Intel SSDSC2BX800G401 User Manual

Intel® Solid State Drive DC S3610 Series

Product Specification

Capacity:

 2.5-inch: 100GB, 200GB, 400GB, 480GB, 800GB,

1.2TB, 1.6TB

 1.8-inch: 200GB, 400GB, 800GB

Components:

 Intel®

20nm NAND Flash Memory

 High Endurance Technology (HET)

Multi-Level Cell (MLC)

Form Factor: 2.5–inch and 1.8-inch Read and Write IOPS

1,2

(Full LBA Range, IOMeter* Queue Depth 32)

 Random 4KB  Random 4KB Writes: Up to 28,000 IOPS  Random 8KB  Random 8KB Writes: Up to 14,000 IOPS

Bandwidth Performance

 Sustained Sequential Read: Up to 550 MB/s  Sustained Sequential Write: Up to 520 MB/s

Endurance: 3 drive writes per day

 100GB: 0.5PB – 200GB: 1.1PB  400GB: 3.0PB – 480GB: 3.7PB  800GB: 5.3PB (2.5”) – 800GB: 4.2PB (1.8”)  1.2TB: 8.6PB – 1.6TB: 10.7PB

Latency (average sequential)

 Read: 55 µs (TYP)  Write: 66 µs (TYP)

Quality of Service

 Read/Write: 500 µs / 5 ms (99.9%)

Performance Consistency

 Read/Write: Up to 90%/90% (99.9%)

AES 256-bit Encryption Altitude

 Operating: -1,000 to 10,000 ft  Operating  Non-operating: -1,000 to 40,000 ft

Product Ecological Compliance

 RoHS*

Compliance

 SATA Revision 3.0; compatible with SATA 6Gb/s, 3Gb/s

and 1.5Gb/s interface rates

 ATA/ATAPI Command Set – 2 (ACS-2 Rev 7);

includes SCT (Smart Command Transport) and device statistics log support

 Enhanced SMART ATA feature set  Native Command Queuing (NCQ) command set  Data set management Trim command

1. Performance values vary by capacity

2. Performance specifications apply to both compressible and incompressible data

3. 4KB = 4,096 bytes; 8KB = 8,192 bytes.

MB/s = 1,000,000 bytes/second

5. Based on JESD218 standard.

6. Based on Random 4KB QD=1 workload, measured as t he time taken for 99.9 percentile of commands to finish the round-trip from host to drive and back to host

7. Measur ement taken once the workload has reached ste ady state but including all backgroun d activities required for normal operation and data reliability

8. Based on Random 4KB QD=32 workload, measured as the (IOPS in the 99.9th percentile slowest 1-se cond interval)/(average IOPS during the test)

9. Altitu de pressure is simulated in a test cham ber; excludes soft error

10. Extended operation at a higher altitude might impact relia bility.

11. If both 12V an d 5V power supplies are present, defaults to 5V+ 12V power supplies. Does not support 12 v olt only.

12. Based on 5Vpower supply

13. Please contact your Intel representative for details on the no n-operating temperature range

Order Number: 331342-005US

Reads: Up to 84,000 IOPS

Reads: Up to 52,000 IOPS

6,7

: 10,000 to 15,000 ft

7,8

for 5 years

Power Management

 2.5 inch: 5V or 5V+12V SATA Supply Rail

 1.8 inch: 3.3V SATA Supply Rail  SATA Interface Power Management  OS-aware hot plug/removal  Enhanced power-loss data protection feature

Power

 Active: Up to 6.8 W (TYP)

 Idle: 600 mW

Weight:

 2.5-inch 100GB, 200GB, 400GB & 480GB:

82 grams ± 2 grams

 2.5-inch 800GB: 88 grams ± 2 grams  2.5-inch 1.2-1.6TB: 94 grams ± 2 grams  1.8-inch 200GB: 88 grams ± 2 grams  1.8-inch 400-800GB: 94 grams ± 2 grams

Temperature

 Operating: 0°  Non-Operating

C to 70° C

: -55° C to 95° C

 Temperature monitoring and logging  Thermal throttling

Shock (operating and non-operating):

1,000 G/0.5 ms

Vibration

 Operating: 2.17 G  Non-Operating

Reliability

RMS

: 3.13 G

(5-700 Hz)

(5-800 Hz)

RMS

 Uncorrectable Bit Error Rate (UBER):

1 sector per 10

^17

bits read

 Mean Time Between Failures (MTBF): 2 million hours  End-to-End data protection

Certifications and Declarations

 UL*, CE*, C-Tick*, BSMI*, KCC*, Microsoft* WHCK, VCCI*,

SATA-IO*

Compatibility

 Windows 7*, Windows 8*, and Windows 8.1*  Windows Server 2012* R2  Windows Server 2012*  Windows Server 2008* Enterprise 32/64bit SP2  Windows Server 2008* R2 SP1  Windows Server 2003* Enterprise R2 64bit SP2  VMWare* 5.1, 5.5  Red Hat* Enterprise Linux* 5.5, 5.6, 6.1, 6.3, 7.0  SUSE* Linux* Enterprise Server 10, 11 SP1  CentOS* 64bit 5.7, 6.3  Intel® SSD Toolbox with Intel® SSD Optimizer

Revision

Description

Date

001

Initial release.

January 2015

002

Added 1.8” SKUs spec

February 2015

003

Updated values in Table 1, "User-Addressable Sectors."

March 2015

004

 Table 18, SMART Attributes:

- SMART Attribute EAh - added bytes description

- Added new SMART Attribute F3h description and status flags

 Section 5.4.2: Updated SMART Attribute E2h decimal precision points from 3 to 2  Added 100GB capacity and specifications

July 2015

005

 Added 100GB capacity in 2.5” FF

October 2015

Intel® Solid State Drive DC S3610 Series

Ordering Information

Contact your local Intel sales representative for ordering information.

Revision History

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Intel Non-Volatile Memory Solutions Group (NSG) states that, through our Software Legal Compliance (SWLC) process, we have examined and evaluated firmware and software components that may accompany this Intel Solid State Drive product, including embedded SSD firmware and any Intel-provided drivers. We conclude that there are no Open Source elements contained in these components. For more information about our SWLC process, please contact your Intel Representative.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm

Low Halogen applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.

Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.

*Other names and brands may be claimed as the property of others.

October 2015 Product Specification 331342-003US 2

Intel® Solid State Drive DC S3610 Series

Contents

Revision History ......................................................................................................................................................................................... 2

Terminology ................................................................................................................................................................................................ 5

1 Overview ....................................................................................................................................................................... 6

2 Product Specifications .............................................................................................................................................. 7

2.1 Capacity ......................................................................................................................................................................................... 7

2.2 Performance ................................................................................................................................................................................ 7

2.3 Electrical Characteristics .................................................................................................................................................... 10

2.4 Environmental Conditions ................................................................................................................................................. 13

2.5 Product Regulatory Compliance ..................................................................................................................................... 13

2.6 Reliability ................................................................................................................................................................................... 14

2.7 Temperature Sensor ............................................................................................................................................................ 15

2.8 Power Loss Capacitor Test ................................................................................................................................................ 15

2.9 Hot Plug Support ................................................................................................................................................................... 15

3 Mechanical Information ......................................................................................................................................... 16

4 Pin and Signal Descriptions .................................................................................................................................. 18

4.1 2.5-inch Form Factor Pin Locations .............................................................................................................................. 18

4.2 1.8-inch Form Factor Pin Locations .............................................................................................................................. 18

4.3 Connector Pin Signal Definitions .................................................................................................................................... 19

4.4 Power Pin Signal Definitions............................................................................................................................................. 19

5 Supported Command Sets .................................................................................................................................... 21

5.1 ATA General Feature Command Set ............................................................................................................................. 21

5.2 Power Management Command Set............................................................................................................................... 21

5.3 Security Mode Feature Set ................................................................................................................................................ 22

5.4 SMART Command Set ......................................................................................................................................................... 22

5.5 Device Statistics ...................................................................................................................................................................... 28

5.6 SMART Command Transport (SCT) ............................................................................................................................... 30

5.7 Data Set Management Command Set .......................................................................................................................... 30

5.8 Host Protected Area Command Set .............................................................................................................................. 30

5.9 48-Bit Address Command Set ......................................................................................................................................... 31

5.10 General Purpose Log Command Set............................................................................................................................. 31

5.11 Native Command Queuing ................................................................................................................................................ 31

5.12 Software Settings Preservation ....................................................................................................................................... 31

6 Certifications and Declarations ............................................................................................................................ 32

7 References ................................................................................................................................................................ 33

Appendix A: IDENTIFY DEVICE Command Data ............................................................................................................... 34

October 2015 Product Specification 331342-005US 3

Intel® Solid State Drive DC S3610 Series

Figures

Figure 1: Intel SSD DC S3610 Series 2.5-inch Dimensions ................................................................................................................. 16

Figure 2: Intel® SSD DC S3610 Series 1.8-inch Dimensions ............................................................................................................... 17

Figure 3: Layout of 2.5-inch Form Factor Signal and Power Segment Pins ................................................................................ 18

Figure 4: Layout of 1.8-inch Form Factor Signal and Power Segment Pins ................................................................................ 18

Tables

Table 1: User Addressable Sectors ..................................................................................................................................................................... 7

Table 2: Random Read/Write Input/Output Operations Per Second (IOPS) .................................................................................. 7

Table 3: Random Read/Write IOPS Consistency .......................................................................................................................................... 8

Table 4: Sequential Read and Write Bandwidth ........................................................................................................................................... 8

Table 5: Latency........................................................................................................................................................................................................... 8

Table 6: Quality of Service 2.5-inch ................................................................................................................................................................... 9

Table 7: Quality of Service 1.8-inch ................................................................................................................................................................... 9

Table 8: Operating Voltage for 2.5-inch Form Factor ............................................................................................................................. 10

Table 9: Power Consumption for 2.5-inch Form Factor (5V Supply)............................................................................................... 10

Table 10: Power Consumption for 2.5-inch Form Factor (5V + 12V Supply) ................................................................................. 11

Table 11: Operating Voltage for 1.8-inch Form Factor ............................................................................................................................. 11

Table 12: Power Consumption for 1.8-inch Form Factor ........................................................................................................................ 12

Table 13: Temperature, Shock, Vibration........................................................................................................................................................ 13

Table 14: Product Regulatory Compliance Specifications ...................................................................................................................... 13

Table 15: Reliability Specifications ..................................................................................................................................................................... 14

Table 16: Serial ATA Connector Pin Signal Definitions—2.5-inch and 1.8-inch Form Factors .............................................. 19

Table 17: Serial ATA Power Pin Definitions—2.5-inch Form Factors ................................................................................................ 19

Table 18: Serial ATA Power Pin Definitions—1.8-inch Form Factors ................................................................................................ 20

Table 19: SMART Attributes .................................................................................................................................................................................. 23

Table 20: SMART Attribute Status Flags .......................................................................................................................................................... 26

Table 21: Serial ATA Power Pin Definitions—2.5-inch Form Factors ................................................................................................ 29

Table 22: Device Certifications and Declarations ........................................................................................................................................ 32

Table 23: Standards References .......................................................................................................................................................................... 33

Table 24: Returned Sector Data ........................................................................................................................................................................... 34

Product Specification October 2015 4 331342-005US

Term

Definition

ATA

Advanced Technology Attachment

DAS

Device Activity Signal

DMA

Direct Memory Access

ECC

Error Correction Code

EXT

Extended

FPDMA

First Party Direct Memory Access

Gigabyte. Note: The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND flash management and maintenance purposes.

Gigabit

HDD

Hard Disk Drive

HET

High Endurance Technology

Kilobyte

I/O

Input/Output

IOPS

Input/Output Operations Per Second

ISO

International Standards Organization

LBA

Logical Block Address

Megabyte (1,000,000 bytes)

MLC

Multi-level Cell

MTBF

Mean Time Between Failures

NCQ

Native Command Queuing

NOP

No Operation

Petabyte

PCB

Printed Circuit Board

PIO

Programmed Input/Output

RDT

Reliability Demonstration Test

RMS

Root Mean Square

SATA

Serial Advanced Technology Attachment

SCT

SMART Command Transport

SMART

Self-Monitoring, Analysis and Reporting Technology. This is an open standard for developing hard drives and software systems that automatically monitors the health of a drive and reports potential problems.

SSD

Solid State Drive

Terabyte

TYP

Typical

UBER

Uncorrectable Bit Error Rate

Intel® Solid State Drive DC S3610 Series

Terminology

October 2015 Product Specification 331342-005US 5

1 Overview

This document describes the specifications and capabilities of the Intel® SSD DC S3610 Series.

The Intel SSD DC S3610 Series delivers excellent performance and Quality of Service combined with high reliability for Serial Advanced Technology Attachment (SATA)-based computers in capacities of 100GB, 200GB, 400GB, 480GB, 800GB, 1.2TB and 1.6TB.

By combining 20nm Intel® NAND Flash Memory technology with SATA 6Gb/s interface support, the Intel SSD DC S3610 Series delivers Sequential Read speeds of up to 550 MB/s and Sequential Write speeds of up to 520 MB/s. The Intel SSD DC S3610 Series also delivers Random 4k Read speeds of up to 84,000 IOPS and Random 4K Write speeds of up to 28,000 IOPS, and Quality of Service of 500 µs for random 4KB reads measured at a queue depth of 1.

The industry-standard 2.5-inch and 1.8-inch form factors enable interchangeability with existing hard disk drives (HDDs) and native SATA HDD drop-in replacement with the enhanced performance, reliability, ruggedness, and power savings offered by an SSD.

Intel SSD DC S3610 Series offers these key features:

 Standard Endurance Technology  High I/O and throughput performance  Consistent I/O latency  Enhanced power-loss data protection  End-to-End data protection  Thermal throttling  Temperature Sensor  Inrush current management  Low power  High reliability  Temperature monitor and logging  Power loss protection capacitor self-test

Intel® Solid State Drive DC S3610 Series

Product Specification October 2015 6 331342-005US

Intel SSD DC S3610 Series

Unformatted Capacity

(Total User Addressable Sectors in LBA Mode)

100GB

195,371,568

200GB

390,721,968

400GB

781,422,768

480GB

937,703,088

800GB

1,562,824,368

1.2TB

2,344,225,968

1.6GB

3,125,627,568

Specification1

Unit

Intel SSD DC S3610 Series

100GB

(2.5”)

200GB

(2.5”/1.8”)

400GB

(2.5”/1.8”)

480GB

(2.5”)

800GB

(2.5”/1.8”)

1.2TB (2.5”)

1.6TB (2.5”)

Random 4KB Read (up to)2

IOPS

82,000

84,000/

70,000

84,000/

70,000

84,000

84,000/

70,000

84,000

Random 4KB Write (up to)

IOPS

6,500

12,000/

11,000

25,000/

22,000

28,000

28,000/

17,000

28,000

27,000

Random 8KB Read (up to)3

IOPS

45,000

52,000/

48,000

52,000/

47,000

52,000

52,000/

46,000

52,000

Random 8KB Write (up to)

IOPS

3,200

6,000/

5,500

12,000/

11,000

14,000

14,000/

9,000

15,000

14,000

Random 4KB 70/30 Read/Write (up to)2

IOPS

17,000

30,000/

28,000

46,000/

40,000

49,000

49,000/

37,000

51,000

50,000

Random 8KB 70/30 Read/Write (up to)3

IOPS

9,000

15,000/

14,000

25,000/

23,000

28,000

29,000/

21,000

30,000

29,000

Intel® Solid State Drive DC S3610 Series

2 Product Specifications

2.1 Capacity

Table 1: User Addressable Sectors

Notes:

1GB = 1,000,000,000 bytes; 1 sector = 512 bytes.

LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive.

The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND flash management and maintenance purposes.

2.2 Performance

Table 2: Random Read/Write Input/Output Operations Per Second (IOPS)

Notes:

1. Performance measured using IOMeter* with Queue Depth 32. Measurements are performed on a full Logical Block Address (LBA) span of the drive.

2. 4KB = 4,096 bytes

3. 8KB = 8,192 bytes

October 2015 Product Specification 331342-005US 7

Intel® Solid State Drive DC S3610 Series

Specification1

Unit

Intel SSD DC S3610 Series

100GB

(2.5”)

200GB

(2.5”/1.8”)

400GB

(2.5”/1.8”)

480GB

(2.5”)

800GB

(2.5”/1.8”)

1.2TB (2.5”)

1.6TB

(2.5”)

Random 4KB Read (up to)2

90/90

Random 4KB Write (up to)

90/90

90/85

Random 8KB Read (up to)3

90/90

Random 8KB Write (up to)

90/90

Specification

Unit

Intel SSD DC S3610 Series

100GB

(2.5”)

200GB

(2.5”/1.8”)

400GB

(2.5”/1.8”)

480GB

(2.5”)

800GB

(2.5”/1.8”)

1.2TB (2.5”)

1.6TB (2.5”)

Sequential Read (SATA 6Gb/s) 1

MB/s

410

550/500

550

550/500

550

Sequential Write (SATA 6Gb/s) 1

MB/s

110

230/220

400/370

450

520/380

500

Specification

Intel SSD DC S3610 Series

100GB/200GB/400GB/

480GB

800GB/1.2TB/

1.6TB

Latency1 (TYP)

Read

Write

Power On to Ready

55 µs

66 µs

5.0 s

55 µs

66 µs

7.0 s

Table 3: Random Read/Write IOPS Consistency

Notes:

1. Performance consistency measured using IOMeter* based on Random 4KB QD=32 workload, measured as the (IOPS in the 99.9th percentile

slowest 1-second interval) / (average IOPS during the test). Measurements are performed on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data rel iability

2. 4KB = 4,096 bytes

3. 8KB = 8,192 bytes

Table 4: Sequential Read and Write Bandwidth

Note:

1. Performance measured using IOMeter* with 128KB (131,072 bytes) of transfer size with Queue Depth 32.

Table 5: Latency

Notes:

1. Device measured using IOMeter*. Latency measured using 4KB (4,096 bytes) transfer size with Queue Depth equal to 1 on a sequential workload.

2. Power On To Ready time assumes proper shutdown. Time varies if shutdown is not preceded by STANDBY IMMEDIATE command. For 95% of the

time, the maximum time for power on to ready will be less than 15 seconds.

Product Specification October 2015 8 331342-005US

Specification

Unit

Intel 2.5-inch SSD DC S3610 Series

Queue Depth=1

Queue Depth=32

100GB/200GB/

400GB/480GB

800GB/1.2TB/

1.6TB

100GB/200GB/

400GB/480GB

800GB/1.2TB/

1.6TB

Quality of Service

1,2

(99.9%)

Reads

ms 2 5 5 5

Writes

ms 5 0.5

15/10/10/10

10/5/5

Quality of Service

1,2

(99.9999%)

Reads

Writes

20/30/30

Specification

Unit

Intel 1.8-inch SSD DC S3610 Series

Queue Depth=1

Queue Depth=32

200GB

400GB/800GB

200GB

400GB/800GB

Quality of Service

1,2

(99.9%)

Reads

0.2

0.2/2 5 5

Writes

ms 2 0.5/1

Quality of Service

1,2

(99.9999%)

Reads

5/10

Writes

20/30

Intel® Solid State Drive DC S3610 Series

Table 6: Quality of Service 2.5”

Table 7: Quality of Service 1.8"

Notes:

1. Device measured using IOMeter*. Quality of Service measured using 4KB (4,096 bytes) transfer size on a random workload on a full Logical Block

Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability.

2. Based on Random 4KB QD=1, 32 workloads, measured as the time taken for 99.9(or 99.9999) percentile of commands to finish the round-trip from

host to drive and back to host.

October 2015 Product Specification 331342-005US 9

2.3 Electrical Characteristics

Electrical Characteristics

Intel SSDDC S3610 Series

100GB, 200GB, 400GB, 480GB, 800GB, 1.2TB, 1.6TB

5V Operating Characteristics:

Operating Voltage range Inrush Current (Typical Peak) 1

5V (±5%)

1.2A for the first 1s

12V Operating Characteristics:

Operating Voltage range Inrush Current (Typical Peak) 1

12V (±10%)

1.2A for the first 1s

Specification

Unit

Intel SSD DC S3610 Series

100GB

200GB

400GB

480GB

800GB

1.2TB

1.6TB

Active Write - RMS Average1

3.3

4.7

5.3

6.3

6.4

6.8

Active Write - Burst2

2.0

3.6

5.7

6.6

8.7

10.0

10.7

Active Write - Max Burst3

4.8

4.9

7.4

9.0

11.3

11.6

12.2

Active Read - RMS Average4

3.3

2.6

2.7

2.9

3.0

3.3

Active Read - Burst5

2.5

1.4

4.5

4.3

4.5

4.9

5.7

Active Read – Max Burst6

4.5

4.3

5.6

5.3

6.2

5.9

6.5

Idle

0.53

0.54

0.57

0.61

0.63

0.62

Table 8: Operating Voltage for 2.5-inch Form Factor

Note: Measured from initial device power supply application.

Table 9: Power Consumption for 2.5-inch Form Factor (5V Supply)

Intel® Solid State Drive DC S3610 Series

Notes:

1. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. RMS (Root Mean Squared) Average Power is

measured using Agilent Power Analyzer over a 100 ms sample period with PLI capacitor charge enabled.

2. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. RMS (Root Mean Squared) Burst Power is

measured using Agilent Power Analyzer over a 500 µs sample period with PLI capacitor charge disabled.

3. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. RMS (Root Mean Squared) Max Burst power is

measured using Agilent Power Analyzer over a 500 µs sample period with PLI capacitor charge enabled. Pulse is 0.25% of total time.

4. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential reads. RMS (Root Mean Squared) average power is

measured using Agilent Power Analyzer over a 100 ms sample period with PLI capacitor charge enabled.

5. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential reads. RMS (Root Mean Squared) burst power is

measured using Agilent Power Analyzer over a 500 µs sample period with PLI capacitor charge disabled.

6. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential reads. RMS (Root Mean Squared) Max Burst power is

measured using Agilent Power Analyzer over a 500 µs sample period with PLI capacitor charge enabled. Pulse is approximately 0.25% of total time.

Product Specification October 2015 10 331342-005US

Specification1

Unit

Intel SSD DC S3610 Series

100GB

200GB

400GB

480GB

800GB

1.2TB

1.6TB

12V

Active Write - RMS Average1

2.6

1.2

1.6

2.0

1.8

3.2

1.9

3.6

2.1

4.5

2.1

4.1

2.3

4.5

Active Write - Burst2

2.0

1.3

2.1

2.2

2.4

4.2

2.5

5.1

2.3

7.1

2.9

7.8

3.0

8.2

Active Write - Max Burst3

4.0

1.3

3.4

2.2

3.9

4.1

4.5

5.0

4.5

7.8

4.7

7.7

4.5

8.2

Active Read - RMS Average4

2.8

0.9

1.8

0.9

1.9

0.9

1.9

0.9

2.0

0.9

2.2

1.0

2.3

1.7

Active Read - Burst5

1.9

1.0

2.0

1.4

2.3

2.0

2.4

2.0

2.4

3.6

2.8

4.1

3.0

1.7

Active Read – Max Burst6

3.9

0.9

3.3

1.4

3.6

2.0

4.4

2.1

4.4

2.1

4.3

2.5

4.5

5.4

Idle

0.5

0.1

0.54

0.01

0.57

0.01

0.58

0.01

0.61

0.01

0.63

0.01

0.62

0.01

Electrical Characteristics

Intel SSD DC S3610 Series

200GB, 400GB, 800GB

3.3V Operating Characteristics:

Operating Voltage range Inrush Current (Typical Peak) 1

3.3V (±5%)

1.5A for the first 1s

Intel® Solid State Drive DC S3610 Series

Table 10: Power Consumption for 2.5-inch Form Factor (5V + 12V Supply)