Intel SSDSC2BW480H601, SSDSC2BW480H6R5 User Manual

Intel® Solid-State Drive 535 Series (2.5-inch)
Power
Active (BAPCo MobileMark* 2007 Workload):
165 mW
Idle
3
: 55 mW
DevSleep: 5 mW
Temperature
Operating
4
: 0o C to 70o C
Non-Operating: -55
o
C to 95o C
Reliability
Uncorrectable Bit Error Rate (UBER):
<1 sector per 1016 bits read
Mean Time Between Failure (MTBF):
1.2 million hours
Shock
Operating and Non-Operating: 1,500 G/0.5 ms
Vibration
Operating: 2.17 GRMS (5-700Hz) Non-operating: 3.13 GRMS (5-800Hz)
Certifications and Declarations:
UL* CE* C-Tick* BSMI* KCC* Microsoft* WHCK VCCI* SATA-IO*
Product Ecological Compliance
RoHS*
Intel® Solid-State Drive 535 Series (2.5-inch)
Product Specification
NOTES:
1. Performance values vary by capacity.
2. Random 4KB writes measured using out-of-box SSD.
3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.
4. As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for maintaining proper
device operating temperatures on heavier workloads.
Order Number: 332062-003US
Ordering Information
Revision Number
Description
Revision Date
001
Initial release
April 2015
002
Updated Performance Rating in Table 4, 360GB Capacity Updated Endurance Rating in Table 10, from 20GB to 40GB
April 2015
003
Added 56GB Capacity
Sept 2015
Contact your local Intel sales representative for ordering information.
Revision History
Intel® Solid-State Drive 535 Series (2.5-inch)
Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase.
IOMeter* Test and System Configurations: Intel® Core™ i5-2400S (6MB L3 Cache, 2.5GHz), Intel Desktop Board DH67CF, Intel HD Graphics driver 9.17.10.2875, BIOS: BLH6710H.84A.0160.2012.1204.1156, Chipset: Intel INF 9.2.0.1016, Memory: 4GB (2X2GB) Kingston DDR3-1333, Intel RST driver 12.9, Microsoft Windows 7 Enterprise 64-bit with SP1.
For more complete information about performance and benchmark results, visit http://www.intel.com/performance
All documented endurance test results are obtained in compliance with JESD218 Standards; refer to individual sub-sections within this document for specific methodologies. See www.jedec.org for detailed definitions of JESD218 Standards.
Low Halogen applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.
Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2015 Intel Corporation. All rights reserved.
Product Specification September 2015 2 332062-003US
Intel® Solid-State Drive 535 Series (2.5-inch)
Contents
Revision History ......................................................................................................................... 2
1 Overview ...................................................................................................................... 5
1.1 Terms and Acronyms ........................................................................................................ 6
1.2 Reference Documents ....................................................................................................... 7
2 Product Specifications ..................................................................................................... 8
2.1 Capacity ........................................................................................................................ 8
2.2 Performance .................................................................................................................. 8
2.3 Electrical Characteristics .................................................................................................... 9
2.4 Environmental Conditions ................................................................................................. 10
2.4.1 Temperature, Shock, Vibration ......................................................................... 10
2.4.2 Altitude .......................................................................................................... 10
2.5 Product Regulatory Compliance ......................................................................................... 11
2.6 Reliability ..................................................................................................................... 12
2.7 Hot Plug Support............................................................................................................ 12
3 Mechanical Information .................................................................................................. 13
4 Pin and Signal Descriptions ............................................................................................. 14
4.1 Pin Locations ................................................................................................................ 14
4.2 Signal Descriptions ......................................................................................................... 14
4.2.1 Connector Pin Signal Definitions ............................................................................ 14
4.2.2 Power Pin Signal Definitions ................................................................................. 15
4.3 Device Sleep Feature ....................................................................................................... 15
5 Supported Command and Feature Sets .............................................................................. 16
5.1 Supported ATA General Feature Command Set ....................................................................... 16
5.2 Advanced Power Management (APM) ................................................................................... 19
5.3 Security ....................................................................................................................... 19
5.3.1 Sanitization Methods .......................................................................................... 19
5.4 Device Statistics ............................................................................................................. 19
5.5 Software Settings Preservation ........................................................................................... 20
5.6 DevSleep ..................................................................................................................... 21
5.7 SMART Command Transport ............................................................................................. 21
5.8 SMART Attributes ........................................................................................................... 22
5.9 SMART Logs.................................................................................................................. 24
6 Certifications and Declarations ........................................................................................ 26
7 Appendix .................................................................................................................... 27
7.1 Identify Device ............................................................................................................... 27
7.2 Models ........................................................................................................................ 31
September 2015 Product Specification 332062-003US 3
Intel® Solid-State Drive 535 Series (2.5-inch)
Tables
Table 1: Glossary of Terms and Acronyms ............................................................................ 6
Table 2: Standard References ........................................................................................... 7
Table 3: User Addressable Sectors ..................................................................................... 8
Table 4: Compressible Performance ................................................................................... 8
Table 5: Incompressible Performance ................................................................................. 8
Table 6: Latency........................................................................................................... 9
Table 7: Operating Voltage and Power Consumption ............................................................... 9
Table 8: Temperature, Shock, Vibration .............................................................................. 10
Table 9: Product Regulatory Compliance Specifications .......................................................... 11
Table 10: Reliability Specifications ...................................................................................... 12
Table 11: Serial ATA Connector Pin Definitions....................................................................... 14
Table 12: Serial ATA Power Pin Definitions ............................................................................ 15
Table 13: Supported ATA Commands and Feature Sets ............................................................ 16
Table 14: APM Subcommand Codes for Power Management and Definitions .................................. 19
Table 15: APM Subcommand Codes for Thermal Power Management and Definitions ....................... 19
Table 16: Supported Secure Erase Modes and Definitions ......................................................... 19
Table 17: Supported Sanitize Device Modes and Definitions ...................................................... 19
Table 18: Device Statistics Log ........................................................................................... 20
Table 19: Preserved Software Settings ................................................................................. 20
Table 20: DevSleep Control Parameters ............................................................................... 21
Table 21: SMART Attributes .............................................................................................. 22
Table 22: SMART Attribute Status Flags ............................................................................... 24
Table 23: Device Certifications and Declarations ..................................................................... 26
Table 24: Identify Device Returned Sector Data ...................................................................... 27
Table 25: Available Models ............................................................................................... 31
Figures
Figure 1: Dimensions for Full Size 2.5-inch Drives ................................................................... 13
Figure 2: Layout of Signal and Power Segment Pins ................................................................ 14
Product Specification September 2015 4 332062-003US
Intel® Solid-State Drive 535 Series (2.5-inch)
1 Overview
The Intel® Solid-State Drive 535 Series is the next generation of Intel Solid-State Drive Consumer Family which continue to deliver reliable performance and low power consumption with high quality. The Intel SSD 535 Series is built for a wide range of consumer and embedded platforms. Along with a variety of capacities, the Intel SSD 535 Series offers:
High I/O and Throughput Performance Low Power Consumption High Reliability Advanced Encryption Standard (AES) 256-bit Encryption End-to-End Data Protection Data Compression
The Intel SSD 535 Series is aligned with the latest version of the Intel® SSD Toolbox for monitoring and maintaining the health of the SSD. To find the latest version of Intel SSD Toolbox, and for more information on the Intel SSD 535 Series, visit www.intel.com/ssd and click on the Consumer Family or Resource Center links.
September 2015 Product Specification 332062-003US 5
1.1 Terms and Acronyms
Term
Description
AHCI*
Advanced Host Controller Interface
APM
Advanced Power Management
ATA
Advanced Technology Attachment
DAS
Device Activity Signal
DevSleep
Device Sleep
DIPM
Device Initiated Power Management
DMA
Direct Memory Access
DPTF
Dynamic Platform Thermal Framework
eDrive
Microsoft* specification for a drive that complies to the TCG Opal 2.0 and IEEE 1667* standards
EXT
Extended
FPDMA
First Party Direct Memory Access
GB
Gigabyte (1,000,000,000 bytes) Note: The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND flash management and maintenance purposes.
HDD
Hard Disk Drive
HIPM
Host Initiated Power Management
I/O
Input/Output
IOPS
Input/Output Operations Per Second
KB
Kilobyte (1,024 bytes)
LBA
Logical Block Address
LPM
Link Power Management
MB
Megabyte (1,000,000 bytes)
MLC
Multi-level Cell
MTBF
Mean Time Between Failures
NCQ
Native Command Queuing
NOP
No Operation
PIO
Programmed Input/Output
PSID
Physical Security ID, public drive-unique value
RDT
Reliability Demonstration Test
RMS
Root Mean Squared
SATA
Serial Advanced Technology Attachment
SED
Self-Encrypting Drive
SMART
Self-Monitoring, Analysis and Reporting Technology
SSD
Solid-State Drive
TYP
Typical
UBER
Uncorrectable Bit Error Rate
Table 1: Glossary of Terms and Acronyms
Intel® Solid-State Drive 535 Series (2.5-inch)
Product Specification September 2015 6 332062-003US
Date or Rev. #
Title
Location
May 2005
SFF-8201, 2.5-inch drive form factor
http://www.sffcommittee.org/
May 2006
SFF-8223, 2.5-inch Drive w/Serial Attachment Connector
http://www.sffcommittee.org/
Sept 2008
IEC 55022 Information Technology Equipment Radio disturbance Characteristics Limits and methods of measurement CISPR22:2008 (Modified)
http://www.iec.ch/ Dec 2008
VCCI
http://www.vcci.jp/vcci_e/
June 2009
RoHS
http://qdms.intel.com/ Click Search MDDS Database and search for material description datasheet
August 2010
IEC 55024 Information Technology Equipment Immunity characteristics Limits and methods of measurement CISPR24:2010
http://www.iec.ch/ Sept 2010
Solid-State Drive (SSD) Requirements and Endurance Test Method (JESD218)
http://www.jedec.org/standards­documents/docs/jesd218/
August 2013
Serial ATA Revision 3.2
http://www.sata-io.org/ October 2013
ACS-3 Specification
http://www.t13.org/
Intel® Solid-State Drive 535 Series (2.5-inch)
1.2 Reference Documents
Table 2: Standard References
September 2015 Product Specification 332062-003US 7
2 Product Specifications
Capacity
Unformatted Capacity (Total User Addressable Sectors in LBA mode)
56GB
109,417,392
120GB
234,441,648
180GB
351,651,888
240GB
468,862,128
360GB
703,282,608
480GB
937,703,088
Capacity
Specification
Random
4KB Read
(up to)1
Random
4KB Write
(up to)2
Random
4KB Write
(TYP)1
Sequential
128KB Read1
Sequential
128KB Write1
IOPS
IOPS
IOPS
MB/s
MB/s
56GB
12,000
80,000
23,000
540
480
120GB
24,000
80,000
37,500
540
480
180GB
41,000
80,000
49,000
540
490
240GB
41,000
80,000
49,000
540
490
360GB
45,000
33,000
29,500
540
490
480GB
48,000
37,000
31,000
540
490
Capacity
Specification
Random
4KB Read
(up to)1
Random
4KB Write
(up to)1
Sequential
128KB Read1
Sequential
128KB Write1
IOPS
IOPS
MB/s
MB/s
56GB
13,000
2,000
400
100
120GB
18,000
15,000
450
130
180GB
37,500
17,000
470
170
240GB
37,500
23,000
510
230
360GB
37,500
10,000
525
240
480GB
37,500
13,000
540
300
2.1 Capacity
Table 3: User Addressable Sectors
2.2 Performance
Table 4: Compressible Performance
Intel® Solid-State Drive 535 Series (2.5-inch)
Note:
1. Performance measured by Intel using IOMeter* with Queue Depth 32. Measurements are performed on 8 GB of
Logical Block Address (LBA) range on a full SSD.
2. Random 4 KB writes measured using out-of-box SSD.
Table 5: Incompressible Performance
Note:
1. Performance measured by Intel using IOMeter* with Queue Depth 32
Product Specification September 2015 8 332062-003US
Specification
Intel SSD 535 Series (All Capacities)
Read
1
80 µs (TYP)
85 µs (TYP)
500 ms (TYP)
<10 s
Write
1
Power On To Ready
2
Max Power On To Ready
3
Electrical Characteristics
Value
56GB
120GB
180GB
240GB
360GB
480GB
Operating Voltage for 5 V (±5%)
Min
Max
Rise Time (Max/Min)
Fall Time (Max/Min)
Noise Tolerance
Min Off Time1
4.75 V
5.25 V
100 ms / 0.1 ms
5 s / 1 ms
100 mV pp (10 Hz – 30 MHz)
1 s
Power Consumption (TYP)
Active2
Idle3
DevSleep4
165 mW
55 mW
5 mW
Thermal Power5
2.1 W
3.1 W
3.7 W
4.5 W
4.5 W
4.5 W
Regulator Power6
2.5 W
3.4 W
4.0 W
4.9 W
5.5 W
5.8 W
Intel® Solid-State Drive 535 Series (2.5-inch)
Table 6: Latency
Note:
1. Based on sequential 4KB using IOMeter with Queue Depth 1 workload with compressible (non-random) data
pattern. Write Cache enabled.
2. Power On To Ready time assumes safe shutdown
3. Max Power On To Ready time assumes unsafe shutdown. Based on statistical measurement of 95% quality of
service.
2.3 Electrical Characteristics
Table 7: Operating Voltage and Power Consumption
NOTES:
1. Minimum time from when power removed from drive (Vcc < 100 mV) to when power can be reapplied to drive.
2. Active power measured during execution of MobileMark* 2007 with SATA Link Power Management (LPM) enabled.
3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.
4. Power consumption during DevSleep state.
5. Power measured during 128kB sequential writes with Queue Depth 32 workload using 100 ms sample period. This
represents power that would be thermal load on system during heavy workloads.
6. Power measured during 128kB sequential writes with Queue Depth 32 workload using 500 us sample period. This
represents power that system power supply would have to regulate for proper device operation.
September 2015 Product Specification 332062-003US 9
2.4 Environmental Conditions
Electrical Characteristics
Range
Case Temperature
Operating
Non-operating1
0° C – 70° C
-55° C – 95° C
Temperature Gradient2
Operating
Non-operating
30 (TYP)° C/hr
30 (TYP)° C/hr
Humidity
Operating
Non-operating
5 – 95 %
5 – 95 %
Shock and Vibration
Range
Shock3
Operating
Non-operating
1,500 G (Max) at 0.5 msec
1,500 G (Max) at 0.5 msec
Vibration4
Operating
Non-operating
2.17 GRMS (5-700 Hz) Max
3.13 RMS (5-800 Hz) Max
2.4.1 Temperature, Shock, Vibration
Table 8: Temperature, Shock, Vibration
Intel® Solid-State Drive 535 Series (2.5-inch)
NOTES:
1. Please contact your Intel representative for details on the non-operating temperature range.
2. Temperature gradient measured without condensation.
3. Shock specifications assume SSD is mounted securely with the input vibration applied to the drive-mounting
screws. Stimulus may be applied in the X, Y or Z axis. Shock specification is measured using peak acceleration and pulse width value.
4. Vibration specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting
screws. Stimulus may be applied in the X, Y or Z axis. Vibration specification is measured using G Root Mean Squared (GRMS) value.
2.4.2 Altitude
The drive is not sensitive to changes in atmospheric pressure because it has no moving parts. Drive tested under non-operational conditions to pressures representative of -1 K and +40 K feet.
Product Specification September 2015 10 332062-003US
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