Intel SSDSC2BA800G301, SSDSC2BA100G301, SSDSC2BA200G301, SSDSC2BA400G301 User manual

Intel® Solid-State Drive DC S3700 Series

Product Specification

Capacity: 2.5-inch : 100GB, 200GB, 400GB, 800GB 1.8-inch : 200GB, 400GB

Components:

−Intel® 25nm NAND Flash Memory

−High Endurance Technology (HET) Multi-Level Cell (MLC)

Form Factor: 2.5- and 1.8-inch

Read and Write IOPS1,2 (Full LBA Range, Iometer* Queue Depth 32)

−Random 4KB3 Reads: Up to 75,000 IOPS

−Random 4KB Writes: Up to 36,000 IOPS

−Random 8KB3 Reads: Up to 47,500 IOPS

−Random 8KB Writes: Up to 20,000 IOPS

Bandwidth Performance1

−Sustained Sequential Read: Up to 500 MB/s4

−Sustained Sequential Write: Up to 460 MB/s

Endurance: 10 drive writes per day5 for 5 years

Latency (average sequential)

−Read: 50 µs (TYP)

−Write: 65 µs (TYP)

Quality of Service6,8

−Read/Write: 500 µs (99.9%)

Performance Consistency7,8

Read/Write: Up to 90%/90% (99.9%)

AES 256-bit Encryption

Altitude (simulated)

–Operating: -1,000 to 10,000ft

–Non-operating: -1,000 to 40,000ft

Product Ecological Compliance

−RoHS*

Compliance

−SATA Revision 3.0; compatible with SATA 6Gb/s, 3Gb/s and 1.5Gb/s interface rates

−ATA9-ACS2; includes SCT (Smart Command Transport) and device statistics log support

−Enhanced SMART ATA feature set

−Native Command Queuing (NCQ) command set

−Data set management Trim command

Power Management

−2.5” 5V or 12V SATA Supply Rail9

−1.8” 3.3V SATA Supply Rail

−SATA Interface Power Management

−OS-aware hot plug/removal

−Enhanced power-loss data protection

Power10

−Active: Up to 6 W (TYP)

−Idle: 650 mW

Weight:

−2.5” 200, 400, 800GB: 73.6 grams ± 2 grams

−2.5” 100GB: 70 grams ± 2 grams

−1.8” 200, 400GB: 38 grams ± 2 grams

Temperature

−Operating: 0o C to 70o C

−Non-Operating11: -55o C to 95o C

−Temperature monitoring and logging

−Thermal throttling

Shock (operating and non-operating):

−1,000 G/0.5 msec

Vibration

−Operating: 2.17 GRMS (5-700 Hz)

−Non-operating: 3.13 GRMS (5-800 Hz)

Reliability

−Uncorrectable Bit Error Rate (UBER):

1sector per 1017 bits read

−Mean Time Between Failures (MTBF):

2 million hours

−End-to-End data-path protection

Certifications and Declarations

−UL*, CE*, C-Tick*, BSMI*, KCC*, Microsoft* WHCK*, VCCI*, SATA-IO*

Compatibility

−Windows* 7 and Windows* 8

−Windows* Server 2012

−Windows* Server 2008 Enterprise 32/64bit SP2

−Windows* Server 2008 R2 SP1

−Windows* Server 2003 Enterprise R2 64bit SP2

−Red Hat* Enterprise Linux* 5.5, 5.6, 6.1, 6.3

−SUSE* Linux Enterprise Server 10, 11 SP1

−CentOS* 64bit 5.7, 6.3

−Intel® SSD Toolbox with Intel® SSD Optimizer

1.Performance values vary by capacityandformfactor

2.Performance specifications apply to both compressible and incompressible data

3.4KB = 4,096 bytes; 8KB = 8,192 bytes.

4.MB/s = 1,000,000 bytes/second

5.Based on JESD218 standard. For 200GB 1.8 inches drive, it is 9.8 drives write per day.

6.Based on Random 4KB QD=1 workload, measured as the time taken for 99.9 percentile of commands to finish the round-trip from host to drive and back to host

7.Based on Random 4KB QD=32 workload, measured as the (IOPS in the 99.9th percentile slowest 1-second interval)/(average IOPS during the test)

8.Measurement taken once the workload has reached steady state but including all background activities required for normal operation and data reliability

9.Defaults to 12V, if both 12V and 5V are present

10.Based on 5V supply; refer to Table 7 for more details

11.Please contact your Intel representative for details on the non-operating temperature range

Order Number: 328171-007US

Ordering Information

Contact your local Intel sales representative for ordering information.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

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Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm

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Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others.

Copyright © 2014 Intel Corporation. All rights reserved.

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Contents

Revision History .............................................................................................................................			4
Terms and Acronyms......................................................................................................................			5
1.0	Overview ............................................................................................................................		6
2.0	Product Specifications .........................................................................................................		7
	2.1	Capacity...............................................................................................................................	7
	2.2	Performance........................................................................................................................	7
	2.3	Electrical Characteristics .....................................................................................................	9
	2.4	Environmental Conditions.................................................................................................	11
	2.5	Product Regulatory Compliance........................................................................................	12
	2.6	Reliability...........................................................................................................................	12
	2.7	Temperature Sensor..........................................................................................................	13
	2.8	Power Loss Capacitor Test ................................................................................................	13
	2.9	Hot Plug Support ...............................................................................................................	13
3.0	Mechanical Information .....................................................................................................		14
4.0	Pin and Signal Descriptions.................................................................................................		16
	4.1	2.5” Form Factor Pin Locations .........................................................................................	16
	4.2	1.8” Form Factor Pin Locations .........................................................................................	16
	4.3	Connector Pin Signal Definitions.......................................................................................	17
	4.4	Power Pin Signal Definitions .............................................................................................	17
5.0	Supported Command Sets ..................................................................................................		19
	5.1	ATA General Feature Command Set .................................................................................	19
	5.2	Power Management Command Set ..................................................................................	19
	5.3	Security Mode Feature Set................................................................................................	19
	5.4	SMART Command Set .......................................................................................................	20
	5.5	Device Statistics.................................................................................................................	25
	5.6	SMART Command Transport (SCT)....................................................................................	27
	5.7	Data Set Management Command Set...............................................................................	27
	5.8	Host Protected Area Command Set ..................................................................................	27
	5.9	48-Bit Address Command Set............................................................................................	27
	5.10	General Purpose Log Command Set..................................................................................	28
	5.11	Native Command Queuing................................................................................................	28
	5.12	Software Settings Preservation.........................................................................................	28
6.0	Certifications and Declarations ...........................................................................................		28
7.0	References .........................................................................................................................		29
Appendix A: IDENTIFY DEVICE Command Data ...............................................................................			30
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Revision History

	Date	Revision	Description
	October 2012	001	Initial release
	November 2012	002	Updated Power On to Ready specification for 800 GB capacity
	February 2013	003	Updated: OS Compatibility; Certifications and Declarations; Power Pin Signal Definitions;
			SMART Attributes descriptions
	March 2013	004	Edited for clarity
	April 2013	005	Updated Device Identify Table; SMART Attribute Definition. Endurance spec for 1.8-inch 200
			GB drive, voltage spec
	June 2013	006	Added X,Y, Z dimension in section 3.0
			Page 1: Compliance, Changed from ATA8-ACS2 to ATA9-ACS2
			Table 14: Changed Endurance Rating Value
	March 2014	007	Table 18: Changed SMART Attribute E9h, PW and Threshold values to 1.
			Section 5.4.1.1: Added User Notes and changed step 6 in Use Case 2.
			Appendix A: Changes to Words 59-62, 80, 81, 89, 90, 129-159, 176-205 and 255.

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Terms and Acronyms

Table 1 defines the terms and acronyms used in this document.

Table 1.	Glossary of Terms and Acronyms
Term		Definition
ATA		Advanced Technology Attachment
CRC		Cyclic Redundancy Check
DAS		Device Activity Signal
DMA		Direct Memory Access
ECC		Error Correction Code
EXT		Extended
FPDMA		First Party Direct Memory Access
		Gigabyte
GB		Note: The total usable capacity of the SSD may be less than the total physical capacity because a small
		portion of the capacity is used for NAND flash management and maintenance purposes.
Gb		Gigabit
HDD		Hard Disk Drive
HET		High Endurance Technology
KB		Kilobyte
I/O		Input/Output
IOPS		Input/Output Operations Per Second
ISO		International Standards Organization
LBA		Logical Block Address
MB		Megabyte (1,000,000 bytes)
MLC		Multi-level Cell
MTBF		Mean Time Between Failures
NCQ		Native Command Queuing
NOP		No Operation
PB		Petabyte
PCB		Printed Circuit Board
PIO		Programmed Input/Output
RDT		Reliability Demonstration Test
RMS		Root Mean Square
SATA		Serial Advanced Technology Attachment
SCT		SMART Command Transport
		Self-Monitoring, Analysis and Reporting Technology
SMART		An open standard for developing hard drives and software systems that automatically monitors the
		health of a drive and reports potential problems.
SSD		Solid-State Drive
TB		Terabyte
TYP		Typical
UBER		Uncorrectable Bit Error Rate

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1.0Overview

This document describes the specifications and capabilities of the Intel® SSD DC S3700 Series.

The Intel SSD DC S3700 Series delivers leading performance and Quality of Service combined with world-class reliability and endurance for Serial Advanced Technology Attachment (SATA)-based computers in four capacities: 100 GB, 200 GB, 400 GB and 800 GB.

By combining 25nm Intel® NAND Flash Memory technology with SATA 6Gb/s interface support, the Intel SSD DC S3700 Series delivers sequential read speeds of up to 500 MB/s and sequential write speeds of up to 460 MB/s. Intel SSD DC S3700 Series delivers Quality of Service of 500 us for random 4KB reads and writes measured at a queue depth of 1.

The Intel SSD DC S3700 Series also includes High Endurance Technology (HET), which combines NAND silicon enhancements and SSD NAND management techniques to extend the write endurance of an SSD, leading to lifetime endurance levels of 10 drive writes per day for 5 years.

The industry-standard 2.5-inch form factor enables interchangeability with existing hard disk drives (HDDs) and native SATA HDD drop-in replacement with the enhanced performance, reliability, ruggedness, and power savings offered by an SSD.

Intel SSD DC S3700 Series offers these key features:

•High Endurance Technology (HET)

•High I/O and throughput performance

•Consistent I/O latency

•Enhanced power-loss data protection

•End-to-End data-path protection

•Thermal throttling

•Temperature Sensor

•Inrush current management

•Low power

•High reliability

•Enhanced ruggedness

•Temperature monitor and logging

•Power loss protection capacitor self-test

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2.0Product Specifications

2.1Capacity

Table 2.	User Addressable Sectors
Intel® SSD DC S3700 Series			Unformatted Capacity
			(Total User Addressable Sectors in LBA Mode)
	100GB		195,371,568
	200GB		390,721,968
	400GB		781,422,768
	800GB		1,562,824,368

Notes: 1GB = 1,000,000,000 bytes; 1 sector = 512 bytes.

LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive.

The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND flash management and maintenance purposes.

2.2Performance

Table 3.	Random Read/Write Input/Output Operations Per Second (IOPS)
Specification1		Unit			Intel SSD DC S3700 Series
			100 GB		200 GB			400 GB		800 GB
					(2.5”/1.8”)			(2.5”/1.8”)
Random 4KB Read (up to)2		IOPS	75,000	75,000 / 75,000			75,000 / 75,000			75,000
Random 4KB Write (up to)		IOPS	19,000	32,000 / 29,000			36,000 / 36,000			36,000
Random 8KB Read (up to)3		IOPS	47,500	47,500 / 47,500			47,500 / 47,500			47,500
Random 8KB Write (up to)		IOPS	9,500	16,500 / 14,500			19,500 / 19,500			20,000

Table 4.	Random Read/Write IOPS Consistency
Specification4		Unit			Intel SSD DC S3700 Series
			100 GB		200 GB			400 GB		800 GB
					(2.5”/1.8”)			(2.5”/1.8”)
Random 4KB Read (up to)2		%	90	90			90			90
Random 4KB Write (up to)		%	85	90			90			90
Random 8KB Read (up to)3		%	90	90			90			90
Random 8KB Write (up to)		%	85	90			90			90

Notes: 1. Performance measured using Iometer* with Queue Depth 32. Measurements are performed on a full Logical Block

Address (LBA) span of the drive.

2.4KB = 4,096 bytes

3.8KB = 8,192 bytes

4.Performance consistency measured using Iometer* based on Random 4KB QD=32 workload, measured as the (IOPS in the 99.9th percentile slowest 1-second interval)/(average IOPS during the test). Measurements are performed on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability

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Table 5.	Sequential Read and Write Bandwidth
					Intel® SSD DC S3700 Series
Specification		Unit
				100GB	200GB	400GB	800GB
Sequential Read (SATA 6Gb/s)1		MB/s	500		500	500	500
Sequential Write (SATA 6Gb/s)1		MB/s	200		365	460	460
Notes: 1. Performance measured		using Iometer* with 128KB (131,072 bytes) of transfer size with Queue Depth 32.

Table 6.	Latency
Specification			Intel SSD DC S3700 Series
			100, 200 and 400GB		800 GB
Latency1 (TYP)
Read			50 µs		50 µs
Write			65 µs		65 µs
Power On to Ready2			2.0 s		3.0 s

Table 7.	Quality of Service
					Intel SSD DC S3700 Series
Specification		Unit	Queue Depth=1			Queue Depth=32
			100GB		200/400/800	100GB		200/400/800
					GB			GB
Quality of Service3,4 (99.9%)
Reads		ms	0.5		0.5	1		1
Writes		ms	0.5		0.5	15		10
Quality of Service3,4 (99.9999%)
Reads		ms	10		5	10		5
Writes		ms	10		5	20		20

Notes:

1.Device measured using Iometer. Latency measured using 4 KB (4,096 bytes) transfer size with Queue Depth equal to 1 on a sequential workload.

2.Power On To Ready time assumes proper shutdown. Time varies if shutdown is not preceded by STANDBY IMMEDIATE command.

3.Device measured using Iometer. Quality of Service measured using 4 KB (4,096 bytes) transfer size on a random workload on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability.

4.Based on Random 4KB QD=1, 32 workloads, measured as the time taken for 99.9(or 99.9999) percentile of commands to finish the round-trip from host to drive and back to host.

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2.3Electrical Characteristics

Table 8.	Operating Voltage for 2.5-inch Form Factor
			Intel® SSDDC S3700 Series
Electrical Characteristics
			100, 200, 400 and 800GB
5 V Operating Characteristics:
Operating Voltage range			5 V (±5%)
Rise time (Max/Min)			1 s / 1 ms
Fall time (Min)2			1 ms
Noise level			500 mV pp 10 Hz – 100 KHz
			50 mV pp 100 KHz – 20 MHz
Min Off time3			500 ms
Inrush Current (Typical Peak) 1			1.0 A, < 1 s
12 V Operating Characteristics:
Operating Voltage range			12 V (±10%)
Rise time (Max/Min)			1 s / 1 ms
Fall time (Min)2			1 ms
Noise level			1000 mV pp 10 Hz – 100 KHz
			100 mV pp 100 KHz – 20 MHz
Min Off time3			500 ms
Inrush Current (Typical Peak) 1			1.0 A, < 1 s

Notes:

1.Measured from initial device power supply application

2.Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss management

3.The drive needs to be powered off for at least 500msec before powering on

Table 9. Power Consumption for 2.5-inch Form Factor (5V Supply)

				Intel SSD DC S3700 Series
Specification	Unit
			100GB	200GB	400GB	800GB
Active Write - RMS Average 1	W	2.8		4.2	5.2	5.8
Active Write - RMS Burst 2	W	3.1		4.6	7.7	8.2
Idle	W	0.6		0.6	0.6	0.6

Table 10. Power Consumption for 2.5-inch Form Factor (12V Supply)

				Intel SSD DC S3700 Series
Specification1	Unit
			100GB	200GB	400GB	800GB
Active Write - RMS Average	W	2.9		4.4	5.4	6.0
Active Write - RMS Burst	W	3.3		4.8	7.6	8.2
Idle	W	0.8		0.8	0.8	0.8

Notes:

1.The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) average power is measured using scope trigger over a 100 ms sample period

2.The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) burst power is measured using scope trigger over a 500 us sample period

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	Table 11.	Operating Voltage and Power Consumption for 1.8-inch Form Factor
	Electrical Characteristics		Intel® SSD DC S3700 Series
			200 and 400GB
	Operating Voltage for 3.3 V (±5%)
	Min		3.13 V
	Max		3.47 V
	Rise time (Max/Min)		1 s / 1 ms
	Fall time (Min)2		1 ms
	Noise level		300 mV pp 10 Hz – 100 KHz
			500 mV pp 100 KHz – 20 MHz
	Min Off time3		500 ms
	Inrush Current (Typical Peak) 1		1.2 A, < 1 s

Notes:

1.Measured from initial device power supply application

2.Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss management

3.The drive needs to be powered off for at least 500msec before powering on

Table 12.	Power Consumption for 1.8-inch Form Factor
Specification1		Unit	Intel SSD DC S3700 Series
			200GB	400GB
Active Write - RMS Average @ 3.3V		W	4.3	5.3

Active Write - RMS Burst @ 3.3V	W	4.7	7.9
Idle @ 3.3V	W	0.6	0.6

Notes:

1.The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) power is measured using scope trigger over a 100 ms sample period.

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