Intel SSDSC2BA200G3 User Manual

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− Intel® SSD Toolbox with Inte l® SSD Optimize r
Intel® Solid-State Drive DC S3700
Product Specification
Capacity: 2.5-inch : 100/200/400/800 GB
1.8-inch : 200/400 GB
Intel® 25nm NAND Flash Memory
High Endurance Technology (HET) Multi-Level Cell
(MLC)
Form Factor: 2.5- and 1.8-inch Read and Write IOPS
1,2
(Full LBA Range, Iometer*
Queue Depth 32)
Random 4 KB3 Reads: Up to 75,000 IOPS
Random 4 KB Writes:
Random 8 KB
Random 8 KB Writes:
Bandwidth Performance
3
Up to 36,000 IOPS
Reads: Up to 47,500 IOPS
Up to 20,000 IOPS
1
Sustained Sequential Read: Up to 500 MB/s
Sustained Sequential Write: Up to 460 MB/s
Endurance: 10 drive writes per dayLatency (average sequential)
5
for 5 years
Read: 50 µs (TYP)
Write: 65 µs (TYP)
Quality of Service
6,8
Read/Write: 500 µs (99.9%)
Performa nc e C onsistency
7,8
Read/Write: Up to 90%/90% (99.9 % )
AES 256-bit Encryption Compliance
SATA Revision 3.0; compatible with SATA 6Gb/s, 3Gb/s and 1.5Gb/s interface rates
ATA8-ACS2; includes SCT (Smart Command Transport) and device statistics log support
SSD-enhanced SMART ATA feature set
Native Command Queuing (NCQ) command set
Data set management Trim command
Compatibility
− Windows Server 2008 Enterprise 32/64 bit
− Windows Server 2008 R2
− Red Hat Enterprise Linux* 5.5, 5.6, 6.1
− SUSE* Linux Enterprise Server 11 SP1
Power Management
2.5 inch: 5 V or 12 V SATA Supply Rail
9
1.8 inch: 3.3 V SATA Supp l y Ra i l
− SATA Interface Power Management
OS-aware hot plug/removal
Enhanced power-loss data protection
Power
10
Active: Up to 6 W (TYP)
− Idle: 650 mW
Weight:
2.5” 200,400,800 GB: 73.6 grams ± 2 grams
2.5” 100 GB: 70 gra m s ± 2 grams
1.8” 200, 400 GB : 49 grams ± 2 grams
Temperature
4
Operating: 0
Non-Operating
o
C to 70o C
11
: -55o C to 95o C
− Temperature monitoring and logging
− Thermal throttling
Shock (operating and non-operating):
1,000 G/0.5 msec
Vibration
Operating: 2.17 GRMS (5-700 Hz)
Non-operating: 3.13 GRMS (5-800 Hz)
Reliability
Uncorrectable Bit Error Rate (UBER):
17
1 sector per 10
bits read
Mean Time Between Failures (MTBF): 2 million hours
End-to-End data-path protection
Certifications and Declar a tio ns
UL*, CE*, C-Tick*, BSMI*, KCC* , Micr o soft*
WHQL, VCCI* , SATA-IO*
Product Ecological Compliance
RoHS*
1. Performance values vary by capacity and form factor
2. Performance specifications apply to both compressible and incompressible data
3. 4 KB = 4,096 bytes; 8 KB = 8,192 b ytes.
4.
MB/s = 1,000,000 bytes/second
5. Based on JESD218 standard
6. Based on Ra ndom 4KB QD =1 workloa d, measured as the time taken for 99.9
7. Based on Ra ndom 4KB QD =32 workload, measured as the (IOPS in the 99.9
8. Measurement taken once the workload has reached steady state but including all background activities required for normal operation and data reliability
9. Defaults to 12V, if both 12V and 5V are present
10. Based on 5V supply; refer to Table 7 for more details
11. Please contact your Intel representative for details on the non-operating temperature range
Order Number: 328171-001US October 2012
percentile of commands to finish the round-trip from host t o drive and back to host
th
percentile slowest 1-second interval)/(average IOPS during the test)
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Intel® Solid-State Drive DC S3700
Ordering Information
Contact your local Intel sales repres entative for ordering information .
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILIT Y OR WAR R ANTI E S R ELAT ING T O F IT NE SS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
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Intel may make changes to s pe cifications and p r o d uc t d es criptions at any time, without notice. Designers must not rely on the absence o r character ist ics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local I nt el s ales office or your distri butor to obtain the latest specifications and before placing your product order. Copies of documents which have an order numb e r and a re referenced in this docum e nt , or other Intel literature , may be obtained by calling
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components on the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for th e environment.
Intel and the Intel log o are trademarks of Intel Corporat ion in the U.S. and other countries. *Other names and brand s may be claimed as the property of others. Copyright © 2012 Int el C orpora tion. All rights reserved.
Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 2 Order Number: 328171-001US
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Intel® Solid-State Drive DC S3700
Contents
1.0 Overview .............................................................................................................................5
2.0 Product Specifications ..........................................................................................................6
2.1 Capacity ............................................................................................................................... 6
2.2 Performance ........................................................................................................................ 6
2.3 Electrical Characteristics ..................................................................................................... 8
2.4 Environmental Conditions ................................................................................................... 9
2.5 Product Regulatory Compliance ........................................................................................ 10
2.6 Reliability ........................................................................................................................... 10
2.8 Temperature Sensor .......................................................................................................... 11
2.9 Power Loss Capacitor Test ................................................................................................ 11
2.10 Hot Plug Support ............................................................................................................... 11
3.0 Mechanical Information ..................................................................................................... 12
4.0 Pin and Signal Descriptions ................................................................................................. 14
4.1 2.5-inch Form Factor Pin Locations ................................................................................... 14
4.2 1.8-inch Form Factor Pin Locations ................................................................................... 14
4.3 Connector Pin Signal Definitions ....................................................................................... 15
4.4 Power Pin Signal Definitions ............................................................................................. 15
5.0 Supported Command Sets .................................................................................................. 17
5.1 ATA General Feature Command Set ................................................................................. 17
5.2 Power Management Command Set .................................................................................. 17
5.3 Security Mode Feature Set ................................................................................................ 17
5.4 SMART Command Set ....................................................................................................... 18
5.5 Device Statistics ................................................................................................................. 22
5.6 SMART Command Transport (SCT).................................................................................... 23
5.7 Data Set Management Command Set ............................................................................... 24
5.8 Host Protected Area Command Set .................................................................................. 24
5.9 48-Bit Address Command Set............................................................................................ 24
5.10 General Purpose Log Command Set.................................................................................. 25
5.11 Native Command Queuing ................................................................................................ 25
5.12 Software Settings Preservation ......................................................................................... 25
6.0 Certifications and Declarations ........................................................................................... 25
7.0 References ......................................................................................................................... 26
8.0 Terms and Acronyms .......................................................................................................... 27
9.0 Revision History ................................................................................................................. 28
Appendix A: IDENTIFY DEVICE Command Data ............................................................................... 28
Order Number: 328171-001US 3
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Intel® Solid-State Drive DC S3700
Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 4 Order Number: 328171-001US
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Intel® Solid-State Drive DC S3700

1.0 Overview

This document describes the specifications and capabilities of the Intel SSD DC S3700. The In tel SSD DC S3700 delivers leading performance a nd Quality of Service combined
with world-class reliability and endurance for Serial A dva n ced T ech n ology A ttac h men t (SATA)-based computers in four capacities: 100 GB, 200 GB, 400 GB and 800 GB.
By combining 25n m Intel® NAND Flash Memory tech nology w ith SATA 6G b/s interfa ce support, the Intel SSD DC S3700 delivers sequential r ead speeds of up to 500 MB/s and sequential write speeds of up to 460 MB/s. Intel SSD DC S3700 delivers Quality of Service of 500 us for ran dom 4KB r ea ds a nd writes measured at a queue depth of 1.
The Intel SSD DC S3700 also includes High Endurance Technology (HET), which combines NAND silicon enhancements and SSD NAND management techniques to extend the write endurance of a n SSD, leading to lifetime en durance levels of 10 drive writes per day for 5 years.
The industry-standard 2.5-inch form factor enables interchangeability with ex is ting hard disk drives (HDDs) and native SATA HDD drop-in replacement with the enhanced performance, reliability, ruggedness, and power savings offered by an SSD.
Intel SSD DC S3700 offers these key features:
High Endurance Technology (HET)
High I/O and throughput performance
Consistent I/O latency
Enhanced power-loss data protection
End-to-End data-path protection
Thermal thr ottling
Temperature Sensor
Inrush current management
Low power
High reliability
Enhanced ruggedn es s
Temperature monitor and logging
Power loss prot e c tion capacitor se lf-test
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Intel Solid-State Drive DC S3700
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Intel® Solid-State Drive DC S3700
Table 1. User Addressable Secto rs
Unformatted Capacity
(Total User Addressable Sectors in LBA Mode)
100 GB
195,371,568
200 GB
390,721,968
400 GB
781,422,768
800 GB
1,562,824,368
Table 2. Random Read/W rite Input/Output Opera t ions Per Second (I OPS)
Intel SSD DC S370 0
100 GB
200 GB
(2.5”/1.8”)
400 GB
(2.5”/1.8”)
Random 4 KB Read (up to)2
IOPS
75,000
75,000 / 75,000
75,000 / 75,000
75,000
Random 4 KB Write (up to)
IOPS
19,000
32,000 / 29,000
36,000 / 36,000
36,000
Random 8 KB Read (up to)3
IOPS
47,500
47,500 / 47,500
47,500 / 47,500
47,500
Random 8 KB Write (up to)
IOPS
9,500
16,500 / 14,500
19,500 / 19,500
20,000
Table 3. Random Read/W rite IOPS Consistency
Intel SSD DC S3700
100 GB
200 GB
(2.5”/1.8”)
400 GB
(2.5”/1.8”)
Random 4 KB Read (up to)2
%
90
90
90
90
Random 4 KB Write (up to)
%
85
90
90
90
Random 8 KB Read (up to)3
%
90
90
90
90
Random 8 KB Write (up to)
%
85
90
90
90
Notes: 1. Performance measured using Iom e te r* wi th Queue Depth 32. Measurements are performed on a full Logical Block

2.0 Product Specifications

2.1 Capacity

Intel SSD DC S3700
Notes: 1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes. LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive. The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity
is used for NAND flash management and maintenance purposes.

2.2 Performance

Specification1 Unit
Specification4 Unit
800 GB
800 GB
Address (LBA) span of the drive.
2. 4 KB = 4,096 bytes
3. 8 KB = 8,192 bytes
4. Performance consistency measured using Iometer* based on Random 4KB QD=32 workload, measured as the (IOPS in the 99.9th percentile slowest 1-second interval)/(average IOPS during the test). Measurements are per­formed on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but in­cluding all background activities required for normal operation and data reliability
Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 6 Order Number: 328171-001US
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Table 4. Sequential Rea d a nd Write Bandwidth
Intel SSD DC S370 0
100 GB
200 GB
400 GB
800 GB
Sequential Read (SATA 6Gb/s)1
MB/s
500
500
500
500
Seque ntial Write (SATA 6Gb/s)1
MB/s
200
365
460
460
Table 5. Latency
Intel SSD DC S370 0
100, 200, 400 and 800 GB
Table 6. Quality of Service
Intel SSD DC S3700
Queue Depth=1
Queue Depth=32
100 GB
200/400/800
GB
100 GB
200/400/800
GB
Quality of Service
(99.9%)
Reads
ms
0.5
0.5 1 1
Writes
ms
0.5
0.5
15
10
Quality of Service
(99.9999%)
Reads
ms
10 5 10
5
Writes
ms
10 5 20
20
Intel® Solid-State Drive DC S3700
Specification Unit
Notes: 1. Performance measured using Iometer* with 128 KB (131,072 bytes) of transfer size with Queue Depth 32.
Specification
Latency1 (TYP)
Read Write Power On to Ready
Specification Unit
3,4
3,4
Notes:
1. Device measured using Iometer. Latency meas ured using 4 KB (4,096 byt es) transfer size with Queue Depth eq ual to 1 on a sequential workload.
2. Power On To Ready time assumes proper shutdown. Time varies if shutdown is not preceded by STANDBY IMMEDIATE command.
3. Device measured using Iometer. Quality of Service measured using 4 KB (4,096 bytes) transfer size on a random workload on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability.
4. Based on Random 4KB QD=1, 32 workloads, measured as the time taken for 99.9(or 99.9999) percentile of commands to finish the round-trip from host to drive and back to host.
50 µs
2
65 µs
2.0 s
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Intel Solid-State Drive DC S3700
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2.3 Electrical Characteristics

Table 7. Operating Voltage for 2.5-inch Form Fa c t or
Intel SSDDC S3700
100, 200, 400 and 800 GB
Inrush Current (Typical Peak) 1
1.0 A, < 1 s
Intel SSD DC S3700
100 GB
200 GB
400 GB
800 GB
Active Write - RMS Average 1
W
2.8
4.2
5.2
5.8
Active Write - RMS Burst 2
W
8.2
Idle
W
0.6
0.6
0.6
0.6
Intel SSD DC S3700
100 GB
200 GB
400 GB
800 GB
Active Write - RMS Average
W
6.0
Active Write - RMS Burst
W
3.3
4.8
7.6
8.2
Idle
W
0.8
Electrical Characteristics
Intel® Solid-State Drive DC S3700
5 V Operating Characteristics:
Operating Voltage range
12 V Operating Characteristics:
Operating Voltage range
Inrush Current (Typical Peak)
Notes:
1. Measured from initial device power supply application.
2
5 V (±5%)
12 V (±10%)
1.0 A, < 1 s
Table 8. Power Consumption for 2.5-inch Form Factor (5V Supply)
Specification Unit
3.1 4.6 7.7
Table 9. Power Consumption for 2.5-inch Form Facto r ( 12V Su pply)
Specification1 Unit
2.9 4.4 5.4
0.8 0.8 0.8
Notes:
1. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) average
power is measured using scope t rigger over a 100 ms sample period.
2. The workload equat es 12 8 KB (131,0 7 2 by t es) Q ueu e Depth equal to 32 sequential writes. Root Mean Squared (RMS) burst
power is measured using scope t rigger over a 500 us sample period.
Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 8 Order Number: 328171-001US
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Table 10. Operating Voltage and Power Consumption for 1.8-inch Form Factor
Intel SSD DC S3700
200 and 400 GB
Max
3.47 V
Inrush Current (Typical Peak) 1
1.2 A, < 1 s
Intel SSD DC S3700
200 GB
400 GB
Active Write - RMS Average @ 3.3V
W
4.3
5.3
Active Write - RMS Burst @ 3.3V
W
4.7
7.9
Idle @ 3.3V W 0.6
0.6
Table 12. Temperature, Shock, Vi brat i on
Temperature
Range
Non-operating1
-55 – 95 oC
Non-operating
30 oC/hr (Typical)
Non-operating
5 – 95 %
Shock and Vibration
Range
Non-operating
1,000 G (Max) at 0.5 msec
Non-operating
3.13 G
RMS
(5-800 Hz) Max
Intel® Solid-State Drive DC S3700
Electrical Characteristics
Operating Voltage for 3.3 V (±5%) Min
Notes:
3.13 V
1. Measured from initial device power supply application.
Table 11. Power Consumption for 1.8-inch Form Factor
Specification1 Unit
Notes:
1. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequenti al writes. Root Mean Squared (RMS) pow er is measured using scope tri gg er ov e r a 1 0 0 ms sample period.

2.4 Environme nt al Condi t ions

Case Temperature Operating
0 – 70
o
C
Temperature Gradient Operating
Humidity Operating
3
Shock Operating
Vibration
4
Operating
Notes:
2
30
o
C/hr (Typical)
5 – 95 %
1,000 G (Max) at 0.5 msec
2.17 G
(5-700 Hz) Max
RMS
1. Please contact your Intel representative for details on the non-operating temperature range.
2. Temperature gradient measured without condensation.
3. Shock specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Shock specification is measured using Root Mean Squared (RMS) value.
4. Vibration specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus may b e ap plied in the X, Y or Z axis. Vibration specification is measured using RMS value.
Intel Solid-State Drive DC S3700 October 2012 Product Specification Order Number: 328171-001US 9
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2.5 Product Regulatory Compliance

Table 13. Product Regulatory Compliance Specifications
Region For Which
Conformity Declared
Standard Digital Apparatus
measurement CISPR24:2010
measurement CISPR24:2008 (Modified)
— Part 1: General Requirements
Table 14. Reliability Specifications
to the host.
Test (RDT).
Power On/Off Cycles is defined as power being remov ed fr om the
SSD, and then restored . Mos t host sy stems rem ove p ower from the shutdown.
Intel SSD DC S3700 meets or exceeds the regulatory or certification requirements in Table 8.
Title Description
Intel® Solid-State Drive DC S3700
TITLE 47-Telecommunications CHAPTER 1— FEDERAL COMMUNMICATIONS COMMISSION PART 15 — RADIO FREQUENCY DEVICES
ICES-003, Issue 4 Interference-Causing Equipment
IEC 55024 Information Technology Equipment — Immunity characteristics— Limits a n d method s of
IEC 55022 Information Technology Equipment — Radio disturbance Characteristics— Limits and methods of
EN-60950-1 2nd Edition
UL/CSA EN-60950-1 2nd Edition
FCC Part 15B Class B
CA/CSA-CEI/IEC CISPR 22:02. This is CISPR 22:1997 with Canadian Modifications
EN-55024: 1998 and its amendments European Union
EN-55022: 2006 and its amendments European Union
Information Technology Equipment — Safety
Information Technology Equipment — Safety — Part 1: General Requirements

2.6 Reliability

Intel SSD DC S3700 meets or exceeds SSD enduran ce and data retention requirements as specified in the JESD218 standard. R elia b ility specifications are listed in the table
Parameter Value
below:
USA
Canada
USA/Canada
USA/Canada
Uncorrectable Bit Error Rate (UBER)
Uncorrectable bit error rate will not exceed one sector in the
specified number of bits read. In the unlikely event of a non-recoverable read error, the SSD will report it as a read failure to the host; the sector in error is considered corrupt and is not returned
Mean Time Between Failures (MTBF)
Mean Time Between Failures is estimated bas ed o n Telc o r dia*
methodology and demonstrated through Reliability Demonstration
Power On/Off Cycles
SSD when entering suspend and hibernate as well as on a system
Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 10 Order Number: 328171-001US
< 1 sector per 10
2,000,000 hours
24 per day
17
bits read
Page 11
Table 14. Reliability Specifications
endurance.
requirements according to the JESD218 standard.
Intel® Solid-State Drive DC S3700
Parameter Value
Insertion Cycles
SATA/power cable insertion/removal cycles.
Data Retention
The time period for retaining data in the NAND at maximum rated
Endurance Rating
1. Refer to JESD218 standard table 1 for UBER, FFR and other Enterprise SSD requirements

2.8 Temperature Sensor

The Intel S SD DC S3700 has an internal temperature sensor with an accuracy of +/-2C over a range of -20C to +80C which can be monitor ed using two SMART attributes: Airflow Temperature (BEh) and Device Internal Temperature (C2h).
For more information on supported S MART attrib utes, see “SMA RT Attributes ” on p age
17.
50 on SATA cable
500 on backplane
3 months power-off retention once SSD reaches rated write endurance at 40 °C
10 drive writes/day over 5 years while running JESD218
standard
1
The number of drive writes such that the SSD meets the

2.9 Power Loss Capacitor Test

The Intel SSD DC S3700 supports te sting of the pow er loss capacitor, w hich can be monitored using the following SMART attribute: (175, AFh).

2.10 Hot Plug Support

Hot Plug insertion an d removal is supported in th e presence of a proper c onnector and appropriate operating sy s tem ( O S ) , as described in the SATA 3.0 spec if ic a tion.
This product supports asynchronous signal recovery and issues an unsolicited COMINIT when first mated w ith a powered connector to guaran tee r eliable detection by a host system without hardware device detec tion.
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Intel Solid-State Drive DC S3700
Page 12

3.0 Mechanical Information

Figures 1 and 2 show the physical package information for the Intel S SD DC S 3700 in the 2.5- and 1.8-inch form factors. All dimensions are in millimeters .
Figure 1. Intel SSD DC S 3700 2.5-inch Dimensions
Intel® Solid-State Drive DC S3700
Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 12 Order Number: 328171-001US
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Intel® Solid-State Drive DC S3700
Figure 2. Intel SSD DC S 37001.8-inch Dimensions
October 2012 Product Specification Order Number: 328171-001US 13
Intel Solid-State Drive DC S3700
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Intel® Solid-State Drive DC S3700

4.0 Pin and Signal Descriptions

4.1 2.5-inch Form Factor Pin Locations

Figure 4. Layout of 2.5-inch Form Factor Signal and Power Segment Pins
Note: 2.5-inch connector supports built in latching capability.

4.2 1.8-inch Form Factor Pin Locations

Figure 3. Layout of 1.8-inch Form Factor Signal a nd Power Segment Pi ns
Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 14 Order Number: 328171-001US
Page 15
Factors
S1
Ground
1st mate
S2
A+
S3
A-
S4
Ground
1st mate
S5
B-
S6
B+
S7
Ground
1st mate
Table 16. Serial ATA Power Pin Definitions—2.5-inch Form Factors
P12
Not connected
(3.3 V Power)
--
P22
Not connected
(3.3 V Power)
--
P32
Not connected
(3.3 V Power; pre-charge)
2nd Mate
P4
Ground
Ground
1st Mate
P53
Ground
Ground
1st Mate
P63
Ground
Ground
1st Mate
P7
V5
5 V Power
1st Mate
P8
V5
5 V Power
2nd Mate
P9
V5
5 V Power
2nd Mate
P103
Ground
Ground
1st Mate
P116
DAS
Device Activity Signal
2nd Mate
P12
Ground
Ground
1st Mate
P137
V12
12 V Power
1st Mate
P147
V12
12 V Power
2nd Mate
P157
V12
12 V Power
2nd Mate
Intel® Solid-State Drive DC S3700

4.3 Connector Pin Signal Definitions

Table 15. Serial ATA Connector Pin Signal Def initions—2.5-inch and 1.8-inch Form
Pin Function Definition
Differential signal pair A
Differential signal pair B
Note: Key and spacing separate signal and power segments.

4.4 Power Pin Signal Definitions

Pin1 Function Definition Mating Order
3,4
3,5
3,5
3,5
3,4
Notes:
1. All pins are in a single row, with a 1.27 mm (0.050-inch) pitch.
2. Pins P1, P2 and P3 are connected together, although they are not connected internally to the device. The host may put 3.3 V on these pins.
3. The mating sequence is:
• ground pins P4-P6, P10, P12 and the 5V power pin P7
• signal pins and the rest of the 5V power pins P8-P9
4. Ground connectors P4 and P12 may contact before the other 1st mate pins in both the power and signal connectors to discharge ESD in a suitably configured backplane connector.
5. Power pins P7, P8, and P9 are internally connected to one another within the device.
6. The host may ground P11 if it is not used for Device Activity Signal (DAS).
7. Pins P13, P14 and P15 are internally connected to one another within the device. The host may put 12 V on these pins.
October 2012 Product Specification Order Number: 328171-001US 15
Intel Solid-State Drive DC S3700
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Intel® Solid-State Drive DC S3700
Table 17. Serial ATA Power Pin Definitions—1.8-inch F orm Factors
P12
V33
3.3 V Power
2nd Mate
P22
V33
3.3 V Power, per-charge
2nd Mate
P33
Ground
--
1st Mate
P43
Ground
--
1st Mate
P54
V5
5 V Power; not connected.
1st Mate
P64
V5
5 V Power; not connected.
2nd Mate
P75
DAS
Device Activity Signal
2nd Mate
Key
Key
NC
NC
P86
Optional
Manufacturing Test Pin
2nd Mate
P96
Optional
Manufacturing Test Pin
2nd Mate
Pin Function Definition Mating Order1
Notes:
1. All mate sequences assume zero angular offset between connectors.
2. P1 and P2 are internally connected to one another within the device.
3. Ground connectors P3 and P4 may contact before the other 1st mate pins in both the power and signal connectors to
discharge ESD in a suitably configure backplane connector.
4. Pins P5 and P6 are not connected internally to the device but there is an option to connect through a zero ohm stuffing
resistor. The host may put 5V on these pins.
5. The host may ground P7 if it is not used for Device Activity Signal (DAS).
6. P8 and P9 should not be connected by the host.
Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 16 Order Number: 328171-001US
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Intel® Solid-State Drive DC S3700

5.0 Supported Command Sets

Intel SSD DC S3700 supports all mandatory ATA (Advanced Technology Attachment) commands defined in the AT A8-ACS specification d escribed in this section.

5.1 ATA General Feature Command Set

The Taylorsville SSD supports the ATA General Feature command set (non- PACKET), which consists of:
− EXECUTE DEVICE DIAGNOSTIC
− SET FEATURES
− IDENTIFY DEVICE
Note: See Appendix A, “IDENTIFY DE VICE Command Data” on page 27 for details on the sector data returned after issuing an IDENTIFY DEVICE command.
Intel SSD DC S3700 also supports the following optiona l commands:
− READ DMA
− WRITE DMA
− READ SECTOR(S)
− READ VERIFY SECTOR(S)
− READ MULTIPLE
− SEEK
− SET FEATURES
− WRITE SECTOR(S)
SET MULTIPLE MODE
− WRITE MULTIPLE
FLUSH CACHE
− READ BUFFFER
− WRITE BUFFER
− NOP
DOWNLOAD MICROCODE
− WRITE UNCORRECTABLE EXT
1. The only multiple supported will be multiple 1
1

5.2 Power Management Command Set

Intel SSD DC S3700 supports the Power Management command set, which consists of:
CHECK POWER MODE
− IDLE
− IDLE IMMEDIATE
− SLEEP
− STANDBY
− STANDBY IMMEDIATE

5.3 Security Mode Feature Set

Intel SSD DC S3700 supports the Secu r ity Mode command set, which consists of:
− SECURITY SET PASSWORD
SECURITY UNLOCK
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Intel Solid-State Drive DC S3700
Page 18
SECUR ITY ER A S E PR EPARE
Table 18. SMART Attributes
SP
EC
ER
PE
OC
PW
blocks si n ce leaving the f actory (grown def ect count).
counted: active, idle and slumb er .
number of power cycle events over t he life of the device.
AAh
Available Reserved Spa c e (See Attribute E8)
1 1 0 0 1 1 10
Program Fail Count
shows the percent remaining of allowable program fails.
− SECURITY ERASE UNIT
SECURITY FREEZE LOCK
− SECURITY DISABLE PASSWORD

5.4 SMART Command Set

Intel SSD DC S3700 supports the SMART command set, whic h consists of:
− SMART READ DATA
− SMART READ ATTRIBUTE THRESHOLDS
− SMART ENABLE/DISABLE ATTRIBUTE AUTOSAVE
− SMART SAVE ATTRIBUTE VALUES
SMART EXECUTE OFF-LINE IMMEDIATE
− SMART READ LOG SECTOR
− SMART WRITE LOG SECTOR
− SMART ENABLE OPERATIONS
− SMART DISABLE OPERATIONS
− SMART RETURN STATUS
− SMART ENABLE/DISABLE AUTOMATIC OFFLINE
Intel® Solid-State Drive DC S3700
5.4.1 SMART Attributes
Table 13 lists the SMART attributes supported by the Intel SSD DC S3700 and the corresponding s tatus flags and threshold settings.
ID Attribute
05h
09h
0Ch
Re-allocated Sector Count The raw value of this attribute shows the number of retired
Power-On Hours Count The raw value reports two values: the first 4 bytes report
the cumulative number of power-on hours over the life of the device, the remaining bytes report the number of milliseconds since the last hour increment. The On/Off status of the Device Initiated Power Management (DIPM) feature will affect the number of hours reported. If DIPM is turned On, the recorded value for power-on hours does not include the time that the device is in a "slumber" state. If DIPM is turned Off, the recorded value for power-on hours should match the clock time, as all three device states are
Power Cycle Count
The raw value of this attribute reports the cumulative
Status Flag s
Threshold
1 1 0 0 1 0 0 (none)
1 1 0 0 1 0 0 (none)
1 1 0 0 1 0 0 (none)
ABh
The raw value of this attribute shows total count of pro­gram fails and the normalized value, beginning at 100,
Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 18 Order Number: 328171-001US
1 1 0 0 1 0 0 (none)
Page 19
Table 18. SMART Attributes
SP
EC
ER
PE
OC
PW
Erase Fail Count
the percent remaining of allowable erase fails.
Unexpect ed Power Loss
the
PLI activity using capacitor power).
Power Loss Protection Failure
o discharge cap, saturates
number of tests.
SATA Downshift Count
Uncorrectable Error Count
Correction Code (ECC).
in C degrees.
number of unsafe (unclean) shutdown events over the life
the last command.
(PCB) sensor without of fse t.
re-allocated on next write.
redundancy check (CRC) errors.
the host.
maximum rated cycles.
Intel® Solid-State Drive DC S3700
ID Attribute
Ach
AEh
AFh
B7h
B8h
BBh
BEh
The raw value of this attribute shows total count of erase fails and the normalized value, beginning at 100, shows
Also known as “Power-off Retract Count” per magnet­ic-drive terminology. Reports numbe r of uncl ean shutdo wns, cumul ative o ver life of the SSD. An “unclean shutdown” is th e removal of po wer without STANDBY IMMEDIATE as the last command (regardless of
Last test result as microseconds t at max value. Also logs minutes since last test and lifetime
The count of the number of times SATA interface se­lected lower signaling rate due to error.
End-to-End Error Det ection Count
Reports number of End-to-End recovered errors cor­rected by hardware.
The raw value shows the count of errors that could not be recovered using Error
Temperature - Airflow Temperature (Case) Reports the
SSD case temperature. Raw value suggests 100 - case temperature
Status Flag s
Threshold
1 1 0 0 1 0 0 (none)
1 1 0 0 1 0 0 (none)
1 1 0 0 1 1 10
1 1 0 0 1 0 0 (none)
1 1 0 0 1 0 0 (none)
1 1 0 0 1 0 0 (none)
1 0 0 0 1 0 0 (none)
Power-Off Retract Count (Unsafe Shutdown Count) The raw value of this attribute reports the cumulative
C0h
C2h
C5h
C7h
E1h
E2h
of the device. An unsafe shutdown occurs whenever the device is powered off without STANDBYIMMEDIATE being
Temperature - Device Internal Temperature
Reports internal temperature of the SSD. Temperature reading is the value direct from the printed circuit board
Pending Sector Count Number of current unrecoverable read errors that will be
CRC Error Count The total number of encountered SATA interface cyclic
Host Writes The raw value of this attribute reports the total number of
sectors written by the host system. The raw value is increased by 1 for every 65,536 sectors (32MB) written by
Timed Workload Media Wear Measures the wea r seen by t he SSD ( since reset of the
workload timer, attribute E4h), as a percentage of the
October 2012 Product Specification Order Number: 328171-001US 19
1 1 0 0 1 0 0 (none)
1 0 0 0 1 0 0 (none)
0 1 0 0 1 0 0 (none)
1 1 0 0 1 0 0 (none)
1 1 0 0 1 0 0 (none)
1 1 0 0 1 0 0 (none)
Intel Solid-State Drive DC S3700
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Intel® Solid-State Drive DC S3700
Table 18. SMART Attributes
SP
EC
ER
PE
OC
PW
E4h).
reserved space. The t hreshold value for this attribut e is 10 percent availability.
100 to 1 as the average erase cycle c ount increases from 0
wear can be put on the device.
Reports Percent Throttle Status and Count of events
the host.
the host.
Table 19. SMART Attribute Status Flags
SP
Self-preserving attribute
Not a self-preserving attribute
Self-preserving attribute
EC
Event count attribute
Not an event count attribute
Event count attribute
ER
Error rate attribute
Not an error rate attribute
Error rate attribute
PE
Performance attribute
Not a performance attribute
Performance attribute
online activity
PW
Pre-fail warranty attribute
Advisory
Pre-fail
ID Attribute
Timed Workloa d Host Read/Write Ra tio
E3h
E4h
E8h
E9h
EAh
F1h
Shows the percentage of I/O operations that are read
operations (since reset of the workload timer, attribute
Timed Workload Timer Measures the el aps e d time (number of minutes since
starting this workload timer).
Available Reserved Spa c e
This attribute reports th e number of reserve blocks
remaining. The normaliz ed v a lue begins at 100 ( 64h), which corresponds to 100 percent availability of the
Media Wearout Indicator
This attribute reports the number of cycles the NAND media
has undergone. The normalized value declines linearly from to the maximum rated cycles.
Once the nor malized v a lue reaches 1, the number will not
decrease, although it is likely th at sign ificant addit i onal
Thermal Throttle Status
Total LBAs Written
The raw value of this attribute reports the total number of
sectors written by the host system. The raw value is increased by 1 for every 65,536 sectors (32MB) written by
Status Flag s
Threshold
1 1 0 0 1 0 0 (none)
1 1 0 0 1 0 0 (none)
1 1 0 0 1 1 10
1 1 0 0 1 0 0 (none)
1 1 0 0 1 0 0 (none)
1 1 0 0 1 0 0 (none)
Total LBAs Read
F2h
Status Flag Description Value = 0 Value = 1
OC
The raw value of this attribute reports the total number of
sectors read by the host system. The raw value is increased by 1 for every 65,536 sectors (32MB) read by
Online collection attribute Collected only during offline activity
Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 20 Order Number: 328171-001US
1 1 0 0 1 0 0 (none)
Collected during both offline and
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Intel® Solid-State Drive DC S3700
5.4.1.1 Timed Workload Endurance Indicators
Timed Workload Medi a Wear Indicator — ID E2h
This attribute tracks the driv e wear seen by the device dur ing the last wear timer loop, as a percentage of the maximum ra ted cycles. The raw value trac ks the percentage up to 3 decimal points. This valu e s hould be divided by 1024 to get th e perc entage.
For example: if the raw v alue is 4450, the percentage is 4450/1024 = 4. 345%. The raw value is held at FFFFh until the wear timer (attribute E4h) reaches 60 (minutes). The normalized value is alway s s et to 100 and should be ignored.
Timed Workload Ho st Reads Percentage — ID E3h
This attribute sh ows the perc en tage of I /O opera tion s tha t are rea d opera tion s durin g the last workload timer loop. The raw value tracks this percentage and is held at FFFFh until the workloa d timer (attri bute E4h) r eaches 60 (minutes) . The normalized valu e is always set to 100 and should be ignor ed.
Workload Timer — ID E4h
This attribute is u s e d to measure the time ela p sed during th e current workload. The attribute is reset when a SMART EXECUTE OFFLINE IMMEDIATE (D4h) subcommand 40h is issued to the dr ive. The raw valu e tracks the time in minutes and has a maximum value of 232 = 4,294,967,296 minu tes (8,171 years ). The normaliz ed value is always set to 100 and should be ign ored.
Example Use Cases
The Timed Workload Endu ran ce a ttribu tes des crib ed in th is s ection ar e inten d ed to b e used to measure the amount of m edia wear that the drive is subjected to during a timed workload.
Ideally, the system that th e drive is being u sed in shou ld be capable of iss uing SM ART commands. Otherwise, provisions have been pr ovided to allow the media wear attributes to be persistent s o th e dr iv e c a n be moved to a SMART capable system to read out the drive wear attribu te values.
Use Case 1 – With a System Capable of SMAR T Commands
1. Issue the SMART EXECUTE OFF-LINE IMMEDIATE (D4h) sub-command 40h to reset the drive wear attrib utes.
2. Run the workload to be e valua ted for a t least 60 min u tes. Oth erwis e the driv e wear attributes will not be available.
3. Read out the drive w ear attributes with th e SMART READ DATA (D0h) com­mand.
Use Case 2 – With a System Not Capable of SM ART Commands
1. On a SMART capable system, issue the SMART EXECUTE OFF-LINE IMMEDIATE (D4h) sub-command 40h to reset the E4h (work load timer ) a ttribute.
2. Move the drive to the system wh er e th e workload will be measured (and not capable of SMART commands).
3. Run the workload to be e valua ted for a t least 60 min u tes. Oth erwis e the driv e wear attributes will not be available.
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Intel® Solid-State Drive DC S3700
4. Do a clean system power down by issuing the ATA STANDBY IMMEDIATE command prior to shutting down the system. This will store a ll the drive wea r SMART attributes to persistent memory within the dri ve.
5. Move the drive to a SMART capable system.
6. Read out the drive w ear attributes with th e SMART READ DATA (D0h) com­mand within 60 minutes after power-up.
Example Calculation of Drive Wear
The following is an example of how the drive wear attributes c a n be used to evaluate the impact of a given workload. The Hos t W rites SMART attribute (E1h) can a lso be used to calculate th e amount of data written by the host du r ing the workload by reading this attribute befor e a nd after running the workload. This example assumes that the steps shown in “Exam ple Us e Cases” on page 18 were followed to obtain the following attribu te values:
Timed Workload Media Wear (E2h) has a raw value of 16. T herefore, the per­centage wear = 16/1024 = 0.016%.
Timed Workload Host Read/Write Ratio (E 3 h) has a normalized value of 80, in­dicating that 80% of operations were reads.
Workload T imer (E4h) has a raw value of 500. Therefore the workload r an for 500 minutes.
Host Writes Count (E1h) had a raw value of 100, 000 pr ior to running the workload and a value of 130,000 at th e end of the workload. Theref ore, the number of sectors written by the host du ring the workload was 30, 000 * 65,535 = 1,966,050,000 sectors or 1,966,050,000 * 512/1,000, 000,000 = 1,007 GB.
The following con clusions can be m a de for this example case: The workload took 50 0 minutes to comp lete with 80% r eads and 20% writes . A total of
1,007 GB of data was written to the device, which increased th e m edia wear in the drive by 0.016%. At this p oint in time, this w orkl oad is c aus ing a w ear rate of 0.016 % for every 500 minutes, or 0.0019 2%/ hour.
5.4.2 SMART Logs
Intel SSD DC S3700 implements the following Log Addr esses: 00h, 02h, 03h , 06h, and 07h.
DC S3700 implements host vendor specific logs (a ddresses 80h-9Fh) as read and write scratchpads, where the d efau lt va lue is zero ( 0). In tel SS D Tay lors ville doe s n ot wr ite any specific values to th ese logs unless directed by the hos t through the appropr iate commands.
DC S3700 also implem ents a dev ice v endor s pecific l o g at addres s A 9h as a rea d-only log area with a defa ult value of zero (0 ) .

5.5 Device Statistics

In addition to the SM ART attribute s tructu re, s tatistic s per tainin g to the operati on an d health of the In tel SSD Taylors ville can be repor ted to the h ost on requ est throu gh the Device Statistics log as defined in th e ATA specification.
The Device Statistics log is a read-only GPL/SMART log loc ated at read log addr ess 0x04 and is accessible using READ LOG EXT, READ LOG DMA EXT or SMART READ LOG commands.
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Page 23
Table 20. Serial ATA Power Pin Definitions—2.5-inch Form Factors
Equivalent SMART
applicable)
0x00
--
List of Supported Pages
--
0x08
Power Cycle Count
0Ch
0x10
Power-On Hours
09h
0x18
Logical Sectors Written
E1h
for every host write
0x28
Logical Sectors Read
F2h
for every host read
and Completion
counts from 1 to 150
Intel® Solid-State Drive DC S3700
Table 15 lists the Devic e Statistics supported by the Intel S SD Taylorsville.
Page Offset Description
0x01 – General Statistics
0x04 – General Error Statistics
0x05 – Temperature Statistics
0x06 – Transport Statistics
0x07 – Solid State Device Statistics 0x08 Percentage Used Endurance Indicator
0x20
0x30
0x08 Num Reported Uncorrectable Errors BBh
0x10
0x00 Device Statistics Information Header -­0x08 Current Temperature -­0x10 Average Short Term Temperature -­0x18 Average Long Term Temperature -­0x20 Highest Temperature -­0x28 Lowest Temperature -­0x30 Highest Average Short Term Temperature -­0x38 Lowest Average Short Term Temperature -­0x40 Highest Average Long Term Temperature -­0x48 Lowest Average Long Term Temperature -­0x50 Time in Over-Temperature -­0x58 Specified Maximum Operating Temperature -­0x60 Time in Under-Temperature -­0x68 Specified Minimum Operating Temperature -­0x08 Number of Har dw a r e Res et s -­0x10 Number of ASR Events -­0x18 Number of Interface CRC Errors --
Num Write Commands – incremented by one
Num Read Commands – incremented by one
Num Resets Between Command Acceptance
attribute (if
--
--
--
E9h
Note: This device statistic

5.6 SMART Command Transport (SCT)

With SMART Command Transport (SCT), a host can send commands and data to an SSD and receive status and data from an SSD using standard write/read commands to manipulate two SM ART Logs:
Log Address E0h ("SCT Command/Status") — us ed to send commands and retrieve
status
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Intel® Solid-State Drive DC S3700
Log Address E1h ("SCT Data Transfer") — used to transport data
Intel SSD DC S3700 supports the following standard SCT a c tions:
Write Same — DC S3700 implements this action code as desc r ibe d in the ATA
specification.
Error Recovery Control — DC S3700 accepts this action code, and will store and
return error-recovery time limit v alues.
Feature Control - DC S3700 supports feature code 0001h (write ca c he) feature
code 0002h (write cache reordering), and feature c ode 0003h (time interval for temperature logg ing). It also supports D000h(Power Safe Write Cach e capacitor test interval), (D001h(r ead/write power governor m ode), D002h(read/write thermal governor mode), D003h(read power governor bu r s t pow er) , D004h(read power governor average pow er ) .
Data table command - DC S3700 supports data table command as specified in
ATA8-ACS2. This will read ou t tempera ture log ging in forma tion in ta ble ID 0002h .
Read Status Support - DC S3700 supports read status log
Custom Phy Settings –DC S3700 supports custom Phy settings us in g C002h
command. It can be used to set predefined configurations or custom slew rates.
Spread Spectrum Clocking – DC S3700 supports en a blin g or dis a bling Spread
Spectrum Clocking usin g C003h c om m a nd.
Phy Speed–DC S3700 supports setting Ph y speed using C004h comman d. Th is
command can be used to downsh if t th e SATA negotiated speed to 3Gb/s or
1.5Gb/s.

5.7 Data Set Management Command Set

Intel SSD DC S3700 supports the Data S et Ma na gem en t com man d s et Tr im at tr ibu te, which consists of:
DATA SET MANAGEMENT

5.8 Host Protected Area Command Set

Intel SSD DC S3700 supports the Host Protected Are a command set, wh ich consists of:
− READ NATIVE MAX ADDRESS
− SET MAX ADDRESS
− READ NATIVE MAX ADDRESS EXT
− SET MAX ADDRESS EXT
Intel SSD DC S3700 also supports the following optional commands:
− SET MAX SET PASSWORD
− SET MAX LOCK
− SET MAX FREEZE LOCK
− SET MAX UNLOCK

5.9 48-Bit Address Command Set

Intel SSD DC S3700 supports the 48-bit Address command set, which consists of:
FLUSH CACHE EXT
− READ DMA EXT
− READ NATIVE MAX ADDRESS EXT
− READ SECTOR(S) EXT
− READ VERIFY SECTOR(S) EXT
− SET MAX ADDRESS EXT
− WRITE DMA EXT
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Page 25
Table 21. Device Certifications and Declarations
Certification
Description
COUNCIL of 15 December 2004.
1: General Requirements)
Compatibility (EMC) Framework requirements of the Australian Communication Authority (ACA).
harmonized with CISPR 22: 2005.04.
Laboratory (RRL) Ministry of Information and Communication Republic of Korea.
computers or facsimile.
Intel® Solid-State Drive DC S3700
− WRITE MULTIPLE EXT
− WRITE SECTOR(S) EXT
− WRITE MULTIPLE FUA EXT
− WRITE DMA FUA EXT

5.10 General Purpose Log Command Set

Intel SSD DC S3700 supports the General Purpose Log command set, which consists of:
− READ LOG EXT
− WRITE LOG EXT

5.11 Native Comm and Queuing

Intel SSD DC S3700 supports the Native Command Queuing (NCQ) command set, which includes:
− READ FPDMA QUEUED
− WRITE FPDMA QUEUED
Note: With a maximum Queue Depth set to 32.

5.12 Software Settings Preservation

Intel SSD DC S3700 supports the SET FEATURES parameter to enable/disable the preservation of software settings.

6.0 Certifications and Declarations

Table 16 describes the Device Certifications supported by the Intel SSD DC S3700.
CE Compliant
UL Recognized
C-Tick Compliant
BSMI Compliant
Low Voltage DIRECTIVE 2006/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 12 December 2006, and EMC Directive 2004/108/EC OF THE EUROPEAN PARLIAMENT AND OF THE
Underwriters Laboratories, Inc. Bi-National Component Recognition; UL 60950-1, 2nd Edition, 2007-03-27 (Information Technology Equipment - Safety - Part 1: General Requirements)
CSA C22.2 No. 60950-1-07, 2nd Edition, 2007-03 (Informa tion Tec hnolog y Equipm ent - Safety - Part
Compliance with the Australia/New Zealand Standard AS/NZS3548 and Electromagnetic
Compliance to the Taiwan EMC standard CNS 13438: Information technology equipment - Radio disturbance Characteristics - limits and methods of measurement, as amended on June 1, 2006, is
Compliance with paragraph 1 of Article 11 of the Electromagnetic Compatibility Control Regulation
KCC
VCCI
RoHS Compliant Restriction of Hazardous Substance Directive
October 2012 Product Specification Order Number: 328171-001US 25
and meets the Electromagnetic Compatibility (EMC) Framework requirements of the Radio Research
Voluntary Control Council for Interface to cope with disturbance problems caused by personal
Intel Solid-State Drive DC S3700
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Intel® Solid-State Drive DC S3700
Table 21. Device Certifications and Declarations
Certification
Description
WEEE
Directive on Waste Electrical and Electronic Equipment
Table 22. Standards References
(JESD219)
nts/results/jesd219
Dec 2008
VCCI
http://www.vcci.jp/vcci_e/
for material description datasheet
June 2009
Serial ATA Revision 3.0
http://www.sata-io.org/
May 2005
SFF-8201, 2.5-inch dri ve form factor
http://www.sffcommittee.org/
voltage variations immunity tests)

7.0 References

Table 17 identifies the standards information referenced in this documen t.
Date Title Location
July 2012
Sept 2010
June 2009 RoHS
August 2009 ACS-2-ATA/ATAPI Command Set 2 Specification http://www.t13.org/
May 2006 SFF-8223, 2.5-inch Drive w/Serial Attachment Connector http://www.sffcommittee.org/
1995 1996 1995 1995 1997 1994
Solid-State Drive (SSD) Requirements and Endurance Test Method
Solid-State Drive (SSD) Requirements and Endurance Test Method (JESD218)
International Electrotechnical Commission EN 61000 4-2 (Electrostatic discharge immunity test) 4-3 (Radiated, radio-frequency, electromagnetic field immunity test) 4-4 (Electrical fast transient/burst immunity test) 4-5 (Surge immunity test) 4-6 (Immunity to conducted disturbances, induced by radio-
frequency fields) 4-11 (Voltage Variations, voltage dips, short interruptions and
http://www.jedec.org/standards-docume
http://www.jedec.org/standards-docume nts/docs/jesd218/
http://qdms.intel.com/ Click Search MDDS Database and search
http://www.iec.ch/
1995 ENV 50204
(Radiated electromagnetic field from digital radio telephones)
Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 26 Order Number: 328171-001US
http://www.dbicorporation.com/ radimmun.htm/
Page 27
Table 23. Glossary of Terms a nd Acronyms
ATA
Advanced Technology Attachment
CRC
Cyclic Redundancy Check
DAS
Device Activity Signal
DMA
Direct Memory Access
ECC
Error Correction Code
EXT
Extended
FPDMA
First Party Direct Memory Access
portion of the capacity is used for NAND flash management and maintenance purposes.
Gb
Gigabit
HDD
Hard Disk Drive
HET
High Endurance Technology
KB
Kilobyte
I/O
Input/Output
IOPS
Input/Output Operations Per Second
ISO
International Standards Organization
LBA
Logical Block Address
MB
Megabyte (1,000,000 bytes)
MLC
Multi-level Cell
MTBF
Mean Time Between Failures
NCQ
Native Command Queuing
NOP
No Operation
PB
Petabyte
PCB
Printed Circuit Board
PIO
Programmed Input/Output
RDT
Reliability Demonstration Test
RMS
Root Mean Square
SATA
Serial Advanced Technology Attachment
SCT
SMART Command Transport
health of a drive and reports potential problems.
SSD
Solid-State Drive
TB
Terabyte
TYP
Typical
Intel® Solid-State Drive DC S3700

8.0 Terms and Acronyms

Table 18 defines the terms and acronyms used in this documen t.
Term Definition
GB
SMART
Gigabyte Note: The total usable capacity of the SSD may be less than the total physical capacity because a small
Self-Monitoring, Analysis and Reporting Technology An open standard for developing hard drives and software systems that automatically monitors the
UBER Uncorrectable Bit Error Rate
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Intel® Solid-State Drive DC S3700
Date
Revision
Description
June 2012
001
Initial release.
Table 24. Returned Sector Da t a
F = Fixed
X = Both
0 X 0040h
General configuration bit-significant information
1 X 3FFFh
Obsolete - Number of logical cylinders (16,383)
2 V C837h
Specific configuration
3 X 0010h
Obsolete - Number of logical heads (16)
4-5 X 0h Retired
6 X 003Fh
Obsolete - Number of logical sectors per logical track (63)
7-8 V 0h Reserved for assignment by the CompactFlash* Association (CFA)
9 X 0h Retired
10-19 F
varies
Serial number (20 ASCII characters)
20-21 X 0h
Retired 22 X 0h
Obsolete
23-26 F
varies
Firmware revision (8 ASCII characters)
Model number (Intel® Solid-State Drive)
47
F
8001h
48 F 4000h
Trusted Computing F eatur e Set
49 F 2F00h
Capabilities
50 F 4000h
Capabilities
51-52 X 0h
Obsolete
53 F 0007h
Words 88 and 70:64 valid
54 X 3FFFh
Obsolete - Number of logical cylinders (16,383)
55 X 0010h
Obsolete - Number of logical heads (16)
56 X 003Fh
Obsolete - Number of logical sectors per logical track (63)
57-58 X
FC1000FBh
Obsolete
59 F F101 Number of sectors transferred per interrupt on multiple commands
63 X 0007h
Multi-w or d D MA modes supported/select e d
64 F 0003h
PIO modes supported
65 F 0078h
Minimum multiword DMA transfer cycle time per word
66 F 0078h
Manufacturer’s recommended multiword DMA transfer cycle time
67 F 0078h
Minimum PIO transfer cycle time without flow control
68 F 0078h
Minimum PIO transfer cycle time with IORDY flow control

9.0 Revision History

Appendix A: IDENTIFY DEVICE Command Data

Word
27-46
V = Variable
F
Default Value Description
varies
7:0—Maximum number of sectors transferred per interrupt on multiple commands
60-62
V
100GB: 0BA52230h 200GB: 0FFFFF FFh 400GB: 0FFFFF FFh 800GB: 0FFFFF FFh
Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 28 Order Number: 328171-001US
Total number of user-addressable sector
Page 29
Table 24. Returned Sector Da t a
F = Fixed
X = Both
69 F 4030h
Additional Supported
70 F 0000h
Reserved
71-74 F 0h
Reserved for IDENTIFY PACKET DEVICE command
75 F 001Fh
Queue depth
76 F 850Eh
Serial ATA capabilities
77 F 0006h
Reserved for future Serial ATA definition
78 F 0040h
Serial ATA features supported
79 V 0040h
Serial ATA features enabled
80 F 01FCh
Major version number
81 F 0028h
Minor version number
82 F 746Bh
Command set supported
84 F 6163h
Command set/feature supported extension
85 V 7469h
Command set/feature enabled
86 V B401h
Command set/feature enabled
87 V 6163h
Command set/feature default
88 V 407Fh
Ultra DMA Modes
89 F 0001h
Time required for security erase unit completion
90 F 0001h
Time required for enhanced security erase completion
91 V 0h Current advanced power management value
92 V 0FFFEh
Master Password Revision Code
93
X
0h
94 V 0h Vendor’s recommended and actual acoustic management value
95 F 0h Stream minimum request size
96 V 0h Streaming transfer time - DMA
97 V 0h Streaming access latency - DMA and PIO
98-99 F 0h
Streaming performance granularity
800GB: 5D26CEB0h
104 V 0h Streaming transfer time - PIO
106 F 4000h
Physical sector size / logical sector size
107 F 0h Inter-seek delay for ISO-7779 acoustic testing in microseconds
108-111
F varies
Unique ID
112-115
F 0h Reserved for world wide name extension to 128 bits
116 V 0h Reserved for technical report
117-118
F 0h Words per logical sector
119 F 405Ch
Supported settings
120 F 401Ch
Command set/feature enabled/supported
121-126
F 0h Reserved
127 X 0h Removable Media Status Notification feature set support
128 V 0021h
Security status
Intel® Solid-State Drive DC S3700
Word
83
V = Variable
F
Default Value Description
7501h
Command sets supported
Hardware reset result: the contents of bits (12:0) of this word shall change only during the execution of a hardware reset
100-103 V
105
V
100GB: 0BA52230h 200GB: 1749F1B0h 400GB: 2E9390B0h
0001h
Maximum number of 512-byte blocks of LBA Range Entries per DATA
October 2012 Product Specification Order Number: 328171-001US 29
Maximum user LBA for 48-bit address feature set
SET MANAGEMENT command
Intel Solid-State Drive DC S3700
Page 30
Intel® Solid-State Drive DC S3700
Table 24. Returned Sector Da t a
F = Fixed
X = Both
129 V 1h
Vendor-specific
130-159
X 0h Vendor-specific
160 X 0h CompactFlash Association (CFA) power mode 1
161-167
X 0h Reserved for assignment by the CFA
168 X 3h
Reserved for assignment by the CFA
169 X 0001h
Data set management Trim attribute support
170-175
F 0h Reserved for assignment by the CFA
176-205
X 0h Current media serial number
206 X 003Dh
SCT Command Transport
207-208
F 0000h
Reserved
209 X 4000h
Alignment of logical blocks within a physical block
210-211
V 0000h
Write-Read-Verify Sector Count Mode 3 (DWord)
212-213
F 0000h
Write-Read-Verify Sector Count Mode 2 (DWord)
214 X 0000h
NV Cache Capabilities
215-216
V 0000h
NV Cache Size in Logical Blocks (DWord)
217 F 0001h
Nominal media rotation rate
218 V 0000h
Reserved
219 F 0000h
NV Cache Options
220 V 0000h
Write-Read-Verify feature set
221 X 0000h
Reserved
222 F 101Fh
Transport major version number
223 F 0000h
Transport minor version number
224-229
F 0000h
Reserved
230-233
X 0000h
Extended Number of User Addressable Sectors (QWord)
235
F FFFFh
command for mode 03h
236-254
X 0000h
Reserved
255 V 74A5 Integrity word
Word
V = Variable
Default Value Description
234
Notes: F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change
F
when media is removed or changed. V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the commands executed by the device. X = F or V. The content of the word may be fixed or variable.
0001h
Minimum number of 512-byte data blocks per DOWNLOAD MICROCODE command for mode 03h
Maximum number of 512-byte data blocks per DOWNLOAD MICROCODE
Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 30 Order Number: 328171-001US
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