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Intel

Solid-State Drive DC S3500 Series

Product Specification

 Capacity:

− 2.5-inch: 80/120/160/240/300/480/600/800 GB

− 1.8-inch: 80/240/400/800 GB

 Components:

− Intel

20nm NAND Flash Memory

− Multi-Level Cell (MLC)

 Form Factor: 2.5–inch and 1.8-inch  Read and Write IOPS

1,2

(Full LBA Range,

Iometer* Queue Depth 32)

− Random 4 KB3 Reads: Up to 75,000 IOPS

− Random 4 KB Writes: U p to 11,500 IOPS

− Random 8 KB

− Random 8 KB Writes: U p to 5,500 IOPS

 Bandwidth Performance

− Sustained Sequential Read: Up to 500 MB/s4

− Sustained Sequential Write: Up to 450 MB/s

 Latency (average sequential)

− Read: 50 µs (TYP)

− Write: 65 µs (TYP)

 Quality of Service

− Read/Write: 500 µs / 5 ms (99.9%)

 AES 256-bit Encryption  Compliance

− SATA Revisi o n 3.0; comp a tib le with SATA 6Gb/s, 3Gb/s and 1.5Gb/s interface rates

− ATA8-ACS2; includes SCT (Smart Command Transport) and device statistics log s upport

− Enhanced SMART ATA feature set

− Native Comma nd Queuing (NCQ ) comm and set

− Data set management Trim command

 Compatibility

− Windows 7 and Windows 8

− Windo ws Server 2012

− Windo ws Server 2008 Enterprise 32/64bit SP2

− Windows Server 2008 R2 SP1

− Windo ws Server 2003 Enterprise R2 64bit SP2

− Red Hat Enterpr ise Linux* 5.5, 5.6, 6.1, 6.3

− SUSE* Linux Enter pr is e Serv er 10, 11 SP1

− CentOS 64bit 5.7, 6.3

− Intel

 Product Ecological Compliance

SSD Toolbox with Intel® SSD Optimizer

− RoHS*

1. Performance values vary by capacity and form factor

2. Performance specifications apply to both compressible and incompressible data

3. 4 KB = 4,096 bytes ; 8 KB = 8,192 bytes

MB/s = 1,000,000 bytes/second.

Based on Random 4KB QD=1 workload, measured as the time taken for 99.9 percentile of commands to finish the round-trip from host to drive and back to host

Measurement taken once the workload has reached steady state but including all background activities required for normal operation and data reliability

Defaults to 12V, if both 12V and 5V are present

Based on 5V su pply

9. Please contact your Inte l representativ e f or details on the n on-operati n g t emperature range

10.

Based on JESD218 standard

December 2013 Order Number: 328860-003US

Reads: Up to 47,500 IOPS

5, 6

 Power Management

− 2.5 inch: 5 V or 12 V SATA Supply Rail7

− 1.8 inch: 3.3 V SATA Supply Rail

− SATA Interfac e Power Management

− OS-aware hot plug/removal

− Enhanced power-loss data protection

 Power

− Active: Up to 5.0 W (TYP)

− Idle: 650 mW

 Weight:

− 2.5-inch 80-240 GB: 70 grams ± 2 grams

− 2.5-inch 300-800 GB: 72 grams ± 2 grams

− 1.8-inch 80 GB: 35 grams ± 2 grams

− 1.8-inch 240-800 GB: 37 grams ± 2 grams

 Temperature

− Operating: 0° C to 70° C

− Non-Operating

: -55° C to 95° C

− Temperatur e mo nitor ing and logging

− Thermal throttling

 Shock (operating and non-operating):

1,000 G/0.5 msec

 Vibration

− Operating: 2.17 G

− Non-Operating

 Altitude (simulated)

RMS

: 3.13 G

(5-700 Hz)

(5-800 Hz)

RMS

− Operating: -1,000 to 10,000ft

− Non-Operating

 Reliability

− Uncorre c table Bi t Error Rate (UBER ):

− 1 sector per 10

: -1,000 to 40, 000ft

bits read

− Mean Time Betwee n Failures (MTBF): 2,000,000 hours

− End-to-End data protection

 Endurance Rating

− 80 GB: 45 TBW – 120 GB: 70 TBW

− 160 GB: 100 TBW – 240 GB: 140 TBW

− 300 GB: 170 TBW – 400 GB: 225 TBW

− 480 GB: 275 TBW – 600 GB: 330 TBW

− 800 GB: 450 TBW

 Certifications and Declarations

− UL*, CE*, C-Tick*, BSMI*, KCC*, Microsoft* WHCK,

VCCI*, SATA-IO

Ordering Information

Contact your local Intel sales representative for ordering information.

Intel® Solid-State Drive DC S3500

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABIL IT Y WH AT SOE VER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELAT ING T O SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND H OLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AF F I L IATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AG AI NST AL L C L AIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPL I CAT I ON, WHE T HE R OR NOT INT E L OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or inst ructions marked "reserved" or " undefined." Intel reserve s these for future definition and shall have no responsibilit y whatsoever for conflicts or incompat ibili ties ar ising fr om futur e c hanges to t hem. T he infor matio n here is subj ect to cha nge w ithout not ice. Do no t fina lize a d es ign w ith this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local I nt el s ales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or o ther I ntel literature, may b e o btained by ca lling 1-800-548-4725,

or go to: http://www.intel.com/design/literature.htm Low Halogen applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased

components on the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame re tardants and/or PVC may not be better for the environment.

Intel and the Intel log o are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brand s may be claimed as the property of ot h ers. Copyright © 2013 Intel Corporation. All righ ts reserved.

Product Specification December 2013 2 328860-003US

Intel® Solid-State Drive DC S3500

Contents

Revision History ..............................................................................................................................4

Terms and Acronyms .......................................................................................................................4

1.0 Overview .............................................................................................................................6

2.0 Product Specifications ..........................................................................................................7

2.1 Capacity ............................................................................................................................... 7

2.2 Performance ........................................................................................................................ 7

2.3 Electrical Characteristics ..................................................................................................... 9

2.4 Environmental Conditions ................................................................................................. 12

2.5 Product Regulatory Compliance ........................................................................................ 12

2.6 Reliability ........................................................................................................................... 13

2.7 Temperature Sensor .......................................................................................................... 14

2.8 Power Loss Capacitor Test ................................................................................................ 14

2.9 Hot Plug Support ............................................................................................................... 14

3.0 Mechanical Information ..................................................................................................... 15

4.0 Pin and Signal Descriptions ................................................................................................. 17

4.1 2.5-inch Form Factor Pin Locations ................................................................................... 17

4.2 1.8-inch Form Factor Pin Locations ................................................................................... 17

4.3 Connector Pin Signal Definitions ....................................................................................... 18

4.4 Power Pin Signal Definitions ............................................................................................. 18

5.0 Supported Command Sets .................................................................................................. 20

5.1 ATA General Feature Command Set ................................................................................. 20

5.2 Power Management Command Set .................................................................................. 20

5.3 Security Mode Feature Set ................................................................................................ 20

5.4 SMART Command Set ....................................................................................................... 21

5.5 Device Statistics ................................................................................................................. 26

5.6 SMART Command Transport (SCT).................................................................................... 27

5.7 Data Set Management Command Set ............................................................................... 27

5.8 Host Protected Area Command Set .................................................................................. 27

5.9 48-Bit Address Command Set............................................................................................ 28

5.10 General Purpose Log Command Set.................................................................................. 28

5.11 Native Command Queuing ................................................................................................ 28

5.12 Software Settings Preservation ......................................................................................... 28

6.0 Certifications and Declarations ........................................................................................... 29

7.0 References ......................................................................................................................... 29

Appendix A: IDENTIFY DEVICE Command Data ............................................................................... 30

December 2013 Product Specification 328860-002US 3

Revision History

Date

Revision

Description

April 2013

001

Initial release.

3. Added X,Y, Z dimension in section 3.0

3. Updated Table 23

ATA

Advanced Technology Attachment

CRC

Cyclic Redundancy Check

DAS

Device Activity Signal

DMA

Direct Memory Access

ECC

Error Correction Code

EXT

Extended

FPDMA

First Party Direct Memory Access

portion of the capacity is used for NAND flash management and maintenance purposes.

Gigabit

HDD

Hard Disk Drive

HET

High Endurance Technology

Kilobyte

I/O

Input/Output

IOPS

Input/Output Operations Per Second

ISO

International Standards Organization

LBA

Logical Block Address

Megabyte (1,000,000 bytes)

MLC

Multi-level Cell

MTBF

Mean Time Between Failures

NCQ

Native Command Queuing

NOP

No Operation

Petabyte

PCB

Printed Circuit Board

PIO

Programmed Input/Output

RDT

Reliability Demonstration Test

RMS

Root Mean Square

SATA

Serial Advanced Technology Attachment

SCT

SMART Command Transport

1. Random write IOPS consistency changes from 75% to 80%

June 2013 002

December 2013 003

2. Added read power in table 8, 9 and 11

1. Updated Section 5.4.1 Timed Workload Endurance Indicators with user notes

2. Updated Table 6 notes

Terms and Acronyms

Intel® Solid-State Drive DC S3500

Term Definition

Gigabyte Note: The total usable capacity of the SSD may be less than the total physical capacity because a small

Product Specification December 2013 4 328860-003US

health of a drive and reports potential problems.

SSD

Solid-State Drive

Terabyte

TYP

Typical

Intel® Solid-State Drive DC S3500

Term Definition

SMART

UBER Uncorrectable Bit Error Rate

Self-Monitoring, Analysis and Reporting Technology An open standard for developing hard drives and software systems that automatically monitors the

December 2013 Product Specification 328860-002US 5

1.0 Overview

This document describes the spec ificati ons a nd cap abiliti es of th e Intel® SSD DC S3500. The Intel

with world-class r eliability for Seria l Advanced Technology Attachment (SATA)-based computers in nine capacities: 80 GB, 120 GB, 160 GB, 240 GB, 300 GB, 400 GB, 480 GB, 600 GB and 800 GB.

By combining 20nm Intel support, the Intel sequential write speeds of up to 450 MB/s. Intel SSD DC S3500 delivers Quality of Service of 500 us for ran dom 4KB r ea ds m ea s ured at a queue depth of 1.

The industry-standard 2.5-inch and 1.8-inch form fac tors enable interchangeabil ity w ith existing hard disk drives (H D Ds) and native SATA HDD drop-in replacement with the enhanced performanc e, reliability, ruggedness, and power savings offered by an S S D .

Intel SSD DC S3500 offers these key features:

SSD DC S3500 delivers leading performan ce and Quality of Serv ice combin ed

• Standard Endurance T ec hnology

• High I/O and throughput performance

• Consistent I/O latency

• Enhanced power-loss data protection

• End-to-End data protection

• Thermal throttling

• Temperature Sensor

• Inrush current management

• Low power

• High reliability

• Enhanced ruggedness

• Temperature monitor and logging

• Power loss protection capacitor self-test

Intel® Solid-State Drive DC S3500

SSD DC S3500 delivers sequential read spee ds of up to 500 MB/s and

NAND Flash Memory technology with SATA 6Gb/s interface

Product Specification December 2013 6 328860-003US

Table 1. User Addressable Secto rs

Unformatted Capacity

(Total User Addressable Sectors in LBA Mode)

80 GB

156,301,488

120 GB

234,441,648

160 GB

312,581,808

240 GB

468,862,128

300 GB

586,072,368

400 GB

781,422,768

480 GB

937,703,088

600 GB

1,172,123,568

800 GB

1,562,824,368

Table 2.

Random Read/W rite Input/Output Operat ions Per Second (IO P S )

Intel SSD DC S3500

80 GB

1.8”)

240 GB

1.8”)

800 GB

1.8”)

Random 4 KB Read (up to)2

IOPS

70,000

75,000

Random 4 KB Write (up to)

IOPS

7,000

4,600

7,500

9,000

11,000

11,500

Random 8 KB Read (up to)3

IOPS

39,000

47,000

47,500

Random 8 KB Write (up to)

IOPS

3,700

2,300

3,800

4,400

5,500

Intel® Solid-State Drive DC S3500

2.0 Product Specifications

2.1 Capacity

Intel SSD DC S3500

Notes: 1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes. LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive. The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is

used for NAND flash management and maintenance purposes.

2.2 Performance

Specification1 Unit

Notes: 1. Performance measured using Iomet er * wi t h Queue Dep t h 3 2 . Mea surements are performed on a full Logical Block

Address (LBA) span of the drive.

2. 4 KB = 4,096 bytes

3. 8 KB = 8,192 bytes

4. Performance co nsistency m easured usi ng Iometer* based on Random 4KB QD=32 workload, measured as the (IOPS in the 99.9th percentile sl ow est 1-second interval)/(averag e IOP S d u ring t h e te s t) . M easur ements are performed on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but inc lu ding all background activities required for normal operation and data reliability

(2.5/

120 GB 160 GB

(2.5”/

300 GB

400 GB

(1.8”)

480

/600 GB

(2.5”/

December 2013 Product Specification 328860-002US 7

Intel® Solid-State Drive DC S3500

Table 3. Random Read/W rite IOPS Consistency

Intel SSD DC S3500

80GB

1.8”)

240GB

1.8”)

800GB

1.8”)

Random 4 KB Read (up to)2

Random 4 KB Write (up to)

Random 8 KB Read (up to)3

Random 8 KB Write (up to)

Notes: 1. Performance measured using Iometer* with Queue Depth 32 . Mea surements are performed on a full Logical Block

second interval)/( average IOPS during the tes t). Meas urements a re perform ed on a

Table 4. Sequential Rea d a nd Write Bandwidth

Intel SSD DC S3500

80GB

1.8”)

240GB

1.8”)

480

800GB

1.8”)

6Gb/s)1

Table 5. Latency

Intel SSD DC S3500

80GB (2.5/1.8”), 120GB, 160GB, 240GB (2.5”/1.8”),

300GB, 400GB (1.8”), 480GB, 600 GB

Specification4 Unit

Address (LBA) span of the drive.

2. 4 KB = 4,096 bytes

3. 8 KB = 8,192 bytes

4. Performance consistency measured using Iometer* based on Random 4KB QD=32 workload, measured as the (IOPS in the 99.9th p ercen til e sl owes t 1full Logical Block Address (LBA) span of the drive once the workload has reached steady state, including all background activities required for normal operation and data reliability

Specification Unit

Sequential Read (SATA

MB/s 340 445 475 500 500 500 500 500

(2.5/

120GB 160GB

(2.5”/

300GB

400GB

(1.8”)

400GB

(1.8”)

480 /

600 GB

/600

(2.5”/

Seque ntial Wr ite (SATA

Notes: 1. Performance measured using Iometer* with 128 KB (131,072 bytes) of transfer size with Queue Depth 32.

Specification

Latency1 (TYP)

Read Write Power On to Ready

MB/s 100 135 175 260 315 380 410 450

800GB (2.5”/1.8”)

50 µs 65 µs

2.0 s

Product Specification December 2013 8 328860-003US

50 µs 65 µs

3.0 s

Table 6. Quality of Service

Intel SSD DC S3500

Queue Depth=1

Queue Depth=32

80/120/160/

240 GB

300/400/480/

600/800 GB

80/120/160/

240 GB

300/400/480/

600/800 GB

Quality of Service

(99.9%)

Reads

0.5

0.5 2 2

Writes

ms 5 2

Quality of Service

(99.9999%)

Reads

10 5 10

Writes

Table 7. Operating Voltage for 2.5-inch Form Fac t or

Intel SSDDC S3500

80 GB, 120 GB, 160 GB, 240 GB, 300 G B, 480 GB, 600 GB, 800 GB

Inrush Current (Typical Peak) 1

1.0 A, < 1 s

Inrush Current (Typical Peak) 1

500 ms

1.0 A, < 1 s

Intel® Solid-State Drive DC S3500

Specification Unit

3, 4

3,4

Notes:

1. Device measured using Iometer. Latenc y measured using 4 KB (4,096 bytes) trans fer size with Queue Depth equal to 1 on a sequential workload.

2. Power On To Ready time assumes proper shut down. Time varies if shutdown is not preceded by STANDBY IMMEDI ATE command. For 95% of the time, the maximum time fo r pow er on t o ready will be less than 10 seconds.

3. Device measured using Iometer. Quali ty of S ervice measured using 4 KB (4,096 bytes) transfer size on a random workload on a full Logical Block Address (LBA ) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability.

4. Based on Random 4KB QD=1, 32 workloads, measured as the time taken for 99.9(or 99.9999) percentile of commands to finish the round-trip from host to drive and back to host.

2.3 Electrical Characteristics

Electrical Characteristics

5 V Operating Characteristics:

Operating Voltage range Rise time (Max/Min) Fall time (Min) Noise level

Min Off time

500 mV pp 10 Hz – 100 KHz

50 mV pp 100 KHz – 20 MHz

12 V Operating Characteristics:

Operating Voltage range Rise time (Max/Min) Fall time (Min) Noise level

Min Off time

Notes:

1000 mV pp 10 Hz – 100 KHz

100 mV pp 100 KHz – 20 MHz

1. Measured from initial device power supply application.

2 Fall time needs to be equal or better than minimum in order to guarantee full functionali ty of enhanced power loss management.

3. The drive needs to be powered off fo r at l east 5 00m sec before powering on.

December 2013 Product Specification 328860-002US 9

5 V (±5%)

1 s / 1 ms

1 ms

500 ms

12 V (±10%)

1 s / 1 ms

1 ms

Intel® Solid-State Drive DC S3500

Intel SSD DC S3500

80 GB

120 GB

160 GB

240 GB

300 GB

480 GB

600 GB

800 GB

Active Write - RMS Average 1

1.8

2.0

2.3

2.9

3.5

4.3

4.5

5.0

Active Write - RMS Burst 2

2.0

2.4

2.7

3.2

3.9

5.2

5.5

7.3

Active Read - RMS Average 3

1.5

1.6

Active Read - RMS Burst 4

1.8

2.2

2.5

2.8

3.0

3.3

3.4

3.5

Idle

Intel SSD DC S3500

80 GB

120 GB

160 GB

240 GB

300 GB

480 GB

600 GB

800 GB

Active Write - RMS Average1

Active Write - RMS Burst2

2.2

2.5

2.8

3.4

4.2

5.5

6.8

7.8

Active Read - RMS Average3

1.6

1.7

1.8

Active Read - RMS Burst4

2.1

2.3

2.6

3.2

3.6

6.4

Idle

0.8

0.9

Table 8. Power Consumption for 2.5-inch Form Factor (5V Supply )

Specification Unit

0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6

Notes:

1. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) average power is measured using scope t rigger over a 100 ms sample period.

2. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) burst power is measured using scope trigger over a 500 us sample period.

3. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential reads. Root Mean Squared (RMS) average power is measured using scope t rigger over a 100 ms sample period.

4. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential reads. Root Mean Squared (RMS) burst power is measured using scope tri gg er ov e r a 5 0 0 us sample period.

Table 9. Power Consumption for 2.5-inch Form Factor ( 12V Supply)

Specification1 Unit

2.0 2.3 2.5 3.1 3.5 4.3 4.5 5.0

Notes:

1. The workload equat es 12 8 KB (131,0 7 2 by t es) Q ueu e Depth equal to 32 sequential writes. Roo t Mean Squa red (RMS) average power is me asured using sc ope trigger over a 100 ms sample period.

2. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) burst power is measured using scope tri gg er ov e r a 500 us sample period.

3. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential reads. Root Mean Squared (RMS) average power is measured using scope t rigger over a 100 ms sample period.

4. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential reads. Root Mean Squared (RMS) burst power is measured using scope tri gg er ov e r a 5 0 0 us sample period.

Product Specification December 2013 10 328860-003US

Table 10. Operating Volta ge and Power Consumption for 1.8-inch Form Factor

Intel SSD DC S3500

80 GB

240 GB

400 GB

800 GB

500 ms

Inrush Current (Typical Peak) 1

1.2 A, < 1 s

Intel SSD DC S3500

80 GB

240 GB

400 GB

800 GB

Active Write - RMS Average @ 3.3V

2.0

3.5

4.5

5.2

Active Write - RMS Burst @ 3.3V

2.2

3.8

5.0

7.5

Active Read - RMS Average @ 3.3V

1.3

1.4

Active Read - RMS Burst @ 3.3V

1.8

2.6

3.0

Idle @ 3.3V

0.6

Intel® Solid-State Drive DC S3500

Electrical Characteristics

Operating Voltage for 3.3 V (±5%) Min Max Rise time (Max/Min) Fall time (Min)

Noise level

Min Off time

Notes:

300 mV pp 10 Hz – 100 KHz

500 mV pp 100 KHz – 20 MHz

3.13 V

3.47 V

1 s / 1 ms

1 ms

1. Measured from initial device power supply application.

2. Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss management.

3. The drive needs to be powered off fo r at l east 5 00m sec before powering on.

Table 11. Power Consumpti on for 1.8-inch Form Factor

Specification1 Unit

Notes:

1. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) power

is measured using scope tri gg er ov e r a 1 0 0 ms sample period.

December 2013 Product Specification 328860-002US 11

2.4 Environme nt al Conditions

Table 12. Temperature, Shock, Vibration

Temperature

Range

Non-operating1

-55 – 95 oC

Non-operating

30 oC/hr (Typical)

Non-operating

5 – 95 %

Shock and Vibration

Range

Non-operating

1,000 G (Max) at 0.5 msec

Non-operating

3.13 G

RMS

(5-800 Hz) Max

Table 13. Product Regulatory Compliance Spe c ifications

Region For Which

Conformity Declared

Standard Digital Apparatus

measurement CISPR24:2010

measurement CISPR24:2008 (Modified)

— Part 1: General Requirements

Intel® Solid-State Drive DC S3500

Case Temperature Operating

Temperature Gradient Operating

Humidity Operating

Shock Operating

Vibration Operating

Notes:

1. Please contact your Intel representative for details on the non-operating temperature range.

2. Temperature gradient measured without condensation.

3. Shock specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus

4. Vibration specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws.

may be applied in the X, Y or Z axis. Shock specification is measured using Root Mean Squared (RMS) value. Stimu lus may be applied in the X, Y or Z axis. Vibration speci fication is measured us ing RMS value.

30 oC/hr (Typical)

1,000 G (Max) at 0.5 msec

2.17 G

0 – 70 oC

5 – 95 %

(5-700 Hz) Max

RMS

2.5 Product Regulatory Compliance

Intel SSD DC S3500 meets or exceeds the regulatory or certification requ ir ements in Table 13.

Title Description

TITLE 47-Telecommunications CHAPTER 1— FEDERAL COMMUNMICATIONS COMMISSION PART 15 — RADIO FREQUENCY DEVICES

ICES-003, Issue 4 Interference-Causing Equipment

IEC 55024 Information Technology Equipment — Immunity characteristics— L imits and m ethods o f

IEC 55022 Information Technology Equipment — Radio disturbance Characteristics— Limits and methods of

EN-60950-1 2nd Edition

UL/CSA EN-60950-1 2nd Edition

FCC Part 15B Class B

CA/CSA-CEI/IEC CISPR 22:02. This is CISPR 22:1997 with Canadian Modifications

EN-55024: 1998 and its amendments European Union

EN-55022: 2006 and its amendments European Union

Information Technology Equipment — Safety

Information Technology Equipment — Safety — Part 1: General Requirements

USA

Canada

USA/Canada

Product Specification December 2013 12 328860-003US

Table 14. Reliability Specifications

to the host.

Test (RDT).

Power On/Off Cycles is defined as pow er bein g removed from the

shutdown.

endurance.

while running JESD218 standard1

Intel® Solid-State Drive DC S3500

2.6 Reliability

Intel SSD DC S3500 meets or exceeds SSD endura nce an d data reten tion requ ir ements as specified in the JESD218 standard. R elia b ility specificati ons are listed in the ta ble

Parameter Value

Uncorrectable Bit Error Rate (UBER)

below:

Uncorrectable bit error rate will not exceed one sector in the

specified number of bits read. In the unlikely event of a non-recoverable read error, the SSD will report it as a read failure to the host; the sector in error is considered corrupt and is not returned

Mean Time Between Failures (MTBF)

Mea n Ti me Between Failures is estimated based on Telcordia*

methodology and demonstrated through Reliability Demonstration

Power On/Off Cycles

SSD, and then restored . Mos t host sy stems rem ove p ower from the SSD when entering suspend and hibernate as well as on a system

Insertion Cycles SATA /power cable insertion/removal cycles.

Data Retention

The time period for retaining data in the NAND at maximum rated

< 1 sector per 10

2,000,000 hours

24 per day

50 on SATA cable 500 on backplane

3 months power-off retention once SSD reaches rated write end uranc e at 40 °C

bits read

Endurance Rating

Based on JESD219 workload.

1. Refer to JESD218 standard table 1 for UBER, FFR and other Enterprise SSD requirements

December 2013 Product Specification 328860-002US 13

80 GB: 45 TBW 120 GB:70 TBW

160 GB: 100 TBW

240 GB: 140 TBW 300 GB: 170 TBW 400 GB: 225 TBW 480 GB: 275 TBW 600 GB: 330 TBW

800 GB: 450 TBW

2.7 Temperature Sensor

The Intel SSD DC S3500 has an internal temperature sensor with an accuracy of +/-2C over a range of -20C to +80C which can be monitored using two SMART attr ibutes: Airflow Temperature (BEh) and Device Internal Temperatu re ( C2h).

For more information on supported S MART attributes, s ee “SMART Attributes” on page

18.

2.8 Power Loss Capacitor Test

The Intel SSD DC S3500 supports testing of the power loss capacitor, which can be monitored using the following SMA R T a ttr ibute: (175, AFh ).

2.9 Hot Plug Support

Hot Plug insertion a nd removal is supported in the presence of a proper connector an d appropriate operating sy s tem ( O S ) , as described in the SATA 3.0 specif ica tion .

This product supports asynchronous signal recovery and issues an unsolicited COMINIT when first mated with a powered connector to guarantee reliable det ec tion by a host system without hardware device detection.

Intel® Solid-State Drive DC S3500

Product Specification December 2013 14 328860-003US

Intel® Solid-State Drive DC S3500

3.0 Mechanical Information

Figures 1 and 2 show the physical package information for th e Intel SSD DC S3500 in the

2.5- and 1.8-inch form factors. All dimensions a re in millimeters.

Figure 1: Intel SSD DC S3500 2.5-inch Dimensions

X – Length -- * Y - Width Z - Height

100.45 Max 69.85 +/- 0.25 7.0 +0/-0.5

* - does not include 0.3 connector protrusion

December 2013 Product Specification 328860-002US 15

Figure 2: Intel SSD DC S35001.8-i nc h Dimensions

Intel® Solid-State Drive DC S3500

X - Length Y - Width Z - Height

78.50 +/- 0.60 54.0 +/- 0.25 5.0 +/- 0.35

Product Specification December 2013 16 328860-003US

Intel® Solid-State Drive DC S3500

4.0 Pin and Signal Descriptions

4.1 2.5-inch Form Factor Pin Locations

Figure 3: Layout of 2.5-inch Form Factor Signal and P ower Segment Pins

Note: 2.5-inch connector supports built in latching capability.

4.2 1.8-inch Form Factor Pin Locations

Figure 4: Layout of 1.8-inch Form Factor Signal and P ower Segment Pins

December 2013 Product Specification 328860-002US 17

Intel® Solid-State Drive DC S3500

Factors

Ground

1st mate

A+

A-

Ground

1st mate

B-

B+

Ground

1st mate

Table 16. Serial A T A Power Pin Definitions—2.5-inch Form Factors

P12

Not connected

(3.3 V Power)

P22

Not connected

(3.3 V Power)

P32

Not connected

(3.3 V Power; pre-charge)

2nd Mate

Ground

1st Mate

P53

Ground

1st Mate

P63

Ground

1st Mate

5 V Power

1st Mate

5 V Power

2nd Mate

5 V Power

2nd Mate

P103

Ground

1st Mate

P116

DAS/DSS

Device Activity Signal/Disable Staggered Spin-up

2nd Mate

P12

Ground

1st Mate

P137

V12

12 V Power

1st Mate

P147

V12

12 V Power

2nd Mate

P157

V12

12 V Power

2nd Mate

4.3 Connector Pin Signal Definitions

Table 15. Serial A T A C onnector Pin Signal De finitions—2.5-inch and 1.8-inch Form

Pin Function Definition

Differential signal pair A

Differential signal pair B

Note: Key and spacing separate signal and power segments.

4.4 Power Pin Signal Definitions

Pin1 Function Definition Mating Order

3,4

3,5

3,4

Notes:

1. All pins are in a single row, with a 1.27 mm (0.050-inch) pitch.

2. Pins P1, P2 and P3 are connected together, although they are not connected internally to the device. The host may put 3.3 V on these pins.

3. The mating sequence is:

• ground pins P4-P6, P10, P12 and the 5V power pin P7

• signal pins and the rest of the 5V power pins P8-P9

4. Ground connectors P4 and P12 may contact before the other 1st mate pins in both the power and signal connectors to discharge ESD in a suitably configured backplane connector.

5. Power pins P7, P8, and P9 are internally connected to one another within the device.

6. The host may ground P11 if it is not used for Device Activity Signal (DAS).

7. Pins P13, P14 and P15 are internally connected to one another within the device. The host may put 12 V on these pins.

Product Specification December 2013 18 328860-003US

Table 17. Serial A T A Power Pin Definiti ons—1.8-inch Form Factors

P12

V33

3.3 V Power

2nd Mate

P22

V33

3.3 V Power, per-charge

2nd Mate

P33

Ground

1st Mate

P43

Ground

1st Mate

P54

5 V Power; not connected.

1st Mate

P64

5 V Power; not connected.

2nd Mate

P75

DAS/DSS

Device Activity Signal/Disable Staggered Spin-up

2nd Mate

Key

P86

Optional

Manufacturing Test Pin

2nd Mate

P96

Optional

Manufacturing Test Pin

2nd Mate

Intel® Solid-State Drive DC S3500

Pin Function Definition Mating Order1

Notes:

1. All mate sequences assume zero angular offset between connectors.

2. P1 and P2 are internally connected to one another within the device.

3. Ground connectors P3 and P4 may contact before the other 1st mate pins in both the power and signal connectors to dis-

charge ESD in a suitably configure backplane connector.

4. Pins P5 and P6 are not connected internally to the device but there is an option to connect th rough a zero ohm stuffing

resistor. The host may put 5V on these pins.

5. The host may ground P7 if it is not used for Device Activity Signal (DAS).

6. P8 and P9 should not be connected by the host.

December 2013 Product Specification 328860-002US 19

5.0 Supported Command Sets

Intel SSD DC S3500 supports all mandatory ATA (Advanced Technology Attachment) commands defined in the AT A8-ACS specification described in this sec tion.

5.1 ATA General Feature Command Set

The I ntel SSD DC S3500 supports the ATA General Feature com mand set (non- PACKET), which consists of:

− EXECUTE DEVICE DIAGNOSTIC

− SE T FEATURES

− IDENTIFY DEVICE

Note: See Appendix A, “IDENTIFY DEVICE Command Data” on page 27 for deta ils on the sector data returned after issuing an IDENTIFY DEVICE command.

Intel SSD DC S3500 also supports the following optional commands:

− READ DMA

− WRITE DMA

− READ SECTOR(S)

− READ VERIFY SECTOR(S)

− READ MULTIPLE

− SEEK

− SE T FEATURES

− WRITE SECTOR(S)

− SET MULTIPLE MODE

− WRITE MULTIPLE

− FLUSH CACHE

− READ BUFFF E R

− WRITE BUFFER

− NOP

− DOWNLOAD MICROCODE

− WRITE UNCORRECTABLE EXT

1. The only multiple supported will be multiple 1

Intel® Solid-State Drive DC S3500

5.2 Power Management Command Set

Intel SSD DC S3500 supports the Power Management command set, which consists of:

− CHECK POWER MODE

− IDLE

− IDLE IMMEDIATE

− SLEEP

− STANDBY

− STANDBY IMMEDIATE

5.3 Security Mode Feature Set

Intel SSD DC S3500 supports the Security Mode comm and set, which con s is ts of:

− SECURITY SET PASSWORD

− SECURITY UNLOCK

− SECURITY ERASE PREPARE

− SECURITY ERASE UNIT

− SECURITY FREEZE LOCK

− SECURITY DISABLE PASSWO RD

Product Specification December 2013 20 328860-003US

Table 18. SMART Attributes

remaining of allowable grown defect count.

Normalized value: always 100.

reports the cumulative number of power cycle

Normalized value: always 100.

AAh

Available Reserved Spa c e (See Attribute E8)

1 1 0 0 1 1 10

Program Fail Count

remaining of allowable program fails.

Erase Fail Count

remaining of allowable erase fails.

Unexpect ed Power Loss

Normalized value: always 100.

Power Loss Protection Failure

Last test result as microseco nds to discharg e cap, satura tes

1: Last test result as microseconds to discharge

cap, saturates at max value. Test result expec ted in range

Intel® Solid-State Drive DC S3500

5.4 SMART Command Set

Intel SSD DC S3500 supports the SMART command set, which consists of:

− SMART READ DATA

− SMART READ ATTRIBUTE THRESHOLDS

− SMART ENABLE/DISABLE ATTRIBUTE AUTOSAVE

− SMART SAVE ATTRIBUTE VALUE S

− SMART EXECUTE OFF-LINE IMMEDIATE

− SMART READ LOG SECTOR

− SMART WRITE LOG SECTOR

− SMART ENABLE OPERATIONS

− SMART DISABLE OPERATIONS

− SMART RETURN STATUS

− SMART ENABLE/DISABLE AUTOMATIC OFFLINE

5.4.1 SMART Attributes

Table 18 lists the SMART attributes supported by the Intel SSD DC S3500 and the corresponding status flags and threshold settings.

ID Attribute

Re-allocated Sector Count

05h

09h

0Ch

ABh

ACh

AEh

Raw value: shows the number of retired blocks since

leaving the factory (grown defect count).

Normalized value: beginning at 100, shows the pe rce nt

Power-On Hours Count Raw value: reports power-on time, cumulative over the life

of the SSD, integer number in hour time units.

Power Cycle Count

Raw value: events over the life of the devi ce.

Raw value: shows total count of program fails. Normalized value: beginning at 100, shows the percent

Raw value: shows total count of erase fails. Normalized value: beginning at 100, shows the percent

Also known as “Power-off Retract Count” per magnetic-drive terminology. Raw value: reports number of unclean shutdowns , cumulative ov er the life o f the SSD. An “unclean shutdown” is the removal of pow er without STANDBY IMMEDIATE as the last command (regardless of PLI activity using capacitor power).

Status Flag s

Threshold

1 1 0 0 1 0 0 (none)

at max value. Also logs minutes since last test and lifetime

AFh

December 2013 Product Specification 328860-002US 21

number of tests. Raw value: Bytes 0-

1 1 0 0 1 1 10

Intel® Solid-State Drive DC S3500

Table 18. SMART Attributes

25 <= result <= 5000000, lower indicates specific error

SATA Downshift Count

Normalized value: alw ays 100.

Uncorrectable Error Count

Normalized value: alw ays 100.

Temperature - Airflow Temperature (Case)

Normalized value: 100 – case temperature in C degrees.

Normalized value: always 100.

device temperature in C deg rees,

100 if device temperature less than 50.

Normalized value: always 100.

ID Attribute

code.

Bytes 2-3: Minutes since last test, saturates at max

value.

Bytes 4-5: Lifetime number of tests, not incremented on

power cycle, saturates at max value.

Normalized value: set to 1 on test failure or 11 if the

capacitor has been tested in an excessive temperature condition, otherwise 100.

B7h

B8h

BBh

BEh

Raw value: reports number of times SATA interface

selected lower signaling rate due to error.

End-to-End Error Detection Count

Raw value: reports number of End-to-End detected and

corrected errors by hardware.

Raw value: shows the number of errors that could not

be recovered using Error

Correction Code (ECC).

Raw value: reports SSD case temp erature statistics.

Bytes 0-1: Current case temperature, Celsius

Byte 2: Recent min case temperatu re , Celsius

Byte 3: Recent max case temperature, Celsius

Bytes 4-5: Over temperature counter. Number of times

sampled temperature ex c ee ds drive max operating tem-

perature specification.

Status Flag s

Threshold

1 1 0 0 1 0 0 (none)

1 0 0 0 1 0 0 (none)

Power-Off Retract Count (Unsafe Shutdown Count) Raw value: reports the cumulative number of unsafe

C0h

C2h

C5h

C7h

E1h

(unclean) shutdown events over the life of the device. An unsafe shutdown occurs whenever the device is powered off without STANDBYIMMEDIATE being the last command.

Temperature - Device Internal Temperature

Raw value: Reports internal temperature of the SSD in degrees Celsius. Temp er a t ur e reading is the value direct from the printed circuit board (PCB) sensor without offset.

Normalized value: 150 –

Pending Sector Count Raw value: number of current unrecoverable read errors

that will be re-allocated on next write.

CRC Error Count Raw value: shows total number of encountered SATA

interface cyclic redundancy check (CRC) errors.

Host Writes Raw value: reports total number of sectors written by the

host system. The raw value is inc reas ed by 1 for every 65,536 sectors (32MB) written by the host.

Product Specification December 2013 22 328860-003US

1 1 0 0 1 0 0 (none)

1 0 0 0 1 0 0 (none)

0 1 0 0 1 0 0 (none)

1 1 0 0 1 0 0 (none)

Table 18. SMART Attributes

Normalized value: always 100.

threshold value for this attribute is 10 percent availability.

wear can be put on the device.

Normalized value: always 100.

reports the total number of sec tors written by

the host system. The raw value is increased b y 1 for every

Normalized value: always 100.

Intel® Solid-State Drive DC S3500

ID Attribute

Timed Workload Media Wear Raw value: measures the wear seen by the SSD (since

reset of the workload timer, attribute E4h), as a

E2h

E3h

E4h

E8h

E9h

percentage of the maximum rate d cycles. Divide the raw value by 1024 to derive the perc entag e with 3 decimal points.

Timed Workloa d Host Read/Write Ratio Raw value: shows the percentage of I/O operations that

are read operations (since reset of the workload timer, attribute E4h). Reported as integer percentage from 0 to

100.

Timed Workload Timer Raw value: measures the elapsed time (number of

minutes since starting this workload timer).

Available Reserved Spa c e

Raw value: reports number of reserve blocks remaining. Normalized value: begins at 100 , which corresponds to

100 percent availability of the reserved space. The

Media Wearout Indicator

Raw value: always 0. Normalized value: reports the number of cycles the NAND

media ha s under gone. Declines linearly from 1 00 to 1 as the average erase cycle count i n c r ea ses from 0 to the maximum rated cycles.

Once the nor malized va lue reaches 1, the number will not

decrease, although it is likely that significan t additional

Status Flag s

Threshold

1 1 0 0 1 0 0 (none)

1 1 0 0 1 1 10

1 1 0 0 1 0 0 (none)

Thermal Throttle Status Raw value: reports Percent Throttle Status and Count of events

EAh

F1h

F2h

Byte 0: Throttle status reported as integer percentage. Bytes 1-4: Throttling event count. Number of times thermal throttle has activated. Preserved over power cycles. Byte 5: Reserved.

Total LBAs Written

Raw value:

65,536 sectors (32MB) written by the host.

Total LBAs Read

Raw value: reports the total number of sectors read by the

host system. The raw value is inc reas ed by 1 for every 65,536 sectors (32MB) read by the host.

December 2013 Product Specification 328860-002US 23

1 1 0 0 1 0 0 (none)

Intel® Solid-State Drive DC S3500

Table 19. SMART Attribute Status Flags

Self-preserving attribute

Not a self-preserving attribute

Self-preserving attribute

Event count attribute

Not an event count attribute

Event count attribute

Error rate attribute

Not an error rate attribute

Error rate attribute

Performance attribute

Not a performance attribute

Performance attribute

online activity

Pre-fail warranty attribute

Advisory

Pre-fail

Status Flag Description Value = 0 Value = 1

Online collection attribute Collected only during offline activity

5.4.1 Timed Workload Endurance Indicators

Timed Workload Medi a Wear Indicator — ID E2 h

This attribute tracks the driv e wear seen by the device during the last wear t imer loop, as a percentage of the maximum rated cycles. The r aw value tracks the percen tage up to 3 decimal points. This va lu e sh ou ld be div ided by 1024 to get the percentage.

For example: if the raw va lue is 4450, the percen tage is 4450/10 24 = 4.345%. The raw value is held at FFFFh until the wear timer (attribute E4h) reaches 60 (minutes) after a SMART EXECUTE OFFLINE IMMEDIATE (B0h/D4h) subcommand 40h to the SSD. The normalized value is alway s s et to 100 and should be ignored.

Timed Workload Ho st Reads Percentage — ID E3h

This attribute sh ows the percentag e of I/O operations that are read opera tions during th e last workload timer loop. The raw value tracks this percentage and is held at FFFFh until the workload timer (attribu te E4h) reaches 60 ( minutes). The normalized value is always set to 100 and should be ignored.

Workload Timer — ID E4h

This attribute is u s e d to measure the time elapsed during the current workload. T he attribute is reset when a SMART EXECUTE OFFLINE IMMEDIATE (D4h) subcommand 40h is issued to the drive . The raw value tracks the time in minu tes and has a maximum valu e of 232 = 4,294,967,296 min utes (8,171 years). The normaliz ed value is always set to 100 and should be ignored.

Collected during both offline and

User Notes

• Sending a SMART EXECUTE OFFLINE IMMEDIATE (B0h/D4h) subcommand 40h to the SSD resets and s tarts all thr ee attribu tes (Media W ear I ndicator, Attribute E2 h, Host Reads Percentage, Attribute E3h, and the Workload timer, Attribute E 4 h) to FFFFh.

• The Attribute raw values are held at FFFFh until the Workload timer (Attribute E4h) reaches a total of 60 ( minutes) of power on tim e . After 60 minutes, the Timed Workload data is made available.

• After the Workloa d timer (E4h) reaches 60 (minutes), th e Timed Workload data is saved every minute so only 59 s ec onds of data is lost if power is r em oved without receiving ATA STANDBY IMMEDIA TE . Accumulated data is not r eset due to power loss.

• Upon power up, th e attributes hold a sn a p s hot of their last saved va lues for 59 seconds and live data is available after 60 seconds, once the in itial one hou r interval is completed.

Product Specification December 2013 24 328860-003US

Intel® Solid-State Drive DC S3500

Example Use Cases

The Timed Workload Enduran c e a ttributes described in this section a r e in tended to be used to measure the amount of media wear that th e drive is subjected t o during a timed workload.

Ideally, the system that th e dr iv e is being used in should be capable of issu in g SMART commands. Oth erwise, provisions h ave been provided to allow the media wear attribu tes to be persistent so the drive can be moved to a SMART capable system to read out the drive wear attribute values.

Use Case 1 – With a System Capable of SMART Commands

1. On a SMART capable system, issue the SMART EXECUTE OFF-LINE IMMEDIATE

(D4h) sub-command 40h to reset the drive wear attributes.

2. Run the wor kload to be evaluated for at least 60 minutes. O therwise the drive

wear attributes will not be available.

3. Read out the d rive wear attributes with the SMART READ DATA ( D0h) command.

Use Case 2 – With a System Not Capable of SMART Commands

1. On a SMART capable system, issue the SMART EXECUTE OFF-LINE IMMEDIATE

(D4h) sub-command 40h to reset the the drive wear attributes.

2. Move the drive to the system where the workload will be measured (and not

capable of SMART commands).

3. Run the wor kload to be evaluated for at least 60 minutes . Otherwise the driv e

wear attributes will not be available.

4. Do a clean system power down by issuing the ATA STANDBY IMMEDIATE

command prior to shutting down the system. This will store all the drive wear SMART attributes to persistent memory within the drive.

5. Move the drive to a SMART capable system.

6. Read out the driv e wear at tributes wi th the SM ART REA D DATA ( D0h) comm and

within 60 minutes after power-up.

Example Calculation of Drive Wear

The following is a n example of how th e drive wear attr ibutes can be used to evaluate th e impact of a given workload. The H ost Writes SMART attr ibute (E1h) can also be used to calculate the amount of data written by the host during the w orkload by reading this attribute before and after running the workload. This example as s umes that the steps shown in “Exa mple Use Cases” on page 18 were f ollowed to obta in the followin g attribut e values:

• Timed Workload Media Wear (E2h) has a raw va lue of 16. Therefore, the percentage wear = 16/1024 = 0.016%.

• Timed Workload Host Read/ W r ite R atio (E3h) has a normaliz ed value of 80, indicating that 80% of operations were reads.

• Workload Timer (E 4h) has a raw v alue of 500. Therefore the w orkload ran for 500 minutes.

• Host Writes Count ( E1h) had a raw value of 100,000 prior to ru nning th e workload and a value of 130,000 at the end of the workload. Therefore, the n umber of sectors written by the hos t du r ing the workload was 30,000 * 65,535 = 1,966,050,000 sectors or 1,966,050,000 * 512/1,000, 000,000 = 1,007 GB.

The following con clusions can be ma de for this example case:

December 2013 Product Specification 328860-002US 25

The workload took 500 minutes to complete with 80% reads a nd 20% writes. A total of

Table 20. Device Statistics Log

Equivalent SMART

applicable)

0x00

List of Supported Pages

0x08

Power Cycle Count

0Ch

0x10

Power-On Hours

09h

0x18

Logical Sectors Written

E1h

for every host write

0x28

Logical Sectors Read

F2h

for every host read

and Completion

1,007 GB of data was written to the device, wh ich increased the media wea r in the drive by 0.016%. At this point in time, this workload is causing a wear rate of 0. 016% for every 500 minutes, or 0.00192%/hour.

5.4.2 SMART Logs

Intel SSD DC S3500 implements the following Log Address es : 00h, 02h, 03h, 06h, and 07h.

DC S3500 implements host vendor s pec ific logs (addresses 80h-9Fh) as read and write scratchpads, where the default value is zero (0). In tel SSD DC S 3500 does not write a ny specific values to these logs unles s d ir ected by the host throug h the appropriate commands.

DC S3500 also implements a device vendor specific log at address A9h as a read-only log area with a default value of zero (0).

5.5 Device Statistics

In addition to the SMART attribute stru c ture, statistics p er taining to the operat ion and health of the Intel SSD DC S3500 can be reported to th e host on request throu gh the Device Statistics log as defined in the ATA specification.

Intel® Solid-State Drive DC S3500

The Device Statistic s log is a read-only GPL/SMART log located at rea d log address 0x04 and is accessible using READ LOG EXT, READ LOG DMA EXT or SMART READ LOG commands.

Table 20 lists the Device Statistics suppor ted by the Intel SSD DC S 3500.

Page Offset Description

0x01 – General Statistics

0x04 – General Error Statistics

0x05 – Temperature Statistics

attribute (if

0x20

0x30

0x08 Num Reported Uncorrectable Errors BBh

0x10

0x00 Device Statistics Information Header -0x08 Current Temperature -0x10 Average Short Term Temperature -0x18 Average Long Term Temperature -0x20 Highest Temperature -0x28 Lowest Temperature -0x30 Highest Average Short Term Temperature -0x38 Lowest Average Short Term Temperature --

Num Write Commands – incremented by one

Num Read Commands – incremented by one

Num Resets Between Command Acceptance

Product Specification December 2013 26 328860-003US

Table 20. Device Statistics Log

Equivalent SMART

applicable)

counts from 1 to 150

Intel® Solid-State Drive DC S3500

Page Offset Description

0x40 Highest Average Long Term Temperature -0x48 Lowest Average Long Term Temperature -0x50 Time in Over-Temperature -0x58 Specified Maximum Operating Temperature -0x60 Time in Under-Temperature -0x68 Specified Minimum Operating Temperature -0x08 Number of Hardware Resets --

0x06 – Transport Statistics

0x07 – Solid State Device Statistics 0x08 Percentage Used Endurance Indicator

0x10 Number of ASR Events -0x18 Number of Interface CRC Errors --

5.6 SMART Command Transport (SCT)

With SMART Command Transport (SCT), a host can send commands and data to an SSD and receive status and data from an SSD using standard write/read commands to manipulate two SM ART Logs:

− Log Address E0h ("SCT Co mmand/Status") — used to send commands and retrieve status

− Log Address E1h ("SCT Data Transfer") — used to transport data

attribute (if

E9h

Note: This device statistic

Intel SSD DC S3500 supports the following standard SCT actions:

− Write Same — DC S3500 implements this action code as described in the ATA specif ic a tion

− Error Recovery Control — DC S3500 accepts this action code, and will store and return

error-recovery time limit values

− Feature Contr ol - DC S3500 supports feature code 0001h (write cache) feature code 0002h

(write cache reordering), and featur e code 0003h (time interval for temperature logging). It also supports D000h(Power Safe Write Cache capacitor test interval), (D001h(read/write power governor mode), D002h(read thermal governor mode), D003h(read power governor burs t power), D004h(read power governor average power)

− Data table command - DC S3500 supports data table command as specified in ATA8-ACS2. This

will read out temperature logging infor mation in table ID 0002h

− Read Status Support - DC S3500 supports read status log

5.7 Data Set Management Command Set

Intel SSD DC S3500 supports the Data Set Ma nagement command s et Trim attribute, which consists of:

− DATA SET MANAGEMENT

5.8 Host Protected Area Command Set

Intel SSD DC S3500 supports the Host Protected Area command set, which consists of:

− READ NATIVE MAX ADDRESS

− SET MAX ADDRESS

− READ NATIVE MAX ADDRESS EXT

− SET MAX ADDRESS EXT

Intel SSD DC S3500 also supports the following optional commands:

− SET MAX SET PASSWORD

December 2013 Product Specification 328860-002US 27

− SET MAX LOCK

− SET MAX FREEZE LOCK

− SET MAX UNLOCK

5.9 48-Bit Address Command Set

Intel SSD DC S3500 supports the 48-bit Address command set, which consists of:

− FLUSH CACHE EXT

− READ DMA EXT

− READ NATIVE MAX ADDRESS EXT

− READ SECTOR(S) EXT

− READ VERIFY SECTOR(S) EXT

− SET MAX ADDRESS EXT

− WRITE DMA EXT

− WRITE MULTIPLE EXT

− WRITE SECTOR(S) EXT

− WRITE MULTIPLE FUA EXT

− WRITE DMA FUA EXT

5.10 General Purpose Log Command Set

Intel SSD DC S3500 supports th e General Purpose Log command set, which consists of:

− READ LOG EXT

− WRITE LOG EXT

Intel® Solid-State Drive DC S3500

5.11 Native Comm and Queuing

Intel SSD DC S3500 supports the Native Command Queuing (NCQ) command set, which includes:

− READ FPDMA QUEUED

− WRITE FPDMA QUEUED

Note: With a maximum Queue Depth set to 32.

5.12 Software Settings Preservation

Intel SSD DC S3500 supports the SET FEATURES parameter to enable/disable the preservation of software settings .

Product Specification December 2013 28 328860-003US

Table 21. Device Certifications and Declarations

Certification

Description

COUNCIL of 15 December 2004.

1: General Requirements)

computers or facsim ile.

Table 22. Standards References

(JESD218)

nts/docs/jesd218/

Dec 2008

VCCI

http://www.vcci.jp/vcci_e/

for material description datasheet

Intel® Solid-State Drive DC S3500

6.0 Certifications and Declarations

Table 21 describes the Device Certifications supported by the Intel SSD DC S3500.

CE Compliant

UL Recognized

C-Tick Compliant

BSMI Compliant

KCC

VCCI

RoHS Compliant Restriction of Hazardous Substance Directive

WEEE Directive on Waste Electrical and Electronic Equipment

Low Voltage DIRECTIVE 2006/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 12 December 2006, and EMC Directive 2004/108/EC OF THE EUROPEAN PARLIAMENT AND OF THE

Underwriters Laboratories, Inc. Bi-National Component Recognition; UL 60950-1, 2nd Edition, 2007-03-27 (Information Technology Equipment - Safety - Part 1: General Requirements)

CSA C22.2 No. 60950-1-07, 2nd Edition, 2007-03 (Informa tion Te chnolo gy Equipm ent - Safety - Part

Compliance with the Australia/New Zealand Standard AS/NZS3548 and Electromagnetic Compatibility (EMC) Framework requirements of the Australian Communication Authority (ACA).

Compliance to the Taiwan EMC standard CNS 13438: Information technology equipment - Radio disturbance Characteristics - limits and methods of measurement, as amended on June 1, 2006, is harmonized with CISPR 22: 2005.04.

Compliance with paragraph 1 of Article 11 of the Electromagnetic Compatibility Control Regulation and meets the Electromagnetic Compatibility (EMC) Framework requirements of the Radio Research Laboratory (RRL) Ministry of Information and Communication Republic of Korea.

Voluntary Control Council for Interface to cope with disturbance problems caused by personal

7.0 References

Table 22 identifies th e standards infor mation referenced in this document.

Date Title Location

July 2012

Sept 2010

June 2009 RoHS

August 2009 ACS-2-ATA/ATAPI Command Set 2 Specification http://www.t13.org/

June 2009 Serial ATA Revision 3.0 http://www.sata-io.org/

May 2006 SFF-8223, 2.5-inch Drive w/Serial Attachment Connector http://www.sffcommittee.org/

Solid-State Drive (SSD) Requirements and Endurance Test Method (JESD219)

Solid-State Drive (SSD) Requirements and Endurance Test Method

December 2013 Product Specification 328860-002US 29

http://www.jedec.org/standards-docume nts/results/jesd219

http://www.jedec.org/standards-docume

http://qdms.intel.com/ Click Search MDDS Database and search

Intel® Solid-State Drive DC S3500

Table 22. Standards References

May 2005

SFF-8201, 2.5-inch dri ve form factor

http://www.sffcommittee.org/

voltage variations immunity tests)

Word

F = Fixed

X = Both

Default Value

Description

0 X 0040h

General configuration bit-significant information

1 X 3FFFh

Obsolete - Number of logical cylinders (16,383)

2 V C837h

Specific configuration

3 X 0010h

Obsolete - Number of logical heads (16)

4-5 X 0h Retired

6 X 003Fh

Obsolete - Number of logical sectors per logical track (63)

7-8 V 0h Reserved for assignment by the CompactFlash* Association (CFA)

9 X 0h Retired

10-19 F

varies

Serial number (20 ASCII characters)

20-21 X 0h

Retired 22 X 0h

Obsolete

23-26 F

varies

Firmware revision (8 ASCII characters)

Model number (Intel® Solid-State Drive)

8001h

48 F 4000h

Trusted Computing F eatur e Set

49 F 2F00h

Capabilities

50 F 4000h

Capabilities

51-52 X 0h

Obsolete

53 F 0007h

Words 88 and 70:64 valid

54 X 3FFFh

Obsolete - Number of logical cylinders (16,383)

55 X 0010h

Obsolete - Number of logical heads (16)

56 X 003Fh

Obsolete - Number of logical sectors per logical track (63)

57-58 X

FC1000FBh

Obsolete

59 F BF01 Number of sectors transferred per interrupt on multiple commands

300GB: 0FFFFFFFh

Date Title Location

International Electrotechnical Commission EN 61000

1995 1996 1995 1995 1997 1994

4-2 (Electrostatic discharge immunity test) 4-3 (Radiated, radio-frequency, electromagnetic field immunity test) 4-4 (Electrical fast transient/burst immunity test) 4-5 (Surge immunity test) 4-6 (Immunity to conducted disturbances, induced by radio-

frequency fields) 4-11 (Voltage Variations, voltage dips, short interruptions and

http://www.iec.ch/

1995 ENV 50204

(Radiated electromagnetic field from digital radio telephones)

http://www.dbicorporation.com/ radimmun.htm/

Appendix A: IDENTIFY DEVICE Command Data

Table 23. Returned Sector Data

V = Variable

27-46

varies

7:0—Maximum number of sectors transferred per interrupt on multiple commands

60-61

0950F8B0h 120GB: 0DF94BB0h 160GB: 0FFFFFFFh 240GB: 0FFFFFFFh

Product Specification December 2013 30 328860-003US

Total number of user-addressable sector for 28-bit commands

Word

F = Fixed

X = Both

Default Value

Description

800GB: 0FFFFFFFh

62 X 0h

Obsolete

63 X 0007h

Multi-w or d D MA modes supported/selecte d

64 F 0003h

PIO modes supported

65 F 0078h

Minimum multiword DMA transfer cycle time per word

66 F 0078h

Manufacturer’s recommended multiword DMA transfer cycle time

67 F 0078h

Minimum PIO transfer cycle time without flow control

68 F 0078h

Minimum PIO transfer cycle time with IORDY flow control

69 F 4030h

Additional Supported

70 F 0000h

Reserved

71-74 F 0h

Reserved for IDENTIFY PACKET DEVICE command

75 F 001Fh

Queue depth

76 F 850Eh

Serial ATA capabilities

77 F 0006h

Reserved for future Serial ATA definition

78 F 0040h

Serial ATA features supported

79 V 0040h

Serial ATA features enabled

80 F 03FCh

Major version number

81 F 0110h

Minor version number

82 F 746Bh

Command set supported

84 F 6163h

Command set/feature supported extension

85 X 7469h

Command set/feature enabled

86 X B401h

Command set/feature enabled

87 X 6163h

Command set/feature default

88 X 407Fh

Ultra DMA Modes

89 F 0002h

Time required for security erase unit completion

90 F 0002h

Time required for enhanced security erase completion

91 V 0h Current advanced power management value

92 V 0FFFEh

Master Password Revision Code

94 V 0h Vendor’s recommended and actual acoustic management value

95 F 0h Stream minimum request size

96 V 0h Streaming transfer time - DMA

97 V 0h Streaming access latency - DMA and PIO

98-99 F 0h

Streaming performance granularity

800GB: 5D26CEB0h

104 V 0h Streaming transfer time - PIO

105 V 0004h

Maximum number of 512-byte blocks of LBA Range Entries per DATA

Intel® Solid-State Drive DC S3500

Table 23. Returned Sector Data

V = Variable

400GB: 0FFFFFFFh 480GB: 0FFFFFFFh

600GB: 0FFFFFFFh

100-103 V

7501h

Command sets supported

Hardware reset result: the contents of bits (12:0) of this word shall change only during the execution of a hardware reset

80GB: 0950F8B0h 120GB: 0DF94BB0h 160GB: 12A19EB0h 240GB: 1BF244B0h 300GB: 22EEC130h 400GB: 2E9390B0h 480GB: 37E436B0h 600GB: 45DD2FB0h

Maximum user LBA for 48-bit address feature set

December 2013 Product Specification 328860-002US 31

Table 23. Returned Sector Data

Word

F = Fixed

X = Both

Default Value

Description

SET MANAGEMENT command

106 F 6003h

Physical sector size / logical sector size

107 F 0h Inter-seek delay for ISO-7779 acoustic testing in microseconds

108-111

F varies

Unique ID

112-115

F 0h Reserved for world wide name extension to 128 bits

116 V 0h Reserved for technical report

117-118

F 0h Words per logical sector

119 F 405Ch

Supported settings

120 X 401Ch

Command set/feature enabled/supported

121-126

F 0h Reserved

127 X 0h Removable Media Status Notification feature set support

128 X 0021h

Security status

129 V

001Ch

Vendor-specific

130-139

X 0h Vendor-specific

140-149

Disable Logical Error Field

150-159

Vendor-specific

160 X 0h CompactFlash Association (CFA) power mode 1

161-167

X 0h Reserved for assignment by the CFA

168 X

0003h

Reserved for assignment by the CFA

169 X 0001h

Data set management Trim attribute support

170-175

F 0h Reserved for assignment by the CFA

176-205

V Varies

Current media serial number

206 X 003Dh

SCT Command Transport

207-208

F 0000h

Reserved

209 X 4000h

Alignment of logical blocks within a physical block

210-211

V 0000h

Write-Read-Verify Sector Count Mode 3 (DWord)

212-213

214 X 0000h

NV Cache Capabilities

215-216

V 0000h

NV Cache Size in Logical Blocks (DWord)

217 F 0001h

Nominal media rotation rate

218 V 0000h

Reserved

219 F 0000h

NV Cache Options

220 V 0000h

Write-Read-Verify feature set

221 X 0000h

Reserved

222 F 101Fh

Transport major version number

223 F 0000h

Transport minor version number

224-229

F 0000h

Reserved

230-233

X 0000h

Extended Number of User Addressable Sectors (QWord)

234

F 0001h

command for mode 03h

235

F FFFFh

command for mode 03h

236-254

X 0000h

Reserved

255 V Varies

Integrity word

V = Variable

Intel® Solid-State Drive DC S3500

Notes: F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change

when media is removed or changed.

0000h

Write-Read-Verify Sector Count Mode 2 (DWord)

Minimum number of 512-byte data blocks per DOWNLOAD MICROCODE

Maximum number of 512-byte data blocks per DOWNLOAD MICROCODE

Product Specification December 2013 32 328860-003US

Intel® Solid-State Drive DC S3500

V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the commands executed by the device. X = F or V. The content of the word may be fixed or variable.

December 2013 Product Specification 328860-002US 33

Intel SSDSC2BB080G401, SSDSC1NB080G401, SSDSC2BB300G401, SSDSC2BB240G401, SSDSC2BB160G401 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Revision History

Terms and Acronyms

1.0 Overview

2.0 Product Specifications

2.1 Capacity

2.2 Performance

2.3 Electrical Characteristics

2.4 Environme nt al Conditions

2.5 Product Regulatory Compliance

2.6 Reliability

2.7 Temperature Sensor

2.8 Power Loss Capacitor Test

2.9 Hot Plug Support

3.0 Mechanical Information

4.0 Pin and Signal Descriptions

4.1 2.5-inch Form Factor Pin Locations

4.2 1.8-inch Form Factor Pin Locations

4.3 Connector Pin Signal Definitions

4.4 Power Pin Signal Definitions

5.0 Supported Command Sets

5.1 ATA General Feature Command Set

5.2 Power Management Command Set

5.3 Security Mode Feature Set

5.4 SMART Command Set

5.5 Device Statistics

5.6 SMART Command Transport (SCT)

5.7 Data Set Management Command Set

5.8 Host Protected Area Command Set

5.9 48-Bit Address Command Set

5.10 General Purpose Log Command Set

5.11 Native Comm and Queuing

5.12 Software Settings Preservation

6.0 Certifications and Declarations

7.0 References

Appendix A: IDENTIFY DEVICE Command Data