Intel SSDSC2BA200G3 User Manual

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Intel® Solid-State Drive DC S3700

Product Specification

 Capacity: 2.5-inch : 100/200/400/800 GB

1.8-inch : 200/400 GB

 Components:

− Intel® 25nm NAND Flash Memory

− High Endurance Technology (HET) Multi-Level Cell

(MLC)

 Form Factor: 2.5- and 1.8-inch  Read and Write IOPS

1,2

(Full LBA Range, Iometer*

Queue Depth 32)

− Random 4 KB3 Reads: Up to 75,000 IOPS

−

Random 4 KB Writes:

− Random 8 KB

−

Random 8 KB Writes:

 Bandwidth Performance

Up to 36,000 IOPS

Reads: Up to 47,500 IOPS

Up to 20,000 IOPS

− Sustained Sequential Read: Up to 500 MB/s

− Sustained Sequential Write: Up to 460 MB/s

 Endurance: 10 drive writes per day  Latency (average sequential)

for 5 years

− Read: 50 µs (TYP)

− Write: 65 µs (TYP)

 Quality of Service

6,8

− Read/Write: 500 µs (99.9%)

 Performa nc e C onsistency

7,8

Read/Write: Up to 90%/90% (99.9 % )

 AES 256-bit Encryption  Compliance

− SATA Revision 3.0; compatible with SATA 6Gb/s, 3Gb/s and 1.5Gb/s interface rates

− ATA8-ACS2; includes SCT (Smart Command Transport) and device statistics log support

− SSD-enhanced SMART ATA feature set

− Native Command Queuing (NCQ) command set

− Data set management Trim command

 Compatibility

− Windows Server 2008 Enterprise 32/64 bit

− Windows Server 2008 R2

− Red Hat Enterprise Linux* 5.5, 5.6, 6.1

− SUSE* Linux Enterprise Server 11 SP1

 Power Management

− 2.5 inch: 5 V or 12 V SATA Supply Rail

− 1.8 inch: 3.3 V SATA Supp l y Ra i l

− SATA Interface Power Management

− OS-aware hot plug/removal

− Enhanced power-loss data protection

 Power

− Active: Up to 6 W (TYP)

− Idle: 650 mW

 Weight:

− 2.5” 200,400,800 GB: 73.6 grams ± 2 grams

− 2.5” 100 GB: 70 gra m s ± 2 grams

− 1.8” 200, 400 GB : 49 grams ± 2 grams

 Temperature

− Operating: 0

− Non-Operating

C to 70o C

: -55o C to 95o C

− Temperature monitoring and logging

− Thermal throttling

 Shock (operating and non-operating):

− 1,000 G/0.5 msec

 Vibration

− Operating: 2.17 GRMS (5-700 Hz)

− Non-operating: 3.13 GRMS (5-800 Hz)

 Reliability

− Uncorrectable Bit Error Rate (UBER):

1 sector per 10

bits read

− Mean Time Between Failures (MTBF): 2 million hours

− End-to-End data-path protection

 Certifications and Declar a tio ns

− UL*, CE*, C-Tick*, BSMI*, KCC* , Micr o soft*

WHQL, VCCI* , SATA-IO*

 Product Ecological Compliance

− RoHS*

1. Performance values vary by capacity and form factor

2. Performance specifications apply to both compressible and incompressible data

3. 4 KB = 4,096 bytes; 8 KB = 8,192 b ytes.

MB/s = 1,000,000 bytes/second

5. Based on JESD218 standard

6. Based on Ra ndom 4KB QD =1 workloa d, measured as the time taken for 99.9

7. Based on Ra ndom 4KB QD =32 workload, measured as the (IOPS in the 99.9

8. Measurement taken once the workload has reached steady state but including all background activities required for normal operation and data reliability

9. Defaults to 12V, if both 12V and 5V are present

10. Based on 5V supply; refer to Table 7 for more details

11. Please contact your Intel representative for details on the non-operating temperature range

Order Number: 328171-001US October 2012

percentile of commands to finish the round-trip from host t o drive and back to host

percentile slowest 1-second interval)/(average IOPS during the test)

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Intel® Solid-State Drive DC S3700

Ordering Information

Contact your local Intel sales repres entative for ordering information .

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILIT Y OR WAR R ANTI E S R ELAT ING T O F IT NE SS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS OTHERWISE A GREE D IN WRI TIN G BY I NTEL, THE I NTEL P RODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

Intel may make changes to s pe cifications and p r o d uc t d es criptions at any time, without notice. Designers must not rely on the absence o r character ist ics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local I nt el s ales office or your distri butor to obtain the latest specifications and before placing your product order. Copies of documents which have an order numb e r and a re referenced in this docum e nt , or other Intel literature , may be obtained by calling

1-800-548-4725, or go to: http://www.intel.com/design/literature.htm Low Halogen applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased

components on the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for th e environment.

Intel and the Intel log o are trademarks of Intel Corporat ion in the U.S. and other countries. *Other names and brand s may be claimed as the property of others. Copyright © 2012 Int el C orpora tion. All rights reserved.

Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 2 Order Number: 328171-001US

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Intel® Solid-State Drive DC S3700

Contents

1.0 Overview .............................................................................................................................5

2.0 Product Specifications ..........................................................................................................6

2.1 Capacity ............................................................................................................................... 6

2.2 Performance ........................................................................................................................ 6

2.3 Electrical Characteristics ..................................................................................................... 8

2.4 Environmental Conditions ................................................................................................... 9

2.5 Product Regulatory Compliance ........................................................................................ 10

2.6 Reliability ........................................................................................................................... 10

2.8 Temperature Sensor .......................................................................................................... 11

2.9 Power Loss Capacitor Test ................................................................................................ 11

2.10 Hot Plug Support ............................................................................................................... 11

3.0 Mechanical Information ..................................................................................................... 12

4.0 Pin and Signal Descriptions ................................................................................................. 14

4.1 2.5-inch Form Factor Pin Locations ................................................................................... 14

4.2 1.8-inch Form Factor Pin Locations ................................................................................... 14

4.3 Connector Pin Signal Definitions ....................................................................................... 15

4.4 Power Pin Signal Definitions ............................................................................................. 15

5.0 Supported Command Sets .................................................................................................. 17

5.1 ATA General Feature Command Set ................................................................................. 17

5.2 Power Management Command Set .................................................................................. 17

5.3 Security Mode Feature Set ................................................................................................ 17

5.4 SMART Command Set ....................................................................................................... 18

5.5 Device Statistics ................................................................................................................. 22

5.6 SMART Command Transport (SCT).................................................................................... 23

5.7 Data Set Management Command Set ............................................................................... 24

5.8 Host Protected Area Command Set .................................................................................. 24

5.9 48-Bit Address Command Set............................................................................................ 24

5.10 General Purpose Log Command Set.................................................................................. 25

5.11 Native Command Queuing ................................................................................................ 25

5.12 Software Settings Preservation ......................................................................................... 25

6.0 Certifications and Declarations ........................................................................................... 25

7.0 References ......................................................................................................................... 26

8.0 Terms and Acronyms .......................................................................................................... 27

9.0 Revision History ................................................................................................................. 28

Appendix A: IDENTIFY DEVICE Command Data ............................................................................... 28

Order Number: 328171-001US 3

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Intel® Solid-State Drive DC S3700

Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 4 Order Number: 328171-001US

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Intel® Solid-State Drive DC S3700

1.0 Overview

This document describes the specifications and capabilities of the Intel SSD DC S3700. The In tel SSD DC S3700 delivers leading performance a nd Quality of Service combined

with world-class reliability and endurance for Serial A dva n ced T ech n ology A ttac h men t (SATA)-based computers in four capacities: 100 GB, 200 GB, 400 GB and 800 GB.

By combining 25n m Intel® NAND Flash Memory tech nology w ith SATA 6G b/s interfa ce support, the Intel SSD DC S3700 delivers sequential r ead speeds of up to 500 MB/s and sequential write speeds of up to 460 MB/s. Intel SSD DC S3700 delivers Quality of Service of 500 us for ran dom 4KB r ea ds a nd writes measured at a queue depth of 1.

The Intel SSD DC S3700 also includes High Endurance Technology (HET), which combines NAND silicon enhancements and SSD NAND management techniques to extend the write endurance of a n SSD, leading to lifetime en durance levels of 10 drive writes per day for 5 years.

The industry-standard 2.5-inch form factor enables interchangeability with ex is ting hard disk drives (HDDs) and native SATA HDD drop-in replacement with the enhanced performance, reliability, ruggedness, and power savings offered by an SSD.

Intel SSD DC S3700 offers these key features:

• High Endurance Technology (HET)

• High I/O and throughput performance

• Consistent I/O latency

• Enhanced power-loss data protection

• End-to-End data-path protection

• Thermal thr ottling

• Temperature Sensor

• Inrush current management

• Low power

• High reliability

• Enhanced ruggedn es s

• Temperature monitor and logging

• Power loss prot e c tion capacitor se lf-test

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Intel Solid-State Drive DC S3700

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Intel® Solid-State Drive DC S3700

Table 1. User Addressable Secto rs

Unformatted Capacity

(Total User Addressable Sectors in LBA Mode)

100 GB

195,371,568

200 GB

390,721,968

400 GB

781,422,768

800 GB

1,562,824,368

Table 2. Random Read/W rite Input/Output Opera t ions Per Second (I OPS)

Intel SSD DC S370 0

100 GB

200 GB

(2.5”/1.8”)

400 GB

(2.5”/1.8”)

Random 4 KB Read (up to)2

IOPS

75,000

75,000 / 75,000

75,000

Random 4 KB Write (up to)

IOPS

19,000

32,000 / 29,000

36,000 / 36,000

36,000

Random 8 KB Read (up to)3

IOPS

47,500

47,500 / 47,500

47,500

Random 8 KB Write (up to)

IOPS

9,500

16,500 / 14,500

19,500 / 19,500

20,000

Table 3. Random Read/W rite IOPS Consistency

Intel SSD DC S3700

100 GB

200 GB

(2.5”/1.8”)

400 GB

(2.5”/1.8”)

Random 4 KB Read (up to)2

Random 4 KB Write (up to)

Random 8 KB Read (up to)3

Random 8 KB Write (up to)

Notes: 1. Performance measured using Iom e te r* wi th Queue Depth 32. Measurements are performed on a full Logical Block

2.0 Product Specifications

2.1 Capacity

Intel SSD DC S3700

Notes: 1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes. LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive. The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity

is used for NAND flash management and maintenance purposes.

2.2 Performance

Specification1 Unit

Specification4 Unit

800 GB

Address (LBA) span of the drive.

2. 4 KB = 4,096 bytes

3. 8 KB = 8,192 bytes

4. Performance consistency measured using Iometer* based on Random 4KB QD=32 workload, measured as the (IOPS in the 99.9th percentile slowest 1-second interval)/(average IOPS during the test). Measurements are performed on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability

Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 6 Order Number: 328171-001US

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Table 4. Sequential Rea d a nd Write Bandwidth

Intel SSD DC S370 0

100 GB

200 GB

400 GB

800 GB

Sequential Read (SATA 6Gb/s)1

MB/s

500

Seque ntial Write (SATA 6Gb/s)1

MB/s

200

365

460

Table 5. Latency

Intel SSD DC S370 0

100, 200, 400 and 800 GB

Table 6. Quality of Service

Intel SSD DC S3700

Queue Depth=1

Queue Depth=32

100 GB

200/400/800

100 GB

200/400/800

Quality of Service

(99.9%)

Reads

0.5

0.5 1 1

Writes

0.5

Quality of Service

(99.9999%)

Reads

10 5 10

Writes

10 5 20

Intel® Solid-State Drive DC S3700

Specification Unit

Notes: 1. Performance measured using Iometer* with 128 KB (131,072 bytes) of transfer size with Queue Depth 32.

Specification

Latency1 (TYP)

Read Write Power On to Ready

Specification Unit

3,4

Notes:

1. Device measured using Iometer. Latency meas ured using 4 KB (4,096 byt es) transfer size with Queue Depth eq ual to 1 on a sequential workload.

2. Power On To Ready time assumes proper shutdown. Time varies if shutdown is not preceded by STANDBY IMMEDIATE command.

3. Device measured using Iometer. Quality of Service measured using 4 KB (4,096 bytes) transfer size on a random workload on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability.

4. Based on Random 4KB QD=1, 32 workloads, measured as the time taken for 99.9(or 99.9999) percentile of commands to finish the round-trip from host to drive and back to host.

50 µs

65 µs

2.0 s

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Intel Solid-State Drive DC S3700

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2.3 Electrical Characteristics

Table 7. Operating Voltage for 2.5-inch Form Fa c t or

Intel SSDDC S3700

100, 200, 400 and 800 GB

Inrush Current (Typical Peak) 1

1.0 A, < 1 s

Intel SSD DC S3700

100 GB

200 GB

400 GB

800 GB

Active Write - RMS Average 1

2.8

4.2

5.2

5.8

Active Write - RMS Burst 2

8.2

Idle

0.6

Intel SSD DC S3700

100 GB

200 GB

400 GB

800 GB

Active Write - RMS Average

6.0

Active Write - RMS Burst

3.3

4.8

7.6

8.2

Idle

0.8

Electrical Characteristics

Intel® Solid-State Drive DC S3700

5 V Operating Characteristics:

Operating Voltage range

12 V Operating Characteristics:

Operating Voltage range

Inrush Current (Typical Peak)

Notes:

1. Measured from initial device power supply application.

5 V (±5%)

12 V (±10%)

1.0 A, < 1 s

Table 8. Power Consumption for 2.5-inch Form Factor (5V Supply)

Specification Unit

3.1 4.6 7.7

Table 9. Power Consumption for 2.5-inch Form Facto r ( 12V Su pply)

Specification1 Unit

2.9 4.4 5.4

0.8 0.8 0.8

Notes:

1. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) average

power is measured using scope t rigger over a 100 ms sample period.

2. The workload equat es 12 8 KB (131,0 7 2 by t es) Q ueu e Depth equal to 32 sequential writes. Root Mean Squared (RMS) burst

power is measured using scope t rigger over a 500 us sample period.

Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 8 Order Number: 328171-001US

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Table 10. Operating Voltage and Power Consumption for 1.8-inch Form Factor

Intel SSD DC S3700

200 and 400 GB

Max

3.47 V

Inrush Current (Typical Peak) 1

1.2 A, < 1 s

Intel SSD DC S3700

200 GB

400 GB

Active Write - RMS Average @ 3.3V

4.3

5.3

Active Write - RMS Burst @ 3.3V

4.7

7.9

Idle @ 3.3V W 0.6

0.6

Table 12. Temperature, Shock, Vi brat i on

Temperature

Range

Non-operating1

-55 – 95 oC

Non-operating

30 oC/hr (Typical)

Non-operating

5 – 95 %

Shock and Vibration

Range

Non-operating

1,000 G (Max) at 0.5 msec

Non-operating

3.13 G

RMS

(5-800 Hz) Max

Intel® Solid-State Drive DC S3700

Electrical Characteristics

Operating Voltage for 3.3 V (±5%) Min

Notes:

3.13 V

1. Measured from initial device power supply application.

Table 11. Power Consumption for 1.8-inch Form Factor

Specification1 Unit

Notes:

1. The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequenti al writes. Root Mean Squared (RMS) pow er is measured using scope tri gg er ov e r a 1 0 0 ms sample period.

2.4 Environme nt al Condi t ions

Case Temperature Operating

0 – 70

Temperature Gradient Operating

Humidity Operating

Shock Operating

Vibration

Operating

Notes:

C/hr (Typical)

5 – 95 %

1,000 G (Max) at 0.5 msec

2.17 G

(5-700 Hz) Max

RMS

1. Please contact your Intel representative for details on the non-operating temperature range.

2. Temperature gradient measured without condensation.

3. Shock specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Shock specification is measured using Root Mean Squared (RMS) value.

4. Vibration specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus may b e ap plied in the X, Y or Z axis. Vibration specification is measured using RMS value.

Intel Solid-State Drive DC S3700 October 2012 Product Specification Order Number: 328171-001US 9

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2.5 Product Regulatory Compliance

Table 13. Product Regulatory Compliance Specifications

Region For Which

Conformity Declared

Standard Digital Apparatus

measurement CISPR24:2010

measurement CISPR24:2008 (Modified)

— Part 1: General Requirements

Table 14. Reliability Specifications

to the host.

Test (RDT).

Power On/Off Cycles is defined as power being remov ed fr om the

SSD, and then restored . Mos t host sy stems rem ove p ower from the shutdown.

Intel SSD DC S3700 meets or exceeds the regulatory or certification requirements in Table 8.

Title Description

Intel® Solid-State Drive DC S3700

TITLE 47-Telecommunications CHAPTER 1— FEDERAL COMMUNMICATIONS COMMISSION PART 15 — RADIO FREQUENCY DEVICES

ICES-003, Issue 4 Interference-Causing Equipment

IEC 55024 Information Technology Equipment — Immunity characteristics— Limits a n d method s of

IEC 55022 Information Technology Equipment — Radio disturbance Characteristics— Limits and methods of

EN-60950-1 2nd Edition

UL/CSA EN-60950-1 2nd Edition

FCC Part 15B Class B

CA/CSA-CEI/IEC CISPR 22:02. This is CISPR 22:1997 with Canadian Modifications

EN-55024: 1998 and its amendments European Union

EN-55022: 2006 and its amendments European Union

Information Technology Equipment — Safety

Information Technology Equipment — Safety — Part 1: General Requirements

2.6 Reliability

Intel SSD DC S3700 meets or exceeds SSD enduran ce and data retention requirements as specified in the JESD218 standard. R elia b ility specifications are listed in the table

Parameter Value

below:

USA

Canada

USA/Canada

Uncorrectable Bit Error Rate (UBER)

Uncorrectable bit error rate will not exceed one sector in the

specified number of bits read. In the unlikely event of a non-recoverable read error, the SSD will report it as a read failure to the host; the sector in error is considered corrupt and is not returned

Mean Time Between Failures (MTBF)

Mean Time Between Failures is estimated bas ed o n Telc o r dia*

methodology and demonstrated through Reliability Demonstration

Power On/Off Cycles

SSD when entering suspend and hibernate as well as on a system

Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 10 Order Number: 328171-001US

< 1 sector per 10

2,000,000 hours

24 per day

bits read

Page 11

Table 14. Reliability Specifications

endurance.

requirements according to the JESD218 standard.

Intel® Solid-State Drive DC S3700

Parameter Value

Insertion Cycles

SATA/power cable insertion/removal cycles.

Data Retention

The time period for retaining data in the NAND at maximum rated

Endurance Rating

1. Refer to JESD218 standard table 1 for UBER, FFR and other Enterprise SSD requirements

2.8 Temperature Sensor

The Intel S SD DC S3700 has an internal temperature sensor with an accuracy of +/-2C over a range of -20C to +80C which can be monitor ed using two SMART attributes: Airflow Temperature (BEh) and Device Internal Temperature (C2h).

For more information on supported S MART attrib utes, see “SMA RT Attributes ” on p age

17.

50 on SATA cable

500 on backplane

3 months power-off retention once SSD reaches rated write endurance at 40 °C

10 drive writes/day over 5 years while running JESD218

standard

The number of drive writes such that the SSD meets the

2.9 Power Loss Capacitor Test

The Intel SSD DC S3700 supports te sting of the pow er loss capacitor, w hich can be monitored using the following SMART attribute: (175, AFh).

2.10 Hot Plug Support

Hot Plug insertion an d removal is supported in th e presence of a proper c onnector and appropriate operating sy s tem ( O S ) , as described in the SATA 3.0 spec if ic a tion.

This product supports asynchronous signal recovery and issues an unsolicited COMINIT when first mated w ith a powered connector to guaran tee r eliable detection by a host system without hardware device detec tion.

October 2012 Product Specification Order Number: 328171-001US 11

Intel Solid-State Drive DC S3700

Page 12

3.0 Mechanical Information

Figures 1 and 2 show the physical package information for the Intel S SD DC S 3700 in the 2.5- and 1.8-inch form factors. All dimensions are in millimeters .

Figure 1. Intel SSD DC S 3700 2.5-inch Dimensions

Intel® Solid-State Drive DC S3700

Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 12 Order Number: 328171-001US

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Intel® Solid-State Drive DC S3700

Figure 2. Intel SSD DC S 37001.8-inch Dimensions

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Intel Solid-State Drive DC S3700

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Intel® Solid-State Drive DC S3700

4.0 Pin and Signal Descriptions

4.1 2.5-inch Form Factor Pin Locations

Figure 4. Layout of 2.5-inch Form Factor Signal and Power Segment Pins

Note: 2.5-inch connector supports built in latching capability.

4.2 1.8-inch Form Factor Pin Locations

Figure 3. Layout of 1.8-inch Form Factor Signal a nd Power Segment Pi ns

Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 14 Order Number: 328171-001US

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Factors

Ground

1st mate

A+

A-

Ground

1st mate

B-

B+

Ground

1st mate

Table 16. Serial ATA Power Pin Definitions—2.5-inch Form Factors

P12

Not connected

(3.3 V Power)

P22

Not connected

(3.3 V Power)

P32

Not connected

(3.3 V Power; pre-charge)

2nd Mate

Ground

1st Mate

P53

Ground

1st Mate

P63

Ground

1st Mate

5 V Power

1st Mate

5 V Power

2nd Mate

5 V Power

2nd Mate

P103

Ground

1st Mate

P116

DAS

Device Activity Signal

2nd Mate

P12

Ground

1st Mate

P137

V12

12 V Power

1st Mate

P147

V12

12 V Power

2nd Mate

P157

V12

12 V Power

2nd Mate

Intel® Solid-State Drive DC S3700

4.3 Connector Pin Signal Definitions

Table 15. Serial ATA Connector Pin Signal Def initions—2.5-inch and 1.8-inch Form

Pin Function Definition

Differential signal pair A

Differential signal pair B

Note: Key and spacing separate signal and power segments.

4.4 Power Pin Signal Definitions

Pin1 Function Definition Mating Order

3,4

3,5

3,4

Notes:

1. All pins are in a single row, with a 1.27 mm (0.050-inch) pitch.

2. Pins P1, P2 and P3 are connected together, although they are not connected internally to the device. The host may put 3.3 V on these pins.

3. The mating sequence is:

• ground pins P4-P6, P10, P12 and the 5V power pin P7

• signal pins and the rest of the 5V power pins P8-P9

4. Ground connectors P4 and P12 may contact before the other 1st mate pins in both the power and signal connectors to discharge ESD in a suitably configured backplane connector.

5. Power pins P7, P8, and P9 are internally connected to one another within the device.

6. The host may ground P11 if it is not used for Device Activity Signal (DAS).

7. Pins P13, P14 and P15 are internally connected to one another within the device. The host may put 12 V on these pins.

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Intel Solid-State Drive DC S3700

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Intel® Solid-State Drive DC S3700

Table 17. Serial ATA Power Pin Definitions—1.8-inch F orm Factors

P12

V33

3.3 V Power

2nd Mate

P22

V33

3.3 V Power, per-charge

2nd Mate

P33

Ground

1st Mate

P43

Ground

1st Mate

P54

5 V Power; not connected.

1st Mate

P64

5 V Power; not connected.

2nd Mate

P75

DAS

Device Activity Signal

2nd Mate

Key

P86

Optional

Manufacturing Test Pin

2nd Mate

P96

Optional

Manufacturing Test Pin

2nd Mate

Pin Function Definition Mating Order1

Notes:

1. All mate sequences assume zero angular offset between connectors.

2. P1 and P2 are internally connected to one another within the device.

3. Ground connectors P3 and P4 may contact before the other 1st mate pins in both the power and signal connectors to

discharge ESD in a suitably configure backplane connector.

4. Pins P5 and P6 are not connected internally to the device but there is an option to connect through a zero ohm stuffing

resistor. The host may put 5V on these pins.

5. The host may ground P7 if it is not used for Device Activity Signal (DAS).

6. P8 and P9 should not be connected by the host.

Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 16 Order Number: 328171-001US

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Intel® Solid-State Drive DC S3700

5.0 Supported Command Sets

Intel SSD DC S3700 supports all mandatory ATA (Advanced Technology Attachment) commands defined in the AT A8-ACS specification d escribed in this section.

5.1 ATA General Feature Command Set

The Taylorsville SSD supports the ATA General Feature command set (non- PACKET), which consists of:

− EXECUTE DEVICE DIAGNOSTIC

− SET FEATURES

− IDENTIFY DEVICE

Note: See Appendix A, “IDENTIFY DE VICE Command Data” on page 27 for details on the sector data returned after issuing an IDENTIFY DEVICE command.

Intel SSD DC S3700 also supports the following optiona l commands:

− READ DMA

− WRITE DMA

− READ SECTOR(S)

− READ VERIFY SECTOR(S)

− READ MULTIPLE

− SEEK

− SET FEATURES

− WRITE SECTOR(S)

− SET MULTIPLE MODE

− WRITE MULTIPLE

− FLUSH CACHE

− READ BUFFFER

− WRITE BUFFER

− NOP

− DOWNLOAD MICROCODE

− WRITE UNCORRECTABLE EXT

1. The only multiple supported will be multiple 1

5.2 Power Management Command Set

Intel SSD DC S3700 supports the Power Management command set, which consists of:

− CHECK POWER MODE

− IDLE

− IDLE IMMEDIATE

− SLEEP

− STANDBY

− STANDBY IMMEDIATE

5.3 Security Mode Feature Set

Intel SSD DC S3700 supports the Secu r ity Mode command set, which consists of:

− SECURITY SET PASSWORD

− SECURITY UNLOCK

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Intel Solid-State Drive DC S3700

Page 18

− SECUR ITY ER A S E PR EPARE

Table 18. SMART Attributes

blocks si n ce leaving the f actory (grown def ect count).

counted: active, idle and slumb er .

number of power cycle events over t he life of the device.

AAh

Available Reserved Spa c e (See Attribute E8)

1 1 0 0 1 1 10

Program Fail Count

shows the percent remaining of allowable program fails.

− SECURITY ERASE UNIT

− SECURITY FREEZE LOCK

− SECURITY DISABLE PASSWORD

5.4 SMART Command Set

Intel SSD DC S3700 supports the SMART command set, whic h consists of:

− SMART READ DATA

− SMART READ ATTRIBUTE THRESHOLDS

− SMART ENABLE/DISABLE ATTRIBUTE AUTOSAVE

− SMART SAVE ATTRIBUTE VALUES

− SMART EXECUTE OFF-LINE IMMEDIATE

− SMART READ LOG SECTOR

− SMART WRITE LOG SECTOR

− SMART ENABLE OPERATIONS

− SMART DISABLE OPERATIONS

− SMART RETURN STATUS

− SMART ENABLE/DISABLE AUTOMATIC OFFLINE

Intel® Solid-State Drive DC S3700

5.4.1 SMART Attributes

Table 13 lists the SMART attributes supported by the Intel SSD DC S3700 and the corresponding s tatus flags and threshold settings.

ID Attribute

05h

09h

0Ch

Re-allocated Sector Count The raw value of this attribute shows the number of retired

Power-On Hours Count The raw value reports two values: the first 4 bytes report

the cumulative number of power-on hours over the life of the device, the remaining bytes report the number of milliseconds since the last hour increment. The On/Off status of the Device Initiated Power Management (DIPM) feature will affect the number of hours reported. If DIPM is turned On, the recorded value for power-on hours does not include the time that the device is in a "slumber" state. If DIPM is turned Off, the recorded value for power-on hours should match the clock time, as all three device states are

Power Cycle Count

The raw value of this attribute reports the cumulative

Status Flag s

Threshold

1 1 0 0 1 0 0 (none)

ABh

The raw value of this attribute shows total count of program fails and the normalized value, beginning at 100,

Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 18 Order Number: 328171-001US

1 1 0 0 1 0 0 (none)

Page 19

Table 18. SMART Attributes

Erase Fail Count

the percent remaining of allowable erase fails.

Unexpect ed Power Loss

the

PLI activity using capacitor power).

Power Loss Protection Failure

o discharge cap, saturates

number of tests.

SATA Downshift Count

Uncorrectable Error Count

Correction Code (ECC).

in C degrees.

number of unsafe (unclean) shutdown events over the life

the last command.

(PCB) sensor without of fse t.

re-allocated on next write.

redundancy check (CRC) errors.

the host.

maximum rated cycles.

Intel® Solid-State Drive DC S3700

ID Attribute

Ach

AEh

AFh

B7h

B8h

BBh

BEh

The raw value of this attribute shows total count of erase fails and the normalized value, beginning at 100, shows

Also known as “Power-off Retract Count” per magnetic-drive terminology. Reports numbe r of uncl ean shutdo wns, cumul ative o ver life of the SSD. An “unclean shutdown” is th e removal of po wer without STANDBY IMMEDIATE as the last command (regardless of

Last test result as microseconds t at max value. Also logs minutes since last test and lifetime

The count of the number of times SATA interface selected lower signaling rate due to error.

End-to-End Error Det ection Count

Reports number of End-to-End recovered errors corrected by hardware.

The raw value shows the count of errors that could not be recovered using Error

Temperature - Airflow Temperature (Case) Reports the

SSD case temperature. Raw value suggests 100 - case temperature

Status Flag s

Threshold

1 1 0 0 1 0 0 (none)

1 1 0 0 1 1 10

1 1 0 0 1 0 0 (none)

1 0 0 0 1 0 0 (none)

Power-Off Retract Count (Unsafe Shutdown Count) The raw value of this attribute reports the cumulative

C0h

C2h

C5h

C7h

E1h

E2h

of the device. An unsafe shutdown occurs whenever the device is powered off without STANDBYIMMEDIATE being

Temperature - Device Internal Temperature

Reports internal temperature of the SSD. Temperature reading is the value direct from the printed circuit board

Pending Sector Count Number of current unrecoverable read errors that will be

CRC Error Count The total number of encountered SATA interface cyclic

Host Writes The raw value of this attribute reports the total number of

sectors written by the host system. The raw value is increased by 1 for every 65,536 sectors (32MB) written by

Timed Workload Media Wear Measures the wea r seen by t he SSD ( since reset of the

workload timer, attribute E4h), as a percentage of the

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1 1 0 0 1 0 0 (none)

1 0 0 0 1 0 0 (none)

0 1 0 0 1 0 0 (none)

1 1 0 0 1 0 0 (none)

Intel Solid-State Drive DC S3700

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Intel® Solid-State Drive DC S3700

Table 18. SMART Attributes

E4h).

reserved space. The t hreshold value for this attribut e is 10 percent availability.

100 to 1 as the average erase cycle c ount increases from 0

wear can be put on the device.

Reports Percent Throttle Status and Count of events

the host.

Table 19. SMART Attribute Status Flags

Self-preserving attribute

Not a self-preserving attribute

Self-preserving attribute

Event count attribute

Not an event count attribute

Event count attribute

Error rate attribute

Not an error rate attribute

Error rate attribute

Performance attribute

Not a performance attribute

Performance attribute

online activity

Pre-fail warranty attribute

Advisory

Pre-fail

ID Attribute

Timed Workloa d Host Read/Write Ra tio

E3h

E4h

E8h

E9h

EAh

F1h

Shows the percentage of I/O operations that are read

operations (since reset of the workload timer, attribute

Timed Workload Timer Measures the el aps e d time (number of minutes since

starting this workload timer).

Available Reserved Spa c e

This attribute reports th e number of reserve blocks

remaining. The normaliz ed v a lue begins at 100 ( 64h), which corresponds to 100 percent availability of the

Media Wearout Indicator

This attribute reports the number of cycles the NAND media

has undergone. The normalized value declines linearly from to the maximum rated cycles.

Once the nor malized v a lue reaches 1, the number will not

decrease, although it is likely th at sign ificant addit i onal

Thermal Throttle Status

Total LBAs Written

The raw value of this attribute reports the total number of

sectors written by the host system. The raw value is increased by 1 for every 65,536 sectors (32MB) written by

Status Flag s

Threshold

1 1 0 0 1 0 0 (none)

1 1 0 0 1 1 10

1 1 0 0 1 0 0 (none)

Total LBAs Read

F2h

Status Flag Description Value = 0 Value = 1

The raw value of this attribute reports the total number of

sectors read by the host system. The raw value is increased by 1 for every 65,536 sectors (32MB) read by

Online collection attribute Collected only during offline activity

Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 20 Order Number: 328171-001US

1 1 0 0 1 0 0 (none)

Collected during both offline and

Page 21

Intel® Solid-State Drive DC S3700

5.4.1.1 Timed Workload Endurance Indicators

Timed Workload Medi a Wear Indicator — ID E2h

This attribute tracks the driv e wear seen by the device dur ing the last wear timer loop, as a percentage of the maximum ra ted cycles. The raw value trac ks the percentage up to 3 decimal points. This valu e s hould be divided by 1024 to get th e perc entage.

For example: if the raw v alue is 4450, the percentage is 4450/1024 = 4. 345%. The raw value is held at FFFFh until the wear timer (attribute E4h) reaches 60 (minutes). The normalized value is alway s s et to 100 and should be ignored.

Timed Workload Ho st Reads Percentage — ID E3h

This attribute sh ows the perc en tage of I /O opera tion s tha t are rea d opera tion s durin g the last workload timer loop. The raw value tracks this percentage and is held at FFFFh until the workloa d timer (attri bute E4h) r eaches 60 (minutes) . The normalized valu e is always set to 100 and should be ignor ed.

Workload Timer — ID E4h

This attribute is u s e d to measure the time ela p sed during th e current workload. The attribute is reset when a SMART EXECUTE OFFLINE IMMEDIATE (D4h) subcommand 40h is issued to the dr ive. The raw valu e tracks the time in minutes and has a maximum value of 232 = 4,294,967,296 minu tes (8,171 years ). The normaliz ed value is always set to 100 and should be ign ored.

Example Use Cases

The Timed Workload Endu ran ce a ttribu tes des crib ed in th is s ection ar e inten d ed to b e used to measure the amount of m edia wear that the drive is subjected to during a timed workload.

Ideally, the system that th e drive is being u sed in shou ld be capable of iss uing SM ART commands. Otherwise, provisions have been pr ovided to allow the media wear attributes to be persistent s o th e dr iv e c a n be moved to a SMART capable system to read out the drive wear attribu te values.

Use Case 1 – With a System Capable of SMAR T Commands

1. Issue the SMART EXECUTE OFF-LINE IMMEDIATE (D4h) sub-command 40h to reset the drive wear attrib utes.

2. Run the workload to be e valua ted for a t least 60 min u tes. Oth erwis e the driv e wear attributes will not be available.

3. Read out the drive w ear attributes with th e SMART READ DATA (D0h) command.

Use Case 2 – With a System Not Capable of SM ART Commands

1. On a SMART capable system, issue the SMART EXECUTE OFF-LINE IMMEDIATE (D4h) sub-command 40h to reset the E4h (work load timer ) a ttribute.

2. Move the drive to the system wh er e th e workload will be measured (and not capable of SMART commands).

3. Run the workload to be e valua ted for a t least 60 min u tes. Oth erwis e the driv e wear attributes will not be available.

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Intel Solid-State Drive DC S3700

Page 22

Intel® Solid-State Drive DC S3700

4. Do a clean system power down by issuing the ATA STANDBY IMMEDIATE command prior to shutting down the system. This will store a ll the drive wea r SMART attributes to persistent memory within the dri ve.

5. Move the drive to a SMART capable system.

6. Read out the drive w ear attributes with th e SMART READ DATA (D0h) command within 60 minutes after power-up.

Example Calculation of Drive Wear

The following is an example of how the drive wear attributes c a n be used to evaluate the impact of a given workload. The Hos t W rites SMART attribute (E1h) can a lso be used to calculate th e amount of data written by the host du r ing the workload by reading this attribute befor e a nd after running the workload. This example assumes that the steps shown in “Exam ple Us e Cases” on page 18 were followed to obtain the following attribu te values:

• Timed Workload Media Wear (E2h) has a raw value of 16. T herefore, the percentage wear = 16/1024 = 0.016%.

• Timed Workload Host Read/Write Ratio (E 3 h) has a normalized value of 80, indicating that 80% of operations were reads.

• Workload T imer (E4h) has a raw value of 500. Therefore the workload r an for 500 minutes.

• Host Writes Count (E1h) had a raw value of 100, 000 pr ior to running the workload and a value of 130,000 at th e end of the workload. Theref ore, the number of sectors written by the host du ring the workload was 30, 000 * 65,535 = 1,966,050,000 sectors or 1,966,050,000 * 512/1,000, 000,000 = 1,007 GB.

The following con clusions can be m a de for this example case: The workload took 50 0 minutes to comp lete with 80% r eads and 20% writes . A total of

1,007 GB of data was written to the device, which increased th e m edia wear in the drive by 0.016%. At this p oint in time, this w orkl oad is c aus ing a w ear rate of 0.016 % for every 500 minutes, or 0.0019 2%/ hour.

5.4.2 SMART Logs

Intel SSD DC S3700 implements the following Log Addr esses: 00h, 02h, 03h , 06h, and 07h.

DC S3700 implements host vendor specific logs (a ddresses 80h-9Fh) as read and write scratchpads, where the d efau lt va lue is zero ( 0). In tel SS D Tay lors ville doe s n ot wr ite any specific values to th ese logs unless directed by the hos t through the appropr iate commands.

DC S3700 also implem ents a dev ice v endor s pecific l o g at addres s A 9h as a rea d-only log area with a defa ult value of zero (0 ) .

5.5 Device Statistics

In addition to the SM ART attribute s tructu re, s tatistic s per tainin g to the operati on an d health of the In tel SSD Taylors ville can be repor ted to the h ost on requ est throu gh the Device Statistics log as defined in th e ATA specification.

The Device Statistics log is a read-only GPL/SMART log loc ated at read log addr ess 0x04 and is accessible using READ LOG EXT, READ LOG DMA EXT or SMART READ LOG commands.

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Page 23

Table 20. Serial ATA Power Pin Definitions—2.5-inch Form Factors

Equivalent SMART

applicable)

0x00

List of Supported Pages

0x08

Power Cycle Count

0Ch

0x10

Power-On Hours

09h

0x18

Logical Sectors Written

E1h

for every host write

0x28

Logical Sectors Read

F2h

for every host read

and Completion

counts from 1 to 150

Intel® Solid-State Drive DC S3700

Table 15 lists the Devic e Statistics supported by the Intel S SD Taylorsville.

Page Offset Description

0x01 – General Statistics

0x04 – General Error Statistics

0x05 – Temperature Statistics

0x06 – Transport Statistics

0x07 – Solid State Device Statistics 0x08 Percentage Used Endurance Indicator

0x20

0x30

0x08 Num Reported Uncorrectable Errors BBh

0x10

0x00 Device Statistics Information Header -0x08 Current Temperature -0x10 Average Short Term Temperature -0x18 Average Long Term Temperature -0x20 Highest Temperature -0x28 Lowest Temperature -0x30 Highest Average Short Term Temperature -0x38 Lowest Average Short Term Temperature -0x40 Highest Average Long Term Temperature -0x48 Lowest Average Long Term Temperature -0x50 Time in Over-Temperature -0x58 Specified Maximum Operating Temperature -0x60 Time in Under-Temperature -0x68 Specified Minimum Operating Temperature -0x08 Number of Har dw a r e Res et s -0x10 Number of ASR Events -0x18 Number of Interface CRC Errors --

Num Write Commands – incremented by one

Num Read Commands – incremented by one

Num Resets Between Command Acceptance

attribute (if

E9h

Note: This device statistic

5.6 SMART Command Transport (SCT)

With SMART Command Transport (SCT), a host can send commands and data to an SSD and receive status and data from an SSD using standard write/read commands to manipulate two SM ART Logs:

− Log Address E0h ("SCT Command/Status") — us ed to send commands and retrieve

status

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Intel Solid-State Drive DC S3700

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Intel® Solid-State Drive DC S3700

− Log Address E1h ("SCT Data Transfer") — used to transport data

Intel SSD DC S3700 supports the following standard SCT a c tions:

− Write Same — DC S3700 implements this action code as desc r ibe d in the ATA

specification.

− Error Recovery Control — DC S3700 accepts this action code, and will store and

return error-recovery time limit v alues.

− Feature Control - DC S3700 supports feature code 0001h (write ca c he) feature

code 0002h (write cache reordering), and feature c ode 0003h (time interval for temperature logg ing). It also supports D000h(Power Safe Write Cach e capacitor test interval), (D001h(r ead/write power governor m ode), D002h(read/write thermal governor mode), D003h(read power governor bu r s t pow er) , D004h(read power governor average pow er ) .

− Data table command - DC S3700 supports data table command as specified in

ATA8-ACS2. This will read ou t tempera ture log ging in forma tion in ta ble ID 0002h .

− Read Status Support - DC S3700 supports read status log

− Custom Phy Settings –DC S3700 supports custom Phy settings us in g C002h

command. It can be used to set predefined configurations or custom slew rates.

− Spread Spectrum Clocking – DC S3700 supports en a blin g or dis a bling Spread

Spectrum Clocking usin g C003h c om m a nd.

− Phy Speed–DC S3700 supports setting Ph y speed using C004h comman d. Th is

command can be used to downsh if t th e SATA negotiated speed to 3Gb/s or

1.5Gb/s.

5.7 Data Set Management Command Set

Intel SSD DC S3700 supports the Data S et Ma na gem en t com man d s et Tr im at tr ibu te, which consists of:

− DATA SET MANAGEMENT

5.8 Host Protected Area Command Set

Intel SSD DC S3700 supports the Host Protected Are a command set, wh ich consists of:

− READ NATIVE MAX ADDRESS

− SET MAX ADDRESS

− READ NATIVE MAX ADDRESS EXT

− SET MAX ADDRESS EXT

Intel SSD DC S3700 also supports the following optional commands:

− SET MAX SET PASSWORD

− SET MAX LOCK

− SET MAX FREEZE LOCK

− SET MAX UNLOCK

5.9 48-Bit Address Command Set

Intel SSD DC S3700 supports the 48-bit Address command set, which consists of:

− FLUSH CACHE EXT

− READ DMA EXT

− READ NATIVE MAX ADDRESS EXT

− READ SECTOR(S) EXT

− READ VERIFY SECTOR(S) EXT

− SET MAX ADDRESS EXT

− WRITE DMA EXT

Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 24 Order Number: 328171-001US

Page 25

Table 21. Device Certifications and Declarations

Certification

Description

COUNCIL of 15 December 2004.

1: General Requirements)

Compatibility (EMC) Framework requirements of the Australian Communication Authority (ACA).

harmonized with CISPR 22: 2005.04.

Laboratory (RRL) Ministry of Information and Communication Republic of Korea.

computers or facsimile.

Intel® Solid-State Drive DC S3700

− WRITE MULTIPLE EXT

− WRITE SECTOR(S) EXT

− WRITE MULTIPLE FUA EXT

− WRITE DMA FUA EXT

5.10 General Purpose Log Command Set

Intel SSD DC S3700 supports the General Purpose Log command set, which consists of:

− READ LOG EXT

− WRITE LOG EXT

5.11 Native Comm and Queuing

Intel SSD DC S3700 supports the Native Command Queuing (NCQ) command set, which includes:

− READ FPDMA QUEUED

− WRITE FPDMA QUEUED

Note: With a maximum Queue Depth set to 32.

5.12 Software Settings Preservation

Intel SSD DC S3700 supports the SET FEATURES parameter to enable/disable the preservation of software settings.

6.0 Certifications and Declarations

Table 16 describes the Device Certifications supported by the Intel SSD DC S3700.

CE Compliant

UL Recognized

C-Tick Compliant

BSMI Compliant

Low Voltage DIRECTIVE 2006/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 12 December 2006, and EMC Directive 2004/108/EC OF THE EUROPEAN PARLIAMENT AND OF THE

Underwriters Laboratories, Inc. Bi-National Component Recognition; UL 60950-1, 2nd Edition, 2007-03-27 (Information Technology Equipment - Safety - Part 1: General Requirements)

CSA C22.2 No. 60950-1-07, 2nd Edition, 2007-03 (Informa tion Tec hnolog y Equipm ent - Safety - Part

Compliance with the Australia/New Zealand Standard AS/NZS3548 and Electromagnetic

Compliance to the Taiwan EMC standard CNS 13438: Information technology equipment - Radio disturbance Characteristics - limits and methods of measurement, as amended on June 1, 2006, is

Compliance with paragraph 1 of Article 11 of the Electromagnetic Compatibility Control Regulation

KCC

VCCI

RoHS Compliant Restriction of Hazardous Substance Directive

October 2012 Product Specification Order Number: 328171-001US 25

and meets the Electromagnetic Compatibility (EMC) Framework requirements of the Radio Research

Voluntary Control Council for Interface to cope with disturbance problems caused by personal

Intel Solid-State Drive DC S3700

Page 26

Intel® Solid-State Drive DC S3700

Table 21. Device Certifications and Declarations

Certification

Description

WEEE

Directive on Waste Electrical and Electronic Equipment

Table 22. Standards References

(JESD219)

nts/results/jesd219

Dec 2008

VCCI

http://www.vcci.jp/vcci_e/

for material description datasheet

June 2009

Serial ATA Revision 3.0

http://www.sata-io.org/

May 2005

SFF-8201, 2.5-inch dri ve form factor

http://www.sffcommittee.org/

voltage variations immunity tests)

7.0 References

Table 17 identifies the standards information referenced in this documen t.

Date Title Location

July 2012

Sept 2010

June 2009 RoHS

August 2009 ACS-2-ATA/ATAPI Command Set 2 Specification http://www.t13.org/

May 2006 SFF-8223, 2.5-inch Drive w/Serial Attachment Connector http://www.sffcommittee.org/

1995 1996 1995 1995 1997 1994

Solid-State Drive (SSD) Requirements and Endurance Test Method

Solid-State Drive (SSD) Requirements and Endurance Test Method (JESD218)

International Electrotechnical Commission EN 61000 4-2 (Electrostatic discharge immunity test) 4-3 (Radiated, radio-frequency, electromagnetic field immunity test) 4-4 (Electrical fast transient/burst immunity test) 4-5 (Surge immunity test) 4-6 (Immunity to conducted disturbances, induced by radio-

frequency fields) 4-11 (Voltage Variations, voltage dips, short interruptions and

http://www.jedec.org/standards-docume

http://www.jedec.org/standards-docume nts/docs/jesd218/

http://qdms.intel.com/ Click Search MDDS Database and search

http://www.iec.ch/

1995 ENV 50204

(Radiated electromagnetic field from digital radio telephones)

Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 26 Order Number: 328171-001US

http://www.dbicorporation.com/ radimmun.htm/

Page 27

Table 23. Glossary of Terms a nd Acronyms

ATA

Advanced Technology Attachment

CRC

Cyclic Redundancy Check

DAS

Device Activity Signal

DMA

Direct Memory Access

ECC

Error Correction Code

EXT

Extended

FPDMA

First Party Direct Memory Access

portion of the capacity is used for NAND flash management and maintenance purposes.

Gigabit

HDD

Hard Disk Drive

HET

High Endurance Technology

Kilobyte

I/O

Input/Output

IOPS

Input/Output Operations Per Second

ISO

International Standards Organization

LBA

Logical Block Address

Megabyte (1,000,000 bytes)

MLC

Multi-level Cell

MTBF

Mean Time Between Failures

NCQ

Native Command Queuing

NOP

No Operation

Petabyte

PCB

Printed Circuit Board

PIO

Programmed Input/Output

RDT

Reliability Demonstration Test

RMS

Root Mean Square

SATA

Serial Advanced Technology Attachment

SCT

SMART Command Transport

health of a drive and reports potential problems.

SSD

Solid-State Drive

Terabyte

TYP

Typical

Intel® Solid-State Drive DC S3700

8.0 Terms and Acronyms

Table 18 defines the terms and acronyms used in this documen t.

Term Definition

SMART

Gigabyte Note: The total usable capacity of the SSD may be less than the total physical capacity because a small

Self-Monitoring, Analysis and Reporting Technology An open standard for developing hard drives and software systems that automatically monitors the

UBER Uncorrectable Bit Error Rate

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Intel Solid-State Drive DC S3700

Page 28

Intel® Solid-State Drive DC S3700

Date

Revision

Description

June 2012

001

Initial release.

Table 24. Returned Sector Da t a

F = Fixed

X = Both

0 X 0040h

General configuration bit-significant information

1 X 3FFFh

Obsolete - Number of logical cylinders (16,383)

2 V C837h

Specific configuration

3 X 0010h

Obsolete - Number of logical heads (16)

4-5 X 0h Retired

6 X 003Fh

Obsolete - Number of logical sectors per logical track (63)

7-8 V 0h Reserved for assignment by the CompactFlash* Association (CFA)

9 X 0h Retired

10-19 F

varies

Serial number (20 ASCII characters)

20-21 X 0h

Retired 22 X 0h

Obsolete

23-26 F

varies

Firmware revision (8 ASCII characters)

Model number (Intel® Solid-State Drive)

8001h

48 F 4000h

Trusted Computing F eatur e Set

49 F 2F00h

Capabilities

50 F 4000h

Capabilities

51-52 X 0h

Obsolete

53 F 0007h

Words 88 and 70:64 valid

54 X 3FFFh

Obsolete - Number of logical cylinders (16,383)

55 X 0010h

Obsolete - Number of logical heads (16)

56 X 003Fh

Obsolete - Number of logical sectors per logical track (63)

57-58 X

FC1000FBh

Obsolete

59 F F101 Number of sectors transferred per interrupt on multiple commands

63 X 0007h

Multi-w or d D MA modes supported/select e d

64 F 0003h

PIO modes supported

65 F 0078h

Minimum multiword DMA transfer cycle time per word

66 F 0078h

Manufacturer’s recommended multiword DMA transfer cycle time

67 F 0078h

Minimum PIO transfer cycle time without flow control

68 F 0078h

Minimum PIO transfer cycle time with IORDY flow control

9.0 Revision History

Appendix A: IDENTIFY DEVICE Command Data

Word

27-46

V = Variable

Default Value Description

varies

7:0—Maximum number of sectors transferred per interrupt on multiple commands

60-62

100GB: 0BA52230h 200GB: 0FFFFF FFh 400GB: 0FFFFF FFh 800GB: 0FFFFF FFh

Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 28 Order Number: 328171-001US

Total number of user-addressable sector

Page 29

Table 24. Returned Sector Da t a

F = Fixed

X = Both

69 F 4030h

Additional Supported

70 F 0000h

Reserved

71-74 F 0h

Reserved for IDENTIFY PACKET DEVICE command

75 F 001Fh

Queue depth

76 F 850Eh

Serial ATA capabilities

77 F 0006h

Reserved for future Serial ATA definition

78 F 0040h

Serial ATA features supported

79 V 0040h

Serial ATA features enabled

80 F 01FCh

Major version number

81 F 0028h

Minor version number

82 F 746Bh

Command set supported

84 F 6163h

Command set/feature supported extension

85 V 7469h

Command set/feature enabled

86 V B401h

Command set/feature enabled

87 V 6163h

Command set/feature default

88 V 407Fh

Ultra DMA Modes

89 F 0001h

Time required for security erase unit completion

90 F 0001h

Time required for enhanced security erase completion

91 V 0h Current advanced power management value

92 V 0FFFEh

Master Password Revision Code

94 V 0h Vendor’s recommended and actual acoustic management value

95 F 0h Stream minimum request size

96 V 0h Streaming transfer time - DMA

97 V 0h Streaming access latency - DMA and PIO

98-99 F 0h

Streaming performance granularity

800GB: 5D26CEB0h

104 V 0h Streaming transfer time - PIO

106 F 4000h

Physical sector size / logical sector size

107 F 0h Inter-seek delay for ISO-7779 acoustic testing in microseconds

108-111

F varies

Unique ID

112-115

F 0h Reserved for world wide name extension to 128 bits

116 V 0h Reserved for technical report

117-118

F 0h Words per logical sector

119 F 405Ch

Supported settings

120 F 401Ch

Command set/feature enabled/supported

121-126

F 0h Reserved

127 X 0h Removable Media Status Notification feature set support

128 V 0021h

Security status

Intel® Solid-State Drive DC S3700

Word

V = Variable

Default Value Description

7501h

Command sets supported

Hardware reset result: the contents of bits (12:0) of this word shall change only during the execution of a hardware reset

100-103 V

105

100GB: 0BA52230h 200GB: 1749F1B0h 400GB: 2E9390B0h

0001h

Maximum number of 512-byte blocks of LBA Range Entries per DATA

October 2012 Product Specification Order Number: 328171-001US 29

Maximum user LBA for 48-bit address feature set

SET MANAGEMENT command

Intel Solid-State Drive DC S3700

Page 30

Intel® Solid-State Drive DC S3700

Table 24. Returned Sector Da t a

F = Fixed

X = Both

129 V 1h

Vendor-specific

130-159

X 0h Vendor-specific

160 X 0h CompactFlash Association (CFA) power mode 1

161-167

X 0h Reserved for assignment by the CFA

168 X 3h

Reserved for assignment by the CFA

169 X 0001h

Data set management Trim attribute support

170-175

F 0h Reserved for assignment by the CFA

176-205

X 0h Current media serial number

206 X 003Dh

SCT Command Transport

207-208

F 0000h

Reserved

209 X 4000h

Alignment of logical blocks within a physical block

210-211

V 0000h

Write-Read-Verify Sector Count Mode 3 (DWord)

212-213

F 0000h

Write-Read-Verify Sector Count Mode 2 (DWord)

214 X 0000h

NV Cache Capabilities

215-216

V 0000h

NV Cache Size in Logical Blocks (DWord)

217 F 0001h

Nominal media rotation rate

218 V 0000h

Reserved

219 F 0000h

NV Cache Options

220 V 0000h

Write-Read-Verify feature set

221 X 0000h

Reserved

222 F 101Fh

Transport major version number

223 F 0000h

Transport minor version number

224-229

F 0000h

Reserved

230-233

X 0000h

Extended Number of User Addressable Sectors (QWord)

235

F FFFFh

command for mode 03h

236-254

X 0000h

Reserved

255 V 74A5 Integrity word

Word

V = Variable

Default Value Description

234

Notes: F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change

when media is removed or changed. V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the commands executed by the device. X = F or V. The content of the word may be fixed or variable.

0001h

Minimum number of 512-byte data blocks per DOWNLOAD MICROCODE command for mode 03h

Maximum number of 512-byte data blocks per DOWNLOAD MICROCODE

Intel® Solid-State Dr i ve DC S3700 Product Specification October 2012 30 Order Number: 328171-001US