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Intel® Solid-State Drive DC S3700 Series

Product Specification

 Capacity: 2.5-inch : 100GB, 200GB, 400GB, 800GB

1.8-inch : 200GB, 400GB

 Components:

− Intel

25nm NAND Flash Memory

− High Endurance Technology (HET) Multi-Level Cell (MLC)

 Form Factor: 2.5- and 1.8-inch  Read and Write IOPS

1,2

(Full LBA Range, Iometer*

Queue Depth 32)

− Random 4KB

−

Random 4KB Writes:

− Random 8KB

−

Random 8KB Writes:

 Bandwidth Performance

− Sustained Sequential Read: Up to 500 MB/s

Reads: Up to 75,000 IOPS

Up to 36,000 IOPS

Reads: Up to 47,500 IOPS

Up to 20,000 IOPS

− Sustained Sequential Write: Up to 460 MB/s

 Endurance: 10 drive writes per day  Latency (average sequential)

for 5 years

− Read: 50 µs (TYP)

− Write: 65 µs (TYP)

 Quality of Service

6,8

− Read/Write: 500 µs (99.9% )

 Performa nc e Consistency

7,8

Read/Write: Up to 90%/90% (99.9% )

 AES 256-bit Encryption  Altitude (simulated)

– Operating: -1,000 to 10,000ft – Non-operating: -1,000 to 40,000ft

 Product Ecological Compliance

− RoHS*

 Compliance

− SATA Revision 3.0; compatible with SATA 6Gb/s, 3Gb/s and 1.5Gb/s interface rates

− ATA9-ACS2; includes SCT (Smart Command Transport) and device statistics log support

− Enhanced SMART ATA feature set

− Native Command Queuing (NCQ) command set

− Data set management Trim command

 Power Management

− 2.5” 5V or 12V SATA Supply Rail

− 1.8” 3.3V SATA Supply Rail

− SATA Interface Power Management

− OS-aware hot plug/removal

− Enhanced power-loss data protection

 Power

− Active: Up to 6 W (TYP)

− Idle: 650 mW

 Weight:

− 2.5” 200, 400, 800GB: 73.6 gra ms ± 2 grams

− 2.5” 100GB: 70 grams ± 2 grams

− 1.8” 200, 400GB: 38 grams ± 2 grams

 Temperature

− Operating: 0

− Non-Operating

C to 70o C

: -55o C to 95o C

− Temperature monitoring and logging

− Thermal throttling

 Shock (operating and non-operating):

− 1,000 G/0.5 msec

 Vibration

− Operating: 2.17 GRMS (5-700 Hz)

− Non-operating: 3.13 GRMS (5-800 Hz)

 Reliability

− Uncorrectable Bit Error Rate (UBER): 1 sector per 10

bits read

− Mean Time Between Failures (MTBF): 2 million hours

− End-to-End data-path protection

 Certifications and Declarations

− UL*, CE*, C-Tick*, BSMI*, KCC* , Micr o soft*

WHCK*, VCCI*, SATA-IO*

 Compatibility

− Windows* 7 and Windows* 8

− Windows* Server 2012

− Windows* Server 2008 Ente rprise 32/64bit SP2

− Windows* Server 2008 R2 SP1

− Windows* Server 2003 Ente rprise R2 64bit SP2

− Red Hat* Enterprise Linux* 5.5, 5.6, 6.1, 6.3

− SUSE* Linux Enterprise Server 10, 11 SP1

− CentOS* 64bit 5.7, 6.3

1. Performance values vary by capacity and form factor

2. Performance specifications apply to both compressible and incompressible data

3. 4KB = 4,09 6 bytes; 8 KB = 8,192 bytes.

MB/s = 1,000,000 bytes/second

5. Based on JESD218 standard. For 200GB 1.8 inches drive, it is 9.8 drives write per day.

6. Based on Ra ndom 4KB QD= 1 workload , measured as the time taken for 99 .9

7. Based on Ra ndom 4KB QD= 32 workload, measured as the (IOPS in the 99.9

8. Measurement taken once the workload has reached steady state but including all background activities required for normal operation and data reliability

9. Defaults to 12V, if both 12V and 5V are present

10. Based on 5V supply; refer to Table 7 for more details

11. Please contact your Intel representative for details on the non-operating temperature range

Order Number: 328171-007US

percentile of commands to finish the round-trip from host to d rive and back to host

percentile slowest 1-second interval)/(average IOPS during the test)

Ordering Information

Contact your local Intel sales represe ntative for ordering information.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILIT Y OR WAR R ANTI E S R ELAT ING T O F IT NE SS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIF Y AND HOL D INTE L AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AF F I L IATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLE SS AG AINST AL L CL AI MS COSTS, DAMAGES, AND EXPENSES AND REASONABLE AT T OR NE Y S' FEE S AR ISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH AR I SING IN ANY WAY OU T OF SU CH MISSION CRITI CAL APP LI C AT ION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESI G N, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.

Intel may make changes to specifications and p r o d uc t d es criptions at any time, without no tice. Designers mus t not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not f inaliz e a des ign with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local I nt el s ales office or your distri but or to obtain the latest specifications and before placing your product order. Copies of document s which have an order number and are ref erenced in this document, or other Intel literature, may be obtained b y calling

1-800-548-4725, or go to: http://www.intel.com/design/literature.htm Low Halogen applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased

components on the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame re tardants and/or PVC may not be bett e r for the environment.

Intel and the Intel log o are trademarks of Intel Corporat ion in the U.S. and other countries. *Other names and brand s may be claimed as the property of ot hers. Copyright © 2014 Int el C orpora tion. All rights reserved.

Advance Product Specification March 2014 2 328171-007

Intel® Solid-State Drive DC S3700 Se r ie s

Contents

Revision History ............................................................................................................................. 4

Terms and Acronyms ...................................................................................................................... 5

1.0 Overview ............................................................................................................................ 6

2.0 Product Specifications ......................................................................................................... 7

2.1 Capacity ............................................................................................................................... 7

2.2 Performance ........................................................................................................................ 7

2.3 Electrical Characteristics ..................................................................................................... 9

2.4 Environmental Conditions ................................................................................................. 11

2.5 Product Regulatory Compliance ........................................................................................ 12

2.6 Reliability ........................................................................................................................... 12

2.7 Temperature Sensor .......................................................................................................... 13

2.8 Power Loss Capacitor Test ................................................................................................ 13

2.9 Hot Plug Support ............................................................................................................... 13

3.0 Mechanical Information ..................................................................................................... 14

4.0 Pin and Signal Descriptions ................................................................................................. 16

4.1 2.5” Form Factor Pin Locations ......................................................................................... 16

4.2 1.8” Form Factor Pin Locations ......................................................................................... 16

4.3 Connector Pin Signal Definitions ....................................................................................... 17

4.4 Power Pin Signal Definitions ............................................................................................. 17

5.0 Supported Command Sets .................................................................................................. 19

5.1 ATA General Feature Command Set ................................................................................. 19

5.2 Power Management Command Set .................................................................................. 19

5.3 Security Mode Feature Set ................................................................................................ 19

5.4 SMART Command Set ....................................................................................................... 20

5.5 Device Statistics ................................................................................................................. 25

5.6 SMART Command Transport (SCT) .................................................................................... 27

5.7 Data Set Management Command Set ............................................................................... 27

5.8 Host Protected Area Command Set .................................................................................. 27

5.9 48-Bit Address Command Set ............................................................................................ 27

5.10 General Purpose Log Command Set .................................................................................. 28

5.11 Native Command Queuing ................................................................................................ 28

5.12 Software Settings Preservation ......................................................................................... 28

6.0 Certifications and Declarations ........................................................................................... 28

7.0 References ......................................................................................................................... 29

Appendix A: IDENTIFY DEVICE Command Data ............................................................................... 30

March 2014 Product Specification 328171-007 3

Revision History

Date

Revision

Description

October 2012

001

Initial release

November 2012

002

Updated Power On to Ready specification for 800 GB capacity

SMART Attributes descriptions

March 2013

004

Edited for clarity

GB drive, voltage spec

June 2013

006

Added X,Y, Z dimension in section 3.0

Page 1: Compliance, Changed from ATA8-ACS2 to ATA9-ACS2

Appendix A: Changes to Words 59-62, 80, 81, 89, 90, 129-159, 176-205 and 255.

Intel® Solid-State Drive DC S3700 Se r ie s

February 2013 003

April 2013 005

March 2014 007

Updated: OS Compatibility; Certifications and Declarations; Power Pin Signal Definitions;

Updated Device Identify Table; SMART Attribute Definition. Endurance spec for 1.8-inch 200

Table 14: Changed Endurance Rating Value Table 18: Changed SMART Attribute E9h, PW and Threshold values to 1. Section 5.4.1.1: Added User Notes and changed step 6 in Use Case 2.

Product Specification March 2014 4 328171-007

Table 1. Glossary of Terms a nd Acronyms

ATA

Advanced Technology Attachment

CRC

Cyclic Redundancy Check

DAS

Device Activity Signal

DMA

Direct Memory Access

ECC

Error Correction Code

EXT

Extended

FPDMA

First Party Direct Memory Access

portion of the capacity is used for NAND flash management and maintenance purposes.

Gigabit

HDD

Hard Disk Drive

HET

High Endurance Technology

Kilobyte

I/O

Input/Output

IOPS

Input/Output Operations Per Second

ISO

International Standards Organization

LBA

Logical Block Address

Megabyte (1,000,000 bytes)

MLC

Multi-level Cell

MTBF

Mean Time Between Failures

NCQ

Native Command Queuing

NOP

No Operation

Petabyte

PCB

Printed Circuit Board

PIO

Programmed Input/Output

RDT

Reliability Demonstration Test

RMS

Root Mean Square

SATA

Serial Advanced Technology Attachment

SCT

SMART Command Transport

health of a drive and reports potential problems.

SSD

Solid-State Drive

Terabyte

TYP

Typical

Intel® Solid-State Drive DC S3700 Se r ie s

Terms and Acronyms

Table 1 defines the terms and acronyms used in this document.

Term Definition

SMART

Gigabyte Note: The total usable capacity of the SSD may be less than the total physical capacity because a small

Self-Monitoring, Analysis and Reporting Technology An open standard for developing hard drives and software systems that automatically monitors the

UBER Uncorrectable Bit Error Rate

March 2014 Product Specification 328171-007 5

1.0 Overview

This document describes the specifications and capabilities of the Intel® SSD DC S3700 Series.

The Intel SSD DC S3700 Series delivers lea ding performance an d Qu a lity of Service combined with world-class reliability and endurance for Serial Advanced T ec hnology Attachment (SATA)-based computers in four capacities: 100 GB , 200 GB, 400 GB an d 800 GB.

By combining 25nm Intel support, the Intel SSD DC S3700 Series delivers sequential read speeds of u p to 500 MB/s and sequential write speeds of up to 460 MB/s. Intel S S D DC S3700 Series delivers Quality of Service of 500 us for random 4KB reads a nd writes measured at a queue depth of 1.

The Intel SS D DC S3700 Series also includes High Endurance Technology (HET), which combines NAND silicon enhancements and SSD NAND management techniques to extend the write enduran ce of an SSD, leading to lifetime en durance lev els of 10 drive writes per day for 5 years.

Intel® Solid-State Drive DC S3700 Se r ie s

NAND Flash Mem ory tech nology with S ATA 6Gb/ s inter face

The industry-standard 2.5-inch form factor e nables interchan ge a bility with existing hard disk drives (HDDs) and native SATA HDD drop-in replacement with the enhanced performance, reliability, ruggedness, and power sa vings offered by an SSD.

Intel SSD DC S3700 Series offers these key features:

• High Endurance Technology (HET)

• High I/O and throughput performance

• Consistent I/O latency

• Enhanced power-loss data protection

• End-to-End data-path protection

• Thermal thr ottling

• Temperature Sensor

• Inrush current management

• Low power

• High reliability

• Enhanced ruggedn es s

• Temperature monitor a nd logging

• Power loss prot e c tion capacitor self-test

Product Specification March 2014 6 328171-007

Table 2. User Addressa ble Sectors

Unformatted Capacity

(Total User Addressable Sectors in LBA Mode)

100GB

195,371,568

200GB

390,721,968

400GB

781,422,768

800GB

1,562,824,368

Table 3. Random Read/W rite Input/Output Operat ions Per Second (IOPS)

Intel SSD DC S370 0 Series

100 GB

200 GB

(2.5”/1.8”)

400 GB

(2.5”/1.8”)

Random 4KB Read (up to)2

IOPS

75,000

75,000 / 75,000

75,000

Random 4KB Write (up to)

IOPS

19,000

32,000 / 29,000

36,000 / 36,000

36,000

Random 8KB Read (up to)3

IOPS

47,500

47,500 / 47,500

47,500

Random 8KB Write (up to)

IOPS

9,500

16,500 / 14,500

19,500 / 19,500

20,000

Table 4. Random Read/W rite IOPS Consistency

Intel SSD DC S3700 Series

100 GB

200 GB

(2.5”/1.8”)

400 GB

(2.5”/1.8”)

Random 4KB Read (up to)2

Random 4KB Write (up to)

Random 8KB Read (up to)3

Random 8KB Write (up to)

Notes: 1. Performance measured using Iomet er* wi t h Queue Dep t h 3 2 . Mea s u rements are performed on a full Logical Bloc k

Intel® Solid-State Drive DC S3700 Se r ie s

2.0 Product Specifications

2.1 Capacity

Intel® SSD DC S3700 Series

Notes: 1GB = 1,000,000,000 bytes; 1 sector = 512 bytes. LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive. The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity

2.2 Performance

is used for NAND flash management and maintenance purposes.

Specification1 Unit

Specification4 Unit

Address (LBA) span of the drive.

2. 4KB = 4,096 bytes

3. 8KB = 8,192 bytes

4. Performance consis t ency mea sured using Iometer* based on Random 4K B QD= 3 2 workl o a d, measured as the (IOPS in the 99.9th percentile slowest 1-second interval)/(average IOPS during the test). Meas ur ements are performed on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability

800 GB

March 2014 Product Specification 328171-007 7

Intel® Solid-State Drive DC S3700 Se r ie s

Table 5. Sequential Rea d a nd Write Bandwidth

Intel® SSD DC S3700 Series

100GB

200GB

400GB

800GB

Sequential Read (SATA 6Gb/s)1

MB/s

500

Seque ntial Wr ite (SATA 6Gb/s)1

MB/s

200

365

460

Table 6. Latency

Intel SSD DC S370 0 Series

100, 200 and 400GB

800 GB

Table 7. Quality of Service

Intel SSD DC S3700 Series

Queue Depth=1

Queue Depth=32

100GB

200/400/800

100GB

200/400/800

Quality of Service

(99.9%)

Reads

0.5

0.5 1 1

Writes

0.5

Quality of Service

(99.9999%)

Reads

10 5 10

Writes

10 5 20

Specification Unit

Notes: 1. Performance measured using Iometer* with 128KB (131,072 bytes) of transfer size with Queue Depth 32.

Specification

Latency1 (TYP)

Read Write Power On to Ready

Specification Unit

3,4

Notes:

1. Device measured using Iometer. Latency measured using 4 KB (4,096 bytes) transfer size with Queue Depth equal to 1 on a sequential workload.

2. Power On To Ready time assumes proper shutdown. Time vari es i f s hutd o wn is not preceded by STANDBY IMMEDIATE command.

3. Device measured using Iom eter. Quality of Service measured using 4 KB (4,096 bytes) transfer size on a random workload on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability.

4. Based on Random 4KB QD=1, 32 workloads, measured as the time taken for 99.9(or 99.9999) percentile of commands to finish the round-trip from host to drive and back to host.

50 µs

65 µs

2.0 s

50 µs 65 µs

3.0 s

Product Specification March 2014 8 328171-007

Table 8. Operating Voltage for 2.5-inch Form Fac t or

Intel® SSDDC S3700 Series

100, 200, 400 and 800GB

Inrush Current (Typical Peak) 1

1.0 A, < 1 s

Inrush Current (Typical Peak) 1

1.0 A, < 1 s

Intel SSD DC S3700 Series

100GB

200GB

400GB

800GB

Active Write - RMS Average 1

2.8

4.2

5.2

5.8

Active Write - RMS Burst 2

3.1

4.6

7.7

8.2

Idle

0.6

Intel SSD DC S3700 Series

100GB

200GB

400GB

800GB

Active Write - RMS Average

2.9

4.4

5.4

6.0

Active Write - RMS Burst

8.2

Idle

0.8

Intel® Solid-State Drive DC S3700 Se r ie s

2.3 Electrical Characteristics

Electrical Characteristics

5 V Operating Characteristics:

Operating Voltage range Rise time (Max/Min) Fall time (Min) Noise level

Min Off time

12 V Operating Characteristics:

Operating Voltage range Rise time (Max/Min) Fall time (Min) Noise level

Min Off time

Notes:

1. Measured from initial device power supply application

2. Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss management

3. The drive needs to be powered off for at least 500msec before powering on

500 mV pp 10 Hz – 100 KHz

50 mV pp 100 KHz – 20 MHz

1000 mV pp 10 Hz – 100 KHz

100 mV pp 100 KHz – 20 MHz

5 V (±5%)

1 s / 1 ms

1 ms

500 ms

12 V (±10%)

1 s / 1 ms

1 ms

500 ms

Table 9. Power Consumption for 2.5-inch Form Factor (5V Suppl y )

Specification Unit

0.6 0.6 0.6

Table 10. Power Consumption for 2.5-inch Form Factor (12V Supply)

Specification1 Unit

3.3 4.8 7.6

Notes:

1. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) average power is measured using scope trig ger over a 100 ms sample period

2. The workload equates 128 KB (131,0 7 2 by t es) Qu eue D ep t h eq u al to 32 seq u ential writes. Root Mean Squared (RMS) burst power is measured using scope trig g er ov er a 500 us sample period

March 2014 Product Specification 328171-007 9

Table 11. Operating Voltage and Power Consum ption for 1.8-inch Form Factor

Intel® SSD DC S3700 Series

200 and 400GB

Min Off time3

500 ms

Inrush Current (Typical Peak) 1

1.2 A, < 1 s

Intel SSD DC S3700 Series

200GB

400GB

Active Write - RMS Average @ 3.3V

4.3

5.3

Active Write - RMS Burst @ 3.3V

4.7

7.9

Idle @ 3.3V W 0.6

0.6

Electrical Characteristics

Intel® Solid-State Drive DC S3700 Se r ie s

Operating Voltage for 3.3 V (±5%) Min Max Rise time (Max/Min) Fall time (Min) Noise level

Notes:

1. Measured from initial device power supply application

2. Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss management

3. The drive needs to be powered off for at least 500msec before powering on

300 mV pp 10 Hz – 100 KHz

500 mV pp 100 KHz – 20 MHz

3.13 V

3.47 V

1 s / 1 ms

1 ms

Table 12. Power Consumption for 1.8-inch Form Factor

Specification1 Unit

Notes:

1. The wo rkload equates 128 KB (131,0 72 bytes) Queue Dep th equal to 32 sequential wri tes. Root Mean Squared (RM S) power is measured using scope trigg er ov er a 100 ms sample period.

Product Specification March 2014 10 328171-007

Table 13. Temperature, Shock, Vi bration

Temperature

Range

Non-operating1

-55 – 95 oC

Non-operating

30 oC/hr (Typical)

Non-operating

5 – 95 %

Shock and Vibration

Range

Non-operating

1,000 G (Max) at 0.5 msec

Non-operating

3.13 G

RMS

(5-800 Hz) Max

Intel® Solid-State Drive DC S3700 Se r ie s

2.4 Environme nt al Conditions

Case Temperature Operating

Temperature Gradient Operating

Humidity Operating

Shock Operating

Vibration

Operating

Notes:

30 oC/hr (Typical)

1,000 G (Max) at 0.5 msec

2.17 G

0 – 70 oC

5 – 95 %

(5-700 Hz) Max

RMS

1. Please contact your Intel representative for details on the non-operating temperature range.

2. Temp era t ur e g r a dient measured without condensation.

3. Shock specifi c a tions assume the SSD is mounted securel y with the input vibratio n appli ed to the drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Shock specification is measured using Root Mean Squared (RMS) value.

4. Vibration specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Vibration specification is measured using RMS value.

March 2014 Product Specification 328171-007 11

2.5 Product Regulatory Compliance

Table 14. Product Regulatory Compliance Spec ifications

Region For Which

Conformity Declared

Standard Digital Apparatus

measurement CISPR24:2008 (Modified)

— Part 1: General Requirements

Table 15. Reliability Specifications

to the host.

Test (RDT).

Power On/Off Cycles is defined as power being removed from the

shutdown.

Intel® SSD DC S3700 Series m ee ts or e xceeds the regula tor y or certification requirements in Table 14.

Title Description

Intel® Solid-State Drive DC S3700 Se r ie s

TITLE 47-Telecommunications CHAPTER 1— FEDERAL COMMUNMICATIONS COMMISSION PART 15 — RADIO FREQUENCY DEVICES

ICES-003, Issue 4 Interference-Causing Equipment

IEC 55024 Information Technology Equipment — Immunity characteristics— L imits and methods of measurement CISPR24:2010

IEC 55022 Information Technology Equipment — Radio disturbance Characteristics— Limits and methods of

EN-60950-1 2nd Edition

UL/CSA EN-60950-1 2nd Edition

2.6 Reliability

Intel SSD DC S3700 Series meets or exceeds SSD endurance and data retention requirements as specified in the JESD218 standard. Reliability specif icat ions ar e listed in the table below:

FCC Part 15B Class B

CA/CSA-CEI/IEC CISPR 22:02. This is CISPR 22:1997 with Canadian Modifications

EN-55024: 1998 and its amendments European Union

EN-55022: 2006 and its amendments European Union

Information Technology Equipment — Safety

Information Technology Equipment — Safety — Part 1: General Requirements

USA

Canada

USA/Canada

Parameter Value

Uncorrectable Bit Error Rate (UBER)

Uncorrectable bit error rate will not exc eed o ne sec t o r i n the

specified number of bits read. In the unlikely event of a non-recoverable read error, the SSD will report it as a read failure to the host; the sector in error is considered corrupt and is not returned

Mean Time Between Failures ( M T BF)

Mean Time Between Failures is estimated based o n Telc ordia*

methodology and demonstrated through Reliability Demonstration

Power On/Off Cycles

SSD, and then restored. Most host systems remove power from the SSD when entering suspend and hibernate as well as on a system

Product Specification March 2014 12 328171-007

< 1 sector per 10

2,000,000 hours

24 per day

bits read

Table 15. Reliability Specifications

endurance.

while running JESD218 standard1

Intel® Solid-State Drive DC S3700 Se r ie s

Parameter Value

Insertion Cycles

SATA/power cable insertion/removal c ycles.

Data Retention

The time period for retaining data in the NAND at maximum rated

Endurance Rating

The number of drive writes such that the SSD meets the

requirements according to the JESD218 standard.

Notes:

1 Refer to JESD218 standard table 1 for UBER, FFR and other Enterprise SSD requirements 2 For 200GB 1.8 inches drive it is 9.8 drive writes/day

3 months power-off retention once SSD reaches rated write endurance at 40 °C

100GB: 1.83 PBW 200GB: 3.65 P BW 400GB: 7.30 PB W

800GB: 14.60 PBW

50 on SATA cable 500 on backplane

2.7 Temperature Sensor

The Intel® SSD DC S 3700 Series has an internal temperature sensor with an accuracy of +/-2C over a range of -20C to +80C wh ic h can be monitored using two SMART attributes: Airflow Temperature (BEh) and Device Internal Temperature (C2h).

For more information on supported SMAR T attributes, see Table 19 “SMART Attrib utes” on page 20.

2.8 Power Loss Capacitor Test

The Intel SSD DC S3700 Series supports testing of the power loss capacitor, which can be monitored usin g the following SMART attribute: (175, AFh).

2.9 Hot Plug Support

Hot Plug insertion a nd removal is supported in the presen ce of a proper c onnector a nd appropriate operating system (OS), as described in the SATA 3.0 specification.

This product supports asynchronous signal recovery and issues an unsolicited COMINIT when first mated with a powered connector to guarantee reliable detection by a host system without hardware device detec tion.

March 2014 Product Specification 328171-007 13

Intel® Solid-State Drive DC S3700 Se r ie s

3.0 Mechanical Information

Figures 1 and 2 show the physical package information for the Intel® SSD DC S3700 Series in the 2.5- and 1.8-inch form factors. All dimensions are in millimeters.

Figure 1. Intel SSD DC S3700 Series, 2.5” Form Factor Dimensions

X – Length -- * Y - Width Z - Height

100.45 Max 69.85 +/- 0.25 7.0 +0/-0.5

* - does not include 0.3 connector protrusion

Product Specification March 2014 14 328171-007

Intel® Solid-State Drive DC S3700 Se r ie s

Figure 2. Intel

SSD DC S3700 Series, 1.8” Form Factor Dimensions

X - Length Y - Width Z - Height

78.50 +/- 0.60 54.0 +/- 0.25 5.0 +/- 0.35

March 2014 Product Specification 328171-007 15

Intel® Solid-State Drive DC S3700 Se r ie s

4.0 Pin and Signal Descriptions

4.1 2.5” Form Factor Pin Locations

Figure 4. Layout of 2.5” Form Factor Signal and P owe r Segment Pins

Note: 2.5-inch connector supports built in latching capability.

4.2 1.8” Form Factor Pin Locations

Figure 3. Layout of 1.8” Form Factor Signal and P owe r Segment Pins

Product Specification March 2014 16 328171-007

Table 16. Serial AT A Connector Pin Signal De finitions—2.5” and 1.8” Form Factors

Ground

1st mate

A+

A-

Ground

1st mate

B-

B+

Ground

1st mate

Table 17. Serial ATA P owe r P in Definitions—2.5” Form Factors

P12

Not connected

(3.3 V Power)

P22

Not connected

(3.3 V Power)

P32

Not connected

(3.3 V Power; pre-charge)

2nd Mate

Ground

1st Mate

P53

Ground

1st Mate

P63

Ground

1st Mate

5 V Power

1st Mate

5 V Power

2nd Mate

5 V Power

2nd Mate

P103

Ground

1st Mate

P116

DAS/DSS

Device Activity Signal/Disable Staggered Spin-up

2nd Mate

P12

Ground

1st Mate

P137

V12

12 V Power

1st Mate

P147

V12

12 V Power

2nd Mate

P157

V12

12 V Power

2nd Mate

Intel® Solid-State Drive DC S3700 Se r ie s

4.3 Connector Pin Signal Definitions

Pin Function Definition

Differential signal pair A

Differential signal pair B

Note: Key and spacing separate signal and power segments.

4.4 Power Pin Signal Definitions

Pin1 Function Definition Mating Order

3,4

3,5

3,4

Notes:

1. All pins are in a single row, with a 1.27 mm (0.050-inch) pitch.

2. Pins P1, P2 and P3 are connected together, although they are not connected internally to the device. The host may put 3.3 V on these pins.

3. The mating sequence is:

• ground pins P4-P6, P10, P12 and the 5V power pin P7

• signal pins and the rest of the 5V power pins P8-P9

4. Ground connectors P4 and P12 may contact before the other 1st mate pins in both the power and signal connectors to discharge ESD in a suitably configured backplane connector.

5. Power pins P7, P8, and P9 are internally connected to one another within the device.

6. The host may ground P11 if it is not used for Device Activity Signal (DAS).

7. Pins P13, P14 and P15 are internally connected to one another wi thin the device. The hos t ma y p ut 12 V on these pins.

March 2014 Product Specification 328171-007 17

Intel® Solid-State Drive DC S3700 Se r ie s

Table 18. Serial ATA P owe r P in Definitions—1.8” Form Factors

P12

V33

3.3 V Power

2nd Mate

P22

V33

3.3 V Power, per-charge

2nd Mate

P33

Ground

1st Mate

P43

Ground

1st Mate

P54

5 V Power; not connected.

1st Mate

P64

5 V Power; not connected.

2nd Mate

P75

DAS/DSS

Device Activity Signal/Disable Staggered Spin-up

2nd Mate

Key

P86

Optional

Manufacturing Test Pin

2nd Mate

P96

Optional

Manufacturing Test Pin

2nd Mate

Pin Function Definition Mating Order1

Notes:

1. All mate sequences assume zero angular offset between connectors.

2. P1 and P2 are internally connected to one another within the device.

3. Ground connectors P3 and P4 may contact before the other 1st mate pins in both the power and signal connectors to

discharge ESD in a suitably configure backplane connector.

4. Pins P5 and P6 are not connected internally to the device but there is an option to connect through a zero ohm stuffing

resistor. The host may put 5V on these pins.

5. The host may ground P7 if it is not used for Device Activity Signal (DAS).

6. P8 and P9 should not be connected by the host.

Product Specification March 2014 18 328171-007

Intel® Solid-State Drive DC S3700 Se r ie s

5.0 Supported Command Sets

Intel® SSD DC S3700 Series supports all mandatory ATA (Advanced Technology Attachment) commands defined in the ATA8-ACS specification describ e d in this section.

5.1 ATA General Feature Command Set

The Intel SSD DC S3700 Series supports the ATA General Feature command set (nonPACKET), which consists of:

− EXECUTE DEVICE DIAGNOSTIC

− SET FEATURES

− IDENTIFY DEVICE

Note: See Appendix A, “IDENTIFY DEVICE Com mand Data” on page 30 for details on the sector data returned after issuing an IDENTIFY DEVICE command.

Intel SSD DC S3700 Series also supports the followin g optional commands:

− READ DMA

− WRITE DMA

− READ SECTOR(S)

− READ VERIFY SECTOR(S)

− READ MULTIPLE

− SEEK

− SET FEATURES

− WRITE SECTOR(S)

− SET MULTIPLE MODE1

− WRITE MULTIPLE

− FLUSH CACHE

− READ BUFFFER

− WRITE BUFFER

− NOP

− DOWNLOAD MICROCODE

− WRITE UNCORRECTABLE EXT

1. The only multiple supported will be multiple 1

5.2 Power Management Command Set

Intel SSD DC S3700 Series supports the Power Managemen t c omm a nd set, which consists of:

− CHECK POWER MODE

− IDLE

− IDLE IMMEDIATE

− SLEEP

− STANDBY

− STANDBY IMMEDIATE

5.3 Security Mode Feature Set

Intel SSD DC S3700 Series supports the S ecurity Mode comman d set, which consists of:

− SECURITY SET PASSWORD

− SECURITY UNLOCK

− SECUR ITY ERASE PREPARE

− SECURITY ERASE UNIT

− SECURITY FREEZE LOCK

− SECURITY DISABLE PASSWORD

March 2014 Product Specification 328171-007 19

5.4 SMART Command Set

Table 19. SMART Attributes

Status Flag s

remaining of allowable grown defect count.

Program Fail Count

remaining of allowable program fails.

Erase Fail Count

remaining of allowable erase fails.

Unexpect ed P ower Loss

Normalized value: alw ays 100.

Power Loss Protection Failure

Last test result as microsecond s to discharg e cap, satura tes number of tests.

Intel® SSD DC S3700 Series supports the SMART command set, which consists of:

− SMART READ DATA

− SMART READ ATTRIBUTE THRESHOLDS

− SMART ENABLE/DISABLE ATTRIBUTE AUTOSAVE

− SMART SAVE ATTRIBUTE VALUES

− SMART EXECUTE OFF-LINE IMMEDIATE

− SMART READ LOG SECTOR

− SMART WRITE LOG SECTOR

− SMART ENABLE OPERATIONS

− SMART DISABLE OPERATIONS

− SMART RETURN STATUS

− SMART ENABLE/DISABLE AUTOMATIC OFFLINE

5.4.1 SMART Attributes

Table 19 lists the SMART attri butes supported by the Intel SSD DC S3700 Series and the corresponding status flags and threshold settings.

Intel® Solid-State Drive DC S3700 Se r ie s

ID Attribute

Re-allocated Sector Count

05h

09h

0Ch

AAh Availabl e Res e rved Space (See Attribute E8) 1 1 0 0 1 1 10

ABh

ACh

AEh

Raw value: shows th e number of r etired bloc ks since leaving the factory ( grown d efec t coun t).

Normalized value: b egin ning at 1 00, s hows t he perc ent

Power-On Hours Count Raw value: reports power-on time, cumulative over the life

of the SSD, integer number in hour time units.

Normalized value: always 100.

Power Cycle Count

Raw value: reports the cumulative number of power cycle events over the life of the devi ce.

Normalized value: always 100.

Raw value: shows total count of program fails. Normalized value: beginning at 100, shows the percent

Raw value: shows total count of erase fails. Normalized value: beginning at 100, shows the percent

Also known as “Power-off Retract Count” per magnetic-drive terminology. Raw value: reports number of unclean shutdowns, cumulative ov er the life of the SSD. An “unclean shutdown” is the removal of pow er without STANDBY IMMEDIATE as the last command (regardless of PLI activity using capacitor power).

1 1 0 0 1 0 0 (none)

Threshold

AFh

at max value. Also logs minutes since last test and lifetime

Product Specification March 2014 20 328171-007

1 1 0 0 1 1 10

Table 19. SMART Attributes

Status Flag s

Raw value:

1: Last test result as microseconds to discharge

cap, saturates at max value. Test result expected in rang e

condition, otherwise 100.

SATA Downshift Count

Normalized value: alw ays 100.

Uncorrectable Error Count

Normalized value: alw ays 100.

Temperature - Airflow Temperature (Case)

Normalized value: 100 – case temperature in C degrees

Normalized value: always 100.

device temperature in C deg rees,

Normalized value: always 100.

host system. The raw value is inc rease d by 1 for every

Intel® Solid-State Drive DC S3700 Se r ie s

ID Attribute

Bytes 025 <= result <= 5000000, lower indicates specific error

code. Bytes 2-3: Minutes s ince last test, sat urates at max value. Bytes 4-5: Lifetime number of tests, not incremen ted on power cycle, saturates at max val ue. Normalized val ue: set to 1 on test fail ure or 11 if the capacitor has been tes ted in an excessive temperature

B7h

B8h

BBh

BEh

Raw value: reports number of times SATA interface selected lower signaling rate due to error.

End-to-End Error Det ection Count

Raw value: reports number of End-to-End detected and corrected erro rs b y hardware.

Raw value: shows the number of errors that could not be recovered using Error Correction Code (ECC).

Raw value: reports SSD case temperature statistics.

Bytes 0-1: Current case temperature, Celsius Byte 2: Recent min case temperatu re, Celsius Byte 3: Recent max case temperature, Celsius Bytes 4-5: Over temperature counter. Number of times sampled temperature exceeds drive max operating temperature specification.

Threshold

1 1 0 0 1 0 0 (none)

1 0 0 0 1 0 0 (none)

Power-Off Retract Count (Unsafe Shutdown Count) Raw value: reports the cumulative number of unsafe

C0h

C2h

C5h

C7h

E1h

(unclean) shutdown events over the life of the device. An unsafe shutdown occurs whenever the device is powered off without STANDBYIMMEDIATE being the last command.

Temperature - Device Internal Temperature

Raw value: Reports internal temperature of the SSD in degrees Celsius. Temp er at u re r eading is the value direct from the printed circuit board (PCB) sensor without offset.

Normalized value: 150 – 100 if device temperature less than 50.

Pending Sector Count Raw value: number of current unrecoverable read errors

that will be re-allocated on next write.

CRC Error Count Raw value: shows total number of encountered SATA

interface cyclic redundancy check (CRC) errors.

Host Writes Raw value: reports total number of sectors written by the

March 2014 Product Specification 328171-007 21

1 1 0 0 1 0 0 (none)

1 0 0 0 1 0 0 (none)

0 1 0 0 1 0 0 (none)

1 1 0 0 1 0 0 (none)

Intel® Solid-State Drive DC S3700 Se r ie s

Table 19. SMART Attributes

Status Flag s

65,536 sectors (32MB) written by the host.

Normalized value: always 100.

threshold value for this attribute is 10 percent availability.

wear can be put on the device.

Normalized value: always 100.

the host system. The raw value is increased by 1 for every

Normalized value: always 100.

ID Attribute

Timed Workload Media Wear Raw value: measures the wear seen by the SSD (since

reset of the workload timer, attribute E4h), as a

E2h

E3h

E4h

E8h

E9h

percentage of the maximum rated c ycles. Divide the raw value by 1024 to derive the perc entag e with 3 decimal points.

Timed Workloa d Host Read/Write Ra tio Raw value: shows the percentage of I/O operations that

are read operations (si nce reset of the workload timer, attribute E4h). Reported as integer percentage from 0 to

100.

Timed Workload Timer Raw value: measures the elapsed time (number of

minutes since starting this workload timer).

Available Reserved Space

Raw value: reports number of reserve blocks remaining. Normalized value: begins at 100 , which corresponds to

100 percent availability of the reserved space. The

Media Wearout Indicator

Raw value: always 0. Normalized value: reports the number of cycles the NAND

media ha s under gone. Declines linearly from 100 to 1 as the average erase cycle count i ncreases from 0 to the maximum rated cycles.

Once the nor malized value reaches 1, the numb er will not

decrease, although it is likely that significant additional

Threshold

1 1 0 0 1 0 0 (none)

1 1 0 0 1 1 10

1 1 0 0 1 1 1

Thermal Throttle Status Raw value: reports Percent Throttle Status and Count of events

EAh

F1h

F2h

Byte 0: Throttle status reported as integer percentage. Bytes 1-4: Throttling event count. Number of times thermal throttle has acti vated. Preserved over power cycles. Byte 5: Reserved.

Total LBAs Written

Raw value: reports the total number of sectors written by

65,536 sectors (32MB) written by the host.

Total LBAs Read

Raw value: reports the total number of sectors read by the

host system. The raw value is inc rease d by 1 for every 65,536 sectors (32MB) read by the host.

Product Specification March 2014 22 328171-007

1 1 0 0 1 0 0 (none)

Table 20. SMART Attribute Status Flags

Self-preserving attribute

Not a self-preserving attribute

Self-preserving attribute

Event count attribute

Not an event count attribute

Event count attribute

Error rate attribute

Not an error rate attribute

Error rate attribute

Performance attribute

Not a performance attribute

Performance attribute

online activity

Pre-fail warranty attribute

Advisory

Pre-fail

Intel® Solid-State Drive DC S3700 Se r ie s

Status Flag Description Value = 0 Value = 1

Online collection attribute Collected only during offline activity

5.4.1.1 Timed Workload Endurance Indicators

Timed Workload Medi a Wear Indicator — ID E2h

This attribute tracks the driv e wear seen by the device du ring the last wear timer loop, as a percentage of the maximum rated c ycles. The raw value trac ks the percentage up to 3 decimal points. This value should be divided by 1024 to get the percentage.

For example: if the raw valu e is 4450, the percentage is 4450/1024 = 4.345%. T he raw value is held at FFFFh until the wear timer (attribute E4h) reaches 60 (minutes) after a SMART EXECUTE OFFLINE IMMEDIATE (B0h/D4h) subcommand 40h to the SSD. The normalized value is alway s s et to 100 and should be ignored.

Timed Workload Ho st Reads Percentage — ID E3h

This attribute sh ows the percen tage of I /O oper ati ons th at ar e read oper ation s du rin g the last workload timer loop. The raw value tracks this percentage and is held at FFFFh until the workloa d timer (attribu te E4h) rea ches 60 (minu tes). The norm alized value is always set to 100 and should be ign ored.

Workload Timer — ID E4h

This attribute is u sed to measure the tim e e la psed during th e current workload. T he attribute is reset when a SMART EXECUTE OFFLINE IMMEDIATE (D4h) subcommand 40h is issued to the drive. The raw value tracks the time in minutes and has a maximum value of 232 = 4,294,967,296 minutes (8, 171 years). T he normalized va lue is always set to 100 and should be ign or ed.

Collected during both offline and

March 2014 Product Specification 328171-007 23

Intel® Solid-State Drive DC S3700 Se r ie s

User Notes

• Sending a SMART EXECUTE OFFLINE IMMEDIATE (B0h/D4h) subcommand 40h to the SSD resets and starts all three attributes (Media Wear Indicator, Attribute E2h, Host Reads Percentage, Attribute E3h, and the Workload timer, Attribute E4h) to FFFFh.

• The Attribute raw values are held at FFFFh until the Work load timer (Attr ibute E4h) reaches a total of 60 (minutes) of power on time. After 60 minutes , the Timed Workload data is made available.

• After the Work load timer (E4h ) reaches 60 (minu tes), th e Timed Work load data is saved every minu te so only 59 s econds of data is lost if power is rem oved with out receiving ATA STANDBY IMMEDIA TE. Accumulated data is not reset due to power loss.

• Upon power up, the attributes hold a s napshot of their last sa ved values for 59 seconds and live data is available after 60 seconds, once the initial one hour interval is completed.

Example Use Cases

The Timed Workloa d En du ra nc e attr ibute s d esc rib ed i n this sec tion a re in ten de d to be used to measure the amoun t of media wear that the drive is subjected to durin g a timed workload.

Ideally, the sy stem tha t the drive is bein g used in sh ould be capable of issuing S MART commands. Otherwise, pr ov is ion s have been provided to allow the media wea r attributes to be persistent s o th e dr iv e c a n be moved to a SMART capable system to read out the drive wear attribute values.

Use Case 1 – With a System Capable of SMART Commands

1. On a SMART capable system issue the SMART EXECUTE OFF-LINE IMMEDIATE

(D4h) sub-command 40h to reset the drive wear attributes.

2. Run the workload to be evalu ated for a t least 60 min utes . Other wise the drive

wear attributes will not be available.

3. Read out the drive w e a r attributes with the S M ART READ DATA (D0h ) com-

mand.

Use Case 2 – With a System Not Capable of SMART Commands

1. On a SMART capable system, issue the SMART EXECUTE OFF-LINE IMMEDIATE

(D4h) sub-command 40h to reset the drive wear attributes.

2. Move the drive to the system wh er e the workload will be measured (and n ot

capable of SMART commands).

3. Run the workload to be evalu ated for a t least 60 min utes . Other wise th e drive

wear attributes will not be available.

4. Do a clean system power down by issuing the ATA STANDBY IMMEDIATE

command prior to s hutting down th e system. This will s tore all the drive w e ar SMART attributes to persistent memory within the drive.

5. Move the drive to a SMART capable s ystem.

6. Read out the drive w e a r attributes with the S M ART READ DATA (D0h ) com-

mand within 59 seconds after power-up.

Product Specification March 2014 24 328171-007

Intel® Solid-State Drive DC S3700 Se r ie s

Example Calculation of Drive Wear

The following is an example of how the drive wear attributes can be used to eva lu a te the impact of a given workload. The Host Writes SMART attrib ute (E1h) can als o be used to calculate th e a m ount of data written by the host during the workload by reading this attribute befor e a nd after running the workload. This example assumes that the steps shown in “Exa mple U s e C a s es ” on page 18 were followed to obtain the following attribu te values:

• Timed Work load Media Wear (E2h) has a ra w v a lu e of 16. T herefore, the percentage wear = 16/1024 = 0.016%.

• Timed Workload Host Read/ W r ite R atio (E3h) has a normalized value of 80, indicating that 80% of operations w er e r ea ds .

• Workload T imer (E4h) has a raw va lue of 500. Therefore the workload ran f or 500 minutes.

• Host Writes Count (E1h) had a raw value of 100,000 prior to running the workload and a value of 130,000 at th e end of the workload. Therefor e, the number of sectors written by the h ost during the workload wa s 30,000 * 65,535 = 1,966,050,000 sectors or 1,966,050,000 * 512/1,000,000,000 = 1,007 GB.

The following conclus ions can be made for this example case: The workload took 50 0 minutes to comp lete with 80% reads and 20% writes . A total of

1,007 GB of data was writt en to the device, which in creased the media wear in the driv e by 0.016%. At this point in time, this workload is causing a wear rate of 0.016% for every 500 minutes, or 0.00192%/hour.

5.4.2 SMART Logs

Intel® SSD DC S3700 Series implements the following Log Addresses: 00h, 02h, 03h, 06h, an d 07h.

Intel DC S3700 Series implements host v endor specific logs (addresses 80h-9Fh) as read and write scratchpads , where the default value is zero (0). In tel S SD DC S3700 Series does not writ e a ny specific values to these logs unless directed by the host through the appropriate commands.

Intel DC S3700 Series also implements a devic e ven dor specif ic l og at addr ess A9h as a read-only log area with a default value of z er o (0).

5.5 Device Statistics

In addition to the S MART attri bute str uctu re, sta tistic s perta ining to th e opera tion and health of the Inte l SSD DC S3700 Series ca n be reported to the host on request thr ough the Device Statis tics log as defined in the ATA specification.

The Device Statistics log is a read-on ly GPL/SMART log loca ted at read log addre ss 0x04 and is accessible using READ LOG EXT, READ LOG DMA EXT or SMART READ LOG commands.

Table 21 lists the Dev ice Statistics support ed by the Intel SSD DC S3700 Series.

March 2014 Product Specification 328171-007 25

Intel® Solid-State Drive DC S3700 Se r ie s

Table 21. Device Statistics Log

Equivalent SMART

applicable)

0x00

List of Supported Pages

0x08

Power Cycle Count

0Ch

0x10

Power-On Hours

09h

0x18

Logical Sectors Written

E1h

for every host write

0x28

Logical Sectors Read

F2h

for every host read

and Completion

counts from 1 to 150

Page Offset Description

0x01 – General Statistics

0x04 – General Error Statistics

0x05 – Temperature Statistics

0x06 – Transport Statistics

0x07 – Solid State Device Statistics 0x08 Percentage Used End u ra nce Indicator

0x20

0x30

0x08 Num Reported Uncorrectable Errors BBh

0x10

0x00 Device Statistics Information Header -0x08 Current Temperature -0x10 Average Short Term Temperature -0x18 Average Long Term Temperature -0x20 Highest Temperature -0x28 Lowest Temperature -0x30 Highest Average Short Term Temperatu re -0x38 Lowest Average Short Term Temperature -0x40 Highest Average Long Term Temperature -0x48 Lowest Average Long Term Temperature -0x50 Time in Over-Temperature -0x58 Specified Maximum Operating Temperature -0x60 Time in Under-Temperature -0x68 Specified Minimum Operating Temperature -0x08 Number of Hardware Resets -0x10 Number of ASR Events -0x18 Number of Interface CRC Errors --

Num Write Commands – incremented by one

Num Read Commands – incremented by one

Num Resets Between Command Accep t a nce

attribute (if

E9h

Note: This device statistic

Product Specification March 2014 26 328171-007

Intel® Solid-State Drive DC S3700 Se r ie s

5.6 SMART Command Transport (SCT)

With SMART Command Transport (SCT), a host can send commands and data to an SSD and receive status and data from an SSD using standard write/read commands to manipulate two SM ART Logs:

− Log Address E0h ("SCT Command/Status") — u sed to send commands and retrieve

status

− Log Address E1h ("SCT Data Transfer") — used to transport data

SSD DC S3700 Series supports the following standard SCT actions:

Intel

− Write Same — Intel DC S3700 Series im p lements this ac tion code as described in

the ATA specification.

− Error Recovery Control — Intel DC S3700 Series accepts this action code, and will

store and return error-recovery time limit values.

− Feature Control – Intel DC S3700 Series supports feature code 0001h (write cache)

feature code 0002h (write ca c he reordering), and feature code 000 3h (time interval for temperature lo gging). I t also supports D 000h(Power Safe Wr ite Cache capacitor test interval), (D001h(read/write power governor mode), D002h(read/write therma l governor mode), D003h(read power governor burst power), D004h(read power governor average power).

− Data table command – Intel DC S3700 Series supports data table command as

specified in ATA8-ACS2. This will read out tempera ture logging information in table ID 0002h.

− Read Status Support – Intel DC S3700 Series supports read status log

5.7 Data Set Management Command Set

Intel SSD DC S3700 Series supports the Data Set Management command set Trim attribute, wh ic h consists of:

− DATA SET MANAGEMENT

5.8 Host Protected Area Command Set

Intel SSD DC S3700 Series supports the H os t Protected Area command set, which consists of:

− READ NATIVE MAX ADDRESS

− SET MAX ADDRESS

− READ NATIVE MAX ADDRESS EXT

− SET MAX ADDRESS EXT

Intel SSD DC S3700 Series also supports the following opti onal commands:

− SET MAX SET PASSWORD

− SET MAX LOCK

− SET MAX FREEZE LOCK

− SET MAX UNLOCK

5.9 48-Bit Address Command Set

Intel SSD DC S3700 Series supports the 48-bit Address command set, which consists of:

− FLUSH CACHE EXT

− READ DMA EXT

− READ NATIVE MAX ADDRESS EXT

− READ SECTOR(S) EXT

− READ VERIFY SECTOR(S) EXT

− SET MAX ADDRESS EXT

− WRITE DMA EXT

− WRITE MULTIPLE EXT

− WRITE SECTOR(S) EXT

− WRITE MULTIPLE FUA EXT

− WRITE DMA FUA EXT

March 2014 Product Specification 328171-007 27

Intel® Solid-State Drive DC S3700 Se r ie s

Table 22. Device Certifications and Declarations

Certification

Description

COUNCIL of 15 December 2004.

1: General Requirements)

Compatibility (EMC) Framework requirements of the Australian Communication Authority (ACA).

harmonized with CISPR 22: 2005.04.

requirements of the Radio Research

Laboratory (RRL) Ministry of Information and Communication Republic of Korea.

computers or facsim ile.

RoHS Compliant

Restriction of Hazardous Substance Directive

WEEE

Directive on Waste Electrical and Electronic Equipment

5.10 General Purpose Log Command Set

Intel® SSD DC S3700 Series supports the Gen er a l P urpose Log command set, whic h consists of:

− READ LOG EXT

− WRITE LOG EXT

5.11 Native Comm and Queuing

Intel SSD DC S3700 Series supports the Native Command Queuing (NCQ) command set, which includes:

− READ FPDMA QUEUED

− WRITE FPDMA QUEUED

Note: With a maximum Queue Depth set to 32.

5.12 Software Settings Preservation

Intel SSD DC S3700 Series supports the SET FEA T URE S parameter to enable/disable the preservation of software settin g s .

6.0 Certifications and Declarations

Table 22 describes the De v ic e Certifications supported by th e I ntel SSD DC S3700 Series.

CE Compliant

UL Recognized

C-Tick Compliant

BSMI Compliant

KCC

VCCI

Low Voltage DIRECTIVE 2006/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 12 December 2006, and EMC Directive 2004/108/EC OF THE EUROPEAN PARLIAMENT AND OF THE

Underwriters Laboratories, Inc. Bi-National Component Recognition; UL 60950-1, 2nd Edition, 2007-03-27 (Information Technology Equipment - Safety - Part 1: General Requirements)

CSA C22.2 No. 60950-1-07, 2nd Edition, 2007-03 (Informa tion Tec hnology Equipm ent - Safety - Part

Compliance with the Australia/New Zealand Standard AS/NZS3548 and Electromagnetic

Compliance to the Taiwan EMC standard CNS 13438: Information technology equipment - Radio disturbance Characteristics - limits and methods of measurement, as amended on June 1, 2006, is

Compliance with paragraph 1 of Article 11 of the Electromagnetic Compatibility Control Regulation and meets the Electromagnetic Compatibility (EMC) Framework

Voluntary Control Council for Interface to cope with disturbance problems caused by personal

Product Specification March 2014 28 328171-007

Table 23. Standards References

(JESD219)

nts/results/jesd219

(JESD218)

nts/docs/jesd218/

Dec 2008

VCCI

http://www.vcci.jp/vcci_e/

for material description datasheet

June 2009

Serial ATA Revision 3.0

http://www.sata-io.org/

May 2005

SFF-8201, 2.5-inch dri ve form factor

http://www.sffcommittee.org/

voltage variations immunity tests)

(Radiated electromagnetic field from digital radio telephones)

radimmun.htm/

Intel® Solid-State Drive DC S3700 Se r ie s

7.0 References

Table 23 identifies th e standards inf ormation referenced in this document.

Date Title Location

July 2012

Sept 2010

June 2009 RoHS

August 2009 ACS-2-ATA/ATAPI Command Set 2 Specification http://www.t13.org/

May 2006 SFF-8223, 2.5-inch Drive w/Serial Attachment Connector http://www.sffcommittee.org/

1995 1996 1995 1995 1997 1994

Solid-State Drive (SSD) Requirements and Endurance Test Method

International Electrotechnical Commission EN 61000 4-2 (Electrostatic discharge immunity test) 4-3 (Radiated, radio-frequency, electromagnetic field immunity test) 4-4 (Electrical fast transient/burst immunity test) 4-5 (Surge immunity test) 4-6 (Immunity to conducted disturbances, induced by radio-

frequency fields) 4-11 (Voltage Variations, voltage dips, short interruptions and

http://www.jedec.org/standards-docume

http://qdms.intel.com/ Click Search MDDS Database and search

http://www.iec.ch/

1995 ENV 50204

March 2014 Product Specification 328171-007 29

http://www.dbicorporation.com/

Intel® Solid-State Drive DC S3700 Se r ie s

Table 24. Returned Sector Data

F = Fixed

X = Both

0 X 0040h

General configuration bit-significant information

1 X 3FFFh

Obsolete - Number of logical cylinders (16,383)

2 V C837h

Specific configuration

3 X 0010h

Obsolete - Number of logical heads (16)

4-5 X 0h Retired

6 X 003Fh

Obsolete - Number of logical sectors per logical track (63)

7-8 V 0h Reserved for assignment by the CompactFlash* Association (CFA)

9 X 0h Retired

10-19 F

varies

Serial number (20 ASCII characters)

20-21 X 0h

Retired 22 X 0h

Obsolete

23-26 F

varies

Firmware revision (8 ASCII characters)

27-46 F

varies

Model number (Intel® Solid-State Drive)

8001h

48 F 4000h

Trusted Computing F eatur e Set

49 F 2F00h

Capabilities

50 F 4000h

Capabilities

51-52 X 0h

Obsolete

53 F 0007h

Words 88 and 70:64 valid

54 X 3FFFh

Obsolete - Number of logical cylinders (16,383)

55 X 0010h

Obsolete - Number of logical heads (16)

56 X 003Fh

Obsolete - Number of logical sectors per logical track (63)

57-58 X

FC1000FBh

Obsolete

59 F BF01 Number of sectors transferred per interrupt on multiple commands

800GB: 0FFFFFFFh

62 X 0h

Obsolete

63 X 0007h

Multi-w or d D MA modes supported/selected

64 F 0003h

PIO modes supported

65 F 0078h

Minimum multiword DMA transfer cycle time per word

66 F 0078h

Manufacturer’s recommended multiword DMA transfer cycle time

67 F 0078h

Minimum PIO transfer cycle time without flow control

68 F 0078h

Minimum PIO transfer cycle time with IORDY flow control

69 F 4030h

Additional Supported

70 F 0000h

Reserved

71-74 F 0h

Reserved for IDENTIFY PACKET DEVICE command

75 F 001Fh

Queue depth

76 F 850Eh

Serial ATA capabilities

77 F 0006h

Reserved for future Serial ATA definition

78 F 0040h

Serial ATA features supported

79 V 0040h

Serial ATA features enabled

Appendix A: IDENTIFY DEVICE Command Data

Word

V = Variable

Default Value Description

7:0—Maximum number of sectors transferred per interrupt on multiple commands

60-61

100GB: 0BA52230h 200GB: 0FFFFFFFh 400GB: 0FFFFFFFh

Product Specification March 2014 30 328171-007

Total number of user-addressable sector

Table 24. Returned Sector Data

F = Fixed

X = Both

80 F 03FCh

Major version number

81 F 0110h

Minor version number

82 F 746Bh

Command set supported

84 F 6163h

Command set/feature supported extension

85 V 7469h

Command set/feature enabled

86 V B401h

Command set/feature enabled

87 V 6163h

Command set/feature default

88 V 407Fh

Ultra DMA Modes

89 F 0002h

Time required for security erase unit completion

90 F 0002h

Time required for enhanced security erase completion

91 V 0h Current advanced power management value

92 V 0FFFEh

Master Password Revision Code

94 V 0h Vendor’s recommended and actual acoustic management value

95 F 0h Stream minimum request size

96 V 0h Streaming transfer time - DMA

97 V 0h Streaming access latency - DMA and PIO

98-99 F 0h

Streaming performance granularity

800GB: 5D26CEB0h

104 V 0h Streaming transfer time - PIO

106 F 6003h

Physical sector size / logical sector size

107 F 0h Inter-seek delay for ISO-7779 acoustic testing in microseconds

108-111

F varies

Unique ID

112-115

F 0h Reserved for world wide name extension to 128 bits

116 V 0h Reserved for technical report

117-118

F 0h Words per logical sector

119 F 405Ch

Supported settings

120 F 401Ch

Command set/feature enabled/supported

121-126

F 0h Reserved

127 X 0h Removable Media Status Notification feature set support

128 V 0021h

Security status

129 V

1Ch Vendor-specific

130-139

X 0h Vendor-specific

140-149

Disable Logical Error Field

150-159

Vendor-specific

160 X 0h CompactFlash Association (CFA) power mode 1

161-167

X 0h Reserved for assignment by the CFA

168 X 3h

Reserved for assignment by the CFA

169 X 0001h

Data set management Trim attribute support

Intel® Solid-State Drive DC S3700 Se r ie s

Word

100-103 V

V = Variable

Default Value Description

7501h

Command sets supported

Hardware reset result: the contents of bits (12:0) of this word shall change only during the execution of a hardware reset

100GB: 0BA52230h 200GB: 1749F1B0h 400GB: 2E9390B0h

Maximum user LBA for 48-bit address feature set

105

0004h

Maximum number of 512-byte blocks of LBA Range Entries per DATA

SET MANAGEMENT command

March 2014 Product Specification 328171-007 31

Intel® Solid-State Drive DC S3700 Se r ie s

Table 24. Returned Sector Data

F = Fixed

X = Both

170-175

F 0h Reserved for assignment by the CFA

176-205

X Varies

Current media serial number

206 X 003Dh

SCT Command Transport

207-208

F 0000h

Reserved

209 X 4000h

Alignment of logical blocks within a physical block

210-211

V 0000h

Write-Read-Verify Sector Count Mode 3 (DWord)

212-213

F 0000h

Write-Read-Verify Sector Count Mode 2 (DWord)

214 X 0000h

NV Cache Capabilities

215-216

V 0000h

NV Cache Size in Logical Blocks (DWord)

217 F 0001h

Nominal media rotation rate

218 V 0000h

Reserved

219 F 0000h

NV Cache Options

220 V 0000h

Write-Read-Verify feature set

221 X 0000h

Reserved

222 F 101Fh

Transport major version number

223 F 0000h

Transport minor version number

224-229

F 0000h

Reserved

230-233

X 0000h

Extended Number of User Addressable Sectors (QWord)

235

F FFFFh

command for mode 03h

236-254

X 0000h

Reserved

255 V Varies

Integrity word

Word

234

V = Variable

Default Value Description

0001h

Minimum number of 512-byte data blocks per DOWNLOAD MICROCODE command for mode 03h

Maximum number of 512-byte data blocks per DOWNLOAD MICROCODE

Notes: F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change

when media is removed or changed. V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the commands executed by the device. X = F or V. The content of the word may be fixed or variable.

Product Specification March 2014 32 328171-007

Intel SSDSC2BA800G301, SSDSC2BA100G301, SSDSC2BA200G301, SSDSC2BA400G301 User manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Revision History

Terms and Acronyms

1.0 Overview

2.0 Product Specifications

2.1 Capacity

2.2 Performance

2.3 Electrical Characteristics

2.4 Environme nt al Conditions

2.5 Product Regulatory Compliance

2.6 Reliability

2.7 Temperature Sensor

2.8 Power Loss Capacitor Test

2.9 Hot Plug Support

3.0 Mechanical Information

4.0 Pin and Signal Descriptions

4.1 2.5” Form Factor Pin Locations

4.2 1.8” Form Factor Pin Locations

4.3 Connector Pin Signal Definitions

4.4 Power Pin Signal Definitions

5.0 Supported Command Sets

5.1 ATA General Feature Command Set

5.2 Power Management Command Set

5.3 Security Mode Feature Set

5.4 SMART Command Set

5.5 Device Statistics

5.6 SMART Command Transport (SCT)

5.7 Data Set Management Command Set

5.8 Host Protected Area Command Set

5.9 48-Bit Address Command Set

5.10 General Purpose Log Command Set

5.11 Native Comm and Queuing

5.12 Software Settings Preservation

6.0 Certifications and Declarations

7.0 References

Appendix A: IDENTIFY DEVICE Command Data