Intel SSDSC2BB160G401, SSDSC2BB120G401, SSDSC2BB800G401, SSDSC2BB480G401 User manual

Intel

Solid-State Drive DC S3500 Series

Product Specification

 Capacity:

− 2.5-inch: 80/120/160/240/300/480/600/800 GB

− 1.8-inch: 80/240/400/800 GB

 Components:

− Intel

20nm NAND Flash Memory

− Multi-Level Cell (MLC)

 Form Factor: 2.5–inch and 1.8-inch  Read and Write IOPS

1,2

(Full LBA Range,

Iometer* Queue Depth 32)

− Random 4KB3 Reads: Up to 75,000 IOPS

− Random 4KB Writes: Up to 11,500 IOPS

− Random 8KB

− Random 8KB Writes: Up to 5,500 IOPS

 Bandwidth Performance

− Sustained Sequential Read: Up to 500 MB/s4

− Sustained Sequential Write: Up to 450 MB/s

 Latency (average sequential)

− Read: 50 µs (TYP)

− Write: 65 µs (TYP)

 Quality of Service

− Read/Write: 500 µs / 5 ms (99.9%)

 AES 256-bit Encryption  Compliance

− SATA Revisi o n 3.0; comp a tib le with SAT A 6Gb/s, 3Gb/s and 1.5Gb/s interface rates

− ATA9-ACS2; includes SCT (Smart Command Transport) and device statistics log s upport

− Enhanced SMART ATA feature set

− Native Comma nd Queuing (NCQ ) com mand set

− Data set manage ment Tr im command

 Compatibility

− Windows* 7 and Windows* 8

− Windows* Server 2012

− Windows* Server 2008 Enterprise 32/64bit SP2

− Windows* Server 2008 R2 SP1

− Windows* Server 2003 Enterpris e R2 6 4b it S P2

− Red Ha t * Enterprise Linux* 5.5, 5.6, 6.1, 6.3

− SUSE* Linux* Enterprise Server 10, 11 SP1

− CentOS* 64bit 5.7, 6.3

− Intel

 Product Ecological Compliance

− RoHS*

1. Performance values vary by capacity and form factor

2. Performance specifications apply to both compressible and incompressible data

3. 4KB = 4,096 bytes ; 8KB = 8,192 bytes

MB/s = 1,000,000 bytes/second.

Based on Random 4KB QD=1 workload, measured as the time taken for 99.9 percentile of commands to finish the round-trip from host to drive and back to host

Measurement taken once the workload has reached steady state but including all background activities required for normal operation and data reliability

Defaults to 12V, if both 12V and 5V are present

Based on 5V su pply

9. Please contact your Intel repre sen tative for details on the non-operating t emperatu re range

10.

Based on JESD218 standard

Order Number: 328860-004US

Reads: Up to 47,500 IOPS

5, 6

SSD Toolbox with Intel® SSD Optimizer

 Power Management

− 2.5 inch: 5 V or 12 V SATA Supply Rail7

− 1.8 inch: 3.3 V SATA Supply Rail

− SATA Interfac e Powe r Manag ement

− OS-aware hot plug/removal

− Enhanced power-loss data protection

 Power

− Active: Up to 5.0 W (TYP)

− Idle: 650 mW

 Weight:

− 2.5-inch 80-240GB: 70 grams ± 2 grams

− 2.5-inch 300-800GB: 72 grams ± 2 grams

− 1.8-inch 80GB: 35 grams ± 2 grams

− 1.8-inch 240-800GB: 37 grams ± 2 grams

 Temperature

− Operating: 0° C to 70° C

− Non-Operating

: -55° C to 95° C

− Temperatur e mo nitor ing a nd logg ing

− Thermal throttling

 Shock (operating and non-operating):

1,000 G/0.5 msec

 Vibration

− Operating: 2.17 G

− Non-Operating

 Altitude (simulated)

RMS

: 3.13 G

(5-700 Hz)

(5-800 Hz)

RMS

− Operating: -1,000 to 10,000ft

− Non-Operating

 Reliability

− Uncorre c table B it Error Rate (UBER ):

− 1 sector per 10

: -1,000 to 40, 00 0ft

bits read

− Mean Time Betwee n Failures (MTBF): 2,000,000 hours

− End-to-End data protection

 Endurance Rating

− 80GB: 45 TBW – 120GB: 70 TBW

− 160GB: 100 TBW – 240GB: 140 TBW

− 300GB: 170 TBW – 400GB: 225 TBW

− 480GB: 275 TBW – 600GB: 330 TBW

− 800GB: 450 TBW

 Certifications and Declarations

− UL*, CE*, C-Tick*, BSMI*, KCC*, Microsoft* WHCK*,

VCCI*, SATA-IO

Intel® Solid-State Drive DC S3500 Serie s

Ordering Information

Contact your local Intel sales representative for order ing information.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABIL IT Y WH AT SOE VER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, REL AT ING T O SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHO ULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIF Y AND HOL D INTE L AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AF F I L IATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLE SS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPL I CAT I ON, WHE T HE R OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or inst ructions marked "reserved" or " undefined." Intel rese rve s these for future definiti on an d sh all have no responsibility wh atsoever for conflicts or incompat ibili ties ar ising fr om futur e c hanges to t hem. T he infor matio n here is subjec t to change w itho ut not ice. Do not f ina lize a des ign w ith th is information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local I nt el s ales office or your distri but or to obtain the latest specifications and before pla cing your product order. Copies of documents which have an order number and are referenced in this document, or other Inte l literatur e, ma y be o btained by c alling 1-800-548-4725,

or go to: http://www.intel.com/design/literature.htm Low Halogen applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased

components on the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame re tardants and/or PVC may not be be tter for the environment.

Intel and the Intel log o are trademarks of Intel Corporat ion in the U.S. and other coun tries. *Other names and brand s may be claimed as the property of ot hers. Copyright © 2013 Intel Corporation. All rights reserved.

Product Specification March 2014 2 328860-004

Intel® Solid-State Drive DC S3500 Se r ie s

Contents

Revision History ..............................................................................................................................4

Terms and Acronyms .......................................................................................................................4

1.0 Overview .............................................................................................................................5

2.0 Product Specifications ..........................................................................................................6

2.1 Capacity ............................................................................................................................... 6

2.2 Performance ........................................................................................................................ 6

2.3 Electrical Characteristics ..................................................................................................... 8

2.4 Environmental Conditions ................................................................................................. 11

2.5 Product Regulatory Compliance ........................................................................................ 11

2.6 Reliability ........................................................................................................................... 12

2.7 Temperature Sensor .......................................................................................................... 13

2.8 Power Loss Capacitor Test ................................................................................................ 13

2.9 Hot Plug Support ............................................................................................................... 13

3.0 Mechanical Information ..................................................................................................... 14

4.0 Pin and Signal Descriptions ................................................................................................. 16

4.1 2.5-inch Form Factor Pin Locations ................................................................................... 16

4.2 1.8-inch Form Factor Pin Locations ................................................................................... 16

4.3 Connector Pin Signal Definitions ....................................................................................... 17

4.4 Power Pin Signal Definitions ............................................................................................. 17

5.0 Supported Command Sets .................................................................................................. 19

5.1 ATA General Feature Command Set ................................................................................. 19

5.2 Power Management Command Set .................................................................................. 19

5.3 Security Mode Feature Set ................................................................................................ 19

5.4 SMART Command Set ....................................................................................................... 20

5.5 Device Statistics ................................................................................................................. 25

5.6 SMART Command Transport (SCT).................................................................................... 26

5.7 Data Set Management Command Set ............................................................................... 26

5.8 Host Protected Area Command Set .................................................................................. 26

5.9 48-Bit Address Command Set............................................................................................ 27

5.10 General Purpose Log Command Set.................................................................................. 27

5.11 Native Command Queuing ................................................................................................ 27

5.12 Software Settings Preservation ......................................................................................... 27

6.0 Certifications and Declarations ........................................................................................... 28

7.0 References ......................................................................................................................... 28

Appendix A: IDENTIFY DEVICE Command Data ............................................................................... 29

December 2013 Product Specification 328860-002US 3

Revision History

Date

Revision

Description

April 2013

001

1. Random write IOPS consistency changes from 75% to 80%

3. Added X,Y, Z dimension in section 3.0

1. Updated Section 5.4.2 Timed Workload Endurance Indicators with user notes

3. Updated Table 23

1. Page 1: Compliance, Changed from ATA8-ACS2 to ATA9-ACS2

3. Table 23: Corrected Error in Default Value for Words 60-62

Term

Definition

ATA

Advanced Technology Attachment

CRC

Cyclic Redundancy Check

DAS

Device Activity Signal

DMA

Direct Memory Access

ECC

Error Correction Code

EXT

Extended

FPDMA

First Party Direct Memory Access

Gigabyte portion of the capacity is used for NAND flash management and maintenance purposes.

Gigabit

HDD

Hard Disk Drive

HET

High Endurance Technology

Kilobyte

I/O

Input/Output

IOPS

Input/Output Operations Per Second

ISO

International Standards Organization

LBA

Logical Block Address

Megabyte (1,000,000 bytes)

MLC

Multi-level Cell

MTBF

Mean Time Between Failures

NCQ

Native Command Queuing

NOP

No Operation

Petabyte

PCB

Printed Circuit Board

PIO

Programmed Input/Output

RDT

Reliability Demonstration Test

RMS

Root Mean Square

SATA

Serial Advanced Technology Attachment

SCT

SMART Command Transport

Self-Monitoring, Analysis and Reporting Technology health of a drive and reports potential problems.

SSD

Solid-State Drive

Terabyte

TYP

Typical

Intel® Solid-State Drive DC S3500 Series

Initial release.

June 2013 002

December 2013 003

March 2014 004

2. Added read power in table 8, 9 and 11

2. Updated Table 6 notes

2. Table 18: Changed SMART Attribute E9h, PW and Threshold values from 0 to 1.

Terms and Acronyms

Note: The total usable capacity of the SSD may be less than the total physical capacity because a small

SMART

UBER Uncorrectable Bit Error Rate

An open standard for developing hard drives and software systems that automatically monitors the

Product Specification March 2014 4 328860-004

Intel® Solid-State Drive DC S3500 Series

1.0 Overview

This document describes the specifications and capabilities of the

Intel

SSD DC S3500 Series.

The Intel SSD DC S3500 Series delivers leading per formance and Quality of Service combined with world-class reliability for Serial Advanced Technology Attachment (SATA)-based computers in nine capacities: 80GB, 120GB, 160GB, 240GB, 300GB, 400GB, 480GB, 600GB and 800GB.

By combining 20nm Intel support, the Intel 500MB/s and sequential write speeds of up to 450MB/s. Intel SSD DC S3500 Series delivers Quality of Service of 500 us for random 4KB reads meas ured at a queue depth of 1.

The industry-standard 2.5-inch and 1.8-inch form fac tors enable interchangeabil ity with existing hard disk drives (HDDs) and native SATA HDD drop-in replacement with the enhanced performan c e, r eliability, ruggedness, and power s a vings offered by an SSD.

Intel SSD DC S3500 Series offers these key features:

• Standard Endurance Technology

• High I/O and throughput performance

• Consistent I/O latency

• Enhanced power-loss data protecti on

• End-to-End data protection

• Thermal throttling

• Temperature Sensor

• Inrush current management

• Low power

• High reliability

• Enhanced ruggedness

• Temperature monitor and loggin g

• Power loss protection capacitor self -test

SSD DC S3500 Series delivers sequential read speeds of up to

NAND Flash Memory technology with SATA 6Gb/s interface

March 2014 Product Specification 328860-004 5

Intel® Solid-State Drive DC S3500 Series

Table 1. User Addressable Secto rs

Unformatted Capacity

(Total User Addressable Sectors in LBA Mode)

80GB

156,301,488

120GB

234,441,648

160GB

312,581,808

240GB

468,862,128

300GB

586,072,368

400GB

781,422,768

480GB

937,703,088

600GB

1,172,123,568

800GB

1,562,824,368

Table 2.

Random Read/W rite Input/Output Opera t ions Per Second (IOPS)

Intel SSD DC S3500 Series

80GB

1.8”)

240GB

1.8”)

800GB

1.8”)

Random 4KB Read (up to)2

IOPS

70,000

75,000

Random 4KB Write (up to)

IOPS

7,000

4,600

7,500

9,000

11,000

11,500

Random 8KB Read (up to)3

IOPS

39,000

47,000

47,500

Random 8KB Write (up to)

IOPS

3,700

2,300

3,800

4,400

5,500

2.0 Product Specifications

2.1 Capacity

Intel® SSD DC S3500 Series

Notes: 1GB = 1,000,000,000 bytes; 1 sector = 512 bytes.

LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive. The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is

used for NAND flash management and maintenance purposes.

2.2 Performance

Specification1 Unit

Notes: 1. Performance measured using Iomet er* wi t h Queue Dep t h 3 2 . Mea s u rements are performed on a full Logical Block

Address (LBA) span of the drive.

2. 4KB = 4,096 bytes

3. 8KB = 8,192 bytes

4. Performance consist en cy measured using Iometer* based on Random 4KB QD=32 workload, measured as the (IOPS in the 99.9th percentile slowest 1-second interval)/(avera g e IOP S d uring t h e test). Measurements are performed on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability

(2.5/

120GB 160GB

(2.5”/

300GB

400GB

(1.8”)

480

/600GB

(2.5”/

Product Specification March 2014 6 328860-004

Table 3. Random Read/W rite IOPS Consistency

Intel® SSD DC S3500 Series

80GB

1.8”)

240GB

1.8”)

800GB

1.8”)

Random 4 KB Read (up to)2

Random 4 KB Write (up to)

Random 8 KB Read (up to)3

Random 8 KB W rite (up to)

Notes: 1. Performance measured using Iomet er* wi t h Queue Dep t h 3 2 . Mea s u rements are performed on a full Logical Block

second interval)/( average IOPS d uring the tes t). Meas urements are perf orm ed on a

Table 4. Sequential Rea d a nd Write Bandwidth

Intel SSD DC S3500 Series

80GB

1.8”)

240GB

1.8”)

480

800GB

1.8”)

6Gb/s)1

Table 5. Latency

Intel SSD DC S3500 Series

80GB (2.5/1.8”), 120GB, 160GB, 240GB (2.5”/1.8”),

300GB, 400GB (1.8”), 480GB, 600GB

Intel® Solid-State Drive DC S3500 Series

Specification4 Unit

Address (LBA) span of the drive.

2. 4 KB = 4,096 bytes

3. 8 KB = 8,192 bytes

4. Performance consistency measured using Iometer* based on Random 4KB QD=32 workload, measured as the (IOPS in the 99.9th p ercen til e sl owes t 1full Logical Block Address (LBA) span of the drive once the workload has reached steady state, including all background activities required for normal operation and data reliability

Specification Unit

Sequential Read (SATA

(2.5/

MB/s 340 445 475 500 500 500 500 500

120GB 160GB

(2.5”/

300GB

400GB

(1.8”)

400GB

(1.8”)

480 /

600 GB

/600

(2.5”/

Seque ntial Wr i t e (SATA

Notes: 1. Performance measured using Iometer* with 128 KB (131,072 bytes) of transfer size with Queue Depth 32.

Specification

Latency1 (TYP)

Read Write Power On to Ready

MB/s 100 135 175 260 315 380 410 450

800GB (2.5”/1.8”)

50 µs 65 µs

2.0 s

March 2014 Product Specification 328860-004 7

50 µs 65 µs

3.0 s

Intel® Solid-State Drive DC S3500 Series

Table 6. Quality of Service

Intel® SSD DC S3500 Series

Queue Depth=1

Queue Depth=32

80/120/160/

240GB

300/400/480/

600/800GB

80/120/160/

240GB

300/400/480/

600/800GB

Quality of Service

(99.9%)

Reads

0.5

0.5 2 2

Writes

ms 5 2

Quality of Service

(99.9999%)

Reads

10 5 10

Writes

Table 7. Operating Voltage for 2.5-inch Form Fa c tor

Intel SSDDC S3500 Series

80GB, 120GB, 160GB, 240GB, 300GB, 480GB, 60 0G B, 800GB

Inrush Current (Typical Peak) 1

1.0 A, < 1 s

Inrush Current (Typical Peak) 1

1.0 A, < 1 s

Specification Unit

3, 4

3,4

Notes:

1. Device measured using Iometer. Latency measured using 4KB (4,096 bytes) transfer size with Queue Depth equal to 1 on a sequential workload.

2. Power On To Ready time assumes proper shutdown. Time v aries if shutdow n is not preceded by STANDBY IMMEDI ATE command. For 95% of the time, the maximum time fo r pow er on t o ready will be less than 10 seconds.

3. Device measured using Iometer. Quality of Service m easured using 4KB (4,096 bytes) transfer size on a random workload on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability.

4. Based on Random 4KB QD=1, 32 workloads, measured as the time taken for 99.9(or 99.9999) percentile of commands to finish the round-trip from host to drive and back to host.

2.3 Electrical Characteristics

Electrical Characteristics

5 V Operating Characteristics:

Operating Voltage range Rise time (Max/Min) Fall time (Min) Noise level

Min Off time

500 mV pp 10 Hz – 100 KHz

50 mV pp 100 KHz – 20 MHz

12 V Operating Characteristics:

Operating Voltage range Rise time (Max/Min) Fall time (Min) Noise level

Min Off time

Notes:

1000 mV pp 10 Hz – 100 KHz

100 mV pp 100 KHz – 20 MHz 500 ms

1. Measured from initial device power supply application.

2 Fall time needs to be equal or better than minimum in order to guarantee full functionali ty of enhanced power loss management. 3 The drive needs to be powered off for at least 500msec before powering on.

5 V (±5%)

1 s / 1 ms

1 ms

500 ms

12 V (±10%)

1 s / 1 ms

1 ms

Product Specification March 2014 8 328860-004

Intel® SSD DC S3500 Series

80GB

120GB

160GB

240GB

300GB

480GB

600GB

800GB

Active Write - RMS Average 1

1.8

2.0

2.3

2.9

3.5

4.3

4.5

5.0

Active Write - RMS Burst 2

2.0

2.4

2.7

3.2

3.9

5.2

5.5

7.3

Active Read - RMS Average 3

1.5

1.6

Active Read - RMS Burst 4

1.8

2.2

2.5

2.8

3.0

3.3

3.4

3.5

Idle

Intel SSD DC S3500 Series

80GB

120GB

160GB

240GB

300GB

480GB

600GB

800GB

Active Write - RMS Average1

Active Write - RMS Burst2

2.2

2.5

2.8

3.4

4.2

5.5

6.8

7.8

Active Read - RMS Average3

1.6

1.7

1.8

Active Read - RMS Burst4

2.1

2.3

2.6

3.2

3.6

6.4

Idle

0.8

0.9

Intel® Solid-State Drive DC S3500 Series

Table 8. Power Consumption for 2.5-inch Form Factor (5V Suppl y )

Specification Unit

0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6

Notes:

1. The workload equates 128KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) average power is measured using scope trig g er ov er a 100 ms sam ple period.

2. The workload equates 128KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) burst power is measured using scope tri gger ov er a 5 0 0 us sample period.

3. The workload equates 128KB (131,072 bytes) Queue Depth equal to 32 sequential reads. Root Mean Squared (RMS) average power is measured using scope trigger over a 100 ms sample period.

4. The workload equates 128KB (131,072 bytes) Queue Depth equal to 32 sequential reads. Root Mean Squared (RMS) burst power is measured using scope tri gger ov er a 5 0 0 us sample period.

Table 9. Power Consumption f or 2.5-inch Form Factor (12V Supply)

Specification1 Unit

2.0 2.3 2.5 3.1 3.5 4.3 4.5 5.0

Notes:

1. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) average power is measured using scope trig g er ov er a 100 ms sam ple period.

2. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) burst power is measured using scope trigger over a 500 us sample period.

3. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential reads. Root Mean Squared (RMS) average power is measured using scope trig g er ov er a 100 ms sam ple period.

4. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential reads. Root Mean Squared (RMS) burst power is measured using scope tri gger ov er a 5 0 0 us sample period.

March 2014 Product Specification 328860-004 9

Table 10. Operating Vol tage and Power Cons umption for 1.8-inch Form Facto r

Electrical Characteristics

Intel® SSD DC S3500 Series

80GB

240GB

400GB

800GB

500 ms

Inrush Current (Typical Peak) 1

1.2 A, < 1 s

Intel SSD DC S3500 Series

80GB

240GB

400GB

800GB

Active Write - RMS Average @ 3.3V

2.0

3.5

4.5

5.2

Active Write - RMS Burst @ 3.3V

2.2

3.8

5.0

7.5

Active Read - RMS Average @ 3.3V

1.3

1.4

Active Read - RMS Burst @ 3.3V

1.8

2.6

3.0

Idle @ 3.3V

0.6

Intel® Solid-State Drive DC S3500 Series

Operating Voltage for 3.3 V (±5%) Min Max Rise time (Max/Min) Fall time (Min) Noise level

Min Off time

Notes:

1. Measured from initial device power supply application.

2. F all time n eeds to be equal or better than mi nimum in order to guarantee full functionalit y of enhanced power loss management.

3. The drive needs to be powered off fo r at least 5 0 0msec before powering on.

300 mV pp 10 Hz – 100 KHz

500 mV pp 100 KHz – 20 MHz

3.13 V

3.47 V

1 s / 1 ms

1 ms

Table 11. Power Consumption for 1.8-inch Form Factor

Specification1 Unit

Notes:

1. The workload equates 128 KB (131,072 bytes) Queue Dep th equ al to 32 sequenti al writes . Root Mean Squared (RMS) power

is measured using scope tri gger ov er a 1 0 0 ms sample period.

Product Specification March 2014 10 328860-004

+ 21 hidden pages