Intel SSDSC2BF360H501 User Manual

Intel® Solid-State Drive Pro 2500 Series (2.5-inch)

Capacities: 120GB, 180GB, 240GB, 360GB, 480GB

Form Factors: 2.5-inch

Thickness: 7 mm

Weight: Up to 78 grams

SATA 6Gb/s Bandwidth Performance

(Iometer* Queue Depth 32)

 Sustained Sequential Read: up to 540MB/s  Sustained Sequential Write: up to 490MB/s

Read and Write IOPS

(Iometer Queue Depth 32)

 Random 4KB Reads: up to 48,000 IOPS  Random 4KB Writes: up to 80,000 IOPS

Data Compression

End-to-End Data Protection

Intel

Stable Image Platform Program (SIPP)

Security and Manageability Compatibility

 Intel

Core™ vPro™ Processor

 Intel

Setup and Configuration Software

(Intel® SCS)

 AES 256-bit Encryption  Trusted Computing Group* (TCG*) Opal Security

Subsystem Class (SSC) Specification Version 2.0 features

 Windows eDrive*

Additional Compatibility

 Intel

SSD Toolbox with Intel® SSD Optimizer

 Intel

Data Migration Software

 Intel

Rapid Storage Technology

 SATA Revision 3.2  ACS-3 (ATA/ATAPI Command Set 3)  SSD Enhanced SMART ATA feature set  Intel

Dynamic Platform Thermal Framework

(Intel® DPTF)

Power Management

 5.0 V SATA Supply Rail  SATA Link Power Management (LPM)  Advanced Power Management (APM)  Device Sleep (DevSleep)

Power

 Active (BAPCo MobileMark* 2007 Workload):

165 mW

 Idle

: 55 mW

 DevSleep: 5 mW

Temperature

 Operating

: 0o C to 70o C

 Non-Operating: -55

C to 95o C

Reliability

— Uncorrectable Bit Error Rate (UBER):

<1 sector per 1016 bits read

— Mean Time Between Failure (MTBF):

1.2 million hours

— Shock (operating and non-operating):

1,500 G/0.5 ms

Vibration

— Operating: 2.17 G

RMS

(5-700Hz)

— Non-operating: 3.13 G

RMS

(5-800Hz)

Certifications and Declarations:

 UL*  CE*  C-Tick*  BSMI*  KCC*  Microsoft* WHCK  VCCI*  SATA-IO*

Product Ecological Compliance

 RoHS*

Intel® Solid-State Drive Pro 2500 Series (2.5-inch)

Product Specification

NOTES:

1. Performance values vary by capacity.

2. Random 4KB writes measured using out-of-box SSD.

3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.

4. As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for maintaining proper

device operating temperatures on heavier workloads.

Order Number: 330711-001US

Ordering Information

Contact your local Intel sales representative for ordering information.

Intel® Solid-State Drive Pro 2500 Series (2.5-inch)

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Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to cha nge without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

This document contains information on products in the design phase of development.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800548-4725, or go to: http://www.intel.com/design/literature.html

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No computer system can provide absolute security under all conditions. Built-in security features available on select Intel® Solid State Drives may require additional software, hardware, services and/or an Internet connection. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. Consult your system manufacturer for more details.

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*Other names and brands may be claimed as the property of others.

Product Specification July 2014 2 330711-001US

Intel® Solid-State Drive Pro 2500 Series (2.5-inch)

Contents

1 Introduction ................................................................................................................................................................... 5

1.1 Revision History ........................................................................................................................................................................................... 6

1.2 Terminology .................................................................................................................................................................................................. 6

1.3 Reference Documents ............................................................................................................................................................................... 7

2 Product Specifications ................................................................................................................................................. 8

2.1 Capacity ........................................................................................................................................................................................................... 8

2.2 Performance .................................................................................................................................................................................................. 8

2.3 Electrical Characteristics .......................................................................................................................................................................... 9

2.4 Environmental Conditions ................................................................................................................................................................... 10

2.5 Product Regulatory Compliance ....................................................................................................................................................... 11

2.6 Reliability ...................................................................................................................................................................................................... 12

2.7 Hot Plug Support ...................................................................................................................................................................................... 12

3 Mechanical Information ............................................................................................................................................ 13

4 Pin and Signal Descriptions...................................................................................................................................... 14

4.1 Pin Locations .............................................................................................................................................................................................. 14

4.2 Signal Descriptions .................................................................................................................................................................................. 14

4.2.1 Connector Pin Signal Definitions ................................................................................................................................ 14

4.2.2 Power Pin Signal Definitions ......................................................................................................................................... 15

4.3 Device Sleep Feature .............................................................................................................................................................................. 15

5 Supported Command and Feature Sets ................................................................................................................. 16

5.1 Supported ATA General Feature Command Set........................................................................................................................ 16

5.2 Advanced Power Management (APM) ............................................................................................................................................ 19

5.3 Security ......................................................................................................................................................................................................... 19

5.3.1 Sanitization Methods ........................................................................................................................................................ 19

5.3.2 TCG* Opal SSC Support .................................................................................................................................................. 20

5.3.3 Windows eDrive* ................................................................................................................................................................ 20

5.4 Device Statistics ........................................................................................................................................................................................ 20

5.5 Software Settings Preservation ......................................................................................................................................................... 21

5.6 DevSleep ...................................................................................................................................................................................................... 22

5.7 SMART Command Transport .............................................................................................................................................................. 22

5.8 SMART Attributes ..................................................................................................................................................................................... 23

5.9 SMART Logs ................................................................................................................................................................................................ 25

6 Certifications and Declarations ............................................................................................................................... 26

7 Appendix ...................................................................................................................................................................... 27

7.1 Identify Device ........................................................................................................................................................................................... 27

7.2 Models ........................................................................................................................................................................................................... 31

July 2014 Product Specification 330711-001US 3

Intel® Solid-State Drive Pro 2500 Series (2.5-inch)

Tables

Table 1: Terminology ............................................................................................................................................................................. 6

Table 2: Standard References ........................................................................................................................................................... 7

Table 3: User Addressable Sectors ................................................................................................................................................. 8

Table 4: Compressible Performance .............................................................................................................................................. 8

Table 5: Incompressible Performance ........................................................................................................................................... 8

Table 6: Latency ....................................................................................................................................................................................... 9

Table 7: Operating Voltage and Power Consumption ........................................................................................................... 9

Table 8: Temperature, Shock, Vibration .................................................................................................................................... 10

Table 9: Product Regulatory Compliance Specifications ................................................................................................... 11

Table 10: Reliability Specifications ................................................................................................................................................. 12

Table 11: Serial ATA Connector Pin Definitions ....................................................................................................................... 14

Table 12: Serial ATA Power Pin Definitions ................................................................................................................................ 15

Table 13: Supported ATA Commands and Feature Sets ...................................................................................................... 16

Table 14: APM Subcommand Codes for Power Management and Definitions .......................................................... 19

Table 15: APM Subcommand Codes for Thermal Power Management and Definitions ....................................... 19

Table 16: Supported Secure Erase Modes and Definitions ................................................................................................. 19

Table 17: Supported Sanitize Device Modes and Definitions ............................................................................................ 19

Table 18: ID Device Changes with Opal Activation .................................................................................................................. 20

Table 19: Device Statistics Log ......................................................................................................................................................... 21

Table 20: Preserved Software Settings ......................................................................................................................................... 21

Table 21: DevSleep Control Parameters ...................................................................................................................................... 22

Table 22: SMART Attributes ............................................................................................................................................................... 23

Table 23: SMART Attribute Status Flags ...................................................................................................................................... 25

Table 24: Device Certifications and Declarations ..................................................................................................................... 26

Table 25: Identify Device Returned Sector Data ....................................................................................................................... 27

Table 26: Available Models ................................................................................................................................................................ 31

Figures

Figure 1: Dimensions for Full Size 2.5-inch Drives ................................................................................................................. 13

Figure 2: Layout of Signal and Power Segment Pins ............................................................................................................. 14

Product Specification July 2014 4 330711-001US

Intel® Solid-State Drive Pro 2500 Series (2.5-inch)

1 Introduction

This document describes the specifications and capabilities of the Intel® Solid-State Drive Pro 2500 Series (Intel® SSD Pro 2500 Series).

The Intel SSD Pro 2500 Series delivers the next generation of Professional storage solution with enhanced security and manageability features, power-efficient performance, and lower total cost of ownership. The latest generation of the Intel® SSD Professional Family supports Trusted Computing Group* (TCG*) Opal version 2.0 features and is Microsoft eDrive* capable, although “off” is the eDrive factory default out-of-box setting. The industry-standard thin 7mm 2.5-inch form factor is interchangeable with existing SATA hard disk drives (HDDs). In addition, Intel’s proven reliability and low power consumption provide an enhanced mobile experience.

Intel SSD Pro 2500 Series also offers the following additional key features:

 Security and Manageability Features

Intel SSD Pro 2500 Series is a hardware-based self-encrypting drive (SED) enhanced with Opal 2.0* security features. The TCG Opal specification describes a secure boot capability (pre-boot authentication), protection for user data, and administrative capabilities, improving security of critical data at rest. Manageability options are expanded when the Intel SSD Pro 2500 Series is coupled with the latest Intel® Core™ vPro™ processor systems and software such as Intel® Set-up & Configuration Service (Intel® SCS) with the Intel® SSD Pro Plug-in. Offering unique manageability options, IT Administrators can proactively manage the Intel® Solid-State Drive Professional Family and reduce deployment costs while keeping their PCs running smoothly.

 Quality and Reliability Capabilities

Quality and reliability are the cornerstones of Intel® SSD Products and the Intel SSD Pro 2500 is no different. Limiting employee down-time is critical; the reliability of the Intel SSD Pro 2500 Series is key for Low Total Cost of Ownership (TCO).

 Power-Efficient Performance

The new advanced low power modes enable longer battery life and greater mobility. In addition, the Intel SSD Pro 2500 Series provides higher performance throughput for the most demanding workloads.

 Stability

Intel SSD Pro 2500 Series is part of the Intel® Stable Image Platform Program (Intel® SIPP). Intel SIPP aligns key Intel platform components, enabling a predictable transition from one technology generation to the next with minimal compatibility issues. Enhancing software and hardware stability, Intel SIPP aligns with key Intel platform components and drivers and is currently available for at least 15 months post platform Intel SIPP availability.

 Tools

Intel SSD Pro 2500 Series is aligned with the latest version of the Intel® SSD Toolbox for consumers and the Intel® SSD Pro Administrator Tool for business and IT professionals. Intel tools provide key capabilities to maximize your Intel SSD experience. (Visit www.intel.com/ssd to access the Tools panel for download.)

July 2014 Product Specification 330711-001US 5

1.1 Revision History

Revision Number

Description

Revision Date

001

Initial release

July 2014

Term

Description

AHCI*

Advanced Host Controller Interface

APM

Advanced Power Management

ATA

Advanced Technology Attachment

DAS

Device Activity Signal

DevSleep

Device Sleep

DIPM

Device Initiated Power Management

DMA

Direct Memory Access

DPTF

Dynamic Platform Thermal Framework

eDrive

Microsoft* specification for a drive that complies to the TCG Opal 2.0 and IEEE 1667* standards

EXT

Extended

FPDMA

First Party Direct Memory Access

Gigabyte (1,000,000,000 bytes) Note: The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND flash management and maintenance purposes.

HDD

Hard Disk Drive

HIPM

Host Initiated Power Management

I/O

Input/Output

IOPS

Input/Output Operations Per Second

Kilobyte (1,024 bytes)

LBA

Logical Block Address

Locking SP

Locking Security Provider

LPM

Link Power Management

Megabyte (1,000,000 bytes)

MLC

Multi-level Cell

MTBF

Mean Time Between Failures

NCQ

Native Command Queuing

NOP

No Operation

1.2 Terminology

Table 1: Terminology

Intel® Solid-State Drive Pro 2500 Series (2.5-inch)

Product Specification July 2014 6 330711-001US

Term

Description

Opal

A Trusted Computing Group (TCG) standard that defines an interface for managing a Self-Encrypting Drive (SED).

PIO

Programmed Input/Output

PSID

Physical Security ID, public drive-unique value

RDT

Reliability Demonstration Test

RMS

Root Mean Squared

SATA

Serial Advanced Technology Attachment

SED

Self-Encrypting Drive

SMART

Self-Monitoring, Analysis and Reporting Technology

SSD

Solid-State Drive

TCG

Trusted Computing Group

TYP

Typical

UBER

Uncorrectable Bit Error Rate

Date or Rev. #

Title

Location

May 2005

SFF-8201, 2.5-inch drive form factor

http://www.sffcommittee.org/

May 2006

SFF-8223, 2.5-inch Drive w/Serial Attachment Connector

http://www.sffcommittee.org/

Sept 2008

IEC 55022 Information Technology Equipment — Radio disturbance Characteristics— Limits and methods of measurement CISPR22:2008 (Modified)

http://www.iec.ch/ Dec 2008

VCCI

http://www.vcci.jp/vcci_e/

June 2009

RoHS

http://qdms.intel.com/ Click Search MDDS Database and search for material description datasheet

August 2010

IEC 55024 Information Technology Equipment — Immunity characteristics— Limits and methods of measurement CISPR24:2010

http://www.iec.ch/ Sept 2010

Solid-State Drive (SSD) Requirements and Endurance Test Method (JESD218)

http://www.jedec.org/standardsdocuments/docs/jesd218/

February 2012

TCG Opal Specification Version 2.0 rev 1.0

http://www.trustedcomputinggroup.com/

August 2013

Serial ATA Revision 3.2

http://www.sata-io.org/ October 2013

ACS-3 Specification

http://www.t13.org/

Intel® Solid-State Drive Pro 2500 Series (2.5-inch)

1.3 Reference Documents

Table 2: Standard References

July 2014 Product Specification 330711-001US 7

Intel® Solid-State Drive Pro 2500 Series (2.5-inch)

Capacity

Unformatted Capacity (Total User Addressable Sectors in LBA mode)

120GB

234,441,648

180GB

351,651,888

240GB

468,862,128

360GB

703,282,608

480GB

937,703,088

Capacity

Specification

Random

4KB Read

(up to)1

Random

4KB Write

(up to)2

Random

4KB Write

(TYP)1

Sequential

128KB Read1

Sequential

128KB Write1

IOPS

MB/s

120GB

24,000

80,000

37,500

540

480

180GB

41,000

80,000

49,000

540

490

240GB

41,000

80,000

49,000

540

490

360GB

45,000

33,000

28,500

540

490

480GB

48,000

37,000

31,000

540

490

Capacity

Specification

Random

4KB Read

(up to)1

Random

4KB Write

(up to)1

Sequential

128KB Read1

Sequential

128KB Write1

IOPS

MB/s

120GB

18,000

15,000

450

120

180GB

37,500

17,000

455

165

240GB

37,500

23,000

510

225

360GB

37,500

10,000

525

230

480GB

37,500

13,000

540

275

2 Product Specifications

2.1 Capacity

Table 3: User Addressable Sectors

2.2 Performance

Table 4: Compressible Performance

Note:

1. Performance measured using Iometer* with Queue Depth 32. Measurements are performed on 8 GB of Logical Block

Address (LBA) range on a full SSD.

2. Random 4 KB writes measured using out-of-box SSD.

Table 5: Incompressible Performance

Note:

1. Performance measured using Iometer* with Queue Depth 32

Product Specification July 2014 8 330711-001US

Specification

Intel® SSD Pro 2500 Series

120GB

180GB

240GB

360GB

480GB

80 µs (TYP)

85 µs (TYP)

500 ms (TYP)

<10 s

Write1

Power On To Ready2

Max Power On To Ready3

Electrical Characteristics

Value

120GB

180GB

240GB

360GB

480GB

Operating Voltage for 5 V (±5%) Min Max Rise Time (Max/Min) Fall Time (Max/Min) Noise Tolerance Min Off Time1

4.75 V

5.25 V

100 ms / 0.1 ms

5 s / 1 ms

100 mV pp (10 Hz – 30 MHz)

1 s

Power Consumption (TYP) Active2 Idle3 DevSleep4

165 mW

55 mW

5 mW

Thermal Power5

3.1 W

3.7 W

4.5 W

Regulator Power6

3.4 W

4.0 W

4.9 W

5.5 W

5.8 W

Intel® Solid-State Drive Pro 2500 Series (2.5-inch)

Table 6: Latency

Note:

1. Based on sequential 4KB using Iometer with Queue Depth 1 workload with compressible (non-random) data

pattern. Write Cache enabled.

2. Power On To Ready time assumes safe shutdown

3. Max Power On To Ready time assumes unsafe shutdown. Based on statistical measurement of 95% quality of

service.

2.3 Electrical Characteristics

Table 7: Operating Voltage and Power Consumption

NOTES:

1. Minimum time from when power removed from drive (Vcc < 100 mV) to when power can be reapplied to drive.

2. Active power measured during execution of MobileMark* 2007 with SATA Link Power Management (LPM) enabled.

3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.

4. Power consumption during DevSleep state.

5. Power measured during 128kB sequential writes with Queue Depth 32 workload using 100 ms sample period. This

6. Power measured during 128kB sequential writes with Queue Depth 32 workload using 500 us sample period. This

July 2014 Product Specification 330711-001US 9

represents power that would be thermal load on system during heavy workloads.

represents power that system power supply would have to regulate for proper device operation.

2.4 Environmental Conditions

Electrical Characteristics

Range

Case Temperature Operating Non-operating1

0° C – 70° C

-55° C – 95° C

Temperature Gradient2 Operating Non-operating

30 (TYP)° C/hr 30 (TYP)° C/hr

Humidity Operating Non-operating

5 – 95 % 5 – 95 %

Shock and Vibration

Range

Shock3 Operating Non-operating

1,500 G (Max) at 0.5 msec 1,500 G (Max) at 0.5 msec

Vibration4 Operating Non-operating

2.17 GRMS (5-700 Hz) Max

3.13 RMS (5-800 Hz) Max

2.4.1 Temperature, Shock, Vibration

Table 8: Temperature, Shock, Vibration

Intel® Solid-State Drive Pro 2500 Series (2.5-inch)

NOTES:

1. Please contact your Intel representative for details on the non-operating temperature range.

2. Temperature gradient measured without condensation.

3. Shock specifications assume SSD is mounted securely with the input vibration applied to the drive-mounting

screws. Stimulus may be applied in the X, Y or Z axis. Shock specification is measured using peak acceleration and pulse width value.

4. Vibration specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting

screws. Stimulus may be applied in the X, Y or Z axis. Vibration specification is measured using G Root Mean Squared (GRMS) value.

2.4.2 Altitude

The drive is not sensitive to changes in atmospheric pressure because it has no moving parts. Drive tested under non-operational conditions to pressures representative of -1 K and +40 K feet.

Product Specification July 2014 10 330711-001US

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