Intel SSDSC2BA800G301, SSDSC2BA100G301, SSDSC2BA200G301, SSDSC2BA400G301 User manual

− Intel® SSD Toolbox with Intel® SSD Optimizer

Intel® Solid-State Drive DC S3700 Series

Product Specification

 Capacity: 2.5-inch : 100GB, 200GB, 400GB, 800GB

1.8-inch : 200GB, 400GB

 Components:

− Intel

25nm NAND Flash Memory

− High Endurance Technology (HET) Multi-Level Cell (MLC)

 Form Factor: 2.5- and 1.8-inch  Read and Write IOPS

1,2

(Full LBA Range, Iometer*

Queue Depth 32)

− Random 4KB

−

Random 4KB Writes:

− Random 8KB

−

Random 8KB Writes:

 Bandwidth Performance

− Sustained Sequential Read: Up to 500 MB/s

Reads: Up to 75,000 IOPS

Up to 36,000 IOPS

Reads: Up to 47,500 IOPS

Up to 20,000 IOPS

− Sustained Sequential Write: Up to 460 MB/s

 Endurance: 10 drive writes per day  Latency (average sequential)

for 5 years

− Read: 50 µs (TYP)

− Write: 65 µs (TYP)

 Quality of Service

6,8

− Read/Write: 500 µs (99.9% )

 Performa nc e Consistency

7,8

Read/Write: Up to 90%/90% (99.9% )

 AES 256-bit Encryption  Altitude (simulated)

– Operating: -1,000 to 10,000ft – Non-operating: -1,000 to 40,000ft

 Product Ecological Compliance

− RoHS*

 Compliance

− SATA Revision 3.0; compatible with SATA 6Gb/s, 3Gb/s and 1.5Gb/s interface rates

− ATA9-ACS2; includes SCT (Smart Command Transport) and device statistics log support

− Enhanced SMART ATA feature set

− Native Command Queuing (NCQ) command set

− Data set management Trim command

 Power Management

− 2.5” 5V or 12V SATA Supply Rail

− 1.8” 3.3V SATA Supply Rail

− SATA Interface Power Management

− OS-aware hot plug/removal

− Enhanced power-loss data protection

 Power

− Active: Up to 6 W (TYP)

− Idle: 650 mW

 Weight:

− 2.5” 200, 400, 800GB: 73.6 gra ms ± 2 grams

− 2.5” 100GB: 70 grams ± 2 grams

− 1.8” 200, 400GB: 38 grams ± 2 grams

 Temperature

− Operating: 0

− Non-Operating

C to 70o C

: -55o C to 95o C

− Temperature monitoring and logging

− Thermal throttling

 Shock (operating and non-operating):

− 1,000 G/0.5 msec

 Vibration

− Operating: 2.17 GRMS (5-700 Hz)

− Non-operating: 3.13 GRMS (5-800 Hz)

 Reliability

− Uncorrectable Bit Error Rate (UBER): 1 sector per 10

bits read

− Mean Time Between Failures (MTBF): 2 million hours

− End-to-End data-path protection

 Certifications and Declarations

− UL*, CE*, C-Tick*, BSMI*, KCC* , Micr o soft*

WHCK*, VCCI*, SATA-IO*

 Compatibility

− Windows* 7 and Windows* 8

− Windows* Server 2012

− Windows* Server 2008 Ente rprise 32/64bit SP2

− Windows* Server 2008 R2 SP1

− Windows* Server 2003 Ente rprise R2 64bit SP2

− Red Hat* Enterprise Linux* 5.5, 5.6, 6.1, 6.3

− SUSE* Linux Enterprise Server 10, 11 SP1

− CentOS* 64bit 5.7, 6.3

1. Performance values vary by capacity and form factor

2. Performance specifications apply to both compressible and incompressible data

3. 4KB = 4,09 6 bytes; 8 KB = 8,192 bytes.

MB/s = 1,000,000 bytes/second

5. Based on JESD218 standard. For 200GB 1.8 inches drive, it is 9.8 drives write per day.

6. Based on Ra ndom 4KB QD= 1 workload , measured as the time taken for 99 .9

7. Based on Ra ndom 4KB QD= 32 workload, measured as the (IOPS in the 99.9

8. Measurement taken once the workload has reached steady state but including all background activities required for normal operation and data reliability

9. Defaults to 12V, if both 12V and 5V are present

10. Based on 5V supply; refer to Table 7 for more details

11. Please contact your Intel representative for details on the non-operating temperature range

Order Number: 328171-007US

percentile of commands to finish the round-trip from host to d rive and back to host

percentile slowest 1-second interval)/(average IOPS during the test)

Ordering Information

Contact your local Intel sales represe ntative for ordering information.

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Intel may make changes to specifications and p r o d uc t d es criptions at any time, without no tice. Designers mus t not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not f inaliz e a des ign with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local I nt el s ales office or your distri but or to obtain the latest specifications and before placing your product order. Copies of document s which have an order number and are ref erenced in this document, or other Intel literature, may be obtained b y calling

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Intel and the Intel log o are trademarks of Intel Corporat ion in the U.S. and other countries. *Other names and brand s may be claimed as the property of ot hers. Copyright © 2014 Int el C orpora tion. All rights reserved.

Advance Product Specification March 2014 2 328171-007

Intel® Solid-State Drive DC S3700 Se r ie s

Contents

Revision History ............................................................................................................................. 4

Terms and Acronyms ...................................................................................................................... 5

1.0 Overview ............................................................................................................................ 6

2.0 Product Specifications ......................................................................................................... 7

2.1 Capacity ............................................................................................................................... 7

2.2 Performance ........................................................................................................................ 7

2.3 Electrical Characteristics ..................................................................................................... 9

2.4 Environmental Conditions ................................................................................................. 11

2.5 Product Regulatory Compliance ........................................................................................ 12

2.6 Reliability ........................................................................................................................... 12

2.7 Temperature Sensor .......................................................................................................... 13

2.8 Power Loss Capacitor Test ................................................................................................ 13

2.9 Hot Plug Support ............................................................................................................... 13

3.0 Mechanical Information ..................................................................................................... 14

4.0 Pin and Signal Descriptions ................................................................................................. 16

4.1 2.5” Form Factor Pin Locations ......................................................................................... 16

4.2 1.8” Form Factor Pin Locations ......................................................................................... 16

4.3 Connector Pin Signal Definitions ....................................................................................... 17

4.4 Power Pin Signal Definitions ............................................................................................. 17

5.0 Supported Command Sets .................................................................................................. 19

5.1 ATA General Feature Command Set ................................................................................. 19

5.2 Power Management Command Set .................................................................................. 19

5.3 Security Mode Feature Set ................................................................................................ 19

5.4 SMART Command Set ....................................................................................................... 20

5.5 Device Statistics ................................................................................................................. 25

5.6 SMART Command Transport (SCT) .................................................................................... 27

5.7 Data Set Management Command Set ............................................................................... 27

5.8 Host Protected Area Command Set .................................................................................. 27

5.9 48-Bit Address Command Set ............................................................................................ 27

5.10 General Purpose Log Command Set .................................................................................. 28

5.11 Native Command Queuing ................................................................................................ 28

5.12 Software Settings Preservation ......................................................................................... 28

6.0 Certifications and Declarations ........................................................................................... 28

7.0 References ......................................................................................................................... 29

Appendix A: IDENTIFY DEVICE Command Data ............................................................................... 30

March 2014 Product Specification 328171-007 3

Revision History

Date

Revision

Description

October 2012

001

Initial release

November 2012

002

Updated Power On to Ready specification for 800 GB capacity

SMART Attributes descriptions

March 2013

004

Edited for clarity

GB drive, voltage spec

June 2013

006

Added X,Y, Z dimension in section 3.0

Page 1: Compliance, Changed from ATA8-ACS2 to ATA9-ACS2

Appendix A: Changes to Words 59-62, 80, 81, 89, 90, 129-159, 176-205 and 255.

Intel® Solid-State Drive DC S3700 Se r ie s

February 2013 003

April 2013 005

March 2014 007

Updated: OS Compatibility; Certifications and Declarations; Power Pin Signal Definitions;

Updated Device Identify Table; SMART Attribute Definition. Endurance spec for 1.8-inch 200

Table 14: Changed Endurance Rating Value Table 18: Changed SMART Attribute E9h, PW and Threshold values to 1. Section 5.4.1.1: Added User Notes and changed step 6 in Use Case 2.

Product Specification March 2014 4 328171-007

Table 1. Glossary of Terms a nd Acronyms

ATA

Advanced Technology Attachment

CRC

Cyclic Redundancy Check

DAS

Device Activity Signal

DMA

Direct Memory Access

ECC

Error Correction Code

EXT

Extended

FPDMA

First Party Direct Memory Access

portion of the capacity is used for NAND flash management and maintenance purposes.

Gigabit

HDD

Hard Disk Drive

HET

High Endurance Technology

Kilobyte

I/O

Input/Output

IOPS

Input/Output Operations Per Second

ISO

International Standards Organization

LBA

Logical Block Address

Megabyte (1,000,000 bytes)

MLC

Multi-level Cell

MTBF

Mean Time Between Failures

NCQ

Native Command Queuing

NOP

No Operation

Petabyte

PCB

Printed Circuit Board

PIO

Programmed Input/Output

RDT

Reliability Demonstration Test

RMS

Root Mean Square

SATA

Serial Advanced Technology Attachment

SCT

SMART Command Transport

health of a drive and reports potential problems.

SSD

Solid-State Drive

Terabyte

TYP

Typical

Intel® Solid-State Drive DC S3700 Se r ie s

Terms and Acronyms

Table 1 defines the terms and acronyms used in this document.

Term Definition

SMART

Gigabyte Note: The total usable capacity of the SSD may be less than the total physical capacity because a small

Self-Monitoring, Analysis and Reporting Technology An open standard for developing hard drives and software systems that automatically monitors the

UBER Uncorrectable Bit Error Rate

March 2014 Product Specification 328171-007 5

1.0 Overview

This document describes the specifications and capabilities of the Intel® SSD DC S3700 Series.

The Intel SSD DC S3700 Series delivers lea ding performance an d Qu a lity of Service combined with world-class reliability and endurance for Serial Advanced T ec hnology Attachment (SATA)-based computers in four capacities: 100 GB , 200 GB, 400 GB an d 800 GB.

By combining 25nm Intel support, the Intel SSD DC S3700 Series delivers sequential read speeds of u p to 500 MB/s and sequential write speeds of up to 460 MB/s. Intel S S D DC S3700 Series delivers Quality of Service of 500 us for random 4KB reads a nd writes measured at a queue depth of 1.

The Intel SS D DC S3700 Series also includes High Endurance Technology (HET), which combines NAND silicon enhancements and SSD NAND management techniques to extend the write enduran ce of an SSD, leading to lifetime en durance lev els of 10 drive writes per day for 5 years.

Intel® Solid-State Drive DC S3700 Se r ie s

NAND Flash Mem ory tech nology with S ATA 6Gb/ s inter face

The industry-standard 2.5-inch form factor e nables interchan ge a bility with existing hard disk drives (HDDs) and native SATA HDD drop-in replacement with the enhanced performance, reliability, ruggedness, and power sa vings offered by an SSD.

Intel SSD DC S3700 Series offers these key features:

• High Endurance Technology (HET)

• High I/O and throughput performance

• Consistent I/O latency

• Enhanced power-loss data protection

• End-to-End data-path protection

• Thermal thr ottling

• Temperature Sensor

• Inrush current management

• Low power

• High reliability

• Enhanced ruggedn es s

• Temperature monitor a nd logging

• Power loss prot e c tion capacitor self-test

Product Specification March 2014 6 328171-007

Table 2. User Addressa ble Sectors

Unformatted Capacity

(Total User Addressable Sectors in LBA Mode)

100GB

195,371,568

200GB

390,721,968

400GB

781,422,768

800GB

1,562,824,368

Table 3. Random Read/W rite Input/Output Operat ions Per Second (IOPS)

Intel SSD DC S370 0 Series

100 GB

200 GB

(2.5”/1.8”)

400 GB

(2.5”/1.8”)

Random 4KB Read (up to)2

IOPS

75,000

75,000 / 75,000

75,000

Random 4KB Write (up to)

IOPS

19,000

32,000 / 29,000

36,000 / 36,000

36,000

Random 8KB Read (up to)3

IOPS

47,500

47,500 / 47,500

47,500

Random 8KB Write (up to)

IOPS

9,500

16,500 / 14,500

19,500 / 19,500

20,000

Table 4. Random Read/W rite IOPS Consistency

Intel SSD DC S3700 Series

100 GB

200 GB

(2.5”/1.8”)

400 GB

(2.5”/1.8”)

Random 4KB Read (up to)2

Random 4KB Write (up to)

Random 8KB Read (up to)3

Random 8KB Write (up to)

Notes: 1. Performance measured using Iomet er* wi t h Queue Dep t h 3 2 . Mea s u rements are performed on a full Logical Bloc k

Intel® Solid-State Drive DC S3700 Se r ie s

2.0 Product Specifications

2.1 Capacity

Intel® SSD DC S3700 Series

Notes: 1GB = 1,000,000,000 bytes; 1 sector = 512 bytes. LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive. The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity

2.2 Performance

is used for NAND flash management and maintenance purposes.

Specification1 Unit

Specification4 Unit

Address (LBA) span of the drive.

2. 4KB = 4,096 bytes

3. 8KB = 8,192 bytes

4. Performance consis t ency mea sured using Iometer* based on Random 4K B QD= 3 2 workl o a d, measured as the (IOPS in the 99.9th percentile slowest 1-second interval)/(average IOPS during the test). Meas ur ements are performed on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability

800 GB

March 2014 Product Specification 328171-007 7

Intel® Solid-State Drive DC S3700 Se r ie s

Table 5. Sequential Rea d a nd Write Bandwidth

Intel® SSD DC S3700 Series

100GB

200GB

400GB

800GB

Sequential Read (SATA 6Gb/s)1

MB/s

500

Seque ntial Wr ite (SATA 6Gb/s)1

MB/s

200

365

460

Table 6. Latency

Intel SSD DC S370 0 Series

100, 200 and 400GB

800 GB

Table 7. Quality of Service

Intel SSD DC S3700 Series

Queue Depth=1

Queue Depth=32

100GB

200/400/800

100GB

200/400/800

Quality of Service

(99.9%)

Reads

0.5

0.5 1 1

Writes

0.5

Quality of Service

(99.9999%)

Reads

10 5 10

Writes

10 5 20

Specification Unit

Notes: 1. Performance measured using Iometer* with 128KB (131,072 bytes) of transfer size with Queue Depth 32.

Specification

Latency1 (TYP)

Read Write Power On to Ready

Specification Unit

3,4

Notes:

1. Device measured using Iometer. Latency measured using 4 KB (4,096 bytes) transfer size with Queue Depth equal to 1 on a sequential workload.

2. Power On To Ready time assumes proper shutdown. Time vari es i f s hutd o wn is not preceded by STANDBY IMMEDIATE command.

3. Device measured using Iom eter. Quality of Service measured using 4 KB (4,096 bytes) transfer size on a random workload on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability.

4. Based on Random 4KB QD=1, 32 workloads, measured as the time taken for 99.9(or 99.9999) percentile of commands to finish the round-trip from host to drive and back to host.

50 µs

65 µs

2.0 s

50 µs 65 µs

3.0 s

Product Specification March 2014 8 328171-007

Table 8. Operating Voltage for 2.5-inch Form Fac t or

Intel® SSDDC S3700 Series

100, 200, 400 and 800GB

Inrush Current (Typical Peak) 1

1.0 A, < 1 s

Inrush Current (Typical Peak) 1

1.0 A, < 1 s

Intel SSD DC S3700 Series

100GB

200GB

400GB

800GB

Active Write - RMS Average 1

2.8

4.2

5.2

5.8

Active Write - RMS Burst 2

3.1

4.6

7.7

8.2

Idle

0.6

Intel SSD DC S3700 Series

100GB

200GB

400GB

800GB

Active Write - RMS Average

2.9

4.4

5.4

6.0

Active Write - RMS Burst

8.2

Idle

0.8

Intel® Solid-State Drive DC S3700 Se r ie s

2.3 Electrical Characteristics

Electrical Characteristics

5 V Operating Characteristics:

Operating Voltage range Rise time (Max/Min) Fall time (Min) Noise level

Min Off time

12 V Operating Characteristics:

Operating Voltage range Rise time (Max/Min) Fall time (Min) Noise level

Min Off time

Notes:

1. Measured from initial device power supply application

2. Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss management

3. The drive needs to be powered off for at least 500msec before powering on

500 mV pp 10 Hz – 100 KHz

50 mV pp 100 KHz – 20 MHz

1000 mV pp 10 Hz – 100 KHz

100 mV pp 100 KHz – 20 MHz

5 V (±5%)

1 s / 1 ms

1 ms

500 ms

12 V (±10%)

1 s / 1 ms

1 ms

500 ms

Table 9. Power Consumption for 2.5-inch Form Factor (5V Suppl y )

Specification Unit

0.6 0.6 0.6

Table 10. Power Consumption for 2.5-inch Form Factor (12V Supply)

Specification1 Unit

3.3 4.8 7.6

Notes:

1. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) average power is measured using scope trig ger over a 100 ms sample period

2. The workload equates 128 KB (131,0 7 2 by t es) Qu eue D ep t h eq u al to 32 seq u ential writes. Root Mean Squared (RMS) burst power is measured using scope trig g er ov er a 500 us sample period

March 2014 Product Specification 328171-007 9

Table 11. Operating Voltage and Power Consum ption for 1.8-inch Form Factor

Intel® SSD DC S3700 Series

200 and 400GB

Min Off time3

500 ms

Inrush Current (Typical Peak) 1

1.2 A, < 1 s

Intel SSD DC S3700 Series

200GB

400GB

Active Write - RMS Average @ 3.3V

4.3

5.3

Active Write - RMS Burst @ 3.3V

4.7

7.9

Idle @ 3.3V W 0.6

0.6

Electrical Characteristics

Intel® Solid-State Drive DC S3700 Se r ie s

Operating Voltage for 3.3 V (±5%) Min Max Rise time (Max/Min) Fall time (Min) Noise level

Notes:

1. Measured from initial device power supply application

2. Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss management

3. The drive needs to be powered off for at least 500msec before powering on

300 mV pp 10 Hz – 100 KHz

500 mV pp 100 KHz – 20 MHz

3.13 V

3.47 V

1 s / 1 ms

1 ms

Table 12. Power Consumption for 1.8-inch Form Factor

Specification1 Unit

Notes:

1. The wo rkload equates 128 KB (131,0 72 bytes) Queue Dep th equal to 32 sequential wri tes. Root Mean Squared (RM S) power is measured using scope trigg er ov er a 100 ms sample period.

Product Specification March 2014 10 328171-007

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