Intel® Solid-State Drive DC S3700
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Product Specification |
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Capacity: 2.5-inch : 100/200/400/800 GB |
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Power Management |
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1.8-inch : 200/400 GB |
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− 2.5 inch: 5 V or 12 V SATA Supply Rail9 |
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Components: |
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− 1.8 inch: 3.3 V SATA Supply Rail |
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− Intel® 25nm NAND Flash Memory |
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− SATA Interface Power Management |
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− High Endurance Technology (HET) Multi-Level Cell |
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− OS-aware hot plug/removal |
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(MLC) |
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− Enhanced power-loss data protection |
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Form Factor: 2.5- and 1.8-inch |
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Power10 |
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Read and Write IOPS1,2 (Full LBA Range, Iometer* |
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− Active: Up to 6 W (TYP) |
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Queue Depth 32) |
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− Idle: 650 mW |
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Weight: |
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− Random 4 KB3 Reads: Up to 75,000 IOPS |
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− Random 4 KB Writes: Up to 36,000 IOPS |
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− 2.5” 200,400,800 GB: 73.6 grams ± 2 grams |
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− 2.5” 100 GB: 70 grams ± 2 grams |
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− Random 8 KB3 Reads: Up to 47,500 IOPS |
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− 1.8” 200, 400 GB: 49 grams ± 2 grams |
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− Random 8 KB Writes: Up to 20,000 IOPS |
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Temperature |
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Bandwidth Performance1 |
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− Operating: 0o C to 70o C |
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− Sustained Sequential Read: Up to 500 MB/s4 |
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− Non-Operating11: -55o C to 95o C |
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− Sustained Sequential Write: Up to 460 MB/s |
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− Temperature monitoring and logging |
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Endurance: 10 drive writes per day5 for 5 years |
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− Thermal throttling |
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Latency (average sequential) |
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Shock (operating and non-operating): |
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− Read: |
50 µs (TYP) |
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− 1,000 G/0.5 msec |
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− Write: |
65 µs (TYP) |
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Vibration |
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Quality of Service6,8 |
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− Operating: 2.17 GRMS (5-700 Hz) |
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− Read/Write: 500 µs (99.9%) |
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− Non-operating: 3.13 GRMS (5-800 Hz) |
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Performance Consistency7,8 |
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Reliability |
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Read/Write: Up to 90%/90% (99.9%) |
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− Uncorrectable Bit Error Rate (UBER): |
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AES 256-bit Encryption |
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1 sector per 1017 bits read |
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Compliance |
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− Mean Time Between Failures (MTBF): |
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− SATA Revision 3.0; compatible with SATA 6Gb/s, |
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2 million hours |
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3Gb/s and 1.5Gb/s interface rates |
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− End-to-End data-path protection |
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− ATA8-ACS2; includes SCT (Smart Command |
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Certifications and Declarations |
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Transport) and device statistics log support |
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− UL*, CE*, C-Tick*, BSMI*, KCC*, Microsoft* |
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− SSD-enhanced SMART ATA feature set |
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WHQL, VCCI*, SATA-IO* |
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− Native Command Queuing (NCQ) command set |
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Product Ecological Compliance |
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− Data set management Trim command |
−RoHS*
Compatibility
−Windows Server 2008 Enterprise 32/64bit
−Windows Server 2008 R2
−Red Hat Enterprise Linux* 5.5, 5.6, 6.1
−SUSE* Linux Enterprise Server 11 SP1
−Intel® SSD Toolbox with Intel® SSD Optimizer
1.Performance values vary by capacityandformfactor
2.Performance specifications apply to both compressible and incompressible data
3.4 KB = 4,096 bytes; 8 KB = 8,192 bytes.
4.MB/s = 1,000,000 bytes/second
5.Based on JESD218 standard
6.Based on Random 4KB QD=1 workload, measured as the time taken for 99.9 percentile of commands to finish the round-trip from host to drive and back to host
7.Based on Random 4KB QD=32 workload, measured as the (IOPS in the 99.9th percentile slowest 1-second interval)/(average IOPS during the test)
8.Measurement taken once the workload has reached steady state but including all background activities required for normal operation and data reliability
9.Defaults to 12V, if both 12V and 5V are present
10.Based on 5V supply; refer to Table 7 for more details
11.Please contact your Intel representative for details on the non-operating temperature range
Order Number: 328171-001US
October 2012
Intel® Solid-State Drive DC S3700
Ordering Information
Contact your local Intel sales representative for ordering information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm
Low Halogen applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.
Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others.
Copyright © 2012 Intel Corporation. All rights reserved.
Intel® Solid-State Drive DC S3700 |
|
Product Specification |
October 2012 |
2 |
Order Number: 328171-001US |
Intel® Solid-State Drive DC S3700
Contents
1.0 |
Overview ............................................................................................................................. |
5 |
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2.0 |
Product Specifications .......................................................................................................... |
6 |
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2.1 |
Capacity............................................................................................................................... |
6 |
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2.2 |
Performance........................................................................................................................ |
6 |
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2.3 |
Electrical Characteristics ..................................................................................................... |
8 |
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2.4 |
Environmental Conditions................................................................................................... |
9 |
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2.5 |
Product Regulatory Compliance........................................................................................ |
10 |
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2.6 |
Reliability........................................................................................................................... |
10 |
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2.8 |
Temperature Sensor.......................................................................................................... |
11 |
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2.9 |
Power Loss Capacitor Test ................................................................................................ |
11 |
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2.10 |
Hot Plug Support ............................................................................................................... |
11 |
3.0 |
Mechanical Information ..................................................................................................... |
12 |
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4.0 |
Pin and Signal Descriptions................................................................................................. |
14 |
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4.1 |
2.5-inch Form Factor Pin Locations................................................................................... |
14 |
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4.2 |
1.8-inch Form Factor Pin Locations................................................................................... |
14 |
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4.3 |
Connector Pin Signal Definitions....................................................................................... |
15 |
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4.4 |
Power Pin Signal Definitions ............................................................................................. |
15 |
5.0 |
Supported Command Sets .................................................................................................. |
17 |
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5.1 |
ATA General Feature Command Set ................................................................................. |
17 |
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5.2 |
Power Management Command Set.................................................................................. |
17 |
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5.3 |
Security Mode Feature Set................................................................................................ |
17 |
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5.4 |
SMART Command Set ....................................................................................................... |
18 |
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5.5 |
Device Statistics................................................................................................................. |
22 |
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5.6 |
SMART Command Transport (SCT).................................................................................... |
23 |
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5.7 |
Data Set Management Command Set............................................................................... |
24 |
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5.8 |
Host Protected Area Command Set .................................................................................. |
24 |
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5.9 |
48-Bit Address Command Set............................................................................................ |
24 |
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5.10 |
General Purpose Log Command Set.................................................................................. |
25 |
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5.11 |
Native Command Queuing................................................................................................ |
25 |
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5.12 |
Software Settings Preservation......................................................................................... |
25 |
6.0 |
Certifications and Declarations ........................................................................................... |
25 |
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7.0 |
References ......................................................................................................................... |
26 |
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8.0 |
Terms and Acronyms.......................................................................................................... |
27 |
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9.0 |
Revision History ................................................................................................................. |
28 |
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Appendix A: IDENTIFY DEVICE Command Data ............................................................................... |
28 |
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Order Number: 328171-001US |
3 |
Intel® Solid-State Drive DC S3700
Intel® Solid-State Drive DC S3700 |
|
Product Specification |
October 2012 |
4 |
Order Number: 328171-001US |
Intel® Solid-State Drive DC S3700
This document describes the specifications and capabilities of the Intel SSD DC S3700.
The Intel SSD DC S3700 delivers leading performance and Quality of Service combined with world-class reliability and endurance for Serial Advanced Technology Attachment (SATA)-based computers in four capacities: 100 GB, 200 GB, 400 GB and 800 GB.
By combining 25nm Intel® NAND Flash Memory technology with SATA 6Gb/s interface support, the Intel SSD DC S3700 delivers sequential read speeds of up to 500 MB/s and sequential write speeds of up to 460 MB/s. Intel SSD DC S3700 delivers Quality of Service of 500 us for random 4KB reads and writes measured at a queue depth of 1.
The Intel SSD DC S3700 also includes High Endurance Technology (HET), which combines NAND silicon enhancements and SSD NAND management techniques to extend the write endurance of an SSD, leading to lifetime endurance levels of 10 drive writes per day for 5 years.
The industry-standard 2.5-inch form factor enables interchangeability with existing hard disk drives (HDDs) and native SATA HDD drop-in replacement with the enhanced performance, reliability, ruggedness, and power savings offered by an SSD.
Intel SSD DC S3700 offers these key features:
•High Endurance Technology (HET)
•High I/O and throughput performance
•Consistent I/O latency
•Enhanced power-loss data protection
•End-to-End data-path protection
•Thermal throttling
•Temperature Sensor
•Inrush current management
•Low power
•High reliability
•Enhanced ruggedness
•Temperature monitor and logging
•Power loss protection capacitor self-test
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Intel Solid-State Drive DC S3700 |
October 2012 |
Product Specification |
Order Number: 328171-001US |
5 |
Intel® Solid-State Drive DC S3700
Table 1. |
User Addressable Sectors |
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Intel SSD DC S3700 |
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Unformatted Capacity |
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(Total User Addressable Sectors in LBA Mode) |
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100 GB |
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195,371,568 |
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200 GB |
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390,721,968 |
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400 GB |
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781,422,768 |
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800 GB |
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1,562,824,368 |
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Notes: 1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes.
LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive.
The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND flash management and maintenance purposes.
Table 2. |
Random Read/Write Input/Output Operations Per Second (IOPS) |
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Intel SSD DC S3700 |
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Specification1 |
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Unit |
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100 GB |
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200 GB |
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400 GB |
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800 GB |
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(2.5”/1.8”) |
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(2.5”/1.8”) |
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Random 4 |
KB Read (up to)2 |
IOPS |
75,000 |
75,000 / 75,000 |
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75,000 / 75,000 |
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75,000 |
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Random 4 KB Write (up to) |
IOPS |
19,000 |
32,000 / 29,000 |
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36,000 / 36,000 |
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36,000 |
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Random 8 |
KB Read (up to)3 |
IOPS |
47,500 |
47,500 / 47,500 |
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47,500 / 47,500 |
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47,500 |
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Random 8 |
KB Write (up to) |
IOPS |
9,500 |
16,500 / 14,500 |
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19,500 / 19,500 |
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20,000 |
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Table 3. |
Random Read/Write IOPS Consistency |
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Intel SSD DC S3700 |
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Specification4 |
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Unit |
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100 GB |
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200 GB |
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400 GB |
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800 GB |
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(2.5”/1.8”) |
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(2.5”/1.8”) |
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Random 4 |
KB Read (up to)2 |
% |
90 |
90 |
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90 |
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90 |
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Random 4 KB Write (up to) |
% |
85 |
90 |
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90 |
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90 |
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Random 8 |
KB Read (up to)3 |
% |
90 |
90 |
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90 |
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90 |
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Random 8 |
KB Write (up to) |
% |
85 |
90 |
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90 |
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90 |
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Notes: 1. Performance measured using Iometer* with Queue Depth 32. Measurements are performed on a full Logical Block
Address (LBA) span of the drive.
2.4 KB = 4,096 bytes
3.8 KB = 8,192 bytes
4.Performance consistency measured using Iometer* based on Random 4KB QD=32 workload, measured as the (IOPS in the 99.9th percentile slowest 1-second interval)/(average IOPS during the test). Measurements are performed on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability
Intel® Solid-State Drive DC S3700 |
|
Product Specification |
October 2012 |
6 |
Order Number: 328171-001US |
Intel® Solid-State Drive DC S3700
Table 4. |
Sequential Read and Write Bandwidth |
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Intel SSD DC S3700 |
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Specification |
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Unit |
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100 GB |
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200 GB |
400 GB |
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800 GB |
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Sequential Read (SATA 6Gb/s)1 |
MB/s |
500 |
500 |
500 |
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500 |
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Sequential Write (SATA 6Gb/s)1 |
MB/s |
200 |
365 |
460 |
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460 |
Notes: 1. Performance measured using Iometer* with 128 KB (131,072 bytes) of transfer size with Queue Depth 32.
Table 5. |
Latency |
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Specification |
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Intel SSD DC S3700 |
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100, 200, 400 and 800 GB |
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Latency1 (TYP) |
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Read |
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50 µs |
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Write |
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65 µs |
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Power On to Ready2 |
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2.0 s |
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Table 6. |
Quality of Service |
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Intel SSD DC S3700 |
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Specification |
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Unit |
Queue Depth=1 |
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Queue Depth=32 |
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100 GB |
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200/400/800 |
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100 GB |
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200/400/800 |
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GB |
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GB |
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Quality of Service3,4 (99.9%) |
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Reads |
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ms |
0.5 |
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0.5 |
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1 |
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1 |
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Writes |
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ms |
0.5 |
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0.5 |
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15 |
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10 |
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Quality of Service3,4 (99.9999%) |
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Reads |
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ms |
10 |
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5 |
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10 |
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5 |
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Writes |
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ms |
10 |
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5 |
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20 |
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20 |
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Notes:
1.Device measured using Iometer. Latency measured using 4 KB (4,096 bytes) transfer size with Queue Depth equal to 1 on a sequential workload.
2.Power On To Ready time assumes proper shutdown. Time varies if shutdown is not preceded by STANDBY IMMEDIATE command.
3.Device measured using Iometer. Quality of Service measured using 4 KB (4,096 bytes) transfer size on a random workload on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability.
4.Based on Random 4KB QD=1, 32 workloads, measured as the time taken for 99.9(or 99.9999) percentile of commands to finish the round-trip from host to drive and back to host.
|
Intel Solid-State Drive DC S3700 |
October 2012 |
Product Specification |
Order Number: 328171-001US |
7 |
Intel® Solid-State Drive DC S3700
2.3Electrical Characteristics
Table 7. |
Operating Voltage for 2.5-inch Form Factor |
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Intel SSDDC S3700 |
|
Electrical Characteristics |
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100, 200, 400 and 800 GB |
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5 V Operating Characteristics: |
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Operating Voltage range |
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5 V (±5%) |
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Inrush Current (Typical Peak) 1 |
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1.0 A, < 1 s |
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12 V Operating Characteristics: |
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Operating Voltage range |
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12 V (±10%) |
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Inrush Current (Typical Peak) 2 |
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1.0 A, < 1 s |
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Notes:
1.Measured from initial device power supply application.
Table 8. |
Power Consumption for 2.5-inch Form Factor (5V Supply) |
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Intel SSD DC S3700 |
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Specification |
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Unit |
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100 GB |
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200 GB |
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400 GB |
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800 GB |
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Active Write - RMS Average 1 |
W |
2.8 |
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4.2 |
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5.2 |
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5.8 |
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Active Write - RMS Burst 2 |
W |
3.1 |
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4.6 |
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7.7 |
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8.2 |
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Idle |
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W |
0.6 |
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0.6 |
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0.6 |
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0.6 |
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Table 9. |
Power Consumption for 2.5-inch Form Factor (12V Supply) |
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Intel SSD DC S3700 |
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Specification1 |
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Unit |
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100 GB |
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200 GB |
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400 GB |
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800 GB |
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Active Write - RMS Average |
W |
2.9 |
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4.4 |
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5.4 |
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6.0 |
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Active Write - RMS Burst |
W |
3.3 |
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4.8 |
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7.6 |
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8.2 |
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Idle |
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W |
0.8 |
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0.8 |
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0.8 |
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0.8 |
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Notes:
1.The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) average power is measured using scope trigger over a 100 ms sample period.
2.The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) burst power is measured using scope trigger over a 500 us sample period.
Intel® Solid-State Drive DC S3700 |
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Product Specification |
October 2012 |
8 |
Order Number: 328171-001US |
Intel® Solid-State Drive DC S3700
Table 10. Operating Voltage and Power Consumption for 1.8-inch Form Factor
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Intel SSD DC S3700 |
Electrical Characteristics |
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200 and 400 GB |
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Operating Voltage for 3.3 V (±5%) |
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Min |
3.13 V |
Max |
3.47 V |
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Inrush Current (Typical Peak) 1 |
1.2 A, < 1 s |
Notes:
1.Measured from initial device power supply application.
Table 11. |
Power Consumption for 1.8-inch Form Factor |
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Specification1 |
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Unit |
Intel SSD DC S3700 |
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200 GB |
400 GB |
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Active Write - RMS Average @ 3.3V |
W |
4.3 |
5.3 |
Active Write - RMS Burst @ 3.3V |
W |
4.7 |
7.9 |
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Idle @ 3.3V |
W |
0.6 |
0.6 |
Notes:
1.The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) power is measured using scope trigger over a 100 ms sample period.
Table 12. |
Temperature, Shock, Vibration |
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Temperature |
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Range |
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Case Temperature |
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Operating |
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0 – 70 oC |
Non-operating1 |
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-55 – 95 oC |
Temperature Gradient2 |
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Operating |
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30 oC/hr (Typical) |
Non-operating |
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30 oC/hr (Typical) |
Humidity |
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Operating |
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5 – 95 % |
Non-operating |
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5 – 95 % |
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Shock and Vibration |
Range |
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Shock3 |
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Operating |
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1,000 G (Max) at 0.5 msec |
Non-operating |
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1,000 G (Max) at 0.5 msec |
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Vibration4 |
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Operating |
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2.17 GRMS (5-700 Hz) Max |
Non-operating |
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3.13 GRMS (5-800 Hz) Max |
Notes:
1.Please contact your Intel representative for details on the non-operating temperature range.
2.Temperature gradient measured without condensation.
3.Shock specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Shock specification is measured using Root Mean Squared (RMS) value.
4.Vibration specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Vibration specification is measured using RMS value.
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Intel Solid-State Drive DC S3700 |
October 2012 |
Product Specification |
Order Number: 328171-001US |
9 |