Intel SSDSC2BW120A401, SSDSC2BW480A401, SSDSCKGW180A401, SSDSC2BW240A4K5, SSDSC2BW180A401 User Manual

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Intel® Solid-State Drive 530 Series (2.5-inch)

Product Specification

 Capacities: 80 GB, 120 GB, 180 GB, 240 GB,

360 GB, 480 GB

 Components:

− Intel

20 nm NAND Flash Memory

− Multi-Level Cell (MLC)

 Form Factors: 2.5-inch  Thickness: 7 mm  Weight: Up to 78 grams

 SATA 6Gb/s Bandwidth Performance

(Iometer* Queue Depth 32)

− Sustained Sequential Read: up to 540 MB/s

− Sustained Sequential Write: up to 490

MB/s

 Read and W rite IOPS

(Iometer Queue Depth 32)

− Random 4 KB Reads: up to 41,000 IOPS

− Random 4 KB Writes: up to 80,000 IOPS

 Latency (average sequential)

− Read: 80 µs (TYP)

− Write: 85 µs (TYP)

 Data Compression  AES 256-bit Encryption  End-to-End Data Protection  Compatibility

− Intel

SSD Toolbox with Intel® SSD

Optimizer

− Intel

Data Migration Software

Rapid Storage Te c hnology

− SATA Revision 3.0

− ACS-2 (ATA/ATAPI Command Set 2)

− SSD Enhanced SMART ATA feature set

 Power Management

− 5.0 V SATA Supply Rail

− SATA Link Power Management (LPM)

− Device Sleep (DevSleep)

 Power

− Active (BAPCo MobileMark* 2007

Workload): 195 mW

− Idle

: 125 mW

− DevSleep: 5 mW

 Temperature

− Operating

: 0o C to 70o C

− Non-Operating: -55

 Reliability

— Uncorrectable Bit Error Rate (UBER):

<1 sector per 10

— Mean Time Between Failure (MTBF):

1,200,000 hours

— Shock (operating and non-operating):

1,500 G/0.5 msec

 Vibration

— Operating: 2.17 G — Non-operating: 3.13 G

 Certifications and Declarations:

− UL*

− CE*

− C-Tick*

− BSMI*

− KCC*

− Microsoft* WHCK

− VCCI*

− SATA-IO*

 Product Ecological Compliance

− RoHS*

C to 95

bits read

(5-700 Hz)

RMS

(5-800 Hz)

NOTES:

1. Performance values vary by capacity.

2. Random 4 KB writes measured using out-of-box SSD.

3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.

4. As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for maintaining proper device ope r a ting tempe r a tur es on heavier workloads.

October 2013 Product Specification Order Number: 329212-003US 1

Intel® Solid-State Drive 530 Series (2.5-inch)

Ordering Information

Contact your local Intel sales repres e ntative for ordering information.

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Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained

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Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2013 Intel Corporation. All rights reserved.

Product Specification October 2013 2 Order Number: 329212-003US

Intel® Solid-State Drive 530 Series (2.5-inch)

Contents

Revision Histor y .................................................................................................................... 4

1 Introduction ............................................................................................................... 5

1.1 Terminology ................................................................................................................. 6

1.2 Reference Documents .................................................................................................... 7

2 Product Specifications ................................................................................................ 8

2.1 Capacity ...................................................................................................................... 8

2.2 Performance ................................................................................................................. 8

2.3 Electrical Char a cteristics ................................................................................................ 9

2.4 Environmenta l Conditions ............................................................................................. 10

2.4.1 Temperature, Shock, Vibration ........................................................................ 10

2.4.2 Altitude ......................................................................................................... 10

2.5 Product Regulatory Complianc e ..................................................................................... 11

2.6 Reliability ................................................................................................................... 12

2.7 Hot Plug Support ......................................................................................................... 12

3 Mechanical Inf ormation ........................................................................................... 13

4 Pin and Signal Descriptions ...................................................................................... 14

4.1 Pin Locations .............................................................................................................. 14

4.2 Signal Descriptions ...................................................................................................... 14

4.2.1 Connector Pin Signal Def initions ....................................................................... 14

4.2.2 Power Pin Signal Definitions ............................................................................ 15

4.3 Device Sleep Feature ................................................................................................... 15

5 Supported Command Sets ........................................................................................ 16

5.1 ATA General Feature C ommand Set ............................................................................... 16

5.2 Power Management ..................................................................................................... 17

5.3 Security Mode Feature Set ........................................................................................... 17

5.4 SMART Command Set .................................................................................................. 18

5.4.1 SMART Attributes ........................................................................................... 18

5.4.2 SMART Logs .................................................................................................. 21

5.5 Device Statistics ......................................................................................................... 21

5.6 SMART Command Transport ......................................................................................... 22

5.7 Data Set Management Comma nd Set ............................................................................ 22

5.8 Host Protected Area Comm a nd Set ................................................................................ 22

5.9 48-Bit Address Command Set ....................................................................................... 22

5.10 General Purpose Log Comma nd Set ............................................................................... 22

5.11 Native Command Queuing ............................................................................................ 23

5.12 Software Settings Preservation ..................................................................................... 23

5.13 SATA Link Power Management (LPM) ............................................................................. 23

6 Certifications and Declarations ................................................................................ 24

7 Appendix .................................................................................................................. 25

October 2013 Product Specification Order Number: 329212-003US 3

Revision History

Document

Number

Revision

Number

Intel® Solid-State Drive 530 Series (2.5-inch)

Description Revision Date

329212 001US 329212 002US 329212 003US

Initial release Added 120 GB capacity Added 80 GB, 360 GB, and 480 GB capacities

July 2013

September 2013

October 2013

Product Specification October 2013 4 Order Number: 329212-003US

Intel® Solid-State Drive 530 Series (2.5-inch)

1 Introduction

This document describes the specifications and c a p abilities of the In tel® Solid-State Drive 530 Ser ies (Intel® SSD 530 Series).

The Intel SSD 530 Series delivers th e next generation storage solution with new low power features designed for Ultrabook™. The next generation Intel SSD continues to provide high performance expected for Serial Adva nced Technology Attachment (SATA)-based computers.

The industry-standard 2.5-inch form factor enables interchan g ea b ility with existing hard disk drive s (HDDs) and native SATA HDD drop-in replacement with the enhanced performance, reliability, and ruggedness offered by an SS D.

The latest featur e addition is the DevSleep function a lity, a low power drive s ta te controlled by th e host via the DevSleep pin. The drive w ill con s ume a mere 5 mW while in this state.

As compared to standard SATA HDDs, Intel SSD 530 Series offers these key features:

• High I/O and throughput performance

• Low power consumption

• Increased system responsiveness

• High reliability

• Enhanced ruggedness

The Intel SSD 530 Series also offers additional key features such as:

• Advanced Encryption Standard (AES) 256-bit Encryption AES 256-bit encryption is a n industry standa r d in data security, providing a hardware -based

mechanism for encryption and decryption of user data. Utilizing a 256-bit en cryption key, AES encryption—when combined with an ATA drive password—helps protect user data.

• End-to-End Data Protection End-to-end data protection helps protec t data from being corrupted acr oss the data path by using

cyclic redundancy check (CRC), parity, and error correction code (ECC) checks in the data path from the host interfac e to the NAND, and back .

• Data Compression Data compression helps improve performance and endurance by automatically compressing

information sen t to the SSD so that less data has to be processed and stored on the NAND. The amount of data that can be compressed d epends on the type of data.

October 2013 Product Specification Order Number: 329212-003US 5

1.1 Terminology

ATA

Advanced Technology Attachment

DAS

Device Activity Signal

DevSleep

Device Sleep, a new addition to the SATA specificatio n

DIPM

Device Initiated Power Management

DMA

Direct Memory Access

EXT

Extended

FPDMA

First Party Direct Memory Access

Gigabyte (1,000,000,000 bytes)

management and maintenance purpose s .

HDD

Hard Disk Dri ve

HIPM

Host Initiated Power Management

I/O

Input/Output

IOPS

Input/Output Operations Per Second

Kilobyte (1,024 bytes)

LBA

Logical Block Address

LPM

Link Power Management

Megabyte (1,000,000 bytes)

MLC

Multi-level Cell

MTBF

Mean Time Between Failures

NCQ

Native Command Queuing

NOP

No Operation

RDT

Reliability Demonstration Te s t

RMS

Root Mean Squared

SATA

Serial Advanced Technology Attachment

SMART

Self-Monitoring, Analysis and Reporting Technology

SSD

Solid-State Drive

TYP

Typical

UBER

Uncorrectable Bit Error Rate

Table 1: Terminology

Term Description

Intel® Solid-State Drive 530 Series (2.5-inch)

PIO Programmed Input/Output

Note: The total usable capacity of the SSD may be less than the total physi c al capacity because a small portion of the capacity is used for NAND flash

Product Specification October 2013 6 Order Number: 329212-003US

May 2005

SFF-8201, 2.5-inch drive form factor

http://www.sffcommittee.org/

May 2006

SFF-8223, 2.5-inch Drive w/Serial Attachment

http://www.sffcommittee.org/

IEC 55022 Information Technology Equip m e nt —

Dec 2008

VCCI

http://www.vcci.jp/vcci_e/

http://qdms.intel.com/

June 2009

Serial ATA Revision 3.0

http://www.sata-io.org/

IEC 55024 Information Technology Equipment — Solid-State Drive (SSD) Requirements and

http://www.jedec.org/standards-

Intel® Solid-State Drive 530 Series (2.5-inch)

1.2 Reference Documents

Table 2: Standard R e ferences

Date or Rev. # Title Location

Connector

Sept 2008

June 2009 RoHS

August 2009 ACS-2 Specification http://www.t13.org/

August 2010

Sept 2010

Radio disturbance Characteristics— Limits and methods of measurement CISPR22:2008 (Modified)

Immunity characteristics— Limits and methods of measurement CISPR24:2010

Endurance Test Method (JESD218)

http://www.iec.ch/

Click Search MDDS Database and search for material description datashee t

http://www.iec.ch/

documents/docs/jesd218/

October 2013 Product Specification Order Number: 329212-003US 7

Intel® Solid-State Drive 530 Series (2.5-inch)

80 GB

156,301,488

120 GB

234,441,648

180 GB

351,651,888

240 GB

468,862,128

360 GB

703,282,608

480 GB

937,703,088

Capacity

Random

(up to)1

Random

(up to)2

Random

(TYP)1

IOPS

MB/s

80 GB

24,000

80,000

33,000

540

480

120 GB

24,000

80,000

37,500

540

480

180 GB

41,000

80,000

49,000

540

490

240 GB

41,000

80,000

49,000

540

490

360 GB

45,000

80,000

33,000

540

490

480 GB

48,000

80,000

33,000

540

490

Capacity

Specification

Random

(up to)1

Random

(up to)1

IOPS

MB/s

80 GB

20,500

13,000

430

100

120 GB

18,000

15,000

450

130

180 GB

37,500

17,000

470

170

240 GB

37,500

23,000

510

230

360 GB

37,500

10,000

525

240

480 GB

37,500

13,000

540

300

2 Product Specifications

2.1 Capacity

Table 3: User Addre ssable Sectors

Capacity Unformatted Capacity (Total User Addressable Sect ors in LBA mode)

2.2 Performance

Table 4: Compressible Performance

Specification

4 KB Read

Note:

1. Performance measured using Iometer* with Q ue ue Depth 32. Measurements are performed on 8 GB of Logical Block Address (LBA) range on a full SSD

2. Random 4 KB writes measured using out-of-box SSD.

4 KB Write

Sequential

128 KB Read

128 KB Write1

Table 5: Incompressible Performance

4 KB Read

4 KB Write

Sequential

128 KB Read

Sequential

128 KB Write1

Sequential

Note:

1. Performance measured using Iometer* with Q ue ue Depth 32

Product Specification October 2013 8 Order Number: 329212-003US

80 µs (TYP)

Write1

Power On To Ready2

Operating Voltage for 5 V (±5%)

Min Off Time1

1 s

Power Consumption (TYP)

DevSleep4

5 mW

Thermal Power5

2.8 W

3.1 W

3.7 W

4.5 W

Regulator Power6

3.4 W

4.0 W

4.9 W

5.0 W

Intel® Solid-State Drive 530 Series (2.5-inch)

Table 6: Latency

Specification Intel® SSD 530 Series

80 GB 120 GB 180 GB 240 GB 360 GB 480 GB

85 µs (TYP)

1 s (TYP)

Note:

1. Based on sequential 4 KB using Iometer with Queue Depth 1 workload with compr e s s ible (non-random) data pattern. Write Cache enabled.

2. Power On To Ready time assumes proper shutdown

2.3 Electrical Characteristics

Table 7: Operating Voltage and Power Consumption

Electrical Characteristics Value

80 GB 120 GB 180 GB 240 GB 360 GB 480 GB

Min Max Rise Time (Max/Min) Fall Time (Max/Min) Noise Tolerance

Active2 Idle

Note:

1. Minimum time from when power removed from drive (Vcc < 100 mV) to when powe r can be reapplied to drive.

2. Active power measured during executio n of Mobile Mark * 20 07 with SA TA Link Powe r Manageme nt (LPM) enabled.

3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.

4. Power consumption during DevSleep state.

5. Power measured during 128 KB sequential writes with Queue Dep th 32 work lo ad us ing 100 ms sample period. This represents power that would be thermal load on system during heavy workloads.

6. Power measured during 128 KB sequential writes with Queue Dep th 32 work lo ad us ing 500 µs sample period. This represents power that system powe r supp ly would hav e to regulate fo r proper device operation.

100 mV pp (10 Hz – 30 MHz)

4.75 V

5.25 V

100 ms / 0.1 ms

5 s / 1 ms

195 mW 125 mW

October 2013 Product Specification Order Number: 329212-003US 9

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