsink
T
LA
T
SA
U A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U
by using clock modulation and/or operating frequency and input voltage adjustment
when the die temperature is very near its operating limits.
T
control.
power level. TDP is not the maximum power that the processor can dissipate.
reached its maximum operating temperature.
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet
for an active heatsink.
The system ambient air temperature external to a system chassis. This temperature is
usually measured at the chassis air inlets.
equals 3.50 in, etc.
is a static value below TCC activation used as a trigger point for fan speed
CONTROL
§
Thermal/Mechanical Design Guide 11
Introduction
12 Thermal/Mechanical Design Guide
LGA1366 Socket
2 LGA1366 Socket
This chapter describes a surface mount, LGA (Land Grid Array) socket intended for
processors in the Intel® Xeon® 5500 Platform. The socket provides I/O, power and
ground contacts. The socket contains 1366 contacts arrayed about a cavity in the
center of the socket with lead-free solder balls for surface mounting on the
motherboard.
The socket has 1366 contacts with 1.016 mm X 1.016 mm pitch (X by Y) in a
43x41 grid array with 21x17 grid depopulation in the center of the array and selective
depopulation elsewhere.
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). The design includes a back plate which is integral to having
a uniform load on the socket solder joints. Socket loading specifications are listed in
Chapter 4.
Figure 2-1. LGA1366 Socket with Pick and Place Cover Removed
package socket
package
cavity
cavity
socket
Thermal/Mechanical Design Guide 13
Figure 2-2. LGA1366 Socket Contact Numbering (Top View of Socket)
LGA1366 Socket
14 Thermal/Mechanical Design Guide
LGA1366 Socket
15
131417
192321
2731293033
353937
43
2.1 Board Layout
The land pattern for the LGA1366 socket is 40 mils X 40 mils (X by Y), and the pad size
is 18 mils. Note that there is no round-off (conversion) error between socket pitch
(1.016 mm) and board pitch (40 mil) as these values are equivalent.
Figure 2-3. LGA1366 Socket Land Pattern (Top View of Board)
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
32
32
31
31
30
30
29
29
28
28
27
27
26
26
25
25
24
24
23
23
22
22
21
21
20
20
19
19
18
18
17
17
16
16
15
15
14
14
13
13
12
12
11
11
10
10
9
9
8
8
7
7
6
6
5
5
4
4
3
3
2
2
1
1
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
42
41
40
38
36
34
32
28
26
25
24
22
20
18
16
12
Thermal/Mechanical Design Guide 15
2.2 Attachment to Motherboard
The socket is attached to the motherboard by 1366 solder balls. There are no additional
external methods (that is, screw, extra solder, adhesive, and so on) to attach the
socket.
As indicated in Figure 2-4, the Independent Loading Mechanism (ILM) is not present
during the attach (reflow) process.
Figure 2-4. Attachment to Motherboard
LGA1366 Socket
2.3 Socket Components
The socket has two main components, the socket body and Pick and Place (PnP) cover,
and is delivered as a single integral assembly. Refer to Appendix C for detailed
drawings.
2.3.1 Socket Body Housing
The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable
of withstanding 260 °C for 40 seconds (typical reflow/rework). The socket coefficient of
thermal expansion (in the XY plane), and creep properties, must be such that the
integrity of the socket is maintained for the conditions listed in the LGA1366 Socket
Validation Reports.
The color of the housing will be dark as compared to the solder balls to provide the
contrast needed for pick and place vision systems.
2.3.2 Solder Balls
A total of 1366 solder balls corresponding to the contacts are on the bottom of the
socket for surface mounting with the motherboard.
The socket has the following solder ball material:
• Lead free SAC (SnAgCu) solder alloy with a silver (Ag) content between 3% and
4% and a melting temperature of approximately 217 °C. The alloy must be
16 Thermal/Mechanical Design Guide
LGA1366 Socket
compatible with immersion silver (ImAg) motherboard surface finish and a SAC
alloy solder paste.
The co-planarity (profile) and true position requirements are defined in Appendix C.
2.3.3 Contacts
Base material for the contacts is high strength copper alloy.
For the area on socket contacts where processor lands will mate, there is a 0.381 m
[15 inches] minimum gold plating over 1.27 m [50 inches] minimum nickel
underplate.
No contamination by solder in the contact area is allowed during solder reflow.
2.3.4 Pick and Place Cover
The cover provides a planar surface for vacuum pick up used to place components in
the Surface Mount Technology (SMT) manufacturing line. The cover remains on the
socket during reflow to help prevent contamination during reflow. The cover can
withstand 260 °C for 40 seconds (typical reflow/rework profile) and the conditions
listed in the LGA1366 Socket Validation Reports without degrading.
As indicated in Figure 2-5, the cover remains on the socket during ILM installation, and
should remain on whenever possible to help prevent damage to the socket contacts.
Cover retention must be sufficient to support the socket weight during lifting,
translation, and placement (board manufacturing), and during board and system
shipping and handling.
The covers are designed to be interchangeable between socket suppliers. As indicated
in Figure 2-5, a Pin1 indicator on the cover provides a visual reference for proper
orientation with the socket.
See LGA1366_Socket_Pick_and_Place_Removal_Tool_rev2.0 for a drawing of a tool
designed to provide mechanical assistance during cover installation and removal.
Figure 2-5. Pick and Place Cover
Thermal/Mechanical Design Guide 17
2.4 Package Installation / Removal
As indicated in Figure 2-6, access is provided to facilitate manual installation and
removal of the package.
To assist in package orientation and alignment with the socket:
• The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for
proper orientation.
• The package substrate has orientation notches along two opposing edges of the
package, offset from the centerline. The socket has two corresponding orientation
posts to physically prevent mis-orientation of the package. These orientation
features also provide initial rough alignment of package to socket.
• The socket has alignment walls at the four corners to provide final alignment of the
package.
See Appendix F for information regarding a tool designed to provide mechanical
.
Figure 2-6. Package Installation / Removal Features
assistance during processor installation and removal.
LGA1366 Socket
orientation
orientation
notch
notch
alignment
Pin1 triangle
Pin1 triangle
access
access
orientation
orientation
post
post
Pin1 chamfer
Pin1 chamfer
alignment
walls
walls
2.4.1 Socket Standoffs and Package Seating Plane
Standoffs on the bottom of the socket base establish the minimum socket height after
solder reflow and are specified in Appendix C.
Similarly, a seating plane on the topside of the socket establishes the minimum
package height. See Section 4.2 for the calculated IHS height above the motherboard.
18 Thermal/Mechanical Design Guide
LGA1366 Socket
2.5 Durability
The socket must withstand 30 cycles of processor insertion and removal. The max
chain contact resistance from Table 4-4 must be met when mated in the 1st and 30th
cycles.
The socket Pick and Place cover must withstand 15 cycles of insertion and removal.
2.6 Markings
There are three markings on the socket:
• LGA1366: Font type is Helvetica Bold - minimum 6 point (2.125 mm).
• Manufacturer's insignia (font size at supplier's discretion).
• Lot identification code (allows traceability of manufacturing date and location).
All markings must withstand 260°C for 40 seconds (typical reflow/rework profile)
without degrading, and must be visible after the socket is mounted on the
motherboard.
LGA1366 and the manufacturer's insignia are molded or laser marked on the side wall.
2.7 Component Insertion Forces
Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/
Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table
R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force
to insert the package into the socket.
2.8 Socket Size
Socket information needed for motherboard design is given in Appendix C.
This information should be used in conjunction with the reference motherboard keep-
out drawings provided in Appendix B to ensure compatibility with the reference thermal
mechanical components.
Thermal/Mechanical Design Guide 19
2.9 LGA1366 Socket NCTF Solder Joints
15
131417
1923212225
2731293033
353937
43
Intel has defined selected solder joints of the socket as non-critical to function (NCTF)
for post environmental testing. The processor signals at NCTF locations are typically
redundant ground or non-critical reserved, so the loss of the solder joint continuity at
end of life conditions will not affect the overall product functionality. Figure 2-7
.
Figure 2-7. LGA1366 NCTF Solder Joints
identifies the NCTF solder joints.
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
32
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A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
LGA1366 Socket
42
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12
Note: For platforms supporting the DP processor land C3 is CTF.
§
20 Thermal/Mechanical Design Guide
Independent Loading Mechanism (ILM)
3 Independent Loading
Mechanism (ILM)
The Independent Loading Mechanism (ILM) provides the force needed to seat the
1366-LGA land package onto the socket contacts. The ILM is physically separate from
the socket body. The assembly of the ILM to the board is expected to occur after wave
solder. The exact assembly location is dependent on manufacturing preference and test
flow.
Note: The ILM has two critical functions: deliver the force to seat the processor onto the
socket contacts and distribute the resulting compressive load evenly through the socket
solder joints.
Note: The mechanical design of the ILM is integral to the overall functionality of the LGA1366
socket. Intel performs detailed studies on integration of processor package, socket and
ILM as a system. These studies directly impact the design of the ILM. The Intel
reference ILM will be “build to print” from Intel controlled drawings. Intel recommends
using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from Intel's
detailed studies and may not incorporate critical design parameters.
3.1 Design Concept
The ILM consists of two assemblies that will be procured as a set from the enabled
vendors. These two components are ILM cover assembly and back plate.
3.1.1 ILM Cover Assembly Design Overview
The ILM Cover assembly consists of four major pieces: load lever, load plate, frame and
the captive fasteners.
The load lever and load plate are stainless steel. The frame is high carbon steel with
appropriate plating. The fasteners are fabricated from a low carbon steel. The frame
provides the hinge locations for the load lever and load plate.
The cover assembly design ensures that once assembled to the back plate and the load
lever is closed, the only features touching the board are the captive fasteners. The
nominal gap of the frame to the board is ~1 mm when the load plate is closed on the
empty socket or when closed on the processor package.
When closed, the load plate applies two point loads onto the IHS at the “dimpled”
features shown in Figure 3-1. The reaction force from closing the load plate is
transmitted to the frame and through the captive fasteners to the back plate. Some of
the load is passed through the socket body to the board inducing a slight compression
on the solder joints.
Thermal/Mechanical Design Guide 21
Figure 3-1. ILM Cover Assembly
Independent Loading Mechanism (ILM)
3.1.2 ILM Back Plate Design Overview
The unified back plate for 2-socket server and 2-socket Workstation products consists
of a flat steel back plate with threaded studs for ILM attach, and internally threaded
nuts for heatsink attach. The threaded studs have a smooth surface feature that
provides alignment for the back plate to the motherboard for proper assembly of the
ILM around the socket. A clearance hole is located at the center of the plate to allow
access to test points and backside capacitors. An additional cut-out on two sides
provides clearance for backside voltage regulator components. An insulator is preapplied.
Back plates for processors in 1-socket Workstation platforms are covered in the Intel
Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900
Desktop Processor Series, Intel® Xeon® Processor 3500 Series and LGA1366 Socket
Thermal / Mechanical Design Guide.
®
22 Thermal/Mechanical Design Guide
Independent Loading Mechanism (ILM)
Figure 3-2. Back Plate
3.2 Assembly of ILM to a Motherboard
The ILM design allows a bottoms up assembly of the components to the board. In
step 1, (see Figure 3-3), the back plate is placed in a fixture. Holes in the motherboard
provide alignment to the threaded studs. In step 2, the ILM cover assembly is placed
over the socket and threaded studs. Using a T20 Torx* driver fasten the ILM cover
assembly to the back plate with the four captive fasteners. Torque to 9 ± 1 inchpounds. The length of the threaded studs accommodate board thicknesses from
0.062” to 0.100”.
Thermal/Mechanical Design Guide 23
.
Figure 3-3. ILM Assembly
Independent Loading Mechanism (ILM)
24 Thermal/Mechanical Design Guide
Independent Loading Mechanism (ILM)
As indicated in Figure 3-4, socket protrusion and ILM key features prevent 180-degree
rotation of ILM cover assembly with respect to the socket. The result is a specific Pin 1
orientation with respect to the ILM lever.
Figure 3-4. Pin1 and ILM Lever
§
Thermal/Mechanical Design Guide 25
Independent Loading Mechanism (ILM)
26 Thermal/Mechanical Design Guide
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications
4 LGA1366 Socket and ILM
Electrical, Mechanical, and
Environmental Specifications
This chapter describes the electrical, mechanical, and environmental specifications for
the LGA1366 socket and the Independent Loading Mechanism.
4.1 Component Mass
Table 4-1. Socket Component Mass
Component Mass
Socket Body, Contacts and PnP Cover 15 gm
ILM Cover 43 gm
ILM Back Plate for dual processor server products 100 gm
4.2 Package/Socket Stackup Height
Table 4-2 provides the stackup height of a processor in the 1366-land LGA package and
LGA1366 socket with the ILM closed and the processor fully seated in the socket.
Table 4-2. 1366-land Package and LGA1366 Socket Stackup Height
Integrated Stackup Height (mm)
From Top of Board to Top of IHS
Notes:
1. This data is provided for information only, and should be derived from: (a) the height of the socket seating
plane above the motherboard after reflow, given in Appendix C, (b) the height of the package, from the
package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that
are given in the corresponding processor EMTS.
2. This value is a RSS calculation.
7.729 ± 0.282 mm
4.3 Socket Maximum Temperature
The power dissipated within the socket is a function of the current at the pin level and
the effective pin resistance. To ensure socket long term reliability, Intel defines socket
maximum temperature using a via on the underside of the motherboard. Exceeding the
temperature guidance may result in socket body deformation, or increases in thermal
and electrical resistance which can cause a thermal runaway and eventual electrical
failure. The guidance for socket maximum temperature is listed below:
• Via temperature under socket < 96 °C
Thermal/Mechanical Design Guide 27
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications
4.4 Loading Specifications
The socket will be tested against the conditions listed in the LGA1366 Socket Validation
Reports with heatsink and the ILM attached, under the loading conditions outlined in
this chapter.
Table 4-3 provides load specifications for the LGA1366 socket with the ILM installed.
The maximum limits should not be exceeded during heatsink assembly, shipping
conditions, or standard use condition. Exceeding these limits during test may result in
component failure. The socket body should not be used as a mechanical reference or
load-bearing surface for thermal solutions.
Table 4-3. Socket and ILM Mechanical Specifications
Parameter Min Max Notes
Static compressive load from ILM cover to
processor IHS
Heatsink Static Compressive Load 0 N [0 lbf] 266 N [60 lbf] 1, 2, 3
Total Static Compressive Load
(ILM plus Heatsink)
Dynamic Compressive Load
(with heatsink installed)
Target Pick and Place Cover allowable removal
force
Load Lever actuation force N/A 38.3 N [8.6 lbf] in the
445 N [100 lbf] 623 N [140 lbf] 3, 4
445 N (100 lbf) 890 N (200 lbf) 3, 4
N/A 890 N [200 lbf] 1, 3, 5, 6
N/A 4.45 - 6.68 N [1.0 -
1.5 lbf]
vertical direction
10.2 N [2.3 lbf] in the
lateral direction.
Notes:
1. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top
surface.
2. This is the minimum and maximum static force that can be applied by the heatsink and it’s retention
solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated
to these limits.
3. Loading limits are for the LGA1366 socket.
4. This minimum limit defines the compressive force required to electrically seat the processor onto the socket
contacts.
5. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load
requirement.
6. Test condition used a heatsink mass of 550 gm [1.21 lb] with 50 g acceleration measured at heatsink mass.
The dynamic portion of this specification in the product application can have flexibility in specific values, but
the ultimate product of mass times acceleration should not exceed this dynamic load.
4.5 Electrical Requirements
LGA1366 socket electrical requirements are measured from the socket-seating plane of
the processor to the component side of the socket PCB to which it is attached. All
specifications are maximum values (unless otherwise stated) for a single socket
contact, but includes effects of adjacent contacts where indicated.
28 Thermal/Mechanical Design Guide
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications
Table 4-4. Electrical Requirements for LGA1366 Socket
Parameter Value Comment
Mated loop inductance, Loop
Mated partial mutual inductance, L
Maximum mutual capacitance, C.
Socket Average Contact Resistance
(EOL)
Max Individual Contact Resistance
(EOL)
Bulk Resistance Increase
Dielectric Withstand Voltage
Insulation Resistance
<3.9nH
NA
<1 pF
15.2 m
100 m
3 m
360 Volts RMS
800 M
The inductance calculated for two contacts,
considering one forward conductor and one return
conductor. These values must be satisfied at the
worst-case height of the socket.
The inductance on a contact due to any single
neighboring contact.
The capacitance between two contacts
The socket average contact resistance target is
derived from average of every chain contact
resistance for each part used in testing, with a
chain contact resistance defined as the resistance
of each chain minus resistance of shorting bars
divided by number of lands in the daisy chain.
The specification listed is at room temperature
and has to be satisfied at all time.
Socket Contact Resistance: The resistance of
the socket contact, solderball, and interface
resistance to the interposer land.
The specification listed is at room temperature
and has to be satisfied at all time.
Socket Contact Resistance: The resistance of
the socket contact, solderball, and interface
resistance to the interposer land; gaps included.
The bulk resistance increase per contact from
24 °C to 107 °C
4.6 Environmental Requirements
Design, including materials, shall be consistent with the manufacture of units that meet
the following environmental reference points.
The reliability targets in this chapter are based on the expected field use environment
for these products. The test sequence for new sockets will be developed using the
knowledge-based reliability evaluation methodology, which is acceleration factor
dependent. A simplified process flow of this methodology can be seen in Figure 4-1.
Thermal/Mechanical Design Guide 29
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications
Figure 4-1. Flow Chart of Knowledge-Based Reliability Evaluation Methodology
Establish the
market/expected use
environment for the
technology
Develop Speculative
stress conditions based on
historical data, content
experts, and literature
search
Freeze stressing
requirements and perform
additional data turns
Perform stressing to
validate accelerated
stressing assumptions and
determine acceleration
factors
A detailed description of this methodology can be found at:
ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf.
§
30 Thermal/Mechanical Design Guide
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